CN102766892A - Micro-nano processing method and device - Google Patents
Micro-nano processing method and device Download PDFInfo
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- CN102766892A CN102766892A CN2012102847225A CN201210284722A CN102766892A CN 102766892 A CN102766892 A CN 102766892A CN 2012102847225 A CN2012102847225 A CN 2012102847225A CN 201210284722 A CN201210284722 A CN 201210284722A CN 102766892 A CN102766892 A CN 102766892A
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Abstract
The invention discloses a micro-nano processing method and a device. All parameters of a substrate to be processed are utilized, the structure of an electrode plate is determined according to the distribution mode of a conductor surface electric field; an electrochemical solution is determined according to the structure of the electrode plate and indexes of a pre-processing micro-nano structure on the substrate to be processed; the electrode plate and the substrate connected with the anode or the cathode of a current source respectively are placed in the electrochemical solution in an opposite mode, after the power is on, the electrochemical solution is stirred in a preset time, and the micro-nano structure on the substrate and in accordance with the preset indexes is manufactured by using current carriers in the electrochemical solution. According to the micro-nano processing method and the device, reaction ions in the electrochemical solution are controlled by controlling the distribution of the electrostatic field on the surface of the substrate to be subjected to the micro-nano processing, and the micro-nano structure with certain surface shape distribution is manufactured on the substrate finally. Accordingly, purposes of low cost, high efficiency and high precision of processing of a three dimensional and curved surface structure are achieved through the operation of the electrostatic field.
Description
Technical field
The present invention relates to technical field of micro and nano fabrication, in particular, relate to a kind of micro-nano processing method and equipment based on the control distribution of electrostatic.
Background technology
To the micro-nano structure in field extensive application such as micro-nano photoelectron, semi-conductor, micromechanics, biochip, micro-nano biological detections, the micro-nano processing technology of main flow mainly contains traditional photoetching technique, various bundle writing technology and nanometer embossing etc.
Adopt photoetching technique to carry out micro-nano processing, can realize the mass preparation of micro-nano structure figure expeditiously.But aspect the 3D figure of the high surface precision of preparation, this photoetching technique is powerless.Simultaneously, the detrimentally affects such as the empty limit of figure for preventing that the diffraction of light effect from causing need mask plate and the tight pressing of figure.Because mask plate is the planar mechanically resistant material, therefore can only on planar substrate, prepare micro-nano graph, the preparation micro-nano structure then has than big difficulty on curved substrate.
To the problems referred to above, though various bundle writing technology can be realized processing of 3D micro-nano and the processing of curved substrate micro-nano,, identical with photoetching technique, both all adopt the pointwise writing mode, and working (machining) efficiency is lower.And, since comparatively expensive and complicated based on the equipment of various bundle writing technologies, therefore should technology only be suitable for studying purpose, be difficult to be applied to scale operation.
Problem to little processing of 3D figure and the little processing of curved substrate aspect; Just risen a novel micro nanometer processing technology-nanometer embossing in recent years; The micro-nano processing that it can be realized on planar graph and the cylindrical substrate has advantages such as efficient height, tooling cost are low.But, adopt this nanometer embossing to be difficult to remove remaining primer,, spherical and surface be difficult to realize the processing and preparing of micro-nano structure simultaneously on having the substrate of fluctuating.Thereby can't reach accurate realization micro-nano processing, especially aspect little processing of 3D figure and the little processing of curved substrate.
Hence one can see that, how low-cost, high-level efficiency, and the processing of the processing of the realization micro-nano structure of pinpoint accuracy, particularly 3D micro-nano structure and curved substrate micro-nano structure is one of problem of being badly in need of at present solution.
Summary of the invention
In view of this, the invention provides a kind of micro-nano processing method and equipment, can't be implemented in the problem of taking into account low cost, high-level efficiency, high definition in the micro-nano course of processing simultaneously of carrying out in the prior art to overcome.
