CN104911568B - A kind of method of selective chemical plating - Google Patents
A kind of method of selective chemical plating Download PDFInfo
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- CN104911568B CN104911568B CN201510390594.6A CN201510390594A CN104911568B CN 104911568 B CN104911568 B CN 104911568B CN 201510390594 A CN201510390594 A CN 201510390594A CN 104911568 B CN104911568 B CN 104911568B
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- 238000007747 plating Methods 0.000 title claims abstract description 51
- 239000000126 substance Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000011159 matrix material Substances 0.000 claims abstract description 26
- 238000001035 drying Methods 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 9
- 230000007704 transition Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- -1 polyethylene terephthalate Polymers 0.000 claims description 14
- 239000008367 deionised water Substances 0.000 claims description 11
- 229910021641 deionized water Inorganic materials 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 7
- 230000004913 activation Effects 0.000 claims description 7
- 229920000573 polyethylene Polymers 0.000 claims description 7
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 6
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- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 4
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- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 4
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 230000008313 sensitization Effects 0.000 claims description 4
- 230000001235 sensitizing effect Effects 0.000 claims description 4
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 2
- 239000004425 Makrolon Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
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- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
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- RPDJEKMSFIRVII-UHFFFAOYSA-N oxomethylidenehydrazine Chemical class NN=C=O RPDJEKMSFIRVII-UHFFFAOYSA-N 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
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- 229910052697 platinum Inorganic materials 0.000 claims description 2
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- 229920000647 polyepoxide Polymers 0.000 claims description 2
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- 229920001155 polypropylene Polymers 0.000 claims description 2
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- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 238000007761 roller coating Methods 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000004677 Nylon Substances 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- 229920002125 Sokalan® Polymers 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 1
- 239000011976 maleic acid Substances 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229920001778 nylon Polymers 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
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- 238000004528 spin coating Methods 0.000 claims 1
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- 238000002360 preparation method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 3
- 238000007772 electroless plating Methods 0.000 abstract description 2
- 238000002203 pretreatment Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 20
- 239000010408 film Substances 0.000 description 10
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- 229910052751 metal Inorganic materials 0.000 description 4
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- 238000000608 laser ablation Methods 0.000 description 3
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- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 3
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- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 238000006277 sulfonation reaction Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- 229910021645 metal ion Inorganic materials 0.000 description 1
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Abstract
The invention discloses a kind of method of selective chemical plating, belong to electroless plating technology field, its preparation method is：(a) matrix material pre-treatment；(b) matrix surface selectively printing transition zone, drying；(c) it is sensitized and activates the matrix for being printed on transition zone；(d) chemically plating obtains plating piece.The method technological process of selective chemical plating provided by the invention is simple, and cost is cheap, while has good selectivity, ensures chemical plating pattern accuracy.
Description
Technical field
The invention belongs to chemical plating field, more particularly to a kind of method of selective chemical plating.
Background technology
Electroless plating method is the self-catalysis that need not provide an electric current process, and it is by redox by metal deposit
In matrix surface, its coating prepared has good electric conductivity and heat conductivility, and its cost is relatively low, it is not necessary to complicated
Special equipment, moreover it is possible to suitable for the material of complicated shape.
Now with electronic technology and network technical development, required in some fields such as selectively masking, microelectronic component
High-precision selective chemical coating technology.Therefore a kind of selectivity simple and environmentally friendly suitable for various base materials, technique is developed
Electroplating method is learned widely to be paid close attention to.For example, patent 200810141987.3 discloses a kind of plastics composite and its surface choosing
Selecting property metallization process.The method uses laser ablation frosting, is then placed in and is soaked containing metal ion salt solution, finally
Carry out metallochemistry plating.Patent 200810142571.3 discloses a kind of selective chemical plating method for plastic basis material, this
The first coated with nano metal paste on base material of method, then laser ablation, finally carries out chemical coating.Both hair methods use
Laser ablation prepares pattern, and not only cost is high, and operation difficulty is big, and requires also higher to base material, all with patent of the present invention
There is obvious technical difference.For another example patent 201080027204.4 discloses selective deposition side of the metal on plastic base
Method, but this patent has obvious technical difference with patent of the present invention.The method, which includes, is somebody's turn to do plastic products sulfonation, activation
The plastic products of sulfonation so as to receive plating thereon.The method is only applicable to plastic basis material, additionally involves sulfonating reaction, not ring
Protect.For another example patent 201410125969.1 discloses a kind of silver-plated method of selectivity in high filling stone paper.The method bag
High filling stone paper surface printing pattern and chemical silvering are contained in, is only applicable to stone paper base material and chemical silvering, and the present invention
Difference with essence.
