CN102753652A - 蚀刻液组成物 - Google Patents
蚀刻液组成物 Download PDFInfo
- Publication number
- CN102753652A CN102753652A CN2010800497230A CN201080049723A CN102753652A CN 102753652 A CN102753652 A CN 102753652A CN 2010800497230 A CN2010800497230 A CN 2010800497230A CN 201080049723 A CN201080049723 A CN 201080049723A CN 102753652 A CN102753652 A CN 102753652A
- Authority
- CN
- China
- Prior art keywords
- aluminium
- lanthanum
- accounts
- weight
- etching solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052738 indium Inorganic materials 0.000 claims abstract description 21
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 20
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010936 titanium Substances 0.000 claims abstract description 8
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- 239000000470 constituent Substances 0.000 claims description 38
- UZQSJWBBQOJUOT-UHFFFAOYSA-N alumane;lanthanum Chemical compound [AlH3].[La] UZQSJWBBQOJUOT-UHFFFAOYSA-N 0.000 claims description 22
- 239000012528 membrane Substances 0.000 claims description 22
- 150000003608 titanium Chemical class 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 9
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 9
- 239000011707 mineral Substances 0.000 claims description 9
- 235000010755 mineral Nutrition 0.000 claims description 9
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 8
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 claims description 4
- 239000011775 sodium fluoride Substances 0.000 claims description 4
- 235000013024 sodium fluoride Nutrition 0.000 claims description 4
- 229910000952 Be alloy Inorganic materials 0.000 claims description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229910052712 strontium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 4
- ZWOQODLNWUDJFT-UHFFFAOYSA-N aluminum lanthanum Chemical compound [Al].[La] ZWOQODLNWUDJFT-UHFFFAOYSA-N 0.000 abstract 1
- 150000002222 fluorine compounds Chemical class 0.000 abstract 1
- 150000007522 mineralic acids Chemical class 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 229910020794 La-Ni Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000858 La alloy Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical compound [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/20—Acidic compositions for etching aluminium or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0103732 | 2009-10-29 | ||
KR20090103732 | 2009-10-29 | ||
KR1020100098368A KR101804573B1 (ko) | 2009-10-29 | 2010-10-08 | 식각액 조성물 |
KR10-2010-0098368 | 2010-10-08 | ||
PCT/KR2010/006953 WO2011052909A2 (ko) | 2009-10-29 | 2010-10-12 | 식각액 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102753652A true CN102753652A (zh) | 2012-10-24 |
CN102753652B CN102753652B (zh) | 2014-12-10 |
Family
ID=43922758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080049723.0A Active CN102753652B (zh) | 2009-10-29 | 2010-10-12 | 蚀刻液组成物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5706434B2 (zh) |
KR (1) | KR101804573B1 (zh) |
CN (1) | CN102753652B (zh) |
WO (1) | WO2011052909A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114305069A (zh) * | 2020-10-09 | 2022-04-12 | 武汉苏泊尔炊具有限公司 | 一种烹饪器具及其制作方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102092687B1 (ko) * | 2014-03-21 | 2020-03-24 | 동우 화인켐 주식회사 | 액정 표시 장치용 어레이 기판의 제조방법 |
KR102092352B1 (ko) * | 2014-03-31 | 2020-03-23 | 동우 화인켐 주식회사 | 액정 표시 장치용 어레이 기판의 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020185054A1 (en) * | 2001-06-08 | 2002-12-12 | Advanced Technology Materials Inc. | High surface quality gan wafer and method of fabricating same |