For realizing above-mentioned purpose, the present invention provides following technical scheme:
A kind of micro-nano processing method comprises:
Obtain the parameters of the substrate of treating micro-nano processing, and confirm the structure of battery lead plate according to conductive surface electric field distribution mode
;
Wherein, Parameters comprises the electric field strength E of substrate shape, size, electroconductibility, preprocessing micro-nano structure index and the substrate surface position electrostatic field of said substrate; N is the normal component or the radial component of electrostatic field, and H is the mean radius of curvature of battery lead plate position;
According to the structure of said battery lead plate and the preprocessing micro-nano structure index of said substrate, confirm to preset the allocation ratio of the electrochemical solution of the mode correspondence of processing micro-nano structure, and obtain said electrochemical solution;
According to the mode of preset processing micro-nano structure said battery lead plate and substrate are connected the male or female of current source respectively, and the part or all of of said battery lead plate and substrate is positioned in the said electrochemical solution according to relative mode;
Power on, in Preset Time, stir said electrochemical solution, the current carrier in the said electrochemical solution is moved on said substrate, obtain to be positioned at the micro-nano structure that meets said preset processing micro-nano structure index on the said substrate.
Preferably, the mode of said preset processing micro-nano structure comprises electroplating deposition or electrolytic etching;
When the mode of said preset processing micro-nano structure was electroplating deposition, said battery lead plate was connected with the anode of said current source, and said substrate is connected with the negative electrode of said current source;
When the mode of said preset processing micro-nano structure was electrolytic etching, said battery lead plate was connected with the negative electrode of said current source, and said substrate is connected with the anode of said current source.
Preferably, the mode of said preset processing micro-nano structure comprises electroplating deposition or electrolytic etching;
Positively charged ion in the said electrochemical solution is with a kind of element with the material of the said substrate of corresponding electroplating deposition or electrolytic etching.
Preferably, comprising: opposing parallel is over against placing, tilt to place, vertically placing or said battery lead plate of placed offset and said substrate in said electrochemical solution;
The distance range of said battery lead plate and said substrate is 0 ~ 10m rice.
Preferably, according to the said parameters of treating the substrate of micro-nano processing, and the structure of the battery lead plate of confirming according to conductive surface electric field distribution mode is specially:
According to said conductive surface electric field distribution mode the microstructure graph on the said electrode plate surface is set;
With circular, square, Polygons, ellipse, any one shape in sphere, elliposoidal or all kinds of irregular curved surface or arbitrary combination shape are as the global shape of said battery lead plate;
With band through hole, straight joint, the profile of hole or seam is as the closed curve of said battery lead plate;
With electro-conductive material; The insulating material of perhaps having the electro-conductive material figure; Perhaps the semiconductor material with electro-conductive material constitutes said battery lead plate;
Wherein, the shared bulk of said battery lead plate is that 1mm millimeter * 1mm millimeter * 0.1mm millimeter is to 10m rice * 10m rice * 10m rice; Said battery lead plate comprises one at least.
Preferably, said substrate is by silicon, germanium, gallium arsenide, ITO, Graphene, metal, plastics, PMMA, PDMS, and silit, silicon nitride or stupalith constitute;
The shape of said substrate comprises: discoid, straight profiles is dull and stereotyped, curved profile is dull and stereotyped, elliposoidal, sphere, parabolic shape, hyperbolic is planar, saddle is planar, cylinder is planar, index is planar, trigonometrical function is planar, sawtooth is planar, with through hole or do not have the planeform or the curve form of through hole;
The shared bulk of said substrate is that 1mm millimeter * 1mm millimeter * 0.1mm millimeter is to 10m rice * 10m rice * 10m rice.
Preferably, the range of current of said current source comprises: the 0mA milliampere is pacified to 1000A;
Said Preset Time comprises: 0 ~ 99999 second;
Wherein, in said Preset Time, the electric current of said current source is pressed the wave form varies of straight line, dressing function, cycle gate function, trigonometrical function, zigzag wave function or exponential function with said Preset Time.
Stirring amplitude when preferably, stirring said electrochemical solution is lower than the liquid level of said electrochemical solution.
Preferably, when the said substrate of treating micro-nano processing when being a plurality of, single adopts said micro-nano processing method that a said substrate of micro-nano processing of treating is carried out micro-nano processing; Perhaps, single carries out micro-nano processing to a plurality of said substrates of micro-nano processing of treating simultaneously.
