CN104911568A - Selective chemical plating method - Google Patents
Selective chemical plating method Download PDFInfo
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- CN104911568A CN104911568A CN201510390594.6A CN201510390594A CN104911568A CN 104911568 A CN104911568 A CN 104911568A CN 201510390594 A CN201510390594 A CN 201510390594A CN 104911568 A CN104911568 A CN 104911568A
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Abstract
The invention discloses a selective chemical plating method, and belongs to the technical field of chemical plating. The selective chemical plating method includes: (a) performing pretreatment on basis materials; (b) selectively printing and drying a transition layer on the surface of a basis body; (c) sensitizing and activating the basis body with the transition layer printed on; (d) obtaining a plating part through chemical plating. The selective chemical plating method is simple in technological process and low in cost, and simultaneously has good selectivity, and guarantees accuracy of chemical plating patterns.
Description
Technical field
The invention belongs to electroless plating field, refer more particularly to a kind of method of selective chemical plating.
Background technology
Electroless plating method is an autocatalysis process not needing to provide electric current, it deposits metal in matrix surface by redoxomorphism, its coating prepared has good conductivity and heat conductivility, and its cost is lower, do not need complicated specific equipment, the material of complicated shape can also be applicable to.
At present along with electronic technology and network technical development, require high-precision selective chemical coating technology in some fields such as selectively masking, microelectronic device.Therefore develop and be a kind ofly applicable to various base material, technique selective chemical plating method that is simple and environmental protection is paid close attention to widely.Such as, patent 200810141987.3 discloses a kind of plastics composite and surface selective metallization process thereof.This method uses laser ablation frosting, then puts into and soaks containing metal ion salt solution, finally carry out metallochemistry plating.Patent 200810142571.3 discloses a kind of selective chemical plating method for plastic basis material, and this method is coated with nano metal paste, then laser ablation on base material first, finally carries out chemistry coating.Sending out method for these two kinds all adopts laser ablation to prepare pattern, and not only cost is high, and operation easier is large, and also higher to base material requires, all has obvious technical difference with patent of the present invention.For another example patent 201080027204.4 discloses the process for selective deposition of metal on plastic base, but this patent and patent of the present invention have obvious technical difference.This method comprises plastics sulfonation, activates the plastics of this sulfonation to make it accepts plating.This method is only applicable to plastic basis material, relates to sulfonation reaction in addition, not environmentally.For another example patent 201410125969.1 discloses a kind of method that selectivity is silver-plated in height filling stone paper.This method is included in high filling stone paper surface printing pattern and chemical silvering, is only applicable to stone paper base material and chemical silvering, and the present invention has the difference of essence.
Summary of the invention
The object of the invention is to the deficiency overcoming existing selective chemical plating method, a kind of selective chemical plating method being applicable to the simple and environmental protection of various base material, technique is provided.
For solving the problems of the technologies described above, the technical scheme of employing is:
A method for selective chemical plating, prints the transition layer of certain pattern at substrate material surface, be wherein printed on the part energy adsorptive catalyst of transition layer, can carry out chemical plating, described method comprises following steps:
(1) body material pre-treatment: body material is soak 1-5 minute in 1%NaOH solution with oil removing under 50-60 DEG C of condition at massfraction, after base material being cleaned up with deionized water again, finally in an oven under 50-80 DEG C of condition dry 1-10 minute for subsequent use;
(2) print the transition layer of certain pattern at matrix surface, thickness is 1 ~ 500 micron, drying 10 minutes under the condition of 80 DEG C;
(3) step (2) gained matrix is immersed pH and carry out sensitization in the sensitizing solution of 1 ~ 3, sensitization 1 ~ 90 minute at 30-80 DEG C;
(4) step (3) gained matrix is immersed pH to activate in the activation solution of 1-4, at 30-80 DEG C, activate 1 ~ 60 minute;
(5) step (4) gained matrix is cleaned in ionized water, 60 DEG C of dryings 10 minutes after electroless plating, obtain plating piece.
