CN203890477U - Flow guide device and electroplating device - Google Patents
Flow guide device and electroplating device Download PDFInfo
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- CN203890477U CN203890477U CN201420317685.8U CN201420317685U CN203890477U CN 203890477 U CN203890477 U CN 203890477U CN 201420317685 U CN201420317685 U CN 201420317685U CN 203890477 U CN203890477 U CN 203890477U
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- conducting element
- introducing port
- guiding device
- export mouth
- opening
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- 238000009713 electroplating Methods 0.000 title abstract description 8
- 239000012530 fluid Substances 0.000 claims abstract description 36
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 238000007599 discharging Methods 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000009826 distribution Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a flow guide device which comprises a first flow guide part, a second flow guide part and a cover body, wherein an opening in one end of the first flow guide part is a first feeding hole, and an opening in the other end of the first flow guide part is a first discharging hole; the second flow guide part is nested outside the first flow guide part, the side wall of the second flow guide part and the side wall of the first flow guide part form a space, an opening in one end of the second flow guide part is smaller than an opening in the other end of the second flow guide part, a second feeding hole is formed in one end of the second flow guide part and one end of the first flow guide part, and the second feeding hole is connected with the space; a second discharging hole is formed between the cover body and the other end of the second flow guide part, and the second discharging hole is connected with the space. The utility model discloses an electroplating device comprising the flow guide device. The flow guide device is adopted for guiding a fluid (such as electroplating liquid) so as to effectively control the fluid to be uniformly distributed.
Description
Technical field
The utility model relates to a kind of guiding device, and relates to especially a kind of electroplanting device with described guiding device.
Background technology
Electroplating process applies in various fields widely, as surface-treated method, is also applied to the aspects such as circuit board manufacturing, semi-conductor chip, LED electrically-conductive backing plate and semiconductor packages except traditionally.Plating is that workpiece to be plated is immersed in the solion (electroplate liquid) that contains plated metal, negative electrode and anode (expendable or non-expendable) in power supply and plating tank are electrically connected, plated metal is placed in to anode and workpiece to be plated is placed in negative electrode, passing to just can be at the surface deposition of workpiece to be plated one metal film layer after direct current simultaneously.
Along with the progress of ic manufacturing technology, the circuit of manufacturing 0.25 micron of following size is the main flow of metal current processing procedure.Along with wire sizes is dwindled (meaning depth-to-width ratio increases gradually) day by day, traditional chemical vapour deposition or physical vaporous deposition have not been suitable for the circuit of manufacturing 0.25 micron of following size.But electroplating process can be filled efficiently, conducting material can be filled in the through hole that depth-to-width ratio is larger (via) words grooves (trench).Electroplating process has been widely used in the metallization process of back segment at present.
The thickness evenness (uniformity) of metal film layer is always electroplated the important indicator of usefulness for assessment.Because plating is that the Flow Field Distribution (current density) of electroplate liquid is particularly important taking the mobile electrochemical reaction as medium of the zwitterion in electroplate liquid (electric charge).But, in fact, the electric current distribution of workpiece surface to be plated is also inhomogeneous, particularly differ greatly with the current density of fringe region (edge) in the central zone of workpiece to be plated (center), thereby cause in formed metal film layer, the homogeneity of the thickness of described metal film layer is not good, and particularly, at the fringe region of workpiece to be plated, the thickness of described metal film layer is wayward.
Utility model content
The purpose of this utility model is, a kind of guiding device and electroplanting device are provided, and can play guide functions to fluids such as electroplate liquids, makes being evenly distributed of the fluids such as electroplate liquid.
For solving the problems of the technologies described above, the utility model provides a kind of guiding device, comprising:
The first conducting element, the tubular structure that described the first conducting element is both ends open, the opening of one end of described the first conducting element is greater than the opening of the other end of described the first conducting element, the opening of one end of described the first conducting element is as the first introducing port of fluid, and the opening of the other end of described the first conducting element is as the first export mouth of fluid;
The second conducting element, be nested in outside described the first conducting element, the sidewall of the sidewall of described the second conducting element and described the first conducting element forms a space, the tubular structure that described the second conducting element is both ends open, the opening of one end of the second conducting element is less than the opening of the other end of described the second conducting element, one end of one end of described the second conducting element and described the first conducting element forms the second introducing port of fluid, and described the second introducing port is communicated with described space; And
Lid, described lid connects the other end of described the first conducting element, and extends to the other end of described the second conducting element, forms the second export mouth of fluid between described lid and the other end of described the second conducting element, and described the second export mouth is communicated with described space.