A kind of micro-nano processing units comprises:
Treat the substrate of micro-nano processing;
Battery lead plate; Said battery lead plate is according to the parameters of the substrate of treating micro-nano processing, and conductive surface electric field distribution mode
is confirmed structure;
Wherein, Parameters comprises the electric field strength E of substrate shape, size, electroconductibility, preprocessing micro-nano structure index and the substrate surface each several part electrostatic field of said substrate; N is the normal component or the radial component of electrostatic field, and H is the mean radius of curvature of a battery lead plate position;
Solution tank; Said solution tank is used to carry according to the structure of said battery lead plate and the preprocessing micro-nano structure index of said substrate; Confirm to preset the electrochemical solution of the allocation ratio of the mode correspondence of processing micro-nano structure, and partly or entirely be arranged at said battery lead plate and the substrate in the said electrochemical solution;
Current source, the male or female of said current source is connected said battery lead plate respectively with substrate according to the mode of preset processing micro-nano structure;
Probe into the whipping appts in the said solution tank; The part that said whipping appts probes into said electrochemical solution is an isolator; When said current source powers on; Said whipping appts stirs said electrochemical solution in Preset Time, the current carrier in the said electrochemical solution is moved on said substrate, obtains to be positioned at the micro-nano structure that meets said preset processing micro-nano structure index on the said substrate.
Can know via above-mentioned technical scheme, compared with prior art, the invention discloses a kind of micro-nano processing method and equipment.The parameters of the substrate of micro-nano processing is treated in employing, and confirms the surface topography and the area of battery lead plate according to conductive surface electric field distribution mode, and confirms the structure of battery lead plate; Confirm electrochemical solution according to the structure of this battery lead plate with the preprocessing micro-nano structure index of the substrate of treating micro-nano processing then; The battery lead plate and the substrate that will connect the male or female of current source more respectively partly or entirely are positioned in the electrochemical solution according to relative mode; After energising; In Preset Time, stir said electrochemical solution, utilize the current carrier preparation in this electrochemical solution to be positioned at the micro-nano structure that meets said preset processing micro-nano structure index on the said substrate.The invention described above treats that through control the substrate surface distribution of electrostatic of micro-nano processing controls the reactive ion in the electrochemical solution; Perhaps current carrier is to the speed of each position motion of substrate; Thereby control the speed of each substrate corresponding position, finally on this substrate, prepare micro-nano structure with certain face shape distribution according to the mode of preset processing micro-nano structure.Thereby realize utilizing electrostatic field to control the purpose of three-dimensional and curved substrate micro-nano structure low cost, high-level efficiency, high definition shaping.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is embodiments of the invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to the accompanying drawing that provides.
Fig. 1 is the principle schematic of the micro-nano structure method for electrochemical machining of the disclosed control distribution of electrostatic of the embodiment of the invention;
Fig. 2 is the schema of the embodiment of the invention one disclosed a kind of micro-nano processing method;
Fig. 3 is the disclosed micro-nano structure synoptic diagram of on various substrates, making of the embodiment of the invention;
Fig. 4 is the disclosed electrode plate structure synoptic diagram of the embodiment of the invention;
Fig. 5 is the structural representation of this embodiment of the invention two disclosed a kind of micro-nano processing unitss;
Fig. 6 is the schema of the embodiment of the invention three disclosed a kind of micro-nano processing methods.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The present invention adopts the method for electrochemical machining of control distribution of electrostatic; Index according to micro-nano structure to be processed on the substrate; In conjunction with the differential equation that electrostatic field distributes at conductive surface, the design electrode plate structure, and according to battery lead plate and the character configuration electrochemical solution of treating the micro-nano processing structure.And battery lead plate and substrate be connected the anode and the negative electrode of current source respectively, to insert in the electrochemical solution over against mode.After energising, make the current carrier in the electrochemical solution move to each position of substrate, and on substrate, be reduced to metal micro-nanostructure with different rates.Through stirred solution, make that near the current carrier the substrate surface obtains in time replenishing at last.Be implemented in and obtain random two-dimensional or three-D micro-nano yardstick figure on the substrate of arbitrary face shape; So that solve at present than popular photoetching technique and various copying and printing technology; And the unmanageable difficult problem of 3D micro-nano structure, solved the problem that is difficult to preparation micro-nano graph on curved substrate at present simultaneously.Detailed process is elaborated through following examples.
Embodiment one
As shown in Figure 1, be the principle schematic of micro-nano structure method for electrochemical machining of control distribution of electrostatic, wherein 1 is battery lead plate; 2 is substrate to be processed, and 3 is the micro-nano structure that will prepare, and 4 is near virtual electrostatic field intensity distribution substrate; 5 is the colour scale chi of strength of electric field; Color represents field intensity strong more more deeply, and 6 is near the profilograph that field intensity is gone up on a plane (dotted line position place) substrate surface to be processed, and 7 is the current carrier in the electrochemical solution.
