CN106460223A - Plating device - Google Patents
Plating device Download PDFInfo
- Publication number
- CN106460223A CN106460223A CN201580033874.XA CN201580033874A CN106460223A CN 106460223 A CN106460223 A CN 106460223A CN 201580033874 A CN201580033874 A CN 201580033874A CN 106460223 A CN106460223 A CN 106460223A
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- China
- Prior art keywords
- clamp
- guide portion
- plating
- electric plating
- sealing part
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Provided is a plating device that can make plating thickness on two wafers attached to the front and back surfaces of a plating bath jig uniform by preventing occurrences of current lines going around and avoiding unintended plating growth. In a plating device according to the present invention, two wafers (7) for plating treatment are attached to the front and back surfaces of a plating jig (10), and anodes (20) are provided that face each of the surfaces to be processed of the two wafers (7) that are attached. The plating device is provided with a guide section (31) that is provided along the inside wall of a plating tank (30) for retaining plating fluid and in which the plating jig (10) can be inserted, and an expansion seal member (32) provided on the guide section (31). The two wafers (7) are divided in the tank by making the expansion seal member (32) expand and push on the plating jig (10) that has been inserted in the plating tank (30).
Description
Technical field
The present invention relates to can be by preventing detouring, avoiding the growth of undesirable plating to make peace of so-called electric current line
It is loaded on the uniform electroplanting device of electroplating thickness of 2 wafer on table back of the body two sides of clamp for electric plating.
Background technology
Surface to the chip using as the substrate installing quasiconductor, implements copper facing in order to circuit is formed.Specifically
For, in clamp for electric plating, chip is installed, the clamp for electric plating mass-impregnation of chip will be installed in being stored in electroplating bath
Include the electroplate liquid of copper etc., thus electroplating processes are carried out to the surface of chip.
In order to improve the efficiency of electroplating processes, also developed a lot of clamp for electric platings carrying on the back installation chip in two sides in table.Example
As patent document 1 discloses that can use by the pattern printing face of 2 wafer be respectively facing outside install clamp for electric plating
Carry out the Hanging device for electro plating (rack) of the chip of the electroplating processes of 2 wafer simultaneously.By carrying out at the plating of 2 wafer simultaneously
Reason, it is possible to increase overall productivity ratio.
In addition, Patent Document 2 discloses a kind of the two-face exposed of the pattern printing face of semiconductor wafer and power supply section
The electroplating substrate fixture being sealed.In patent documentation 2, by carrying out the electroplating processes on the two sides of semiconductor wafer simultaneously,
Overall productivity ratio can be improved.
Patent documentation 1：Japanese Unexamined Patent Publication 07-243097 publication
Patent documentation 2：Japanese Unexamined Patent Publication 2008-184692 publication
However, arbitrary patent documentation exists all between the inwall (bottom surface) of clamp for electric plating and the electroplating bath of electroplanting device
Gap, produces detouring of so-called electric current line.Accordingly, there exist because electric current line detours to one side extra enforcement electroplating processes, difficulty
So that the uniform problem points of electroplating thickness.
Content of the invention
The present invention completes in light of this situation, and its object is to offer one kind can be by preventing so-called electric current
The generation detoured of line, avoid undesirable plating growth and make to be installed on clamp for electric plating table carry on the back two sides 2 wafer
The uniform electroplanting device of electroplating thickness.
To achieve these goals, electroplanting device involved in the present invention is using 2 wafer of the object as electroplating processes
It is installed on the table back of the body two sides of clamp for electric plating, possess opposed respectively with the object surface of the electroplating processes of 2 wafer installed
Anode, makes to impregnated in as the clamp for electric plating of negative electrode function and stores the electroplating bath of electroplate liquid to execute electroplating processes,
Described electroplanting device is characterised by possessing：Guide portion, this guide portion, along the inwall setting of above-mentioned electroplating bath, can supply upper
State clamp for electric plating insertion；And Expansion sealing part, this Expansion sealing part is arranged at this guide portion, makes this Expansion sealing portion
Part expands and presses on the above-mentioned clamp for electric plating being inserted into above-mentioned electroplating bath, thus divides groove by 2 wafer.
