CN202898574U - Floating type microsphere electroplating device - Google Patents
Floating type microsphere electroplating device Download PDFInfo
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- CN202898574U CN202898574U CN 201220566603 CN201220566603U CN202898574U CN 202898574 U CN202898574 U CN 202898574U CN 201220566603 CN201220566603 CN 201220566603 CN 201220566603 U CN201220566603 U CN 201220566603U CN 202898574 U CN202898574 U CN 202898574U
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Abstract
The utility model provides a floating type microsphere electroplating device, which is capable of electrically depositing a metal on the surface of microspheres which may float in solution. In the floating type microsphere electroplating device provided by the utility model, a plating tank cover is arranged on a plating tank, a cylinder is fixed on the bottom surface of the plating tank cover, a cathode and an anode are fixed in parallel on the bottom surface of the plating tank cover with the center of the plating tank cover as the center of a circle, a hole for regulating the water level is formed between the cathode and the anode of the plating tank cover, and a circular ring array is fixed on the bottom of the plating tank. The floating type microsphere electroplating device provided by the utility model is capable of obtaining metal microspheres excellent in sphericity and surface roughness from various metals, such as gold, copper, nickel and alloys thereof under conventional electroplating process parameters thereof; the thickness of the coating can be regulated by changing the electroplating time; and taking the metal microspheres having the diameter of 300, the maximum thickness of the coating can be about 15.
Description
Technical field
The utility model belongs to electrochemical field, is specifically related to a kind of floatation type microballoon electroplanting device, is applicable to the electroplanting device that the floating microsphere surface to the unlike material of various surface-coated conductive layers carries out galvanic deposit.
Background technology
Mostly at present microsphere surface metallization is to adopt the methods such as physical vaporous deposition, chemical Vapor deposition process, electroless plating, but when these methods of use, along with thicknesses of layers increases, the film surface Quality Down, thickness evenness and surface smoothness all can reduce, can't satisfy well it at material, biological medicine, the application demand in the fields such as photoelectricity and catalysis.
Summary of the invention
In order to overcome the deficiency that the microballoon thickness of coating is partially thin in the prior art, surfaceness is larger, the utility model provides a kind of floatation type microballoon electroplanting device, can be in electroplating solution, understanding the electroplanting device of the surface electrical metal refining of floating microballoon, to be used for preparing thickness large and sphericity and the higher various metallic microspheres of surface smoothness.
The utility model adopts following technical scheme to realize:
Floatation type microballoon electroplanting device of the present utility model is characterized in: described electroplanting device comprises hole, negative electrode, anode, right cylinder, coating bath, rotor, circle ring array, the coating bath lid of regulating water level.Coating bath is cylindric, and the coating bath lid is shaped as cylinder, and the shape of negative electrode and anode is circular thin slice, and material is same with the metallographic phase of wanting plating.Its annexation is, the top of described coating bath is provided with the coating bath lid, and coating bath lid internal diameter is identical with the coating bath external diameter, and coating bath lid medial surface and coating bath upper port outer side are provided with the internal and external threads of mutual coupling, by rotation the coating bath lid is fixed on the coating bath, is used for the sealing coating bath; Coating bath tops outer side center is provided with a square projection, in order to auxiliary rotation coating bath lid.Right cylinder is fixed on the coating bath lid bottom surface centered by coating bath lid axis.Negative electrode, anode be parallel being fixed on the coating bath lid bottom surface respectively take coating bath lid center as the center of circle all, the anode external diameter is identical with coating bath lid internal diameter, the anode internal diameter is greater than the negative electrode external diameter, anode and negative electrode are in the same plane, cylinder diameter is identical with the negative electrode internal diameter, is used for limiting solution and the movement path of microballoon in coating bath.Be provided with the hole of regulating water level between the negative electrode and positive electrode of coating bath lid, the coating bath lid is vertically run through in the hole of adjusting water level, and coating bath inside and atmosphere are communicated with, and is used for injecting in coating bath or the taking-up plating bath.Make the inner and atmosphere connection of coating bath, be used in coating bath, injecting or the taking-up plating bath.Circle ring array is made of the one group of annulus that varies in size, and is fixed in the coating bath bottom as the center of circle take coating bath bottom centre, is used for being separated out the groove with certain depth in the coating bath bottom, and microballoon sinks rear motion in groove and can not smashed by rotor.The rotor level places the center of described circle ring array, drives solution during rotor and flows centered by the coating bath axis.