Based on said structure, as shown in Figure 2, the schema for the disclosed a kind of micro-nano processing method of the embodiment of the invention mainly may further comprise the steps:
Step S101; Obtain the parameters of the substrate of treating micro-nano processing, and confirm the structure of battery lead plate according to conductive surface electric field distribution mode
.
In step S101, parameters comprises the strength of electric field of substrate shape, size, electroconductibility, preprocessing micro-nano structure index and the substrate surface each several part electrostatic field of said substrate.
In
; E is the strength of electric field of substrate surface each several part electrostatic field; N is the normal component or the radial component of electrostatic field, and H is the mean radius of curvature of battery lead plate position.
When in this step S101, confirming the structure of battery lead plate; According to the electrode plate structure surface is potentiometric surface; And electric field line is perpendicular to the principle of electrode plate surface; Can access concrete battery lead plate in conjunction with the above-mentioned conductive surface electric field distribution mode that provides, perhaps can design corresponding battery lead plate, thereby make the electric field distribution that obtains expecting at the substrate surface of treating micro-nano processing according to above-mentioned needs.
Step S102 according to the structure of said battery lead plate and the preprocessing micro-nano structure index of said substrate, confirms to preset the allocation ratio of the electrochemical solution of the mode correspondence of processing micro-nano structure, and obtains said electrochemical solution.
In step S102, the mode of preset processing micro-nano structure comprises electroplating deposition and electrolytic etching.In the process of confirming electrochemical solution; Mode according to current preset processing micro-nano structure; Electroplating deposition or electrolytic etching are confirmed the corresponding electroplating chemical solution or the allocation ratio of electrolytics solution; And the positively charged ion in definite electroplating chemical solution or the electrolytics solution, perhaps current carrier is with a kind of element with the material of the said substrate that carries out electroplating deposition or electrolytic etching.
In addition, dispose the electrochemical solution that forms and to satisfy it does not have corrosive nature to solution tank, electrode pad, substrate to be processed requirement simultaneously.
Step S103 is connected the male or female of current source according to the mode of preset processing micro-nano structure respectively with said battery lead plate and substrate, and the part or all of of said battery lead plate and substrate is positioned in the said electrochemical solution according to relative mode.
In step S103, the mode of said preset processing micro-nano structure comprises electroplating deposition or electrolytic etching; When the mode of said preset processing micro-nano structure was electroplating deposition, said battery lead plate was connected with the anode of said current source, and said substrate is connected with the negative electrode of said current source.
When the mode of said preset processing micro-nano structure was electrolytic etching, said battery lead plate was connected with the negative electrode of said current source, and said substrate is connected with the anode of said current source.
Through above-mentioned steps S103 battery lead plate and the substrate of treating micro-nano processing partly or entirely are put in the solution tank that fills electrochemical solution; And be to make battery lead plate and the substrate of treating micro-nano processing connect the positive and negative polarities of current source respectively, thereby form the steady electrostatic field at the substrate surface of treating micro-nano processing through the mode of different preset processing micro-nano structure.
In addition; In electrochemical solution described in the step S103, can adopt opposing parallel over against placing, tilt to place, vertically placing or said battery lead plate of placed offset and said substrate; That is to say that battery lead plate can parallel mode over against place, tilt placement, vertical placement or placed offset be positioned in the electrochemical solution with substrate; Wherein, but electrochemical solution submergence battery lead plate and substrate, also can partially submerged battery lead plate and substrate; Battery lead plate and substrate distance are adjustable, and setting range is 0 ~ 10m rice.
Behind performing step S103, can comprise further that also the relative position of counter electrode plate and substrate is adjusted, and the size of current of current source is adjusted with the mode of powering on.
Step S104 powers on, and in Preset Time, stirs said electrochemical solution, and the current carrier in the said electrochemical solution is moved on said substrate, obtains to be positioned at the micro-nano structure that meets said preset processing micro-nano structure index on the said substrate.
In step S104; Electrochemical solution is stirred in the back in Preset Time through powering on; Current carrier in the said electrochemical solution is moved on said substrate; And then obtain corresponding electric current distribution through the strength distribution of electric field that constitutes at substrate different positions place, thus obtain different metallic deposition or etching speed at substrate surface, finally obtain being positioned at the micro-nano structure that meets said preset processing micro-nano structure index on the said substrate.Wherein, the micro-nano structure of preset processing micro-nano structure index both had been the two dimension of expection face shape or three-D micro-nano graphic structure.