In said structure, 2 wafer of the object as electroplating processes are installed on the table back of the body two sides of clamp for electric plating,
Possess the anode opposed respectively with the object surface of the electroplating processes of 2 wafer installed, make the plating as negative electrode function
Impregnated in the electroplating bath storing electroplate liquid with fixture to execute electroplating processes, in the above cases, also possess：Guide portion,
This guide portion, can be for clamp for electric plating insertion along the inwall setting of electroplating bath；And Expansion sealing part, this Expansion sealing
Part is arranged at guide portion, so that Expansion sealing part is expanded and press on the clamp for electric plating being inserted into electroplating bath, thus by 2
Chip divides groove, thus the electroplate liquid of a side of electroplating bath of segmentation may not flow into the opposing party.Therefore, it is possible to avoid electric current line in advance
The generation detoured, thus be easily controlled for so that be installed on clamp for electric plating table carry on the back two sides 2 wafer electroplating thickness
Uniformly.
In addition, electroplanting device involved in the present invention is preferred：Guide sections have the inwall along above-mentioned electroplating bath
Sealing groove, in the state of embedment is to the above-mentioned sealing groove of guide sections, configuration is in insertion for above-mentioned Expansion sealing part
To between the clamp for electric plating of above-mentioned electroplating bath and guide sections.
In said structure, guide portion has the sealing groove of the inwall along electroplating bath, and Expansion sealing part is in embedment
To the sealing groove of guide portion, configuration is being inserted between the clamp for electric plating of electroplating bath and guide portion, therefore can
Enough clamp for electric plating is sealed with guide portion with Expansion sealing part and Expansion sealing part simultaneously, being capable of liquid-tight Ground Split
Electroplating bath.
In addition, electroplanting device involved in the present invention is preferred：The u-shaped shape of section shape of above-mentioned Expansion sealing part or
O word shape, upon expansion throughout the above-mentioned sealing groove of guide sections whole region fill.
In said structure, the u-shaped shape of section shape of Expansion sealing part or O word shape, upon expansion throughout drawing
Fill with leading the whole region of sealing groove in portion, therefore by Expansion sealing part being pressed on the plating being inserted into electroplating bath
With fixture, 2 wafer are divided groove, thus the electroplate liquid of a side of electroplating bath of segmentation may not flow into the opposing party.Therefore, it is possible to
Avoid the generation detoured of electric current line in advance, thus be easily controlled as so that the table being installed on clamp for electric plating carries on the back 2 of two sides
The electroplating thickness of chip is uniform.
In addition, electroplanting device involved in the present invention is preferred：Above-mentioned Expansion sealing part is by the resin with drug resistance fluidity
Material is formed.
In said structure, Expansion sealing part is formed by the resin material with drug resistance fluidity, thus without because of plating
Liquid and produce corrosion etc., chronically the inner surface of guide portion can be maintained liquid-tight.
In addition, electroplanting device involved in the present invention is preferred：Guide sections possess insertion groove, and this insertion groove has and is more than
The groove width of the thickness of above-mentioned clamp for electric plating, above-mentioned clamp for electric plating along guide sections above-mentioned insertion groove be inserted into above-mentioned
Electroplating bath.
In said structure, guide portion possesses insertion groove, and this insertion groove has the groove width of the thickness more than clamp for electric plating,
Clamp for electric plating is inserted into above-mentioned electroplating bath along the insertion groove of guide portion, and therefore clamp for electric plating picks and places change with respect to electroplating bath
Obtain easily.If in addition, making Expansion sealing part expand after inserting clamp for electric plating, expansion when picking and placeing can be suppressed
The abrasion of seal member.
