KR101736408B1 - 조명 장치 - Google Patents

조명 장치 Download PDF

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Publication number
KR101736408B1
KR101736408B1 KR1020127022670A KR20127022670A KR101736408B1 KR 101736408 B1 KR101736408 B1 KR 101736408B1 KR 1020127022670 A KR1020127022670 A KR 1020127022670A KR 20127022670 A KR20127022670 A KR 20127022670A KR 101736408 B1 KR101736408 B1 KR 101736408B1
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KR
South Korea
Prior art keywords
light emitting
emitting diode
diode chips
carrier
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020127022670A
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English (en)
Korean (ko)
Other versions
KR20120139717A (ko
Inventor
마티아스 사바틸
노르빈 폰 말름
루츠 회에펠
슈테판 일레크
베른트 바르흐만
파트릭 로데
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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Publication of KR20120139717A publication Critical patent/KR20120139717A/ko
Application granted granted Critical
Publication of KR101736408B1 publication Critical patent/KR101736408B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
KR1020127022670A 2010-01-29 2011-01-17 조명 장치 Expired - Fee Related KR101736408B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102010006135.2 2010-01-29
DE102010006135 2010-01-29
DE102010018260.5 2010-04-26
DE102010018260A DE102010018260A1 (de) 2010-01-29 2010-04-26 Beleuchtungsvorrichtung
PCT/EP2011/050541 WO2011092072A1 (de) 2010-01-29 2011-01-17 Beleuchtungsvorrichtung

Publications (2)

Publication Number Publication Date
KR20120139717A KR20120139717A (ko) 2012-12-27
KR101736408B1 true KR101736408B1 (ko) 2017-05-16

Family

ID=44316189

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127022670A Expired - Fee Related KR101736408B1 (ko) 2010-01-29 2011-01-17 조명 장치

Country Status (7)

Country Link
US (1) US9029878B2 (enExample)
EP (1) EP2529399B1 (enExample)
JP (1) JP5732075B2 (enExample)
KR (1) KR101736408B1 (enExample)
CN (1) CN102714204B (enExample)
DE (1) DE102010018260A1 (enExample)
WO (1) WO2011092072A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011016308A1 (de) 2011-04-07 2012-10-11 Osram Opto Semiconductors Gmbh Anzeigevorrichtung
DE102012209325B4 (de) 2012-06-01 2021-09-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Modul
DE102012213343B4 (de) 2012-07-30 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung VERFAHREN ZUM HERSTELLEN EINES OPTOELEKTRONISCHES HALBLEITERBAUTEILs MIT SAPHIR-FLIP-CHIP
DE202012102963U1 (de) 2012-08-07 2013-11-13 Rp-Technik E.K. Leuchtstofflampenartiges LED-Leuchtmittel
KR102009727B1 (ko) * 2012-11-26 2019-10-22 삼성디스플레이 주식회사 표시 장치, 표시 장치의 제조 방법 및 표시 장치를 제조하기 위한 캐리어 기판
EP3311373B1 (en) * 2015-06-19 2025-01-22 Janssen Pharmaceutica, N.V. Devices and methods for drug administration and mixing, and training of proper techniques therefor
JP6591254B2 (ja) * 2015-10-16 2019-10-16 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
KR20170139924A (ko) * 2016-06-10 2017-12-20 엘지전자 주식회사 투명 발광다이오드 필름
US10290786B2 (en) * 2016-11-01 2019-05-14 Lg Electronics Inc. Transparent light emitting diode film
DE102016221923A1 (de) * 2016-11-09 2018-05-09 Bayerische Motoren Werke Aktiengesellschaft Beleuchtungseinrichtung für ein Kraftfahrzeug
KR102383302B1 (ko) * 2017-11-08 2022-04-05 엘지디스플레이 주식회사 백라이트 유닛 및 이를 포함한 액정표시장치
DE102017130764B4 (de) * 2017-12-20 2024-01-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Vorrichtung mit Halbleiterchips auf einem Primärträger und Verfahren zur Herstellung einer solchen Vorrichtung
JP6963183B2 (ja) * 2018-06-22 2021-11-05 日亜化学工業株式会社 発光モジュールの製造方法
EP3591345B1 (de) * 2018-07-02 2020-11-11 Dr. Johannes Heidenhain GmbH Verfahren zur herstellung einer lichtquelle für eine sensoreinheit einer positionsmesseinrichtung sowie eine positionsmesseinrichtung
EP3818298B1 (en) 2018-07-03 2024-10-23 Glowgadget, LLC Flexible lighting panel and lighting fixture