In addition, in the process of performing step S104,, can make that near the current carrier the substrate surface obtains in time replenishing, so that more fully substrate is accomplished micro-nano processing through stirring electrochemical solution.
In performing step S104, the range of current of the current source that powers on comprises: the 0mA milliampere is to the 100A peace, and adjustable.This current source can be specially constant-current source.The scope of this Preset Time comprises: 0 ~ 9999s second; Wherein, in said Preset Time, the electric current of said current source is pressed the wave form varies of straight line, dressing function, cycle gate function, trigonometrical function, zigzag wave function or exponential function with said Preset Time.
In addition, during stirring in performing step S104, the whipping appts that is immersed in the electrochemical solution part is an isolator, and the stirring amplitude when it stirs said electrochemical solution is lower than the liquid level of said electrochemical solution.
Through carrying out above-mentioned steps S104,, make the carrier concentration uniform distribution through stirring electrochemical solution.And then energising processing in the controllable Preset Time, last, when micro-nano graph to be processed satisfied expectation index, the substrate with micro-nano structure was taken out in outage.
In the method in the disclosed step S101 of this embodiment of the invention described above ~ S104,, can on the substrate of arbitrary face shape, obtain random two-dimensional or three-D micro-nano yardstick figure through adopting the method for electrochemical machining of control distribution of electrostatic.Simultaneously; On principle, be different from fully at present than popular photoetching technique and various copying and printing technology; Its resolving power does not receive the restriction of diffraction limit and die size; Can solve the unmanageable difficult problem of 3D micro-nano structure, solve the problem that is difficult to preparation micro-nano graph on curved substrate at present simultaneously.In addition, its working (machining) efficiency of this embodiment of the invention disclosed method is higher, need not complex apparatus, and cost is also lower, further realizes utilizing electrostatic field to control the purpose of three-dimensional and curved substrate micro-nano structure low cost, high-level efficiency, high definition shaping.
On the basis of the disclosed embodiment of the invention described above, need to prove:
The substrate that need carry out micro-nano processing is by silicon, germanium, gallium arsenide, ITO, Graphene, metal, plastics, PMMA, PDMS, and silit, silicon nitride or stupalith constitute;
The shape of said substrate comprises: discoid, straight profiles is dull and stereotyped, curved profile is dull and stereotyped, elliposoidal, sphere, parabolic shape, hyperbolic is planar, saddle is planar, cylinder is planar, index is planar, trigonometrical function is planar, sawtooth is planar, with through hole or do not have the planeform or the curve form of through hole;
The shared bulk of said substrate is that 1mm millimeter * 1mm millimeter * 0.1mm millimeter is to 10m rice * 10m rice * 10m rice.
When the said substrate of treating micro-nano processing when being a plurality of, single adopts said micro-nano processing method that a said substrate of micro-nano processing of treating is carried out micro-nano processing; Perhaps, single carries out micro-nano processing to a plurality of said substrates of micro-nano processing of treating simultaneously.
As shown in Figure 3, on various substrates, making the micro-nano structure synoptic diagram; Wherein, 15 is planar substrate, and 16 are the micro-nano structure of machine-shaping; 17 is the ruled surface substrate, and 18 is the micro-nano structure of machine-shaping on this substrate; 19 is irregular curved substrate, and 20 is the micro-nano structure that on this substrate, shapes.
In addition, according to the said parameters of treating the substrate of micro-nano processing, and the structure of the battery lead plate of confirming according to conductive surface electric field distribution mode comprises one at least among the performing step S101, also can be for two or more, and it is specially:
According to said conductive surface electric field distribution mode the microstructure graph on the said electrode plate surface is set;
With circular, square, Polygons, ellipse, any one shape in sphere, elliposoidal or all kinds of irregular curved surface or arbitrary combination shape are as the global shape of said battery lead plate;
With band through hole, straight joint, the profile of hole or seam is as the closed curve of said battery lead plate;
With electro-conductive material; The insulating material of perhaps having the electro-conductive material figure; Perhaps the semiconductor material with electro-conductive material constitutes said battery lead plate;
Wherein, the shared bulk of said battery lead plate is that 1mm millimeter * 1mm millimeter * 0.1mm millimeter is to 10m rice * 10m rice * 10m rice.
That is to say; Said battery lead plate can be electro-conductive materials such as metal, ITO, Graphene; Also can be insulating material such as quartz with the electro-conductive material figure, glass, plastics, silicon nitride, silit, pottery, also can be semiconductor materials such as silicon with electro-conductive material, germanium, gallium arsenide.