Wherein, body material is at least one in pottery, polyethylene, polypropylene, polyethylene terephthalate, polyvinyl alcohol, plastics, polystyrene, polymethylmethacrylate, polycarbonate and PEN etc.; Transition layer is containing the polymer emulsion of active group as carboxyl, amino, isocyanic ester and methylol, containing vinylformic acid, methacrylic acid, toxilic acid, methyl methacrylate, methyl acrylate, butyl acrylate, vinyl cyanide and/or cinnamic acrylate copolymer emulsion, carboxy-modified styrene-butadiene latex, polycarbonate resin, at least one in epoxy resin, resol, aqueous polyurethane etc.; The tin protochloride that sensitizing solution is; Activation solution comprises metallic colloid catalyzer, and wherein said metallic colloid catalyzer is at least one of palladium, platinum, silver and Jin Dengzhong.
Above-mentioned transition layer printing method is at least one in spraying, roller coating, printing, silk screen printing, blade coating, immersion plating, intaglio printing and spin coating etc.
In above-mentioned step (5), electroless plating comprises at least one in electroless copper, chemical nickel plating and chemical silvering etc.
In the present invention, the transition layer of only selective printing is by sensitization and activation, and adsorbing metal colloid catalyst, in chemical plating fluid, just can carry out chemistry coating, thus electroless plating precision is very high in meeting.
Beneficial effect of the present invention is: the preparation method that 1, the present invention adopts can reduce the cost of selective chemical plating; 2, the preparation method that the present invention adopts can realize continuous prodution; 3, the preparation method that the present invention adopts can carry out selective chemical plating to various substrates; 4, preparation technology is simple, is easy to control, and energy consumption is low, environmental protection.
Accompanying drawing explanation
Fig. 1 is three-decker schematic diagram of the present invention.
Fig. 2 is polyethylene film of the present invention surface selective chemical copper facing schematic diagram
In accompanying drawing: 1, body material; 2, transition layer; 3, electroless plating coat.
Embodiment
Below by embodiment, the present invention is specifically described.What be necessary to herein means out is that following examples are only used to further illustrate the present invention; limiting the scope of the invention can not be interpreted as; the person skilled in the art in this field makes some nonessential improvement and adjustment according to the invention described above content to the present invention, is all considered as within protection scope of the present invention.
Embodiment 1
Be under 55 DEG C of conditions, soak 2 minutes in 1%NaOH solution with oil removing by PEN base material at massfraction, then with deionized water, the PEN after oil removing cleaned up, under 60 DEG C of conditions dry 2 minutes in an oven.Adopt and print technique prints certain pattern butyl acrylate film at matrix surface, thickness is 30 microns, drying 10 minutes under 80 DEG C of conditions; The matrix being printed on butyl acrylate film is immersed pH and carries out sensitization in the stannous chloride solution of 2, sensitization 6 minutes at 30 DEG C; Next matrix after sensitization is immersed pH to activate in the silver chloride solution of 2.5, at 50 DEG C, activate 4 minutes; Take out and use washed with de-ionized water dry for standby.
Preparation chemical nickel-plating plating solution, bath composition is: NiSO
47H
2o (50 grams per liter), NaH
2pO
2h
2o (25 grams per liter), (NH
4)
2sO
4(11 grams per liter), C
6h
8o
7(7 grams per liter).Base material after activation to be immersed in the chemical nickel-plating plating solution of 55 DEG C plating 5 minutes.After chemical nickel plating, by washed with de-ionized water, 60 DEG C of dryings 10 minutes, obtain chemical nickel plating part on polycarbonate substrate, are wherein only printed on the partial chemical plated with nickel of acrylic film in an oven.
Embodiment 2:
By polyethylene terephthalate base material massfraction be in 1%NaOH solution under 50 DEG C of conditions soak 5 minutes with oil removing, with deionized water, the polyethylene terephthalate after oil removing is cleaned up again, under 50 DEG C of conditions dry 10 minutes in an oven.Adopt plain net typography to print the methyl methacrylate coating of certain pattern at matrix surface, thickness is 1 micron, drying 10 minutes under 80 DEG C of conditions; The matrix being printed on methyl methacrylate film is immersed pH and carries out sensitization in the stannous chloride solution of 3, sensitization 1 minute at 30 DEG C; Next matrix after sensitization is immersed pH to activate in the palladium chloride solution of 4, at 80 DEG C, activate 1 minute; Take out and use washed with de-ionized water dry for standby.
