CN104674313B - A kind of electro-plating method and device that array micro-nano structure is prepared on coated metal surface - Google Patents
A kind of electro-plating method and device that array micro-nano structure is prepared on coated metal surface Download PDFInfo
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- CN104674313B CN104674313B CN201510071023.6A CN201510071023A CN104674313B CN 104674313 B CN104674313 B CN 104674313B CN 201510071023 A CN201510071023 A CN 201510071023A CN 104674313 B CN104674313 B CN 104674313B
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Abstract
The invention discloses a kind of electro-plating method and device that array micro-nano structure is prepared on coated metal surface, anode is respectively provided with the electroplate liquid entrance of electroplate liquid flow channel and outlet；The model sheetinstallat station of the thin-film template for placing micro-nano structure is provided with the upside of the passage of electroplate liquid flow channel, the substrate being provided with the downside of the passage of electroplate liquid flow channel for installation base plate installs station；Due to the control of the flow velocity and current adjustment of electroplate liquid in the electroplate liquid flow channel and passage of unique structure, it is greatly improved the quality of electroplating technology, with reference to this electro-plating method, not only whole electroplating process technological means is simple and easy to do, saving of work and time, and it is with low cost, Flexible formwork assembly is applicable to, and self adaptation curve form design can be carried out according to substrate shapes, the coating with array micro-nano structure is prepared in plane or curved surface.Realize integration prepared by coating and its surface texture, it is not necessary to which secondary structure preparation is carried out to coating.
Description
Technical field
The present invention relates to electroplating technology and its device, more particularly to one kind array micro-nano structure is prepared on coated metal surface
Electro-plating method and device.
Background technology
Growth with society to technological innovation needs, was mainly used in the metal and non-metal electroplating of decorative articles in the past
Technology, has become important functional coating and accuracy electroplate technology now.
Especially using quite varied in the middle of semiconductor microelectronic industry, and with semiconductor integrated circuit to high density,
Small light develops, and various new type functional electroplating technologies will be continued to bring out.
But electroplating technology ripe at present can only realize the compactness and surface smoothness of coating, fail by directly control
Electric current processed, electroplate liquid etc. directly prepare array micro-nano structure on coated metal surface.
Material property is improved by preparing function of surface structure has extensive utilization, such as improves material hydrophilic, carries
Self-cleaning property high etc..Exploration prepares micro-nano structure on coated metal surface, and further improvement functional coating performance has important
Meaning.
Particularly in electronic technology, circuit degree of integration more and more higher, circuit board heat flow density increases, and is plated by improving
Layer Copper Foil specific surface area will have great meaning improving heat dissipation for circuit board ability.
The content of the invention
Can not yet realize preparing functional structure on coated metal surface it is an object of the invention to be directed to existing electroplating technology
Technical deficiency, there is provided a kind of electro-plating method and device that array micro-nano structure is prepared on coated metal surface.
The present invention is achieved through the following technical solutions：
A kind of electroplanting device that array micro-nano structure is prepared on coated metal surface, the electroplanting device includes circulating pump 4, electricity
Source 8, electroplate liquid flow channel 3-1；Anode is respectively provided with electroplate liquid entrance and the electroplate liquid outlet of electroplate liquid flow channel 3-1
2；The model sheetinstallat of the thin-film template 5 for placing micro-nano structure 5-1 is provided with the upside of the passage of electroplate liquid flow channel 3-1
Station, is provided with the substrate peace for installing the substrate 6-1 with seed coating on the downside of the passage of electroplate liquid flow channel 3-1
Dress station；The positive pole jointed anode 2 of the power supply 8, negative pole is used as the negative electrode 7 for connecting seed coating.
Current control module 1 is provided between the positive pole and anode 2 of the power supply 8.
The circulating pump 4 has a rate control module for controlling its rotating speed.
