CN203080093U - Electro-deposition device for manufacturing micro-nano composite porous copper surface structure - Google Patents
Electro-deposition device for manufacturing micro-nano composite porous copper surface structure Download PDFInfo
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- CN203080093U CN203080093U CN 201220712913 CN201220712913U CN203080093U CN 203080093 U CN203080093 U CN 203080093U CN 201220712913 CN201220712913 CN 201220712913 CN 201220712913 U CN201220712913 U CN 201220712913U CN 203080093 U CN203080093 U CN 203080093U
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Abstract
The utility model relates to an electro-deposition device and discloses an electro-deposition device for manufacturing a micro-nano composite porous copper surface structure. The electro-deposition device is used for manufacturing the porous copper structure by electro-deposition through a hydrogen-gas template process. The electro-deposition device for manufacturing the micro-nano composite porous copper surface structure comprises an electro-deposition slot, electro-deposition liquid, a direct-current power supply, a cathode base body and an anode, wherein the anode and the cathode base body are connected with the positive electrode and negative electrode of the direct-current power supply, respectively; the electro-deposition liquid, the cathode base body and the anode are arranged in the electro-deposition slot; and the cathode base body and the anode are soaked in the electro-deposition liquid. The cathode base body and the anode are a red copper column and a red copper plate, respectively, wherein the cathode base body is arranged on the bottom of the electro-deposition slot; the upward top surface of the cathode base body is an electro-deposition layer; and the anode is arranged above the cathode base body. The cathode base body and the anode are horizontally arranged; and the anode area is large enough, so that the cathode base body acquires uniform current density. The pore diameter of the porous copper surface structure manufactured by the electrode-deposition device is greatly increased, and the structure is uniform, and therefore, the porous copper surface structure is a micro-nano composite structure which is formed by superposing a micro-scale pore diameter structure and a wall surface nanometer branched crystal structure.
Description
Technical field
The utility model relates to electric deposition device, particularly a kind of electric deposition device for preparing micro-nano compound porous copper surface tissue.
Background technology
Porous metal material has the characteristics of the big and connectivity of specific surface area, can fully contact with gas phase or liquid phase, is widely used in fields such as battery, electrochemical capacitor, electrochemical sensor, chemical catalysis, enhancement of heat transfer boilings.Copper is as good heat-transfer matcrial, and its vesicular structure has clear superiority in the enhanced boiling heat transfer field.Because porous copper conductivity excellence, the application on the electrode materials of nickel-zinc cell and double layer capacitor also comes into one's own.The preparation method of porous metal copper has a lot, comprise powder metallurgic method, casting, sintering process, take off alloyage, metal deposition, molten metal foaming etc., but these methods or cost height, complex process, or prepared porous steel structure heterogeneity, poor controllability.
The utility model content
The shortcoming that primary and foremost purpose of the present utility model is to overcome prior art provides a kind of electric deposition device for preparing micro-nano compound porous copper surface tissue with not enough, and this device is used for hydrogen template prepared by electrodeposition porous copper surface tissue.
The purpose of this utility model is achieved through the following technical solutions:
A kind of electric deposition device for preparing micro-nano compound porous copper surface tissue, comprise galvanic deposition cell, electrodeposit liquid, direct supply, cathode base and anode, anode and cathode base respectively with direct supply positive and negative, extremely link to each other, electrodeposit liquid, cathode base and anode place galvanic deposition cell, electrodeposit liquid submergence cathode base and anode; Described cathode base and anode are respectively red copper post and copper sheet, and cathode base places the galvanic deposition cell bottom, and cathode base end face up is a deposition layer, and anode is positioned at the top of cathode base.
The equal horizontal positioned of described cathode base and anode makes cathode base surface bubble hydrogen uniform distribution, disengaging, prevents the phase mutual interference; Described annode area is enough big so that cathode base obtains uniform current density.
Described electrodeposit liquid is by H
2SO
4And CuSO
4The aqueous solution and additive form, its composition is preferably: CuSO
40.2～0.6mol/L, H
2SO
41.0 ~ 1.5mol/L, HCl 10 ~ 20mmol/L.
The utility model has following advantage and effect with respect to prior art:
(1) the utility model makes cathode base surface bubble hydrogen uniform distribution, disengaging with anode and cathode base horizontal positioned, prevents the phase mutual interference; The anodic area is enough big so that cathode base obtains uniform current density.
