CN102714204B - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
CN102714204B
CN102714204B CN201180007462.0A CN201180007462A CN102714204B CN 102714204 B CN102714204 B CN 102714204B CN 201180007462 A CN201180007462 A CN 201180007462A CN 102714204 B CN102714204 B CN 102714204B
Authority
CN
China
Prior art keywords
light
emitting diode
carrier
lighting device
diode chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180007462.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN102714204A (zh
Inventor
M.萨巴蒂尔
N.冯马尔姆
L.赫佩尔
S.伊莱克
B.巴赫曼
P.罗德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102714204A publication Critical patent/CN102714204A/zh
Application granted granted Critical
Publication of CN102714204B publication Critical patent/CN102714204B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201180007462.0A 2010-01-29 2011-01-17 照明装置 Expired - Fee Related CN102714204B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102010006135.2 2010-01-29
DE102010006135 2010-01-29
DE102010018260.5 2010-04-26
DE102010018260A DE102010018260A1 (de) 2010-01-29 2010-04-26 Beleuchtungsvorrichtung
PCT/EP2011/050541 WO2011092072A1 (de) 2010-01-29 2011-01-17 Beleuchtungsvorrichtung

Publications (2)

Publication Number Publication Date
CN102714204A CN102714204A (zh) 2012-10-03
CN102714204B true CN102714204B (zh) 2015-11-25

Family

ID=44316189

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180007462.0A Expired - Fee Related CN102714204B (zh) 2010-01-29 2011-01-17 照明装置

Country Status (7)

Country Link
US (1) US9029878B2 (enExample)
EP (1) EP2529399B1 (enExample)
JP (1) JP5732075B2 (enExample)
KR (1) KR101736408B1 (enExample)
CN (1) CN102714204B (enExample)
DE (1) DE102010018260A1 (enExample)
WO (1) WO2011092072A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011016308A1 (de) 2011-04-07 2012-10-11 Osram Opto Semiconductors Gmbh Anzeigevorrichtung
DE102012209325B4 (de) * 2012-06-01 2021-09-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Modul
DE102012213343B4 (de) * 2012-07-30 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung VERFAHREN ZUM HERSTELLEN EINES OPTOELEKTRONISCHES HALBLEITERBAUTEILs MIT SAPHIR-FLIP-CHIP
DE202012102963U1 (de) 2012-08-07 2013-11-13 Rp-Technik E.K. Leuchtstofflampenartiges LED-Leuchtmittel
KR102009727B1 (ko) * 2012-11-26 2019-10-22 삼성디스플레이 주식회사 표시 장치, 표시 장치의 제조 방법 및 표시 장치를 제조하기 위한 캐리어 기판
HK1254640A1 (zh) * 2015-06-19 2019-07-26 Janssen Pharmaceutica, N.V. 用於药物施用和混合的设备和方法及用於所述设备和方法的适当技术的训练
JP6591254B2 (ja) * 2015-10-16 2019-10-16 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
KR20170139924A (ko) * 2016-06-10 2017-12-20 엘지전자 주식회사 투명 발광다이오드 필름
EP3536129B1 (en) * 2016-11-01 2021-07-07 LG Electronics Inc. Transparent light-emitting diode film
DE102016221923A1 (de) * 2016-11-09 2018-05-09 Bayerische Motoren Werke Aktiengesellschaft Beleuchtungseinrichtung für ein Kraftfahrzeug
KR102383302B1 (ko) * 2017-11-08 2022-04-05 엘지디스플레이 주식회사 백라이트 유닛 및 이를 포함한 액정표시장치
DE102017130764B4 (de) * 2017-12-20 2024-01-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Vorrichtung mit Halbleiterchips auf einem Primärträger und Verfahren zur Herstellung einer solchen Vorrichtung
JP6963183B2 (ja) * 2018-06-22 2021-11-05 日亜化学工業株式会社 発光モジュールの製造方法
EP3591345B1 (de) * 2018-07-02 2020-11-11 Dr. Johannes Heidenhain GmbH Verfahren zur herstellung einer lichtquelle für eine sensoreinheit einer positionsmesseinrichtung sowie eine positionsmesseinrichtung
WO2020010243A1 (en) 2018-07-03 2020-01-09 Glowgadget, Llc Flexible lighting panel and lighting fixture