In addition, electroplanting device involved in the present invention is preferred：Above-mentioned Expansion sealing part is configured at the upper of guide sections
State the one side of insertion groove, in the case that above-mentioned Expansion sealing part expands, a side of above-mentioned clamp for electric plating presses on
State Expansion sealing part, the opposing party presses on the another side of the above-mentioned insertion groove of guide sections.
In said structure, Expansion sealing part is configured at the one side of the insertion groove of guide portion, in Expansion sealing part
In the case of expansion, a side of clamp for electric plating presses on Expansion sealing part, and the opposing party presses on the insertion groove of guide portion
Another side, therefore regardless of the shape of Expansion sealing part, all can reliably make the inner surface of guide portion liquid-tight, segmentation
The electroplate liquid of a side of electroplating bath may not flow into the opposing party.Therefore, it is possible to avoid the generation detoured of electric current line in advance, thus
It is easily controlled as so that the electroplating thickness being installed on 2 wafer on the table back of the body two sides of clamp for electric plating is uniform.In addition, can be complete
The fixing clamp for electric plating in ground, thus clamp for electric plating will not because of the stirring of electroplate liquid, circulation etc. activity it is difficult to produce plating different
Often, be prevented from 2 wafer electroplating thickness unbalanced.
According to said structure, 2 wafer of the object as electroplating processes are installed on the table back of the body two sides of clamp for electric plating,
Possess the anode opposed respectively with the object surface of the electroplating processes of 2 wafer installed, make the plating as negative electrode function
Impregnated in the electroplating bath storing electroplate liquid with fixture to execute electroplating processes, in the above cases, also possess：Guide portion,
This guide portion, can be for clamp for electric plating insertion along the inwall setting of electroplating bath；And Expansion sealing part, this Expansion sealing
Part is arranged at guide portion, so that Expansion sealing part is expanded and press on the clamp for electric plating being inserted into electroplating bath, thus by 2
Chip divides groove, thus the electroplate liquid of a side of electroplating bath of segmentation may not flow into the opposing party.Therefore, it is possible to avoid electric current line in advance
The generation detoured, thus be easily controlled for so that be installed on clamp for electric plating table carry on the back two sides 2 wafer electroplating thickness
Uniformly.
Brief description
Fig. 1 is the schematic diagram for illustrating to the summary of the electroplanting device involved by embodiments of the present invention.
Fig. 2 is the solid of the use state of the clamp for electric plating illustrating the electroplanting device involved by embodiments of the present invention
Figure.
Fig. 3 is the top view being viewed from above one of the electroplating bath of electroplanting device involved by embodiments of the present invention.
Fig. 4 be viewed from above the electroplanting device involved by embodiments of the present invention electroplating bath, Fig. 3 guide portion attached
The close-up top view of nearly D.
Fig. 5 is the solid of the structure of Expansion sealing part illustrating the electroplanting device involved by embodiments of the present invention
Figure.
Fig. 6 is the A-A direction view of Fig. 5 of Expansion sealing part of the electroplanting device involved by embodiments of the present invention.
Fig. 7 is for the partially schematic of the electroplanting device illustrating that detour to the electric current line in existing electroplanting device
Figure.
Fig. 8 is the showing of the state being mounted with clamp for electric plating illustrating the electroplanting device involved by embodiments of the present invention
It is intended to.
Fig. 9 is that the local of the state being mounted with clamp for electric plating of the electroplanting device involved by embodiments of the present invention shows
It is intended to.
Specific embodiment
Hereinafter, referring to the drawings embodiments of the present invention are described in detail.Fig. 1 is for the enforcement to the present invention
The schematic diagram that the summary of the electroplanting device involved by mode illustrates.As shown in figure 1, the plating dress involved by present embodiment
Put 1 and store electroplate liquid 40 in electroplating bath 30.