(2) use the porous copper surface tissue aperture of the utility model preparation to increase step by step, the structure homogeneous is micro-meter scale aperture structure and the synergetic micron and nanometer composite structure of the dendritic crystal structure of wall nanometer.
Description of drawings
Fig. 1 is the electric deposition device synoptic diagram of the micro-nano compound porous copper surface tissue of preparation, and 1 is galvanic deposition cell, and 2 is electrodeposit liquid, and 3 is direct supply, and 4 is cathode base, and 5 is anode, and 6 is deposition layer.
Fig. 2 is the process synoptic diagram of hydrogen template prepared by electrodeposition porous copper surface tissue.
Fig. 3 is the sem photograph of the micro-nano compound porous copper surface tissue for preparing.
Embodiment
Below in conjunction with embodiment and accompanying drawing the utility model is described in further detail, but embodiment of the present utility model is not limited thereto.
A kind of device for preparing micro-nano compound porous copper surface tissue as shown in Figure 1, comprise galvanic deposition cell 1, electrodeposit liquid 2, direct supply 3, cathode base 4 and anode 5, anode 5 links to each other with the positive and negative electrode of direct supply 3 respectively with cathode base 4, electrodeposit liquid 2, cathode base 4 and anode 5 place galvanic deposition cell 1, electrodeposit liquid 2 submergence cathode bases 4 and anode 5.
Cathode base 4 and anode 5 are respectively red copper post and copper sheet, and cathode base 4 places galvanic deposition cell 1 bottom, and cathode base 4 end face up is a deposition layer 6, and anode 5 is positioned at the top of cathode base 4.Cathode base 4 and anode 5 equal horizontal positioned make cathode base surface bubble hydrogen uniform distribution, disengaging, prevent the phase mutual interference; Anode 5 areas are enough big so that cathode base 4 obtains uniform current density.
The composition of electrodeposit liquid 2: CuSO
4Concentration is 0.4mol/L, H
2SO
4Concentration is 1.5mol/L, and additive is 20mmol/L for HCl concentration.
Embodiment 2
(1) preparation electrodeposit liquid.Electrodeposit liquid 2 compositions: CuSO
4Concentration is 0.4mol/L, H
2SO
4Concentration is 1.5mol/L, and additive is 20mmol/L for HCl concentration.
(2) prepare cathode base.Cathode base 4 adopts the red copper post, only carries out galvanic deposit at the dome face, and the dome face uses methyl alcohol/nitric acid (V/V)=9/1 as polishing fluid, voltage 6～7V/cm with 800～1000 purpose sand paperings
2Carry out electropolishing, with the activation of 10wt% dilute sulphuric acid; The face that cathode base 4 is not carried out galvanic deposit is coated with envelope with silica gel 704.
(3) prepare anode.Anode 5 adopts copper sheet, and annode area should be enough big so that cathode base obtains uniform current density.
(4) coupling device.To install and press Fig. 1 connection.
(5) galvanic deposit.Current density is set to 3A/cm
2, electrodeposition time is 12s.Electrodeposition process as shown in Figure 2, during energising, bubble hydrogen 8 is separated out from substrate 7, simultaneously the cupric ion reduce deposition is to substrate 7.The position that bubble hydrogen 8 occupies can not form settled layer, cupric ion can only be in the space between bubble " template " reduce deposition, because sedimentation velocity is very fast, cupric ion around the deposited copper exhausts fast, adding that hydrogen is constantly separated out makes cupric ion can't be diffused into depleted region, therefore deposited copper can only the space between bubble in continuous growth, thereby form porous copper layer 9.
(6) aftertreatment of sample.Take out the galvanic deposit sample and soak 1min with deionized water, repeat twice, use alcohol immersion 30s again, take out in air, to dry and obtain micro-nano compound porous copper surface tissue, as shown in Figure 3, its aperture increases step by step, and the structure homogeneous is micro-meter scale aperture structure and the synergetic micron and nanometer composite structure of the dendritic crystal structure of wall nanometer.
(7) thermal treatment.With the micro-nano compound porous copper surface tissue that obtains at H
2Carry out 500 ℃ of thermal treatments under the reducing atmosphere, strengthen the bonding force of micro-nano compound porous copper surface tissue.
The foregoing description is the utility model preferred implementation; but embodiment of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under spirit of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.