Optionally, in described guiding device, described the first conducting element is cylinder-like structure.
Optionally, in described guiding device, described the first introducing port is expanded gradually and is horn-like.
Optionally, in described guiding device, the diameter of described the first introducing port is 2cm～20cm.
Optionally, in described guiding device, the distance of one end of one end of described the second conducting element and described the first conducting element is 1cm～5cm.
Optionally, in described guiding device, described the second conducting element is cylinder-like structure.
Optionally, in described guiding device, the sidewall of described the second conducting element comprises at least one cancave cambered surface.
According to another side of the present utility model, a kind of electroplanting device is also provided, comprising:
For filling the cavity of electroplate liquid;
Anode, is arranged in described cavity;
For fixing the negative electrode of a workpiece to be plated, be arranged in described cavity, described negative electrode is used for a side of fixing described workpiece to be plated to described anode; And
As above the guiding device described in any one, is arranged between described anode and described negative electrode, and described the first introducing port and the second introducing port are towards described anode setting, and described the first export mouth and the second export mouth deviate from described anode setting.
Optionally, in described electroplanting device, the distance between described the first introducing port and described anode is 1mm～3mm.
Optionally, in described electroplanting device, the distance between described the first export mouth and described negative electrode is 1mm～100mm.
Optionally, in described electroplanting device, described workpiece to be plated is wafer.
Optionally, in described electroplanting device, described the first export mouth is circular, 1/5～1/2 of the diameter that the diameter of described the first export mouth is described workpiece to be plated.
Optionally, in described electroplanting device, described lid is annular, 1/2～9/10 of the diameter that the outer ring diameter of described lid is described workpiece to be plated.
Compared with prior art, the utility model provides guiding device and electroplanting device have the following advantages:
In the guiding device and electroplanting device providing at the utility model, described guiding device comprises the first conducting element, the second conducting element and lid, described the first conducting element comprises one first introducing port and one first export mouth, the sidewall of the sidewall of described the second conducting element and described the first conducting element forms a space, one end of one end of described the second conducting element and described the first conducting element forms one second introducing port, between the other end of described lid and described the second conducting element, form one second export mouth, described the second introducing port is connected respectively described space with the second export mouth.Compared with prior art, while adopting described guiding device convection cell (as electroplate liquid) to carry out water conservancy diversion, a part of fluid flows into described the first conducting element from described the first introducing port, and flows out from described the first export mouth; Another part fluid flows into described space from described the second introducing port, and flows out from described the second export mouth; When after described guiding device water conservancy diversion, described a part of fluid distribution is in central zone, the fringe region of described another part fluid distribution outside described a part of fluid, thus can effectively control being evenly distributed of all described fluids.
Brief description of the drawings
Fig. 1 is the sectional view of guiding device in the utility model one embodiment;
Fig. 2 is the stereographic map of the first conducting element in the utility model one embodiment;
Fig. 3 is the stereographic map of the second conducting element in the utility model one embodiment;
Fig. 4 is the vertical view of lid in the utility model one embodiment;
Fig. 5 is the sectional view of electroplanting device in the utility model one embodiment.
Embodiment
Below in conjunction with schematic diagram, guiding device of the present utility model and electroplanting device are described in more detail, wherein represent preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to about system or about the restriction of business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with way of example, the utility model is more specifically described with reference to accompanying drawing.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of guiding device is provided, comprise: the first conducting element, the tubular that described the first conducting element is both ends open, the opening of one end of described the first conducting element is greater than the opening of the other end of described the first conducting element, the opening of one end of described the first conducting element is the first introducing port, and the opening of the other end of described the first conducting element is the first export mouth; The second conducting element, be nested in outside described the first conducting element, the sidewall of the sidewall of described the second conducting element and described the first conducting element forms a space, the tubular that described the second conducting element is both ends open, the opening of one end of the second conducting element is less than the opening of the other end of described the second conducting element, one end of one end of described the second conducting element and described the first conducting element forms one second introducing port, and described the second introducing port connects described space; And lid, described lid connects the other end of described the first conducting element, and extends to the other end of described the second conducting element, between described lid and the other end of described the second conducting element, forms one second export mouth, and described the second export mouth connects described space.While adopting described guiding device convection cell (as electroplate liquid) to carry out water conservancy diversion, a part of fluid flows into described the first conducting element from described the first introducing port, and flows out from described the first export mouth; Another part fluid flows into described space from described the second introducing port, and flows out from described the second export mouth; When after described guiding device water conservancy diversion, described a part of fluid distribution is in central zone, the fringe region of described another part fluid distribution outside described a part of fluid, thus can effectively control being evenly distributed of all described fluids.