The content of the invention
It is an object of the invention to overcome the shortcomings of existing selective chemical plating method, there is provided one kind is applied to various bases
The simple and environmentally friendly selective chemical plating method of material, technique.
In order to solve the above technical problems, the technical scheme used is：
A kind of method of selective chemical plating, the transition zone of certain pattern is printed in substrate material surface, wherein being printed on
The part energy adsorption catalyst of layer is crossed, chemical plating can be carried out, methods described comprises the steps of：
(1) matrix material pre-treatment：Matrix material soaks in mass fraction is 1%NaOH solution under the conditions of 50-60 DEG C
1-5 minutes are steeped with oil removing, then after with deionized water, base material is cleaned up, are finally dried in an oven under the conditions of 50-80 DEG C
1-10 minutes are standby；
(2) transition zone of certain pattern is printed in matrix surface, thickness is 1~500 micron, is dried under conditions of 80 DEG C
10 minutes；
(3) matrix obtained by step (2) is immersed in the sensitizing solution that pH is 1~3 and be sensitized, it is sensitized 1 at 30-80 DEG C~
90 minutes；
(4) matrix obtained by step (3) is immersed in the activating solution that pH is 1-4 and activated, activate 1 at 30-80 DEG C~
60 minutes；
(5) matrix obtained by step (4) is cleaned in ionized water, 60 DEG C of dryings 10 minutes after chemical plating, obtains plating piece.
Wherein, matrix material be ceramics, polyethylene, polypropylene, polyethylene terephthalate, polyvinyl alcohol, plastics,
At least one of polystyrene, polymethyl methacrylate, makrolon and PEN etc.；Transition zone is
Polymer latex containing active group such as carboxyl, amino, isocyanates and methylol, contains acrylic acid, methacrylic acid, horse
Carry out the acrylate copolymer of sour, methyl methacrylate, methyl acrylate, butyl acrylate, acrylonitrile and/or styrene
At least one in emulsion, carboxy-modified styrene-butadiene latex, polycarbonate resin, epoxy resin, phenolic resin, aqueous polyurethane etc.
Kind；The stannous chloride that sensitizing solution is；Activating solution includes metallic colloid catalyst, and wherein described metallic colloid catalyst is
At least one of palladium, platinum, silver and gold etc..
Above-mentioned transition zone printing method is spraying, roller coating, printing, silk-screen printing, blade coating, immersion plating, intaglio printing and rotation
At least one of apply etc..
Chemical plating includes at least one of electroless copper, chemical nickel plating and chemical silvering etc. in above-mentioned step (5).
In the present invention, only the transition zone of selective printing can be by being sensitized and activating, adsorbing metal colloid catalyst,
Could carry out chemical coating in chemical plating fluid, can thus chemical plating precision it is very high.
Beneficial effects of the present invention are：1st, the preparation method that the present invention uses can reduce the cost of selective chemical plating；
2nd, the preparation method that the present invention uses can realize continuous production；3rd, the preparation method that the present invention uses can be to various substrates
Carry out selective chemical plating；4th, preparation technology is simple, easily controllable, and energy consumption is low, environmental protection.
Brief description of the drawings
Fig. 1 is the three-decker schematic diagram of the present invention.
Fig. 2 is selective chemical copper facing schematic diagram in polyethylene film surface of the present invention
In accompanying drawing：1st, matrix material；2nd, transition zone；3rd, chemical plating coat.
Embodiment
The present invention is specifically described below by embodiment.It is necessarily pointed out that following examples are served only for
The present invention is further described, it is impossible to be interpreted as limiting the scope of the invention, the person skilled in the art in the field
Some nonessential modifications and adaptations are made to the present invention according to the invention described above content, be accordingly to be regarded as protection scope of the present invention it
It is interior.
Embodiment 1
PEN base material is soaked 2 points in mass fraction is 1%NaOH solution under the conditions of 55 DEG C
Clock cleans up the PEN after oil removing with oil removing, then with deionized water, in an oven in 60 DEG C of conditions
Lower drying 2 minutes.The butyl acrylate film of certain pattern is printed in matrix surface using printing technology, thickness is 30 microns,
Dried 10 minutes under the conditions of 80 DEG C；It is quick to be carried out in 2 stannous chloride solution that the matrix for being printed on butyl acrylate film is immersed into pH
Change, be sensitized 6 minutes at 30 DEG C；Next matrix after sensitization is immersed in the silver chloride solution that pH is 2.5 and activated, at 50 DEG C
Activation 4 minutes；Take out standby with deionized water cleaning, drying.