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2007096305A (ja) * 2005-09-28 2007-04-12 Osram Opto Semiconductors Gmbh オプトエレクトロニクス半導体チップ、オプトエレクトロニクス半導体チップの製造方法およびオプトエレクトロニクスデバイス
JP2007200877A (ja) * 2005-12-27 2007-08-09 Showa Denko Kk 導光部材および面光源装置ならびに表示装置
US20070290217A1 (en) * 2006-06-16 2007-12-20 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
US20080123355A1 (en) * 2006-07-06 2008-05-29 Dong-Sing Wuu Flexible light emitting module

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US5469020A (en) * 1994-03-14 1995-11-21 Massachusetts Institute Of Technology Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US6473554B1 (en) 1996-12-12 2002-10-29 Teledyne Lighting And Display Products, Inc. Lighting apparatus having low profile
US6340824B1 (en) * 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
DE69937407T2 (de) * 1999-07-09 2008-07-24 Osram Opto Semiconductors Gmbh & Co. Ohg Verkapselung einer vorrichtung
US7163327B2 (en) * 2002-12-02 2007-01-16 3M Innovative Properties Company Illumination system using a plurality of light sources
US7052152B2 (en) * 2003-10-03 2006-05-30 Philips Lumileds Lighting Company, Llc LCD backlight using two-dimensional array LEDs
US7217956B2 (en) 2004-03-29 2007-05-15 Articulated Technologies, Llc. Light active sheet material
US7476557B2 (en) * 2004-03-29 2009-01-13 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7259030B2 (en) * 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
MXPA06011114A (es) * 2004-03-29 2007-01-25 Articulated Technologies Llc Hoja luminosa fabricada de rodillo a rodillo y dispositivos encapsulados de circuito semiconductor.
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
US7997771B2 (en) 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
JP2006011242A (ja) * 2004-06-29 2006-01-12 Kyocera Corp 液晶表示装置
JP2007095674A (ja) 2005-08-30 2007-04-12 Showa Denko Kk 面光源装置および表示装置
JP4629023B2 (ja) * 2005-11-30 2011-02-09 昭和電工株式会社 面光源装置および表示装置
DE102007022947B4 (de) 2007-04-26 2022-05-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
DE102007043401A1 (de) 2007-09-12 2009-03-19 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung und Verfahren zur Herstellung derselben
DE102008005935A1 (de) 2007-11-29 2009-06-04 Osram Opto Semiconductors Gmbh Halbleiteranordnung sowie Verfahren zur Herstellung einer Halbleiteranordnung

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2007096305A (ja) * 2005-09-28 2007-04-12 Osram Opto Semiconductors Gmbh オプトエレクトロニクス半導体チップ、オプトエレクトロニクス半導体チップの製造方法およびオプトエレクトロニクスデバイス
JP2007200877A (ja) * 2005-12-27 2007-08-09 Showa Denko Kk 導光部材および面光源装置ならびに表示装置
US20070290217A1 (en) * 2006-06-16 2007-12-20 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
US20080123355A1 (en) * 2006-07-06 2008-05-29 Dong-Sing Wuu Flexible light emitting module

Also Published As

Publication number Publication date
JP5732075B2 (ja) 2015-06-10
EP2529399B1 (de) 2017-09-20
KR20120139717A (ko) 2012-12-27
CN102714204B (zh) 2015-11-25
US9029878B2 (en) 2015-05-12
EP2529399A1 (de) 2012-12-05
CN102714204A (zh) 2012-10-03
JP2013518374A (ja) 2013-05-20
WO2011092072A1 (de) 2011-08-04
US20130043496A1 (en) 2013-02-21
DE102010018260A1 (de) 2011-08-04

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