Below in conjunction with Fig. 1-Fig. 5, guiding device and the electroplanting device in the present embodiment is described, described guiding device carries out water conservancy diversion for convection cell.
First,, referring to Fig. 1 and Fig. 2, described guiding device 1 comprises the first conducting element 11, the second conducting element 12 and lid 13.
Wherein, the tubular structure that described the first conducting element 11 is both ends open, preferably, described the first conducting element 11 is cylinder-like structure, can ensure preferably the homogeneity of water conservancy diversion.The opening of one end 11a of described the first conducting element 11 is greater than the opening of the other end 11b of described the first conducting element 11, the opening of one end 11a of described the first conducting element 11 is the first introducing port 111, the opening of the other end 11b of described the first conducting element 11 is the first export mouth 112, it is the size that the size of described the first introducing port 111 is greater than described the first export mouth 112, and described the first introducing port 111 is expanded and is horn-like gradually, can make more described fluid enter described the first conducting element 11.Preferably, the diameter D111 of described the first introducing port 111 is 2cm～20cm, for example 3cm, 7cm, 10cm etc.
Continue with reference to figure 1, described the second conducting element 12 is nested in outside described the first conducting element 11, and the sidewall of the sidewall of described the second conducting element 12 and described the first conducting element 11 forms a space 10.The tubular that described the second conducting element 12 is both ends open, preferably, as shown in Figure 3, described the second conducting element 12 is cylinder, can ensure preferably the homogeneity of water conservancy diversion.The opening of one end 12a of described the second conducting element 121 is less than the opening of the other end 12b of described the second conducting element 121, one end 11a of one end 12a of described the second conducting element 121 and described the first conducting element 11 forms one second introducing port 121, described the second introducing port 121 connects described space 10, makes described fluid to flow into described space 10 from described the second introducing port 121.
Preferably, the distance of one end 11a of one end 12a of described the second conducting element 12 and described the first conducting element 11 is 1cm～5cm, for example, and 2cm, 3cm, 4cm etc.
Described lid 13 connects the other end 11b of described the first conducting element 11, and extend to the other end 12b of described the second conducting element 12, between the other end 12b of described lid 13 and described the second conducting element 12, form one second export mouth 122, described the second export mouth 122 is communicated with described space 10.In the present embodiment, described the first conducting element 11 and the second conducting element 12 are cylindric, so described lid 13 is circular, as shown in Figure 4.
Preferably, as shown in Figure 1, the sidewall of described the second conducting element 12 comprises at least one cancave cambered surface 123, can make the described fluid that flows into described space 10 be distributed preferably.In Fig. 1, the sidewall of described the second conducting element 12 comprises two cancave cambered surfaces 123, and in other embodiment of the present utility model, the sidewall of described the second conducting element 12 comprises three, four or more cancave cambered surface 123,
In the present embodiment, described guiding device 1 is for electroplanting device, and so that electroplate liquid (being described fluid) is carried out to water conservancy diversion, as shown in Figure 5, described electroplanting device 2 comprises cavity 20, anode 30, negative electrode 40 and guiding device 1.Certainly, described guiding device 1 can also comprise the parts of electroplate liquid introducing port 60 necessity such as grade, and this is what it will be appreciated by those skilled in the art that, does not repeat at this.
Described cavity 20 is for filling electroplate liquid 50, and described anode 30 and described negative electrode 40 are all arranged in described cavity 30, and general, described anode 30 is arranged on a side of described cavity 20, and described negative electrode 40 is arranged on the opposite side of described cavity 20.Described negative electrode 40 is for fixing a workpiece 41 to be plated, and in the present embodiment, described workpiece 41 to be plated is wafer (wafer).In the time electroplating, described workpiece to be plated 41 is fixed on a side of described negative electrode 40, described negative electrode 40 for a side of fixing described workpiece 41 to be plated to described anode 30, to make described workpiece to be plated 41 towards described anode 30, with in the enterprising electroplating technique of described workpiece 41 to be plated.
Described guiding device 1 is arranged between described anode 30 and described negative electrode 40, described the first introducing port 111 and the second introducing port 121 arrange towards described anode 30, for receiving the described electroplate liquid 50 of described anode 30 directions, described the first export mouth 112 and the second export mouth 122 deviate from described anode 30 and arrange, for exporting described electroplate liquid 50 to described workpiece 41 to be plated.