Chemical nickel-plating plating solution is prepared, bath composition is：NiSO4·7H2O (50 g/l), NaH2PO2·H2O (25 g/l),
(NH4)2·SO4(11 g/l), C6H8O7(7 g/l).Base material after activation is immersed to plating 5 in 55 DEG C of chemical nickel-plating plating solution
Minute.After chemical nickel plating, cleaned, in an oven 60 DEG C of dryings 10 minutes, produced chemical on polycarbonate substrate with deionized water
Nickel plating part, wherein being only printed on the part chemistry plated with nickel of acrylic film.
Embodiment 2：
Polyethylene terephthalate base material under the conditions of 50 DEG C is soaked 5 in mass fraction is 1%NaOH solution
Minute cleans up the polyethylene terephthalate after oil removing with oil removing, then with deionized water, in an oven in 50 DEG C
Under the conditions of dry 10 minutes.The methyl methacrylate coating of certain pattern is printed in matrix surface using plain net typography,
Thickness is 1 micron, is dried 10 minutes under the conditions of 80 DEG C；The matrix for being printed on methyl methacrylate film is immersed into the chlorine that pH is 3
Change and be sensitized in stannous solution, is sensitized 1 minute at 30 DEG C；Next matrix after sensitization is immersed into the palladium chloride solution that pH is 4
In activated, activated 1 minute at 80 DEG C；Take out standby with deionized water cleaning, drying.
Chemical silvering plating solution is prepared, bath composition is：AgNO3(29 g/l), NH3·H2O (4 g/l) and HCHO (55
G/l).Base material after activation is immersed to plating 10 minutes in 45 DEG C of chemical silvering plating solution.After chemical silvering, deionized water is used
Cleaning, 60 DEG C of dryings 10 minutes, produce the silver-plated sample of selective chemical on polyethylene terephthalate base material in an oven,
Wherein only it is printed in the part chemical plating of methyl methacrylate coating silver-colored.
Embodiment 3：
Polyethylene film base material is soaked under the conditions of 60 DEG C in mass fraction is 1%NaOH solution to 1 minute with oil removing,
The polyethylene film after oil removing is cleaned up with deionized water again, dried 1 minute under the conditions of 80 DEG C in an oven.Using scraping
The acrylic acid coatings that technique prints certain pattern in matrix surface are applied, thickness is 500 microns, and 10 points are dried under the conditions of 80 DEG C
Clock；The matrix for being printed on acrylic film is immersed in the stannous chloride solution that pH is 1 and is sensitized, is sensitized 90 minutes at 80 DEG C；Connect
Get off to immerse matrix after sensitization in the palladium chloride solution that pH is 1 and activated, activated 60 minutes at 80 DEG C；Taking-up deionization
Water cleaning, drying is standby.
Electroless copper plating solution is prepared, bath composition is：NiSO4·7H2O (1 g/l), CuSO4·5H2O (24 g/l),
NaH2PO2·H2O (55 g/l), Na3C6H5O7·2H2O (1.5 g/l), H3BO3(70 g/l).Base material after activation is soaked
Enter plating 5 minutes in 40 DEG C of electroless copper plating solution.After electroless copper, cleaned with deionized water, in an oven 60 DEG C of dryings 10
Minute, electroless copper sample on polyethylene film base material is produced, wherein being only printed on the polyethylene film surface of acrylic acid coatings
Region forms Copper thin film (as shown in Figure 2).
Claims (6)
- A kind of 1. method of selective chemical plating, it is characterised in that：Methods described comprises the steps of：(1) by matrix material mass fraction be 1%NaOH solution under the conditions of 50-60 DEG C soak 1-5 minutes with oil removing, then After with deionized water, base material is cleaned up, finally dry 1-10 minutes are standby under the conditions of 50-80 DEG C in an oven；(2) matrix surface after cleaning prints the transition zone of certain pattern, and thickness is 1~500 micron, is placed in 80 DEG C afterwards Under the conditions of dry 10 minutes；(3) matrix obtained by step (2) is immersed in the sensitizing solution that pH is 1~3 and be sensitized, sensitizing temperature is 30-80 DEG C, sensitization Time is 1~90 minute；(4) matrix obtained by step (3) is immersed in the activating solution that pH is 1-4 and activated, activation temperature is 30-80 DEG C, activation Time is 1~60 minute；(5) matrix obtained by step (4) is cleaned in deionized water, 60 DEG C of dryings 10 minutes after chemical plating, obtains plating piece.