Claims (3)
1. electric deposition device for preparing micro-nano compound porous copper surface tissue, comprise galvanic deposition cell, electrodeposit liquid, direct supply, cathode base and anode, anode links to each other with the positive and negative electrode of direct supply respectively with cathode base, electrodeposit liquid, cathode base and anode place galvanic deposition cell, electrodeposit liquid submergence cathode base and anode, it is characterized in that: described cathode base and anode are respectively red copper post and copper sheet, cathode base places the galvanic deposition cell bottom, cathode base end face up is a deposition layer, and anode is positioned at the top of cathode base.
2. the electric deposition device of the micro-nano compound porous copper surface tissue of preparation according to claim 1 is characterized in that: the equal horizontal positioned of described cathode base and anode.
3. the electric deposition device of the micro-nano compound porous copper surface tissue of preparation according to claim 1 is characterized in that: described annode area is enough big so that cathode base obtains uniform current density.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220712913 CN203080093U (en) | 2012-12-20 | 2012-12-20 | Electro-deposition device for manufacturing micro-nano composite porous copper surface structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220712913 CN203080093U (en) | 2012-12-20 | 2012-12-20 | Electro-deposition device for manufacturing micro-nano composite porous copper surface structure |
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| CN203080093U true CN203080093U (en) | 2013-07-24 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104674313A (en) * | 2015-02-10 | 2015-06-03 | 华南理工大学 | Electroplating method and device for preparing array micro/nanostructure on coated metal surface |
| CN104818503A (en) * | 2015-04-15 | 2015-08-05 | 同济大学 | Preparation method of porous copper full-impregnated film of three-dimensional network structure |
| CN105714357A (en) * | 2016-04-29 | 2016-06-29 | 中国工程物理研究院化工材料研究所 | Electrophoretic deposition charging method for energetic material |
| CN106681078A (en) * | 2016-12-21 | 2017-05-17 | 北京工业大学 | Large-area, uniform and fast-responding WO3 electrochromic device and preparation method thereof |
| CN108914178A (en) * | 2018-09-19 | 2018-11-30 | 江西华度电子新材料有限公司 | A method of it is uneven to solve galvanoplastic preparation wick thickness |
| CN109056011A (en) * | 2018-07-01 | 2018-12-21 | 青岛昊月鑫电子材料有限公司 | A kind of preparation method applied to high capacity lithium ion cells cathode micropore copper foil |
| CN110438525A (en) * | 2019-08-08 | 2019-11-12 | 广东省新材料研究所 | A kind of porous electrode and its application producing gas for electrochemistry |
| CN110629258A (en) * | 2019-10-16 | 2019-12-31 | 东莞领杰金属精密制造科技有限公司 | Preparation method of porous copper liquid absorption core |
-
2012
- 2012-12-20 CN CN 201220712913 patent/CN203080093U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104674313A (en) * | 2015-02-10 | 2015-06-03 | 华南理工大学 | Electroplating method and device for preparing array micro/nanostructure on coated metal surface |
| CN104674313B (en) * | 2015-02-10 | 2017-05-31 | 华南理工大学 | A kind of electro-plating method and device that array micro-nano structure is prepared on coated metal surface |
| CN104818503A (en) * | 2015-04-15 | 2015-08-05 | 同济大学 | Preparation method of porous copper full-impregnated film of three-dimensional network structure |
| CN105714357A (en) * | 2016-04-29 | 2016-06-29 | 中国工程物理研究院化工材料研究所 | Electrophoretic deposition charging method for energetic material |
| CN105714357B (en) * | 2016-04-29 | 2017-10-24 | 中国工程物理研究院化工材料研究所 | Energetic material electrophoretic deposition loading method |
| CN106681078A (en) * | 2016-12-21 | 2017-05-17 | 北京工业大学 | Large-area, uniform and fast-responding WO3 electrochromic device and preparation method thereof |
| CN109056011A (en) * | 2018-07-01 | 2018-12-21 | 青岛昊月鑫电子材料有限公司 | A kind of preparation method applied to high capacity lithium ion cells cathode micropore copper foil |
| CN108914178A (en) * | 2018-09-19 | 2018-11-30 | 江西华度电子新材料有限公司 | A method of it is uneven to solve galvanoplastic preparation wick thickness |
| CN110438525A (en) * | 2019-08-08 | 2019-11-12 | 广东省新材料研究所 | A kind of porous electrode and its application producing gas for electrochemistry |
| CN110629258A (en) * | 2019-10-16 | 2019-12-31 | 东莞领杰金属精密制造科技有限公司 | Preparation method of porous copper liquid absorption core |
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