This electrode pad global shape can be circle, square, Polygons, ellipse, the various combinations of sphere, elliposoidal, various irregular curved surfaces and this type of shape.
This electrode pad can be with through hole, straight joint, and the profile of hole or seam is a closed curve.
The microstructure graph that its electrode plate surface has, character such as the material of figure, shape, size, cycle or non-periodic obtain according to the result of expection processing, or design.
As shown in Figure 4, be the electrode plate structure synoptic diagram; 12 is the battery lead plate substrate among the figure, and 13 is the electrode plate surface structure, and 14 is the battery lead plate through hole; The battery lead plate substrate can be various materials such as semi-conductor, isolator, conductor, and surface micro-structure is a conductor material.Battery lead plate is not to be merely a kind of form of synoptic diagram, according to concrete design demand, any variation can be arranged.
Describe micro-nano processing method in detail among the disclosed embodiment of the invention described above, can adopt the equipment of various ways to realize, therefore the invention also discloses a kind of micro-nano processing units, provide concrete embodiment below and be elaborated for method of the present invention.
Embodiment two
As shown in Figure 5, the structural representation for the disclosed a kind of micro-nano processing units of this embodiment of the invention mainly comprises: battery lead plate 1, substrate 2, electrochemical solution 8, solution tank 9, whipping appts 10 and current source 11.
This substrate 2 is for treating the substrate of micro-nano processing.
Said battery lead plate 1 is according to the parameters of the substrate 2 of treating micro-nano processing, and conductive surface electric field distribution mode
is confirmed structure;
Wherein, parameters comprises the electric field strength E of substrate shape, size, electroconductibility, preprocessing micro-nano structure index and the substrate surface each several part electrostatic field of said substrate 2, and n is the normal component or the radial component of electrostatic field, and H is the mean radius of curvature of electrostatic field.
Said solution tank 9 is used to carry according to the structure of said battery lead plate 1 and the preprocessing micro-nano structure index of said substrate 2; Confirm to preset the electrochemical solution 8 of the allocation ratio of the mode correspondence of processing micro-nano structure, and partly or entirely be arranged at the said battery lead plate 1 and substrate 2 in the said electrochemical solution 8;
The male or female of said current source 11 is connected said battery lead plate 1 respectively with substrate 2 according to the mode of preset processing micro-nano structure.
Probe into the whipping appts 10 in the said solution tank 9; The part that said whipping appts 10 probes into said electrochemical solution 8 is an isolator; When said current source 11 powers on; Said whipping appts 10 stirs said electrochemical solution 8 in Preset Time, the current carrier in the said electrochemical solution 8 is moved on said substrate 2, obtains to be positioned at the micro-nano structure 3 that meets said preset processing micro-nano structure index on the said substrate 2.
Concrete implementation in above-mentioned each parts or the device, and the qualification between each execution unit can be referring to the method embodiment of above-mentioned correspondence.Here repeat no more.
The disclosed micro-nano processing units of the invention described above; It treats that through control the substrate surface distribution of electrostatic of micro-nano processing controls the reactive ion in the electrochemical solution; Perhaps current carrier is to the speed of each position motion of substrate; Thereby control the speed of each substrate corresponding position, finally on this substrate, prepare micro-nano structure with certain face shape distribution according to the mode of preset processing micro-nano structure.Thereby realize utilizing electrostatic field to control the purpose of three-dimensional and curved substrate micro-nano structure low cost, high-level efficiency, high definition shaping.
Embodiment three
Based on disclosed micro-nano processing units among disclosed micro-nano processing method in the foregoing description one and the embodiment two.Because micro-nano structure material category to be processed is a lot, present embodiment provides a specific examples.At present embodiment is example with deposited copper micro-nano structure figure on the gold substrate of plane only, need to prove that in addition the making of other material micro-nano structure through changing electrochemical solution and battery lead plate, by following concrete operations mode, can realize equally.
This embodiment of the invention based on micro-nano processing as shown in Figure 5, wherein, the micro-nano structure 3 that prepare is the deposited copper micro-nano structure, electrochemical solution 8 be a copper plating bath, battery lead plate 1, substrate 2, solution tank 9, whipping appts 10 and current source 11.