CN1749354A (zh) * | 2004-08-25 | 2006-03-22 | 三星电子株式会社 | 铟氧化物层的蚀刻剂组合物及使用它的蚀刻方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000028119A (ko) * | 1998-10-30 | 2000-05-25 | 윤종용 | 반도체 제조장비 세정액 |
JP2001339072A (ja) * | 2000-03-15 | 2001-12-07 | Advanced Display Inc | 液晶表示装置 |
KR100742276B1 (ko) * | 2004-11-10 | 2007-07-24 | 삼성전자주식회사 | 저유전율 유전막을 제거하기 위한 식각 용액 및 이를이용한 저유전율 유전막 식각 방법 |
JP5010873B2 (ja) * | 2006-08-23 | 2012-08-29 | 関東化学株式会社 | チタン、アルミニウム金属積層膜エッチング液組成物 |
-
2010
- 2010-10-08 KR KR1020100098368A patent/KR101804573B1/ko active IP Right Grant
- 2010-10-12 WO PCT/KR2010/006953 patent/WO2011052909A2/ko active Application Filing
- 2010-10-12 JP JP2012536649A patent/JP5706434B2/ja active Active
- 2010-10-12 CN CN201080049723.0A patent/CN102753652B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020185054A1 (en) * | 2001-06-08 | 2002-12-12 | Advanced Technology Materials Inc. | High surface quality gan wafer and method of fabricating same |
CN1749354A (zh) * | 2004-08-25 | 2006-03-22 | 三星电子株式会社 | 铟氧化物层的蚀刻剂组合物及使用它的蚀刻方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114305069A (zh) * | 2020-10-09 | 2022-04-12 | 武汉苏泊尔炊具有限公司 | 一种烹饪器具及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2013509702A (ja) | 2013-03-14 |
KR101804573B1 (ko) | 2017-12-06 |
CN102753652B (zh) | 2014-12-10 |
WO2011052909A3 (ko) | 2011-09-01 |
KR20110047130A (ko) | 2011-05-06 |
WO2011052909A2 (ko) | 2011-05-05 |
JP5706434B2 (ja) | 2015-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103898509B (zh) | 刻蚀剂组合物、金属图案的形成方法和阵列基板的制法 | |
JP5753180B2 (ja) | エッチング液組成物 | |
JP5735811B2 (ja) | 銅を主成分とする金属薄膜のエッチング液組成物 | |
TWI598467B (zh) | 製備薄膜電晶體通道蝕刻組合物及製備薄膜電晶體通道方法 | |
JP5841772B2 (ja) | 多重膜のエッチング液組成物及びそのエッチング方法 | |
US8894876B2 (en) | Etchant for electrode and method of fabricating thin film transistor array panel using the same | |
CN103890234B (zh) | 钼合金膜及铟氧化膜的蚀刻液组合物 | |
TWI500819B (zh) | 蝕刻劑組合物以及用於蝕刻多層金屬膜的方法 | |
CN108220963B (zh) | 多层膜用蚀刻液组合物、蚀刻方法及阵列基板的制造方法 | |
KR102137013B1 (ko) | 표시장치용 어레이 기판의 제조방법 | |
CN101130870A (zh) | 钛、铝金属层叠膜蚀刻液组合物 | |
CN106796885B (zh) | 透明导电配线及透明导电配线的制造方法 | |
CN107630219B (zh) | 金属膜蚀刻液组合物及显示装置用阵列基板的制造方法 | |
JP5788400B2 (ja) | エッチング液組成物 | |
CN102753652B (zh) | 蚀刻液组成物 | |
TWI614550B (zh) | 液晶顯示裝置用陣列基板的製備方法及其多層膜用蝕刻液組合物 | |
CN102471687A (zh) | 用于形成金属互连的刻蚀剂组合物 | |
KR102505196B1 (ko) | 구리계 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법 | |
CN103824808A (zh) | 蚀刻剂组合物、形成lcd布线的方法、阵列基板及其制法 | |
KR20090081937A (ko) | 인듐계 산화막의 식각액 조성물 및 이를 이용한 금속패턴의 형성방법 | |
JP6501218B2 (ja) | エッチング液組成物及びエッチング方法 | |
KR20210153224A (ko) | 비과산화수소형 구리 또는 구리 합금 막의 에칭제 | |
KR102092927B1 (ko) | 액정표시장치용 어레이 기판의 제조방법 | |
KR20110016724A (ko) | 금속 배선 형성을 위한 식각액 조성물 | |
KR20110025408A (ko) | 금속 배선 형성을 위한 식각액 조성물 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Effective date: 20130904 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130904 Address after: Jeonbuk, South Korea Applicant after: Dongwoo Fine Chem Co Ltd Applicant after: Samsung Display Co., Ltd. Address before: Jeonbuk, South Korea Applicant before: Dongwoo Fine Chem Co Ltd |
|
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Jeonbuk, South Korea Applicant after: Tongwoo Fine Chemicals Co., Ltd. Applicant after: Samsung Display Co., Ltd. Address before: Jeonbuk, South Korea Applicant before: Dongwoo Fine Chem Co Ltd Applicant before: Samsung Display Co., Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: DONGWOO FINE-CHEM CO., LTD. TO: TONGWOO FINE CHEMICALS CO., LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |