CN102779925A - Substrate structure and method for coating fluorescent powder packaged in diode by using substrate structure - Google Patents
Substrate structure and method for coating fluorescent powder packaged in diode by using substrate structure Download PDFInfo
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- CN102779925A CN102779925A CN201210253752XA CN201210253752A CN102779925A CN 102779925 A CN102779925 A CN 102779925A CN 201210253752X A CN201210253752X A CN 201210253752XA CN 201210253752 A CN201210253752 A CN 201210253752A CN 102779925 A CN102779925 A CN 102779925A
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- phosphor gel
- fluorescent powder
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Abstract
The invention discloses a substrate structure and a method for coating fluorescent powder packaged in a diode by using the substrate structure. The substrate structure comprises an upper layer and a lower layer, wherein the lower layer is of a heat sink, and the upper layer comprises a primary region and secondary regions; the secondary regions are separated from each other and respectively connected with the primary region; the primary region is used for fixing an LED (light-emitting diode) chip; the coated fluorescent powder glue plays a leading optical effect; and the secondary regions are used for storing the remaining fluorescent powder glue. The method comprises the steps that: the LED chip is fixed on the substrate structure and then carried on a circuit connection process to form an LED module; the fluorescent powder glue is coated in the center of the primary region; the LED module coated with the fluorescent powder glue is heated to enable the fluorescent powder glue spread on the substrate in a balancing state, and then the LED module is baked and the fluorescent powder glue is cured to form a fluorescent powder layer; and then the LED module is packaged through the following process. The substrate structure is simple in structure and low in cost, and light color uniformity in packaging the LED is improved, thus the substrate structure is quickly applied to LED packaging production in bulk.
Description
Technical field
The invention belongs to the LED encapsulation technology; Relate to a kind of board structure and be used for the fluorescent material painting method that white light emitting diode encapsulates; The present invention promotes white light emitting diode through the design of LED package substrate construction and encapsulates photochromic consistency, is specially adapted to extensive LED encapsulation and produces.
Background technology
LEDs (Light Emitting Diodes) is a kind of light emitting semiconductor device of processing based on P-N junction electroluminescence principle; Have advantages such as electro-optical efficiency height, long service life, environmental protection and energy saving, volume be little; Be described as the 21 century green illumination light source; If can be applied to the traditional lighting field and will obtain very obvious energy-saving effect, this is significant now what be becoming tight global energy day.Along with the breakthrough that with the nitride is the third generation semi-conducting material technology of representative; Semiconductor lighting industry based on high-power and high-luminance light-emitting diode (LED) is risen rapidly in the whole world; Just becoming semi-conductor photoelectronic industry new growth engines, and causing a revolution in the traditional lighting field.LED has begun to be used widely in a lot of fields because its unique advantages, is thought the main developing direction of following lighting technology to have huge market potential by industry.
The white light LEDs that extensively adopts at present is to form through blue led chip (GaN) and yellow fluorescent powder (YAG or TAG).The phosphor powder layer parameter has a strong impact on the important optical properties such as light extraction efficiency, colour temperature, spatial color uniformity of LED in LED encapsulation; Realize that in the LED encapsulation fluorescent material parameter consistency between the different package modules is most important to the consistency that promotes the LED encapsulating products.The conforming lifting of LED encapsulating products is beneficial to further reduce the LED product cost, promotes the large-scale application of this energy-saving illumination.
The most frequently used fluorescent material coating method of LED encapsulation is through point gum machine the phosphor gel in the syringe to be coated in around the led chip.In coating procedure, the viscosity of phosphor gel will along with time and temperature with change, the pressure and temperature of equipment also will change in the process of operation, the fluorescent material amount that these variations will cause applying on the different LED package module there are differences; Apply the many modules of phosphor gel amount, phosphor powder layer thickness is big, and the general colour temperature of LED package module reduces, otherwise colour temperature is with height.Therefore this phenomenon has caused relatively poor LED encapsulation consistency.As shown in Figure 1, traditional LED board structure is the pair of lamina column structure and since the phosphor gel that effect such as surface tension applies with stagnation in border circular areas; Change along with applying phosphor gel, phosphor powder layer thickness will change thereupon, and different phosphor powder layer thickness causes different LED colour temperatures, finally produces the photochromic consistency of unfavorable encapsulation.A kind of settling mode intuitively is accurately to control phosphor gel to apply, and guarantees that at utmost the phosphor gel amount of each LED encapsulation coating is identical.But because silica gel viscosity is bigger, and coating procedure certainly exists change, and therefore accurately control is the comparison difficulty; The control precision that improves equipment simultaneously will require to replace present phosphor gel coating equipment with more complicated, expensive equipment, and this will increase cost to enterprise, be unfavorable for reducing the LED product cost.Seek a kind of simply, promote the conforming technical scheme of LED encapsulating products cheaply, will help promoting the development of LED encapsulation technology, promote the large-scale application of LED product.