In the middle body of electroplating bath 30, pick and place clamp for electric plating 10 with respect to the electroplating bath 30 storing electroplate liquid 40,
This clamp for electric plating 10 carries on the back, in table, the chip 7 (with reference to Fig. 2) that two sides maintains the object as electroplating processes.Be held in electricity
The position that the object surface of the electroplating processes of chip 7 of plating fixture 10 is opposed is provided with anode (anode electrode) 20.DC source
50 positive pole is connected with anode 20, and the negative pole as negative electrode function is connected with clamp for electric plating 10.By supplying unidirectional current
Stream, is being held in the Surface Creation electroplating film that the chip 7 on two sides carried on the back by table.
Fig. 2 is the use state of the clamp for electric plating 10 illustrating the electroplanting device 1 involved by embodiments of the present invention
Axonometric chart.As shown in Fig. 2 for the clamp for electric plating 10 of the electroplanting device 1 involved by present embodiment, handle part 11 is held in
Supply unit (not shown), is moved into the surface of electroplating bath 30.Then, clamp for electric plating 10 is made to decline in the direction of the arrow,
The holding pedestal 12 of the chip 7 of the object maintaining on two sides as electroplating processes be impregnated in and be stored within electroplating bath 30
Electroplate liquid 40, thus executes the electroplating processes to 2 wafer 7 surface.
Electroplating bath 30 is provided with multiple in electroplanting device 1.Fig. 3 is the electricity being viewed from above involved by embodiments of the present invention
The top view of one of the electroplating bath 30 of plating appts 1.In figure 3, in order to easy to understand, illustrate to be not inserted into the shape of clamp for electric plating 10
State.
Fig. 4 is electroplating bath 30, Fig. 3 the guiding being viewed from above the electroplanting device 1 involved by embodiments of the present invention
The close-up top view of D near portion 31.As shown in figure 4, the inwall (medial surface and inner bottom surface) along electroplating bath 30 possesses
Guide portion 31, this guide portion 31 and the form fit of clamp for electric plating 10, can insert for clamp for electric plating 10.
As shown in Figure 3 and 4, it is provided with the guiding for clamp for electric plating 10 insertion along the inwall of electroplating bath 30
Portion 31.Guide portion 31 is provided with the sealing groove 31a along the inwall of electroplating bath 30.It is provided with aftermentioned in sealing groove 31a
Expansion sealing part 32.Guide portion 31 in the medial surface of electroplating bath 30, the u-shaped shape of section shape, have and can power
The plating insertion groove 31b of fixture 10 insertion.Clamp for electric plating 10 is inserted into electroplating bath 30 along insertion groove 31b.Insertion groove 31b's
Groove width is more than the thickness of the holding pedestal 12 of clamp for electric plating 10.
The sealing groove 31a embedment being in guide portion 31 has the state of Expansion sealing part 32.Thus, it is being inserted into electricity
It is configured with Expansion sealing part 32 between the clamp for electric plating 10 of coating bath 30 and guide portion 31.Make to be arranged on clamp for electric plating 10 with
Expansion sealing part 32 between guide portion 31 expands, and presses on the clamp for electric plating 10 being inserted into electroplating bath 30, thus, it is possible to
By 7 points of grooves of 2 wafer.
Thus, Expansion sealing part 32 throughout the sealing groove 31a of guide portion 31 whole region fill such that it is able to
The electroplate liquid being plated with fixture 10 is divided into a side of two-part electroplating bath 30 is suppressed to flow into the opposing party.Therefore, it is possible to pre-
First avoid the generation detoured of electric current line, be easily controlled as so that 2 wafer 7 on two sides carried on the back by the table being installed on clamp for electric plating 10
Electroplating thickness uniform.
Fig. 5 be illustrate the electroplanting device 1 involved by embodiments of the present invention the structure of Expansion sealing part 32 vertical
Body figure.As shown in figure 5, the Expansion sealing part 32 of electroplanting device 1 involved by present embodiment with along in electroplating bath 30
The form fit of the guide portion 31 that wall is formed, is formed as U-shaped.