Preparation chemical silvering plating solution, bath composition is: AgNO
3(29 grams per liter), NH
3h
2o (4 grams per liter) and HCHO (55 grams per liter).Base material after activation to be immersed in the chemical silvering plating solution of 45 DEG C plating 10 minutes.After chemical silvering, by washed with de-ionized water, 60 DEG C of dryings 10 minutes in an oven, obtain the silver-plated sample of selective chemical on polyethylene terephthalate base material, the partial chemical being wherein only printed on methyl methacrylate coating plates silver.
Embodiment 3:
Be under 60 DEG C of conditions, soak 1 minute in 1%NaOH solution with oil removing by polyethylene film base material at massfraction, then with deionized water, the polyethylene film after oil removing cleaned up, under 80 DEG C of conditions dry 1 minute in an oven.Adopt doctor blade process to print the acrylic acid coatings of certain pattern at matrix surface, thickness is 500 microns, drying 10 minutes under 80 DEG C of conditions; The matrix being printed on acrylic film is immersed pH and carries out sensitization in the stannous chloride solution of 1, sensitization 90 minutes at 80 DEG C; Next matrix after sensitization is immersed pH to activate in the palladium chloride solution of 1, at 80 DEG C, activate 60 minutes; Take out and use washed with de-ionized water dry for standby.
Preparation electroless copper plating solution, bath composition is: NiSO
47H
2o (1 grams per liter), CuSO
45H
2o (24 grams per liter), NaH
2pO
2h
2o (55 grams per liter), Na
3c
6h
5o
72H
2o (1.5 grams per liter), H
3bO
3(70 grams per liter).Base material after activation to be immersed in the electroless copper plating solution of 40 DEG C plating 5 minutes.After electroless copper, by washed with de-ionized water, 60 DEG C of dryings 10 minutes, obtain electroless copper sample on polyethylene film base material in an oven, and the polyethylene film surf zone being wherein only printed on acrylic acid coatings forms Copper thin film (as shown in Figure 2).
Claims (6)
1. a method for selective chemical plating, is characterized in that: described method comprises following steps:
(1) be under 50-60 DEG C of condition, soak 1-5 minute in 1%NaOH solution with oil removing by body material at massfraction, then after base material being cleaned up with deionized water, finally in an oven under 50-80 DEG C of condition dry 1-10 minute for subsequent use;
(2) matrix surface after cleaning prints the transition layer of certain pattern, and thickness is 1 ~ 500 micron, to be placed under the condition of 80 DEG C dry 10 minutes;
(3) step (2) gained matrix is immersed pH and carry out sensitization in the sensitizing solution of 1 ~ 3, sensitizing temperature is 30-80 DEG C, and sensitization time is 1 ~ 90 minute;
(4) step (3) gained matrix is immersed pH to activate in the activation solution of 1-4, activation temperature is 30-80 DEG C, and soak time is 1 ~ 60 minute;
(5) step (4) gained matrix is cleaned in deionized water, 60 DEG C of dryings 10 minutes after electroless plating, obtain plating piece.
2. the method for a kind of selective chemical plating according to claim 1, is characterized in that: the body material in described step (1) is at least one in pottery, polyethylene terephthalate, polyvinyl alcohol, nylon, polystyrene, polyethylene, polypropylene, polymethylmethacrylate, polycarbonate and PEN.
3. the method for a kind of selective chemical plating according to claim 1, it is characterized in that: the transition layer in described step (2) is containing the polymer emulsion of active group as carboxyl, amino, isocyanic ester and methylol, containing vinylformic acid, methacrylic acid, toxilic acid, methyl methacrylate, methyl acrylate, butyl acrylate, vinyl cyanide and/or cinnamic acrylate copolymer emulsion, carboxy-modified styrene-butadiene latex, polycarbonate resin, at least one in epoxy resin, resol, aqueous polyurethane.
4. the method for a kind of selective chemical plating according to claim 1, is characterized in that: the transition layer printing method in described step (2) is at least one in spraying, roller coating, printing, silk screen printing, blade coating, immersion plating, intaglio printing and spin coating.
5. the method for a kind of selective chemical plating according to claim 1, it is characterized in that: in described step (3), sensitizing solution is stannous chloride solution, activation solution comprises metallic colloid catalyzer, and wherein said metallic colloid catalyzer is at least one in palladium, platinum, silver and gold.