The electro-plating method for preparing array micro-nano structure on coated metal surface is as follows：
(1) according to metal or organic plating substrate characteristics, from sputtering method or chemical deposit method in substrate 6-1 surface systems
Standby thickness is the seed coating 6 of 0.1-1um, and initial layers are adsorbed as coated metal；Then this had the substrate of seed coating 6
6-1 is arranged on the substrate on the downside of electroplate liquid flow channel 3-1 and installs on station, the contact plating liquid of seed coating 6；
(2) surface is had the thin-film template 5 of micro-nano structure, electroplate liquid flow channel is arranged on by model sheetinstallat station
The passage upside of 3-1, the micro-nano structure 5-1 contact plating liquid of thin-film template 5；The end of micro-nano structure 5-1 and step (1) are described
The distance between seed coating is 20-100um, and thin-film template 5 is prepared as the constraint template of coating on coated metal surface
The micro-nano structure of correspondence thin-film template 5；
(3) property of initial layers and coated metal material is adsorbed according to coated metal to be plated, by metallic particles 3-2 and is filled out
Hole photo etching is added in electroplate liquid, and filling perforation photo etching is used to refine coating crystalline texture, and the coating for forming metallic particles 3-2 is filled
There is flat configuration during micro-nano structure 5-1；
(4) in plating starting stage, the rotating speed control by current control module 1 and rate control module to circulating pump 4
System, using 2-10A/dm2Current density, coordinate 0.3-1.5ms-1Flow velocity of the electroplate liquid in electroplate liquid flow channel 3-1
Carry out lagging cover；Whne metallic particles 3-2 be grown on seed coating 6 and will with the nib contacts of micro-nano structure 5-1 when, by
Gradually it is limited in electroplate liquid flowing, now uses 0.2-2A/dm instead2Current density, and increase electroplate liquid in flow channel 3-1
Flow velocity to 1.5-6ms-1Smart plating is carried out, metallic particles 3-2 is successfully constantly grown on seed coating 6, until
Space between whole micro-nano structure 5-1 is filled up and contacts thin-film template 5, is at the same time stopped in electroplate liquid flow channel 3-1
Flowing, i.e. electroless plating liquid 3 in electroplate liquid flow channel 3-1, coating stops growing, and completes the micro-nano structure electricity on seed coating 6
Plating；
(5) after the completion of electroplating, thin-film template 5 is dissolved from organic solvent, that is, obtains surface topography for concavity cylinder, circle
The coat of metal of the micro-nano array structure of cone, rectangle or hemisphere.
The depth of step (5) the micro-nano array structure is 2-100um.
The temperature of electroplate liquid 3 is 30 DEG C.
The present invention has the following advantages and effect relative to prior art：
The present apparatus, anode 2 is respectively provided with electroplate liquid entrance and the electroplate liquid outlet of electroplate liquid flow channel 3-1；In electricity
The passage upside of flow of the electrolyte passage 3-1 is provided with the model sheetinstallat station of the thin-film template 5 for placing micro-nano structure 5-1,
The substrate erector for installing the substrate 6-1 with seed coating is provided with the downside of the passage of electroplate liquid flow channel 3-1
Position；The positive pole jointed anode 2 of the power supply 8, negative pole is used as the negative electrode 7 for connecting seed coating.Due to the electricity of unique structure
The control of the flow velocity and current adjustment of electroplate liquid, is greatly improved electroplating technology in flow of the electrolyte passage 3-1 and passage
Quality, with reference to this electro-plating method, not only whole electroplating process technological means is simple and easy to do, saving of work and time, and with low cost.
In electroplating process, by placing the film mould with micro-nano structure on the upside of the passage of electroplate liquid flow channel 3-1
Plate, the thin-film template grows constraint template as coating, and thin-film template can be dissolved by lysate again, realize thin-film template
Separated with micro-nano structure coating, the adjustment of thickness of coating and micro-nano structure pattern can be carried out.
The present apparatus is applicable to Flexible formwork assembly, and can carry out self adaptation curve form design according to substrate shapes, in plane
Or curved surface prepares the coating with array micro-nano structure.Integration prepared by coating and its surface texture is realized, no
Need to carry out secondary structure preparation to coating.
Concavity array structure is prepared for circuit board copper foil surface, boiling heat transfer performance can be effectively improved, greatly improve electricity
Road plate heat dispersion.
Brief description of the drawings
Electroplanting device structural representation of the present invention shown in Fig. 1.
Shown in Fig. 2 the electro-plating method schematic flow sheet of array micro-nano structure is prepared on coated metal surface；Shown in figure, gold
Metal particles 3-2 is grown on seed coating 6, but state during nib contacts not with micro-nano structure 5-1.
Shown in Fig. 3 the electro-plating method schematic flow sheet of array micro-nano structure is prepared on coated metal surface；Shown in figure, gold
Metal particles 3-2 is grown on seed coating 6, and state when will be contacted with the tip of micro-nano structure 5-1.
Shown in Fig. 4 the electro-plating method schematic flow sheet of array micro-nano structure is prepared on coated metal surface；Shown in figure, gold
Metal particles 3-2 is grown on seed coating 6, and the state before gradually the space between whole micro-nano structure 5-1 is filled up.
Specific embodiment
The present invention is more specifically described in detail with reference to specific embodiment.