Described rotor is ellipsoid shaped.
When adopting this device to carry out the microsphere surface galvanic deposit, the bead episphere is larger towards the current density of anode one side part, make the coating speed of growth of these parts very fast, skew occurs and rotates in the center of gravity of microballoon, makes the thicker part of coating deviate from anode under action of gravity, and the thinner partial rotation of coating is to top, thereby realize the even growth of coating, in this process, flowing of plating bath can prevent that bead and cathode sheets from sticking together, and guarantees that microballoon has enough freedoms of motion.
Floatation type microballoon electroplanting device beneficial effect of the present utility model is: simple to operation, controllability is strong.The utility model floatation type microballoon electroplanting device, to various metals, such as gold, copper, nickel and alloy thereof etc., under its conventional electroplating technological parameter, rotating speed by suitable adjusting rotor, can obtain the good metallic microspheres of sphericity and surfaceness, thickness of coating can be regulated by changing electroplating time, take diameter as 300
About gold microsphere be example, the thickness of coating maximum can reach 15
About.
Description of drawings
Fig. 1 is the structural representation of floatation type microballoon electroplanting device of the present utility model;
Among the figure, 1. regulate hole 2. negative electrodes, 3. anodes, 4. right cylinders, 5. coating baths, 6. rotors, 7. circle ring arrays, the 8. coating baths lid of water level.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
Fig. 1 is the structural representation of floatation type microballoon electroplanting device of the present utility model, in Fig. 1, floatation type microballoon electroplanting device of the present utility model comprises hole 1, negative electrode 2, the anode 3 of regulating water level), right cylinder 4, coating bath 5, rotor 6, circle ring array 7, coating bath lid 8; Coating bath 5 is cylindric, and coating bath lid 8 is shaped as cylinder, and the shape of negative electrode 2 and anode 3 is circular thin slice; Its annexation is, the top of described coating bath 5 is provided with coating bath lid 8, and it is identical with coating bath 5 external diameters that coating bath covers 8 internal diameters, and coating bath covers the internal and external threads that 8 medial surfaces and coating bath 5 upper port outer sides are provided with mutual coupling, by rotation coating bath lid 8 is fixed on the coating bath 5, is used for sealing coating bath 5; Coating bath covers 8 top outer centers and is provided with a square projection, in order to auxiliary rotation coating bath lid 8; Right cylinder 4 is fixed in coating bath and covers on 8 bottom surfaces centered by coating bath covers 8 axis; Negative electrode 2, anode 3 all take coating bath cover 8 centers as the center of circle respectively the parallel coating bath that is fixed in cover on 8 bottom surfaces, it is identical that anode 3 external diameters and coating bath cover 8 internal diameters, anode 3 internal diameters are greater than negative electrode 2 external diameters, and anode 3 and negative electrode 2 are in the same plane, and right cylinder 4 diameters are identical with negative electrode 2 internal diameters; Be provided with the hole 1 of regulating water level between the negative electrode 2 of coating bath lid 8 and anode 3, the hole 1 of regulating water level is vertically run through coating bath and is covered 8; Make coating bath 5 inner and atmosphere connections, be used for to coating bath 5 interior injections or taking-up plating bath; Circle ring array 7 is made of the one group of annulus that varies in size, and is fixed in coating bath 5 bottoms as the center of circle take coating bath 5 bottom centre; Rotor 6 levels place the center of described circle ring array 7.
Rotor described in the present embodiment 6 is ellipsoid shaped.