6. the method for a kind of selective chemical plating according to claim 1, is characterized in that: in described step (5), electroless plating comprises at least one in electroless copper, chemical nickel plating and chemical silvering.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105296973A (en) * | 2015-12-01 | 2016-02-03 | 中北大学 | Surface chemical nickel-plating method for ultra high molecular weight polyethylene powder |
| CN106435537A (en) * | 2016-12-06 | 2017-02-22 | 合肥乐凯科技产业有限公司 | Selective chemical plating method for polymer substrate surfaces |
| CN106637147A (en) * | 2016-11-16 | 2017-05-10 | 合肥乐凯科技产业有限公司 | Supporter surface selective electroless plating method |
| CN106947960A (en) * | 2017-04-12 | 2017-07-14 | 合肥学院 | A kind of 3D printing preparation method of polymer/metal composite powder material |
| CN108456875A (en) * | 2018-03-16 | 2018-08-28 | 华南理工大学 | A kind of low roughness silverskin and the preparation method and application thereof |
| CN111235554A (en) * | 2020-03-10 | 2020-06-05 | 中国科学院金属研究所 | In-situ activated titanium alloy surface chemical coating preparation method |
| CN111408713A (en) * | 2020-03-17 | 2020-07-14 | 苏州逸峰新材料科技有限公司 | Preparation method of nickel-coated graphite composite powder material with high coating rate |
| CN115532258A (en) * | 2022-02-09 | 2022-12-30 | 青岛大学 | Preparation method and application of charcoal-based biomimetic catalytic material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101705614A (en) * | 2009-11-03 | 2010-05-12 | 上海大学 | Preparation method of nickel-plated and silver-plated aromatic polyamide conductive fibers |
| CN101705615A (en) * | 2009-11-03 | 2010-05-12 | 上海大学 | Preparation method of nickel-plated and copper-plated aromatic polyamide conductive fibers |
| CN102337526A (en) * | 2011-09-15 | 2012-02-01 | 济南大学 | Preparation method of nickel electrode made of piezoelectric composite material |
| CN103572263A (en) * | 2012-07-28 | 2014-02-12 | 比亚迪股份有限公司 | Plastic surface metallization method and plastic product with surface having metal pattern |
-
2015
- 2015-07-06 CN CN201510390594.6A patent/CN104911568B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101705614A (en) * | 2009-11-03 | 2010-05-12 | 上海大学 | Preparation method of nickel-plated and silver-plated aromatic polyamide conductive fibers |
| CN101705615A (en) * | 2009-11-03 | 2010-05-12 | 上海大学 | Preparation method of nickel-plated and copper-plated aromatic polyamide conductive fibers |
| CN102337526A (en) * | 2011-09-15 | 2012-02-01 | 济南大学 | Preparation method of nickel electrode made of piezoelectric composite material |
| CN103572263A (en) * | 2012-07-28 | 2014-02-12 | 比亚迪股份有限公司 | Plastic surface metallization method and plastic product with surface having metal pattern |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105296973A (en) * | 2015-12-01 | 2016-02-03 | 中北大学 | Surface chemical nickel-plating method for ultra high molecular weight polyethylene powder |
| CN106637147A (en) * | 2016-11-16 | 2017-05-10 | 合肥乐凯科技产业有限公司 | Supporter surface selective electroless plating method |
| CN106435537A (en) * | 2016-12-06 | 2017-02-22 | 合肥乐凯科技产业有限公司 | Selective chemical plating method for polymer substrate surfaces |
| CN106947960A (en) * | 2017-04-12 | 2017-07-14 | 合肥学院 | A kind of 3D printing preparation method of polymer/metal composite powder material |
| CN108456875A (en) * | 2018-03-16 | 2018-08-28 | 华南理工大学 | A kind of low roughness silverskin and the preparation method and application thereof |
| CN111235554A (en) * | 2020-03-10 | 2020-06-05 | 中国科学院金属研究所 | In-situ activated titanium alloy surface chemical coating preparation method |
| CN111408713A (en) * | 2020-03-17 | 2020-07-14 | 苏州逸峰新材料科技有限公司 | Preparation method of nickel-coated graphite composite powder material with high coating rate |
| CN115532258A (en) * | 2022-02-09 | 2022-12-30 | 青岛大学 | Preparation method and application of charcoal-based biomimetic catalytic material |
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