Embodiment
As shown in Figures 1 to 4.A kind of electroplanting device that array micro-nano structure is prepared on coated metal surface of the present invention, the electricity
Plating appts include circulating pump 4, power supply 8, electroplate liquid flow channel 3-1；In the electroplate liquid entrance and electricity of electroplate liquid flow channel 3-1
Plating solution outlet is respectively provided with anode 2；It is provided with the upside of the passage of electroplate liquid flow channel 3-1 for placing micro-nano structure 5-1
Thin-film template 5 model sheetinstallat station, be provided with the downside of the passage of electroplate liquid flow channel 3-1 for install have seed
The substrate of the substrate 6-1 of coating installs station；The positive pole jointed anode 2 of the power supply 8, negative pole is used as connecting seed coating
Negative electrode 7.
Current control module 1 is provided between the positive pole and anode 2 of the power supply 8.
The circulating pump 4 has a rate control module for controlling its rotating speed.
The electro-plating method for preparing array micro-nano structure on coated metal surface is as follows：
(1) according to metal or organic plating substrate characteristics, from sputtering method or chemical deposit method in substrate 6-1 surface systems
Standby thickness is the seed coating 6 of 0.1-1um, and initial layers are adsorbed as coated metal；Then this had the substrate of seed coating 6
6-1 is arranged on the substrate on the downside of electroplate liquid flow channel 3-1 and installs on station, the contact plating liquid of seed coating 6；
(2) surface is had the thin-film template 5 of micro-nano structure (metal), electroplate liquid stream is arranged on by model sheetinstallat station
The passage upside of dynamic passage 3-1, the micro-nano structure 5-1 contact plating liquid of thin-film template 5；The end of micro-nano structure 5-1 and step
(1) the distance between described seed coating be 20-100um (preferably 50um), thin-film template 5 (macromolecule) as coating constraint
Template, the micro-nano structure of correspondence thin-film template 5 is prepared on coated metal surface；
(3) property of initial layers and coated metal material is adsorbed according to coated metal to be plated, by metallic particles 3-2 and is filled out
Hole photo etching is added in electroplate liquid, and filling perforation photo etching is used to refine coating crystalline texture, and the coating for forming metallic particles 3-2 is filled
There is flat configuration during micro-nano structure 5-1；
(4) in plating starting stage, the rotating speed control by current control module 1 and rate control module to circulating pump 4
System, using 2-10A/dm2Current density (preferably 3A/dm2), coordinate 0.3-1.5ms-1(preferably electroplating time is 20min)
Flow velocity of the electroplate liquid in electroplate liquid flow channel 3-1 carries out lagging cover；Treat that metallic particles 3-2 is grown on seed coating 6
And will with the nib contacts of micro-nano structure 5-1 when, due to electroplate liquid flowing be gradually limited, now use 0.2-2A/dm instead2Electricity
Current density (preferably 0.5A/dm2), and increase flow velocity of the electroplate liquid in flow channel 3-1 to 1.5-6ms-1Carry out smart plating (excellent
Select 1.8ms-1), metallic particles 3-2 is successfully constantly grown on seed coating 6, until by whole micro-nano structure 5-1
Between space fill up and contact thin-film template 5, flowing, i.e. electroplate liquid flowing are at the same time stopped in electroplate liquid flow channel 3-1
Electroless plating liquid 3 in passage 3-1, coating stops growing, and completes the micro-nano structure plating on seed coating 6；(by controlling electroplate liquid
Flow velocity, can effectively prevent Nonuniform filling cause at micro-nano structure opening occur block or coating in there is space.)
(5) after the completion of electroplating, thin-film template 5 is dissolved from organic solvent, that is, obtains surface topography for concavity cylinder, circle
The coat of metal of the micro-nano array structure of cone, rectangle or hemisphere.
The depth of step (5) the micro-nano array structure is 2-100um.
Electroplate liquid 3 (CuSo4 electroplate liquids) temperature is 30 DEG C.
The thin-film template 5 of micro-nano structure is not connected with electrode, constraint template is grown as coated metal, by rational allocation
Electrolyte and applying bath flow rate, preparing large area has the plane or curved surface compact metal coating of array micro-nano structure, with
Further improve coated metal surface property.
The present invention can also carry out the self-adaptative adjustment of Flexible formwork assembly curve form according to substrate shapes, both can be with plane base
Material is connected, and can be also connected with Curved surface metal, and realization prepares array micro-nano by electric plating method in curved surface or planar metal surface
Structure.
Embodiments of the present invention are simultaneously not restricted to the described embodiments, and other are any without departing from Spirit Essence of the invention
With the change, modification, replacement made under principle, combine, simplify, should be equivalent substitute mode, be included in of the invention
Within protection domain.