In the time that described electroplanting device 2 is electroplated, described workpiece 41 to be plated is fixed on to a side of described negative electrode 40, described anode 30 and described negative electrode 40 are switched on respectively, and described electroplate liquid introducing port 60 is filled with described electroplate liquid 50 to described cavity 20.Described anode 30 can discharge electric charge in described electroplate liquid 50, and the described electroplate liquid 50 that described electroplate liquid introducing port 60 flows out forms electroplate liquid stream 51 (as shown in dotted arrows in Fig. 5), and described electroplate liquid stream 51 drives described flow of charge.
Wherein, a part of described electroplate liquid stream 51 flows into described the first conducting element 11 from described the first introducing port 111, and flows out from described the first export mouth 112, drives electric charge to flow to the central zone of described workpiece to be plated 41; Described in another part, electroplate liquid stream 51 flows into described space 10 from described the second introducing port 121, and flow out from described the second export mouth 122, drive electric charge to flow to the fringe region of described workpiece to be plated 41, thereby make the central zone of described workpiece to be plated 41 and fringe region all have described charge distribution, the electric current distribution on described workpiece to be plated 41 surfaces is even, the having good uniformity of the thickness of the metal film layer forming.
Preferably, distance L 1 scope between described the first introducing port 111 and described anode 11 is at 1mm～3mm, and for example, 2mm etc., to ensure that the electric charge in described electroplate liquid 50 enters described guiding device 1 with electroplate liquid stream 51.
Preferably, distance between described the first export mouth 112 and described negative electrode 40 is 1mm～100mm, for example, 10mm, 20mm, 50mm etc., to ensure that described electroplate liquid stream 51 can cover described workpiece to be plated 41, makes described charge energy arrive central zone and the fringe region of described workpiece 41 to be plated.
Preferably, the diameter D112 of described the first export mouth 112 be described workpiece to be plated 41 diameter D41 1/5～1/2, for example 1/4,1/3 etc., 1/2～9/10 of the diameter D41 that the outer ring diameter D113 of described lid 13 is described workpiece to be plated 41, for example 2/3,4/5 etc., be conducive to described electroplate liquid stream 51 and cover preferably described workpiece 41 to be plated.
In the present embodiment, described guiding device 1 is for described electroplanting device 2, so that the electroplate liquid of described electroplanting device 2 is carried out to water conservancy diversion.But, in other embodiment of the present utility model, described guiding device 1 also can be used for other occasion, for example can also carry out water conservancy diversion to fluids such as gases, according to foregoing description of the present utility model, be what those having ordinary skill in the art will appreciate that by described guiding device 1 for the fluids such as gas being carried out to water conservancy diversion, therefore not to repeat here.
In sum, the utility model provides a kind of guiding device and electroplanting device, comprise: the first conducting element, the tubular that described the first conducting element is both ends open, the opening of one end of described the first conducting element is greater than the opening of the other end of described the first conducting element, the opening of one end of described the first conducting element is the first introducing port, and the opening of the other end of described the first conducting element is the first export mouth; The second conducting element, be nested in outside described the first conducting element, the sidewall of the sidewall of described the second conducting element and described the first conducting element forms a space, the tubular that described the second conducting element is both ends open, the opening of one end of the second conducting element is less than the opening of the other end of described the second conducting element, one end of one end of described the second conducting element and described the first conducting element forms one second introducing port, and described the second introducing port connects described space; And lid, described lid connects the other end of described the first conducting element, and extends to the other end of described the second conducting element, between described lid and the other end of described the second conducting element, forms one second export mouth, and described the second export mouth connects described space.While adopting described guiding device convection cell (as electroplate liquid) to carry out water conservancy diversion, a part of fluid flows into described the first conducting element from described the first introducing port, and flows out from described the first export mouth; Another part fluid flows into described space from described the second introducing port, and flows out from described the second export mouth; When after described guiding device water conservancy diversion, described a part of fluid distribution is in central zone, the fringe region of described another part fluid distribution outside described a part of fluid, thus can effectively control being evenly distributed of all described fluids.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if these amendments of the present utility model and within modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (13)
1. a guiding device, is characterized in that, comprising:
The first conducting element, the tubular structure that described the first conducting element is both ends open, the opening of one end of described the first conducting element is greater than the opening of the other end of described the first conducting element, the opening of one end of described the first conducting element is as the first introducing port of fluid, and the opening of the other end of described the first conducting element is as the first export mouth of fluid;
The second conducting element, be nested in outside described the first conducting element, the sidewall of the sidewall of described the second conducting element and described the first conducting element forms a space, the tubular structure that described the second conducting element is both ends open, the opening of one end of the second conducting element is less than the opening of the other end of described the second conducting element, one end of one end of described the second conducting element and described the first conducting element forms the second introducing port of fluid, and described the second introducing port is communicated with described space; And
Lid, described lid connects the other end of described the first conducting element, and extends to the other end of described the second conducting element, forms the second export mouth of fluid between described lid and the other end of described the second conducting element, and described the second export mouth is communicated with described space.