Summary of the invention
The object of the present invention is to provide a kind of board structure and be used for the fluorescent material painting method that white light emitting diode encapsulates, the conforming encapsulation requirement of specular that the present invention can still satisfy under the phosphor gel change conditions that has bigger coating on the different package modules.
A kind of board structure provided by the invention is characterized in that this structure comprises upper and lower two-layer, and lower floor is a heating panel, and the upper strata comprises main region and auxilliary zone, and each auxilliary zone is separated from each other, but all links to each other with main region.
The aforesaid substrate structure is used for the fluorescent material painting method of diode package, the steps include:
(1) led chip is fixed on the main region center on board structure upper strata, accomplishes circuit again and connect operation, form led module;
(2) center of the main region in the board structure applies phosphor gel;
The led module that (3) will apply phosphor gel heats, and phosphor gel is sprawled on substrate fast, reaches poised state, led module is toasted again, and solidifies phosphor gel, forms phosphor powder layer;
(4) realize complete led module encapsulation through the follow-up technology that comprises lens mounting and filling gel technology.
Board structure provided by the present invention, main region is used for fixing led chip, and the phosphor gel that applies in this zone plays main optical effect, and auxilliary zone is used to store unnecessary phosphor gel; During the phosphor gel amount change that in explained hereafter, applies, the quantitative change of main region phosphor gel is moving very little, so the very little change of the photochromic generation of LED, thereby improves the photochromic consistency of LED encapsulation.
Utilize the aforesaid substrate structure under the coating phosphor gel exists than the cataclysm situation, can realize that high LED encapsulates photochromic consistency.Because this method only requires board structure is designed again; It is identical extensively to adopt LED fluorescent material to apply in the coating method of fluorescent material and the industry at present, thus simple to operate, low cost; Can be applied to large-scale LED encapsulation in the industry soon; Promote LED and encapsulate photochromic consistency, save packaging cost, promote further developing of LED illumination.
Description of drawings
Fig. 1 is the structural representation of traditional LED base plate for packaging, wherein, and (a) traditional LED package module front view, (b) substrate or heat sink front view and vertical view in traditional LED package module;
Fig. 2 is that the New LED base plate for packaging perhaps is used as heat sink sketch map in the lead frame structure, and 1 is expressed as main region among the figure, and 2 are expressed as auxilliary zone;
Fig. 3 is a kind of board structure sketch map of the present invention of fixed L ED chip, wherein, (a) is the package module front view of fixed L ED chip, (b) is the package module vertical view of fixed L ED chip
Fig. 4 representes a kind of coating phosphor gel technology;
Fig. 5 representes to apply the LED package module of different volumes phosphor gel; Wherein, LED package module when (a) expression phosphor gel volume is 3.9 μ l; LED package module when (b) being 4.0 μ l for the phosphor gel volume, LED package module when (c) being 4.1 μ l, LED package module when (d) being 4.1 μ l for the phosphor gel volume for the phosphor gel volume;
Fig. 6 is the another kind of board structure sketch map of the present invention of fixed L ED chip, wherein, (a) is the package module front view of fixed L ED chip, (b) is the package module vertical view of fixed L ED chip.
Among the figure, the 1001LED substrate, the 1002LED chip, 1003 solder layers, 1004 gold threads, the 1005LED support, 1006 fill the syringe of phosphor gel, 1007 fluorescent material glue-lines, 2002 moulding compounds, 2003 lead frames, 2004 lens, 2005 silica gel layer.
Embodiment
As shown in Figure 2, the present invention proposes a kind of novel board structure, is divided into double-layer structure; Superstructure is divided into two zones, main region 1 and auxilliary zone 2; Main region 1 can be for square; Shapes such as circle, this zone are used for bonding LED chip and main optical effect zone, and auxilliary zone 2 is some isolating constructions; Be distributed in (can be symmetrically distributed or asymmetric distribution) around the main region 1; And link to each other with main region 1, the shape in each auxilliary zone 2 can be identical or different, and shape can be square, fan-shaped and other are irregularly shaped etc.; The main effect in auxilliary zone 2 is to hold unnecessary phosphor gel, reduces main region 1 phosphor powder layer thickness and occurs change along with applying the phosphor gel quantitative changeization.Its lower floor is a heating panel, and heating panel is used to connect external structure, like fin, and large substrates etc.
Among the present invention, the material of substrate can be non-metal base panel materials such as metal substrate materials such as copper, aluminium, silicon and PC plate.