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050212406A1 (en) * 2004-03-29 2005-09-29 Daniels John J Photo-radiation source
CN1716041A (zh) * 2004-06-29 2006-01-04 京瓷株式会社 液晶显示装置
CN1993638A (zh) * 2004-06-01 2007-07-04 3M创新有限公司 Led阵列系统
US20080123355A1 (en) * 2006-07-06 2008-05-29 Dong-Sing Wuu Flexible light emitting module
WO2009067991A2 (de) * 2007-11-29 2009-06-04 Osram Opto Semiconductors Gmbh Halbleiteranordnung sowie verfahren zur herstellung einer halbleiteranordnung

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Publication number Priority date Publication date Assignee Title
US5469020A (en) * 1994-03-14 1995-11-21 Massachusetts Institute Of Technology Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US6473554B1 (en) 1996-12-12 2002-10-29 Teledyne Lighting And Display Products, Inc. Lighting apparatus having low profile
US6340824B1 (en) * 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
DE69937407T2 (de) * 1999-07-09 2008-07-24 Osram Opto Semiconductors Gmbh & Co. Ohg Verkapselung einer vorrichtung
CN100383573C (zh) * 2002-12-02 2008-04-23 3M创新有限公司 多光源照明系统
US7052152B2 (en) * 2003-10-03 2006-05-30 Philips Lumileds Lighting Company, Llc LCD backlight using two-dimensional array LEDs
US7259030B2 (en) * 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
AU2005232074A1 (en) * 2004-03-29 2005-10-20 LumaChip, Inc. Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7476557B2 (en) * 2004-03-29 2009-01-13 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7217956B2 (en) 2004-03-29 2007-05-15 Articulated Technologies, Llc. Light active sheet material
US7858994B2 (en) * 2006-06-16 2010-12-28 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
JP2007095674A (ja) 2005-08-30 2007-04-12 Showa Denko Kk 面光源装置および表示装置
DE102005046450A1 (de) * 2005-09-28 2007-04-05 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip, Verfahren zu dessen Herstellung und optoelektronisches Bauteil
JP4629023B2 (ja) 2005-11-30 2011-02-09 昭和電工株式会社 面光源装置および表示装置
JP4884956B2 (ja) 2005-12-27 2012-02-29 昭和電工株式会社 導光部材および面光源装置ならびに表示装置
DE102007022947B4 (de) 2007-04-26 2022-05-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
DE102007043401A1 (de) * 2007-09-12 2009-03-19 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung und Verfahren zur Herstellung derselben

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050212406A1 (en) * 2004-03-29 2005-09-29 Daniels John J Photo-radiation source
CN1993638A (zh) * 2004-06-01 2007-07-04 3M创新有限公司 Led阵列系统
CN1716041A (zh) * 2004-06-29 2006-01-04 京瓷株式会社 液晶显示装置
US20080123355A1 (en) * 2006-07-06 2008-05-29 Dong-Sing Wuu Flexible light emitting module
WO2009067991A2 (de) * 2007-11-29 2009-06-04 Osram Opto Semiconductors Gmbh Halbleiteranordnung sowie verfahren zur herstellung einer halbleiteranordnung

Also Published As

Publication number Publication date
KR101736408B1 (ko) 2017-05-16
WO2011092072A1 (de) 2011-08-04
CN102714204A (zh) 2012-10-03
JP5732075B2 (ja) 2015-06-10
EP2529399A1 (de) 2012-12-05
KR20120139717A (ko) 2012-12-27
EP2529399B1 (de) 2017-09-20
US20130043496A1 (en) 2013-02-21
JP2013518374A (ja) 2013-05-20
US9029878B2 (en) 2015-05-12
DE102010018260A1 (de) 2011-08-04

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151125

Termination date: 20200117