2. guiding device as claimed in claim 1, is characterized in that, described the first conducting element is cylinder-like structure.
3. guiding device as claimed in claim 2, is characterized in that, described the first introducing port is expanded gradually and is horn-like.
4. guiding device as claimed in claim 2, is characterized in that, the diameter of described the first introducing port is 2cm～20cm.
5. guiding device as claimed in claim 4, is characterized in that, the distance of one end of one end of described the second conducting element and described the first conducting element is 1cm～5cm.
6. guiding device as claimed in claim 1, is characterized in that, described the second conducting element is cylinder-like structure.
7. guiding device as claimed in claim 6, is characterized in that, the sidewall of described the second conducting element comprises at least one cancave cambered surface.
8. an electroplanting device, is characterized in that, comprising:
For filling the cavity of electroplate liquid;
Anode, is arranged in described cavity;
For fixing the negative electrode of a workpiece to be plated, be arranged in described cavity, described negative electrode is used for a side of fixing described workpiece to be plated to described anode; And
Guiding device as described in any one in claim 1-7, is arranged between described anode and described negative electrode, and described the first introducing port and the second introducing port are towards described anode setting, and described the first export mouth and the second export mouth deviate from described anode setting.
9. electroplanting device as claimed in claim 8, is characterized in that, the distance between described the first introducing port and described anode is 1mm～3mm.
10. electroplanting device as claimed in claim 8, is characterized in that, the distance between described the first export mouth and described negative electrode is 1mm～100mm.
11. electroplanting devices as claimed in claim 8, is characterized in that, described workpiece to be plated is wafer.
12. electroplanting devices as claimed in claim 11, is characterized in that, described the first export mouth is circular, 1/5～1/2 of the diameter that the diameter of described the first export mouth is described workpiece to be plated.
13. electroplanting devices as claimed in claim 11, is characterized in that, described lid is annular, 1/2～9/10 of the diameter that the outer ring diameter of described lid is described workpiece to be plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420317685.8U CN203890477U (en) | 2014-06-13 | 2014-06-13 | Flow guide device and electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420317685.8U CN203890477U (en) | 2014-06-13 | 2014-06-13 | Flow guide device and electroplating device |
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| Publication Number | Publication Date |
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| CN203890477U true CN203890477U (en) | 2014-10-22 |
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| CN201420317685.8U Expired - Lifetime CN203890477U (en) | 2014-06-13 | 2014-06-13 | Flow guide device and electroplating device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019079193A1 (en) * | 2017-10-16 | 2019-04-25 | Lam Research Corporation | Convection optimization for mixed feature electroplating |
| CN110886004A (en) * | 2019-12-06 | 2020-03-17 | 隆鑫通用动力股份有限公司 | Electroplating device for electroplating outside cylinder body tank |
| US11047059B2 (en) | 2016-05-24 | 2021-06-29 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
-
2014
- 2014-06-13 CN CN201420317685.8U patent/CN203890477U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11047059B2 (en) | 2016-05-24 | 2021-06-29 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| WO2019079193A1 (en) * | 2017-10-16 | 2019-04-25 | Lam Research Corporation | Convection optimization for mixed feature electroplating |
| KR20200059309A (en) * | 2017-10-16 | 2020-05-28 | 램 리써치 코포레이션 | Convection optimization for mixed feature electroplating |
| CN111492096A (en) * | 2017-10-16 | 2020-08-04 | 朗姆研究公司 | Convection optimization for mixed feature plating |
| CN111492096B (en) * | 2017-10-16 | 2023-02-14 | 朗姆研究公司 | Convection optimization for mixed feature plating |
| KR102563118B1 (en) | 2017-10-16 | 2023-08-04 | 램 리써치 코포레이션 | Convection Optimization for Mixed Feature Electroplating |
| CN110886004A (en) * | 2019-12-06 | 2020-03-17 | 隆鑫通用动力股份有限公司 | Electroplating device for electroplating outside cylinder body tank |
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