And, for Expansion sealing part 32, section shape is again formed as U-shaped, possesses pressure and eats dishes without rice or wine 35, this pressure is eated dishes without rice or wine
35 can be from the opening laterally inner side of U-shaped injection fluid (such as compressed air).Fig. 6 is involved by embodiments of the present invention
And Fig. 5 of Expansion sealing part 32 of electroplanting device 1 A-A direction view.
In the case of eating dishes without rice or wine 35 injecting compressed airs from pressure, arrow S direction shown in Fig. 6 for the Expansion sealing part 32 with
And arrow F direction expands.By the expansion to arrow S direction, Expansion sealing part 32 and the guiding of guide portion 31 will be arranged at
Portion 31 seals.By the expansion to arrow F direction, Expansion sealing part 32 is sealed with clamp for electric plating 10.As a result, energy
Enough make to be in liquid tight condition between clamp for electric plating 10, electroplating bath 30 and Expansion sealing part 32.Additionally, in present embodiment
Used in Expansion sealing part 32 be designed to arrow F direction swell increment be more than to arrow S direction swell increment.
Preferably Expansion sealing part 32 is formed by the material with resistance to chemical reagents.For example by silicone rubber or fluorine class rubber etc.
Formed, produce corrosion etc. thus without because of electroplate liquid 40, chronically the sealing groove 31a of guide portion 31 can be maintained liquid
Close.
Fig. 7 is that the local for the electroplanting device 1 illustrating that detours to the electric current line in existing electroplanting device 1 shows
It is intended to.As shown in fig. 7, the clamp for electric plating 10 being provided with chip 7 on two sides is inserted along guide portion 31.In the past, used in plating
Gap is there will necessarily be between the inwall of fixture 10 and guide portion 31.
Therefore, produce the detouring of electric current line 71, the electroplate liquid that there is a side of electroplating bath 30 flow into the stream of the opposing party (
Gap), thus the electroplating thickness reason in the face of chip 7 of the opposing party is led in the electroplate liquid detouring and flowing into the opposing party of electric current line 71
Cause thickness to increase etc., thus lead to be difficult to control to for so that the electroplating thickness being installed on 2 wafer 7 on two sides is uniform.
On the other hand, Fig. 8 be electroplanting device 1 involved by embodiments of the present invention is shown be mounted with clamp for electric plating
The schematic diagram of 10 state.As shown in figure 8, the inwall along electroplating bath 30 is provided with drawing for clamp for electric plating 10 insertion
Lead portion 31, the Expansion sealing part 32 being configured at the sealing groove 31a of guide portion 31 is set to U-shaped.
Clamp for electric plating 10 in the state of table back of the body two sides is mounted with the chip 7 of the object as electroplating processes, along drawing
Lead portion 31 and be inserted into the bottom surface reaching electroplating bath 30.In the state of clamp for electric plating 10 reaches bottom surface, the liquid level of electroplate liquid 40
81 are located at the position higher than the peak of chip 7.
And, by from eating dishes without rice or wine 35 pressure sky joint 36 injecting compressed airs being connected and make Expansion sealing part 32 with pressure
Expand.Thus, so that Expansion sealing part 32 is close to clamp for electric plating 10, and clamp for electric plating 10 is pressed on guide portion
31, so that clamp for electric plating 10 is close to guide portion 31.As a result, the electroplate liquid 40 of cut-out one side flows into the stream of the opposing party
(gap), can avoid the generation detoured of electric current line in advance, be therefore easily controlled and carry on the back for the table being arranged on clamp for electric plating 10
The electroplating thickness of 2 wafer 7 on two sides is uniform.
In addition, Expansion sealing part 32 can be configured at the one side of the insertion groove 31b of guide portion 31.Fig. 9 is to illustrate this
The partial schematic diagram of the state being mounted with clamp for electric plating 10 of the electroplanting device 1 involved by embodiment of invention.Fig. 9 (a)
State before being configured at Expansion sealing part 32 expansion of the one side 31b1 of the insertion groove 31b of guide portion 31, Fig. 9 are shown
B () illustrates the state after being configured at Expansion sealing part 32 expansion of the one side 31b1 of the insertion groove 31b of guide portion 31.