- A kind of 2. method of selective chemical plating according to claim 1, it is characterised in that：Base in the step (1) Body material is ceramics, polyethylene terephthalate, polyvinyl alcohol, nylon, polystyrene, polyethylene, polypropylene, poly- methyl At least one of methyl acrylate, makrolon and PEN.
- A kind of 3. method of selective chemical plating according to claim 1, it is characterised in that：Mistake in the step (2) It is the polymer latex containing active group such as carboxyl, amino, isocyanates and methylol to cross layer, contains acrylic acid, methyl-prop The polyacrylic acid of olefin(e) acid, maleic acid, methyl methacrylate, methyl acrylate, butyl acrylate, acrylonitrile and/or styrene Ester copolymer emulsion, carboxy-modified styrene-butadiene latex, polycarbonate resin, in epoxy resin, phenolic resin, aqueous polyurethane extremely Few one kind.
- A kind of 4. method of selective chemical plating according to claim 1, it is characterised in that：Mistake in the step (2) Layer printing method is crossed as at least one of spraying, roller coating, printing, silk-screen printing, blade coating, immersion plating, intaglio printing and spin coating.
- A kind of 5. method of selective chemical plating according to claim 1, it is characterised in that：It is sensitized in the step (3) Liquid is stannous chloride solution, and activating solution includes metallic colloid catalyst, and wherein described metallic colloid catalyst be palladium, platinum, At least one of silver and gold.
- A kind of 6. method of selective chemical plating according to claim 1, it is characterised in that：It is chemical in the step (5) Plating includes at least one of electroless copper, chemical nickel plating and chemical silvering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510390594.6A CN104911568B (en) | 2015-07-06 | 2015-07-06 | A kind of method of selective chemical plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510390594.6A CN104911568B (en) | 2015-07-06 | 2015-07-06 | A kind of method of selective chemical plating |
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| Publication Number | Publication Date |
|---|---|
| CN104911568A CN104911568A (en) | 2015-09-16 |
| CN104911568B true CN104911568B (en) | 2018-02-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510390594.6A Expired - Fee Related CN104911568B (en) | 2015-07-06 | 2015-07-06 | A kind of method of selective chemical plating |
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| CN105296973B (en) * | 2015-12-01 | 2018-03-09 | 中北大学 | A kind of ultra-high molecular weight polyethylene powder chemical nickel-plating method for surface |
| CN106637147A (en) * | 2016-11-16 | 2017-05-10 | 合肥乐凯科技产业有限公司 | Supporter surface selective electroless plating method |
| CN106435537A (en) * | 2016-12-06 | 2017-02-22 | 合肥乐凯科技产业有限公司 | Selective chemical plating method for polymer substrate surfaces |
| CN106947960A (en) * | 2017-04-12 | 2017-07-14 | 合肥学院 | Preparation method of polymer/metal composite powder material for 3D printing |
| CN108456875B (en) * | 2018-03-16 | 2019-10-18 | 华南理工大学 | A kind of low roughness silverskin and the preparation method and application thereof |
| CN111235554A (en) * | 2020-03-10 | 2020-06-05 | 中国科学院金属研究所 | In-situ activated titanium alloy surface chemical coating preparation method |
| CN111408713A (en) * | 2020-03-17 | 2020-07-14 | 苏州逸峰新材料科技有限公司 | Preparation method of nickel-coated graphite composite powder material with high coating rate |
| CN115532258B (en) * | 2022-02-09 | 2023-07-21 | 青岛大学 | Preparation method and application of charcoal-based bionic catalytic material |
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| CN101705615B (en) * | 2009-11-03 | 2011-11-23 | 上海大学 | Preparation method of nickel-plated and copper-plated aromatic polyamide conductive fibers |
| CN101705614B (en) * | 2009-11-03 | 2011-09-07 | 上海大学 | Preparation method of nickel-plated and silver-plated aromatic polyamide conductive fibers |
| CN102337526B (en) * | 2011-09-15 | 2013-05-29 | 济南大学 | Preparation method of nickel electrode made of piezoelectric composite material |
| CN103572263B (en) * | 2012-07-28 | 2016-05-11 | 比亚迪股份有限公司 | The method of metallization of plastic surface and surface have the plastic product of metal pattern |
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