The operating process of this embodiment of the invention is as shown in Figure 6, mainly may further comprise the steps:
Step S201 uses the surperficial copper coin of having circular ring structure as battery lead plate 1, wherein, and the thick 1mm millimeter of copper coin; Diameter 10mm millimeter, annulus outside diameter 400 μ m microns, interior diameter 300 μ m microns; Circle ring center is positioned at 2mm millimeter place, copper coin edge, the outstanding copper coin of annulus surface 0.3mm millimeter.
Step S202 as battery lead plate 1, is an example with deposited copper micro-nano structure 3 according to the copper coin among the step S201 here, thus the electrochemical solution 8 of performing step S202 preparation copper plating bath.
Step S203 connects current source 11 positive poles with battery lead plate 1, and substrate 2 connects the negative pole of current source 11, and battery lead plate 1 and substrate 2 are placed copper plating bath 8 simultaneously.
Step S204, adjustment battery lead plate 1 is in parallel over against the position with substrate property 2.Wherein, make both at a distance of the 0.2mm millimeter.
Step S205 powers on, energising processing 10min minute.Wherein, the electric current of said current source is with the electric current 3A in 0 ~ 1min that is changed to of said Preset Time, electric current 1A in the electric current 2A in 1 ~ 2min, 2 ~ 10min.This variation can specifically realize through the energising work program.
Step S206 in galvanization, stirs electrochemical solution, and it is even as far as possible to make that current carrier distributes, the energising EP, and the substrate with micro-nano structure is taken out in outage.
In sum:
Through disclosed micro-nano processing method of each embodiment of the invention described above and equipment,, can on the substrate of arbitrary face shape, obtain random two-dimensional or three-D micro-nano yardstick figure through adopting the method for electrochemical machining of control distribution of electrostatic.Simultaneously, adopt and unconventional metal plate, but the surface has the battery lead plate of figure; And in the process that realizes micro-nano structure processing, there is not mask fabrication; And on substrate, need not prepared beforehand photoresist material or other polymkeric substance graphics templates.Come the control current density distribution through the control distribution of electrostatic at last; And then control different zones metal deposition or etching speed; The final any pattern microstructure that obtains expection is different from the principle technologically than popular photoetching technique and various copying and printing at present fully, and its resolving power does not receive the restriction of diffraction limit and die size; Can solve the unmanageable difficult problem of 3D micro-nano structure, solve the problem that is difficult to preparation micro-nano graph on curved substrate at present simultaneously.
In addition, its working (machining) efficiency of this embodiment of the invention disclosed method is higher, need not complex apparatus, and cost is also lower, further realizes utilizing electrostatic field to control the purpose of three-dimensional and curved substrate micro-nano structure low cost, high-level efficiency, high definition shaping.
Each embodiment adopts the mode of going forward one by one to describe in this specification sheets, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed device of embodiment, because it is corresponding with the embodiment disclosed method, so description is fairly simple, relevant part is partly explained referring to method and is got final product.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments among this paper.Therefore, the present invention will can not be restricted to these embodiment shown in this paper, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (10)
1. a micro-nano processing method is characterized in that, comprising:
Obtain the parameters of the substrate of treating micro-nano processing, and according to conductive surface electric field distribution mode
Confirm the structure of battery lead plate;
Wherein, Parameters comprises the electric field strength E of substrate shape, size, electroconductibility, preprocessing micro-nano structure index and the substrate surface position electrostatic field of said substrate; N is the normal component or the radial component of electrostatic field, and H is the mean radius of curvature of battery lead plate position;
According to the structure of said battery lead plate and the preprocessing micro-nano structure index of said substrate, confirm to preset the allocation ratio of the electrochemical solution of the mode correspondence of processing micro-nano structure, and obtain said electrochemical solution;
According to the mode of preset processing micro-nano structure said battery lead plate and substrate are connected the male or female of current source respectively, and the part or all of of said battery lead plate and substrate is positioned in the said electrochemical solution according to relative mode;
Power on, in Preset Time, stir said electrochemical solution, the current carrier in the said electrochemical solution is moved on said substrate, obtain to be positioned at the micro-nano structure that meets said preset processing micro-nano structure index on the said substrate.
2. method according to claim 1 is characterized in that the mode of said preset processing micro-nano structure comprises electroplating deposition or electrolytic etching;
When the mode of said preset processing micro-nano structure was electroplating deposition, said battery lead plate was connected with the anode of said current source, and said substrate is connected with the negative electrode of said current source;
When the mode of said preset processing micro-nano structure was electrolytic etching, said battery lead plate was connected with the negative electrode of said current source, and said substrate is connected with the anode of said current source.