As shown in Fig. 9 (a), Expansion sealing part 32 expand before in the state of, be configured to along electroplating bath
30 inwall inserts has gap 91 between the guide portion 31 of clamp for electric plating 10 and clamp for electric plating 10.Therefore, as Fig. 9 (b)
Shown, in the case of so that Expansion sealing part 32 is expanded, a side of clamp for electric plating 10 presses on Expansion sealing part 32, separately
One side presses on the another side 31b2 of the insertion groove 31b of guide portion 31.
Therefore, it is possible to Cutting clearance (stream) 91 on the expansion direction of Expansion sealing part 32, thus the plating of a side
Liquid 40 may not flow into the opposing party.Therefore, it is possible to avoid the generation detoured of electric current line in advance, thus it is easily controlled as making to install
The electroplating thickness of 2 wafer 7 carrying on the back two sides in the table of clamp for electric plating 10 is uniform.
In addition, fully clamp for electric plating 10 can be fixed, thus clamp for electric plating 10 will not because of the stirring of electroplate liquid, follow
Ring etc. and activity it is difficult to produce that plating is abnormal, be prevented from 2 wafer 7 electroplating thickness unbalanced.
As described above, according to present embodiment, 2 wafer of the object as electroplating processes are installed on plating folder
The table back of the body two sides of tool, possesses the anode opposed respectively with the object surface of the electroplating processes of 2 wafer, will be used as negative electrode function
Clamp for electric plating impregnated in the electroplating bath storing electroplate liquid to execute electroplating processes, in the above cases, make to be configured at
The Expansion sealing part of the inner surface of guide portion expands and presses on the clamp for electric plating being inserted into electroplating bath, thus by 2 platelets
Piece divides groove, thus the electroplate liquid of a side of electroplating bath of segmentation may not flow into the opposing party, and wherein, described guide portion is along electroplating bath
Inwall arranges and can be for clamp for electric plating insertion.Therefore, it is possible to avoid the generation detoured of electric current line in advance, thus easy control
It is made as so that the electroplating thickness being installed on 2 wafer on table back of the body two sides of clamp for electric plating is uniform.
In addition, after clamp for electric plating is inserted into electroplating bath, starting to split electroplating bath by Expansion sealing part
For two parts, thus, in the time in addition, electroplating bath can be treated as a groove.Therefore, it is possible to easily manage
Manage the concentration for the electroplate liquid in each electroplating bath that will split, consist of identical state.
In addition, above-mentioned embodiment can be changed certainly without departing from the spirit and scope of the invention.Example
Section shape as Expansion sealing part 32 is not limited to U-shaped, as long as O word shape etc., can be throughout when expanding
The section shape filled to the whole region of sealing groove 31a of guide portion 31, is not particularly limited.
Wherein, description of reference numerals is as follows：
1：Electroplanting device；7：Chip；10：Clamp for electric plating；20：Anode (anode electrode)；30：Electroplating bath；31：Guiding
Portion；31a：Sealing groove；31b：Insertion groove；32：Expansion sealing part；71：Electric current line.
Claims (6)
1. a kind of electroplanting device,
2 wafer of the object as electroplating processes are installed on the table back of the body two sides of clamp for electric plating,
Possess the anode opposed respectively with the object surface of the electroplating processes of 2 wafer installed,
Make to impregnated in as the clamp for electric plating of negative electrode function and store the electroplating bath of electroplate liquid to execute electroplating processes,
Described electroplanting device is characterised by possessing：
Guide portion, this guide portion, can be for described clamp for electric plating insertion along the inwall setting of described electroplating bath；And
Expansion sealing part, this Expansion sealing part is arranged at this guide portion,
This Expansion sealing part is made to expand and press on the described clamp for electric plating being inserted into described electroplating bath, thus by 2 platelets
Piece divides groove.