Floatation type microballoon electroplanting device workflow of the present utility model is as follows
Correlation technique parameter of the present utility model is as follows
1) the stirring velocity scope is 100～250r/min;
2) the microballoon coating bath is processed into synthetic glass, diameter be 3.8cm in logical right cylinder;
3) right cylinder is processed into synthetic glass, and radius is 1.8cm;
4) the negative electrode internal diameter is 1.8cm, and external diameter is 2.3cm, and the anode internal diameter is 3cm, and external diameter is 3.5cm.
Claims (2)
1. floatation type microballoon electroplanting device is characterized in that: described electroplanting device comprises hole (1), negative electrode (2), anode (3), right cylinder (4), coating bath (5), rotor (6), circle ring array (7), the coating bath lid (8) of regulating water level; Coating bath (5) is cylindric, and coating bath lid (8) is shaped as cylinder, and the shape of negative electrode (2) and anode (3) is circular thin slice; Its annexation is, the top of described coating bath (5) is provided with coating bath lid (8), and coating bath lid (8) internal diameter is identical with coating bath (5) external diameter, and coating bath covers the internal and external threads that (8) medial surface and coating bath (5) upper port outer side are provided with mutual coupling; Coating bath lid (8) top outer center is provided with a square projection; Right cylinder (4) is fixed on coating bath lid (8) bottom surface centered by coating bath lid (8) axis; Negative electrode (2), anode (3) be parallel being fixed on coating bath lid (8) bottom surface respectively take coating bath lid (8) center as the center of circle all, anode (3) external diameter is identical with coating bath lid (8) internal diameter, anode (3) internal diameter is greater than negative electrode (2) external diameter, anode (3) and negative electrode (2) are in the same plane, and right cylinder (4) diameter is identical with negative electrode (2) internal diameter; Be provided with the hole (1) of regulating water level between the negative electrode (2) of coating bath lid (8) and anode (3), the hole (1) of regulating water level is vertically run through coating bath and is covered (8); Circle ring array (7) is made of the one group of annulus that varies in size, and is fixed in coating bath (5) bottom as the center of circle take coating bath (5) bottom centre; Rotor (6) level places the center of described circle ring array (7).
2. described electroplanting device according to claim 1, it is characterized in that: described rotor (6) is ellipsoid shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220566603 CN202898574U (en) | 2012-10-31 | 2012-10-31 | Floating type microsphere electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220566603 CN202898574U (en) | 2012-10-31 | 2012-10-31 | Floating type microsphere electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202898574U true CN202898574U (en) | 2013-04-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220566603 Expired - Fee Related CN202898574U (en) | 2012-10-31 | 2012-10-31 | Floating type microsphere electroplating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN202898574U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073306A (en) * | 2021-03-24 | 2021-07-06 | 中国科学院近代物理研究所 | Method for uniformly coating metal ball surface in batch |
| CN114875468A (en) * | 2022-07-11 | 2022-08-09 | 南通海翔水处理设备有限公司 | Plating equipment for preventing adhesion of metal sheets |
| CN115074805A (en) * | 2022-07-07 | 2022-09-20 | 中国工程物理研究院激光聚变研究中心 | Floating type micro metal sphere/spherical shell electroplating device and method for electroplating microspheres |
-
2012
- 2012-10-31 CN CN 201220566603 patent/CN202898574U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073306A (en) * | 2021-03-24 | 2021-07-06 | 中国科学院近代物理研究所 | Method for uniformly coating metal ball surface in batch |
| CN115074805A (en) * | 2022-07-07 | 2022-09-20 | 中国工程物理研究院激光聚变研究中心 | Floating type micro metal sphere/spherical shell electroplating device and method for electroplating microspheres |
| CN115074805B (en) * | 2022-07-07 | 2023-10-13 | 中国工程物理研究院激光聚变研究中心 | Floating tiny metal sphere/spherical shell electroplating device and method for electroplating microspheres |
| CN114875468A (en) * | 2022-07-11 | 2022-08-09 | 南通海翔水处理设备有限公司 | Plating equipment for preventing adhesion of metal sheets |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20151031 |
|
| EXPY | Termination of patent right or utility model |