Board structure can pass through CNC milling machine, and processing technologys such as line cutting, forging and pressing, injection moulding and etching realize, can be integral body or non-integral moulding.
The surface of substrate is a reflector layer, and the material of reflector layer can be silver or other any reflectorized material.
The groundwork principle of this substrate is: led chip is bonded in the center of substrate main region 1, and phosphor gel down applies along main region 1 center through a glue coating unit; Because wetting action, silica gel will be along main region 1 surface spreading, the upper surface of substrate.When the phosphor gel amount that applies hour, phosphor gel is in main region 1, increases along with applying the phosphor gel amount, phosphor gel will spread into auxilliary zone 2; The phosphor gel amount that applies further increases, and its distance of in auxilliary zone 2, sprawling is farther, thus the phosphor gel amount in the main region 1 of guaranteeing not with the phosphor gel quantitative changeization that applies, thereby realize that high LED encapsulates photochromic consistency.
Utilize said board structure to carry out the phosphor gel painting method: fluorescent material is added in the glue material; And mix, regulate the ratio between fluorescent material and the glue material, led chip is fixed on the board structure; Accomplish circuit again and connect operation; Form led module, afterwards with phosphor gel through a some glue coating unit, the center of the main region 1 in the board structure applies.The led module heating that applies phosphor gel is reduced phosphor gel viscosity, quicken phosphor gel and sprawl.Treating that phosphor gel tiles on substrate arrives poised state, led module is put into baking box toast, and solidifies phosphor gel, forms phosphor powder layer; Through follow-up lens mounting, fill the complete led module encapsulation of technology realization such as phosphor gel.
The key of the inventive method is to use board structure to improve encapsulation, and other packaging technology can be the same with existing potting process; Being used for the encapsulated LED chip can be the led chip that quaternary material chips such as binary materials such as GaN or AlGaNP or other material are processed.Fluorescent material in the phosphor gel can be the fluorescent material that all LED encapsulation such as YAG and TAG are adopted.It can be that glue materials such as silica gel, epoxy resin and liquid glass are formed that the configuration phosphor gel is used the glue material.The concentration of fluorescent material can be 0.01g/ml ~ 5.0g/ml in the phosphor gel.Glue material and phosphor gel are transferred to approach on the substrate and can be dripped through syringe and be coated with approach such as spraying.
The inventive method goes for LED packing forms such as stent-type, chip on board, array and system in package.
Below through by embodiment the present invention being described in further detail, but following examples only are illustrative, and protection scope of the present invention does not receive the restriction of these embodiment.
Referring to Fig. 3, design and substrate processing structure 1001, board structure is divided into zone 1 and zone 2, and zone 1 is a circle, and zone 2 is fan-shaped, goes to be distributed on regional 1 both sides with regional 1 UNICOM.In board structure wall sputtering silver, form reflective surface; Led chip 1002 is fixed on the center of reflector bottom through scolder 1003, and gold thread 1004 links to each other led chip with led support 1005, form the circuit of connection.As shown in Figure 4, through point gum machine the phosphor gel in the syringe 1006 is coated in the board structure surface along regional 1 center line, the glue material in the phosphor gel is a silica gel, and fluorescent material is YAG fluorescent material, and the fluorescent material amount of coating is 3.9 μ l-4.2 μ l.Phosphor gel 1007 is put into 150 ℃ of baking box bakings and was solidified in 1 hour after reaching poised state on the board structure, and the conformal of accomplishing fluorescent material applies operation.Above-mentioned experimentation carries out repeatedly, adopts the phosphor gel of variable concentrations in each experimentation, and fluorescent material concentration is respectively 0.01g/ml, 0.2gml, 1.0g/ml, 2.0g/ml, 5.0g/ml; It is roughly the same that each time experiment reaches regional 1 fluorescent material pattern, do not move and change (as shown in Figure 5) along with applying the phosphor gel quantitative change basically.
Referring to Fig. 6, design and substrate processing structure 1001, board structure is divided into zone 1 and zone 2, and zone 1 is one square, and regional 2 is triangle, goes to be distributed on regional 1 both sides with regional 1 UNICOM.In board structure wall sputtering silver, form reflective surface; Led chip 1002 is fixed on the center of reflector bottom through scolder 1003, and gold thread 1004 links to each other led chip with led support 1005, form the circuit of connection.Similar with Fig. 4 method for expressing, through point gum machine the phosphor gel in the syringe 1006 is coated in the board structure surface along regional 1 center line, the glue material in the phosphor gel is a silica gel, and fluorescent material is YAG fluorescent material, and the fluorescent material amount of coating is 3.9 μ l-4.2 μ l.Phosphor gel 1007 is put into 150 ℃ of baking boxes and is solidified after reaching poised state on the board structure, and the conformal of accomplishing fluorescent material applies operation.Above-mentioned experimentation carries out repeatedly, adopts the phosphor gel of variable concentrations in each experimentation, and fluorescent material concentration is respectively 0.01g/ml, 0.2g/ml, 1.0gml, 2.0g/ml, 5.0g/ml; It is roughly the same that each time experiment reaches regional 1 fluorescent material pattern, moving and change (effect with Fig. 5 representation class like) along with applying the phosphor gel quantitative change basically.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the disclosed content of this embodiment and accompanying drawing.So everyly do not break away from the equivalence of accomplishing under the disclosed spirit of the present invention or revise, all fall into the scope of the present invention's protection.