Claims (6)
1. a kind of electroplanting device that array micro-nano structure is prepared on coated metal surface, it is characterised in that：The electroplanting device includes
Circulating pump (4), power supply (8), electroplate liquid flow channel (3-1)；Electroplate liquid entrance and plating in electroplate liquid flow channel (3-1)
Liquid outlet is respectively provided with anode (2)；It is provided with for placing micro-nano structure in the passage upside of electroplate liquid flow channel (3-1)
The model sheetinstallat station of the thin-film template (5) of (5-1), is provided with for pacifying in the passage downside of electroplate liquid flow channel (3-1)
The substrate that harness has the substrate (6-1) of seed coating installs station；The positive pole jointed anode (2) of the power supply (8), negative pole conduct
Negative electrode (7) for connecting seed coating.
2. electroplanting device according to claim 1, it is characterised in that：Set between the positive pole and anode (2) of the power supply (8)
It is equipped with current control module (1).
3. electroplanting device according to claim 1, it is characterised in that：The circulating pump (4) controls its rotating speed with one
Rate control module.
4. the electricity of array micro-nano structure is prepared on coated metal surface using electroplanting device any one of claims 1 to 3
Electroplating method, it is characterised in that comprise the following steps：
(1) according to metal or organic plating substrate characteristics, prepared on substrate (6-1) surface from sputtering method or chemical deposit method
Thickness is 0.1-1 μm of seed coating (6), and initial layers are adsorbed as coated metal；Then this had the base of seed coating (6)
Plate (6-1) is arranged on the substrate on the downside of electroplate liquid flow channel (3-1) and installs on station, seed coating (6) contact plating liquid；
(2) surface is had the thin-film template (5) of micro-nano structure, electroplate liquid flow channel is arranged on by model sheetinstallat station
The passage upside of (3-1), micro-nano structure (5-1) contact plating liquid of thin-film template (5)；The end of micro-nano structure (5-1) and step
Suddenly the distance between (1) described seed coating (6) be 20-100 μm, thin-film template (5) as coating constraint template, in coating
Prepare the micro-nano structure of correspondence thin-film template (5) in metal surface；
(3) property of initial layers and coated metal material is adsorbed according to coated metal to be plated, by metallic particles (3-2) and filling perforation
Photo etching is added in electroplate liquid, and filling perforation photo etching is used to refine coating crystalline texture, and the coating for forming metallic particles (3-2) is filled
There is flat configuration during micro-nano structure (5-1)；
(4) in plating starting stage, the rotating speed control by current control module (1) and rate control module to circulating pump (4)
System, using 2-10A/dm2Current density, coordinate 0.3-1.5ms-1Stream of the electroplate liquid in electroplate liquid flow channel (3-1)
Speed carries out lagging cover；Treat that metallic particles (3-2) is grown into and will be with the tip of micro-nano structure (5-1) on seed coating (6)
During contact, because electroplate liquid flowing is gradually limited, 0.2-2A/dm is now used instead2Current density, and increase electroplate liquid flowing
Passage（3-1）Interior flow velocity is to 1.5-6ms-1Smart plating is carried out, makes the metallic particles (3-2) can successfully in seed coating (6)
Upper constantly growth, until space between whole micro-nano structure (5-1) is filled up and thin-film template (5) is contacted, at the same time electroplates
Stop flowing, the i.e. interior electroless plating liquid (3) of electroplate liquid flow channel (3-1) in liquid flow channel (3-1), coating stops growing, complete
Into the micro-nano structure plating on seed coating (6)；
(5) after the completion of electroplating, thin-film template (5) is dissolved from organic solvent, that is, obtains surface topography for concavity cylinder, circle
The coat of metal of the micro-nano array structure of cone, rectangle or hemisphere.
5. electro-plating method according to claim 4, it is characterised in that：The depth of step (5) the micro-nano array structure is
2-100μm。
6. electro-plating method according to claim 4, it is characterised in that：Electroplate liquid (3) temperature is 30 DEG C.
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| CN105253852A (en) * | 2015-09-02 | 2016-01-20 | 西安建筑科技大学 | Manufacturing method of template of micro-nano composite structure |
| CN105329849A (en) * | 2015-10-16 | 2016-02-17 | 上海师范大学 | MEMS micro array structure processing method based on micro-electroplating |
| CN109056011A (en) * | 2018-07-01 | 2018-12-21 | 青岛昊月鑫电子材料有限公司 | A kind of preparation method applied to high capacity lithium ion cells cathode micropore copper foil |
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| WO2006080148A1 (en) * | 2005-01-25 | 2006-08-03 | Nippon Mining & Metals Co., Ltd. | Copper electrolysis solution containing compound having specific skeleton as additive, and electrolytic copper foil produced therefrom |
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| CN203080093U (en) * | 2012-12-20 | 2013-07-24 | 华南理工大学 | Electro-deposition device for manufacturing micro-nano composite porous copper surface structure |
| CN103320825A (en) * | 2013-06-06 | 2013-09-25 | 宁波微极电子科技有限公司 | Method for manufacturing high-density large-scale micro-nano-structure array |
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