2. electroplanting device according to claim 1 it is characterised in that
Described guide portion has the sealing groove of the inwall along described electroplating bath,
Described Expansion sealing part in the state of the described sealing groove of embedment to described guide portion, configuration be inserted into described
Between the clamp for electric plating of electroplating bath and described guide portion.
3. electroplanting device according to claim 2 it is characterised in that
The u-shaped shape of section shape of described Expansion sealing part or O word shape, upon expansion throughout described in described guide portion
The whole region ground filling of sealing groove.
4. the electroplanting device according to any one of claims 1 to 3 it is characterised in that
Described Expansion sealing part is formed by the resin material with drug resistance fluidity.
5. the electroplanting device according to any one of Claims 1 to 4 it is characterised in that
Described guide portion possesses insertion groove, and this insertion groove has the groove width of the thickness more than described clamp for electric plating,
Described clamp for electric plating is inserted into described electroplating bath along the described insertion groove of described guide portion.
6. electroplanting device according to claim 5 it is characterised in that
Described Expansion sealing part is configured at the one side of the described insertion groove of described guide portion,
In the case that described Expansion sealing part expands, a side of described clamp for electric plating presses on described Expansion sealing portion
Part, the opposing party presses on the another side of the described insertion groove of described guide portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-133394 | 2014-06-27 | ||
| JP2014133394 | 2014-06-27 | ||
| PCT/JP2015/067561 WO2015198955A1 (en) | 2014-06-27 | 2015-06-18 | Plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106460223A true CN106460223A (en) | 2017-02-22 |
| CN106460223B CN106460223B (en) | 2018-09-28 |
Family
ID=54938040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580033874.XA Active CN106460223B (en) | 2014-06-27 | 2015-06-18 | Electroplanting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6369544B2 (en) |
| KR (1) | KR101866675B1 (en) |
| CN (1) | CN106460223B (en) |
| WO (1) | WO2015198955A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116419991A (en) * | 2021-06-01 | 2023-07-11 | 株式会社荏原制作所 | Plating apparatus and plating method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6847691B2 (en) * | 2017-02-08 | 2021-03-24 | 株式会社荏原製作所 | Substrate holder used with plating equipment and plating equipment |
| CN114990648B (en) * | 2022-06-21 | 2023-03-24 | 广东捷盟智能装备有限公司 | Electroplating lithium pre-preparing equipment for pole piece |
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- 2015-06-18 JP JP2016529499A patent/JP6369544B2/en active Active
- 2015-06-18 CN CN201580033874.XA patent/CN106460223B/en active Active
- 2015-06-18 KR KR1020167035905A patent/KR101866675B1/en active IP Right Grant
- 2015-06-18 WO PCT/JP2015/067561 patent/WO2015198955A1/en active Application Filing
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| JPH11195639A (en) * | 1997-12-26 | 1999-07-21 | Canon Inc | Anodization device |
| JP2006283157A (en) * | 2005-04-01 | 2006-10-19 | Showa Denko Kk | Tool for surface treatment and surface treatment method |
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| CN102953104A (en) * | 2011-08-15 | 2013-03-06 | 诺发系统有限公司 | Lipseals and contact elements for semiconductor electroplating apparatuses |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116419991A (en) * | 2021-06-01 | 2023-07-11 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN116419991B (en) * | 2021-06-01 | 2024-03-01 | 株式会社荏原制作所 | Plating apparatus and plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6369544B2 (en) | 2018-08-08 |
| KR20170008300A (en) | 2017-01-23 |
| WO2015198955A1 (en) | 2015-12-30 |
| KR101866675B1 (en) | 2018-06-11 |
| JPWO2015198955A1 (en) | 2017-04-27 |
| CN106460223B (en) | 2018-09-28 |
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