Claims (10)
1. a board structure is characterized in that, this structure comprises upper and lower two-layer, and lower floor is a heating panel, and the upper strata comprises main region and auxilliary zone, and each auxilliary zone is separated from each other, but all links to each other with main region.
2. board structure according to claim 1 is characterized in that, auxilliary regional symmetry or asymmetric distribution are around main region.
3. board structure according to claim 1 is characterized in that, main region is square, circular or other shape.
4. board structure according to claim 1 is characterized in that, each auxilliary region shape is identical or different, and its shape is square, fan-shaped or other shape.
5. according to arbitrary described board structure in the claim 1 to 4, it is characterized in that the material of said the upper and lower is metal substrate material or non-metal base panel material.
6. according to arbitrary described board structure in the claim 1 to 4, the surface that it is characterized in that substrate is a reflector layer.
7. the said board structure of claim 1 is used for the method that diode package fluorescent material applies, and the steps include:
(1) led chip is fixed on the main region center on board structure upper strata, accomplishes circuit again and connect operation, form led module;
(2) center of the main region in the board structure applies phosphor gel;
The led module that (3) will apply phosphor gel heats, and phosphor gel is sprawled on substrate fast, reaches poised state, led module is toasted again, and solidifies phosphor gel, forms phosphor powder layer;
(4) realize complete led module encapsulation through the follow-up technology that comprises lens mounting and filling gel technology.
8. the said board structure of claim 7 is used for the method that diode package fluorescent material applies, and the steps include: that the concentration of fluorescent material is 0.01g/ml ~ 5.0g/ml in the phosphor gel.
9. the said board structure of claim 7 is used for the method that diode package fluorescent material applies, and the steps include: to be used for the led chip that encapsulated LED chip binary material or quaternary material chip or other material constitute.
10. the said board structure of claim 7 is used for the method that diode package fluorescent material applies, and the steps include: that glue material and phosphor gel transfer to approach on the substrate and drip through syringe and be coated with or the spraying approach.
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| CN201210253752.XA CN102779925B (en) | 2012-07-20 | 2012-07-20 | Substrate structure and method for coating fluorescent powder packaged in diode by using substrate structure |
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| CN201210253752.XA CN102779925B (en) | 2012-07-20 | 2012-07-20 | Substrate structure and method for coating fluorescent powder packaged in diode by using substrate structure |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101369614A (en) * | 2007-08-17 | 2009-02-18 | 刘胜 | Packaging structure and method for high power white light LED |
| CN101696790A (en) * | 2009-10-27 | 2010-04-21 | 彩虹集团公司 | High-power LED heat-dissipation packaging structure |
| WO2010102910A2 (en) * | 2009-03-09 | 2010-09-16 | Ledon Lighting Jennersdorf Gmbh | Led module with improved light output |
| CN102130235A (en) * | 2010-12-31 | 2011-07-20 | 北京大学深圳研究生院 | Method and device for packaging LED chip |
| CN102569615A (en) * | 2012-01-16 | 2012-07-11 | 华中科技大学 | Free-form surface lens and method of realizing shape-preserving coating for same |
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2012
- 2012-07-20 CN CN201210253752.XA patent/CN102779925B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101369614A (en) * | 2007-08-17 | 2009-02-18 | 刘胜 | Packaging structure and method for high power white light LED |
| WO2010102910A2 (en) * | 2009-03-09 | 2010-09-16 | Ledon Lighting Jennersdorf Gmbh | Led module with improved light output |
| CN101696790A (en) * | 2009-10-27 | 2010-04-21 | 彩虹集团公司 | High-power LED heat-dissipation packaging structure |
| CN102130235A (en) * | 2010-12-31 | 2011-07-20 | 北京大学深圳研究生院 | Method and device for packaging LED chip |
| CN102569615A (en) * | 2012-01-16 | 2012-07-11 | 华中科技大学 | Free-form surface lens and method of realizing shape-preserving coating for same |
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