3. method according to claim 1 is characterized in that the mode of said preset processing micro-nano structure comprises electroplating deposition or electrolytic etching;
Positively charged ion in the said electrochemical solution is with a kind of element with the material of the said substrate of corresponding electroplating deposition or electrolytic etching.
4. method according to claim 1 is characterized in that, comprising: opposing parallel is over against placing, tilt to place, vertically placing or said battery lead plate of placed offset and said substrate in said electrochemical solution;
The distance range of said battery lead plate and said substrate is 0 ~ 10m rice.
5. method according to claim 1 is characterized in that, according to the said parameters of treating the substrate of micro-nano processing, and the structure of the battery lead plate of confirming according to conductive surface electric field distribution mode is specially:
According to said conductive surface electric field distribution mode the microstructure graph on the said electrode plate surface is set;
With circular, square, Polygons, ellipse, any one shape in sphere, elliposoidal or all kinds of irregular curved surface or arbitrary combination shape are as the global shape of said battery lead plate;
With band through hole, straight joint, the profile of hole or seam is as the closed curve of said battery lead plate;
With electro-conductive material; The insulating material of perhaps having the electro-conductive material figure; Perhaps the semiconductor material with electro-conductive material constitutes said battery lead plate;
Wherein, the shared bulk of said battery lead plate is that 1mm millimeter * 1mm millimeter * 0.1mm millimeter is to 10m rice * 10m rice * 10m rice; Said battery lead plate comprises one at least.
6. method according to claim 1 is characterized in that, said substrate is by silicon, germanium, gallium arsenide, ITO, Graphene, metal, plastics, PMMA, PDMS, and silit, silicon nitride or stupalith constitute;
The shape of said substrate comprises: discoid, straight profiles is dull and stereotyped, curved profile is dull and stereotyped, elliposoidal, sphere, parabolic shape, hyperbolic is planar, saddle is planar, cylinder is planar, index is planar, trigonometrical function is planar, sawtooth is planar, with through hole or do not have the planeform or the curve form of through hole;
The shared bulk of said substrate is that 1mm millimeter * 1mm millimeter * 0.1mm millimeter is to 10m rice * 10m rice * 10m rice.
7. method according to claim 1 is characterized in that, the range of current of said current source comprises: the 0mA milliampere is pacified to 1000A;
Said Preset Time comprises: 0 ~ 99999 second;
Wherein, in said Preset Time, the electric current of said current source is pressed the wave form varies of straight line, dressing function, cycle gate function, trigonometrical function, zigzag wave function or exponential function with said Preset Time.
8. method according to claim 1 is characterized in that, the stirring amplitude when stirring said electrochemical solution is lower than the liquid level of said electrochemical solution.
9. method according to claim 1 is characterized in that, when the said substrate of treating micro-nano processing when being a plurality of, single adopts said micro-nano processing method that a said substrate of micro-nano processing of treating is carried out micro-nano processing; Perhaps, single carries out micro-nano processing to a plurality of said substrates of micro-nano processing of treating simultaneously.
10. a micro-nano processing units is characterized in that, comprising:
Treat the substrate of micro-nano processing;
Battery lead plate; Said battery lead plate is according to the parameters of the substrate of treating micro-nano processing, and conductive surface electric field distribution mode
is confirmed structure;
Wherein, Parameters comprises the electric field strength E of substrate shape, size, electroconductibility, preprocessing micro-nano structure index and the substrate surface each several part electrostatic field of said substrate; N is the normal component or the radial component of electrostatic field, and H is the mean radius of curvature of a battery lead plate position;
Solution tank; Said solution tank is used to carry according to the structure of said battery lead plate and the preprocessing micro-nano structure index of said substrate; Confirm to preset the electrochemical solution of the allocation ratio of the mode correspondence of processing micro-nano structure, and partly or entirely be arranged at said battery lead plate and the substrate in the said electrochemical solution;
Current source, the male or female of said current source is connected said battery lead plate respectively with substrate according to the mode of preset processing micro-nano structure;
Probe into the whipping appts in the said solution tank; The part that said whipping appts probes into said electrochemical solution is an isolator; When said current source powers on; Said whipping appts stirs said electrochemical solution in Preset Time, the current carrier in the said electrochemical solution is moved on said substrate, obtains to be positioned at the micro-nano structure that meets said preset processing micro-nano structure index on the said substrate.
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