CN102709647A - 300-watt loading sheet of high-power aluminum nitride ceramic substrate - Google Patents
300-watt loading sheet of high-power aluminum nitride ceramic substrate Download PDFInfo
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- CN102709647A CN102709647A CN2012102166426A CN201210216642A CN102709647A CN 102709647 A CN102709647 A CN 102709647A CN 2012102166426 A CN2012102166426 A CN 2012102166426A CN 201210216642 A CN201210216642 A CN 201210216642A CN 102709647 A CN102709647 A CN 102709647A
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- aluminum nitride
- aluminium nitride
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Abstract
The invention discloses a 300-watt loading sheet of a high-power aluminum nitride ceramic substrate, which comprises an aluminum nitride substrate, wherein the size of the aluminum nitride substrate is 9.5*9.5*1 millimeters, a front face of the aluminum nitride substrate is printed with a back guide layer, a front face of the aluminum nitride substrate is printed with resistors and guide lines, the guide lines are connected with the resistors to form a loading circuit, a grounding end of the loading circuit is electrically connected with the back guide layer, the circuit is provided with a large pad, and the resistors are large-area resistors. The average power of the 300-watt loading sheet of the high-power aluminum nitride ceramic substrate can reach 300 watts, and the 300-watt loading sheet has favorable voltage standing wave ratio (VSWR) performance, is an initiate of a domestic microwave passive device, substitutes similar imported products, and fills the blank of China.
Description
Technical field
The present invention relates to a kind of aluminium nitride ceramics substrate carrier sheet, particularly a kind of high-power aluminium nitride ceramics substrate 300 tile load sheets.
Background technology
Aluminium nitride ceramics substrate carrier sheet belongs to novel high-tech industry at present, replaces the beryllium oxide substrate carrier sheet of traditional not environmental protection, and more international companies compare early the research and development starting of this novel industry.No matter growing along with domestic microwave communication industry is that it is important that independent development, the design studies of domestic aluminium nitride ceramics substrate carrier sheet more seems from the price factor or the needs of self-growth.
Along with increasing of power; To the high power load sheet proposition higher requirement of aluminium nitride ceramics as substrate; Need more large substrates size in order to reach higher power on the one hand; On the one hand along with the continuous development in the market low cost of begging to surrender again, and the miniaturization of components and parts integrated be again new development trend.Simultaneously, the heat conductivility of aluminium nitride ceramics is along with the rising of temperature can have a declining tendency, but contradiction is that improving constantly of power must cause carrier sheet in the process of work, can produce higher heat, just can reach higher temperature.The present domestic 300 tile load sheets that do not use the aluminium nitride ceramics substrate production to be of a size of 9.5*9.5*1mm.
Summary of the invention
To above-mentioned situation, the technical problem that the present invention will solve provides the aluminium nitride ceramics substrate carrier sheet that a kind of 9.5*9.5*1mm of being of a size of can carry 300W power, its stable performance, and resistance accuracy is high, and price has more advantage.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of high-power aluminium nitride ceramics substrate 300 tile load sheets; It comprises that one is of a size of the aluminium nitride substrate of 9.5*9.5*1mm, and the front of said aluminium nitride substrate is printed with back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead; Said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said circuit is provided with large bonding pad, and said resistance adopts the large tracts of land resistive arrangement.
Preferably, be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: these high-power aluminium nitride ceramics substrate 300 tile load sheets just design with large bonding pad; Improved the ability that moment bears big electric current; The large tracts of land resistive arrangement; The ability that has increased its heat dissipation capability and born power makes being of a size of and can bear 300 watts power on the 9.5*9.5*1mm substrate area.Simultaneously can make carrier sheet aspect characteristic, satisfy requirement of actual application, make it have good VSWR performance, substitute similar imported product, fill the domestic gaps.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention, understands technological means of the present invention in order can more to know, and can implement according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. specify as after.Embodiment of the present invention is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described in detail.
As shown in Figure 1; These high-power aluminium nitride ceramics substrate 300 tile load sheets comprise that one is of a size of the aluminium nitride substrate 1 of 9.5*9.5*1mm; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate is printed with lead 2 and resistance 3, resistance 3 transverse arrangement of turbo. and resistance 3 is connected to form load circuit through lead 2; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, can make load circuit ground connection form the loop like this.Be printed with glass protection film 4 on the resistance 3, the upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5, can form effectively protection to lead 2, resistance 3 and glass protection film 4 like this.Back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.Load circuit is provided with the large bonding pad with wire bonds.
These high-power aluminium nitride ceramics substrate 300 tile load sheets just design with large bonding pad; Improved the ability that moment bears big electric current; The large tracts of land resistive arrangement, the ability that has increased its heat dissipation capability and born power makes being of a size of and can bear 300 watts power on the 9.5*9.5*1mm substrate area.Simultaneously can make carrier sheet aspect characteristic, satisfy requirement of actual application, make it have good VSWR performance, substitute similar imported product, fill the domestic gaps.
More than a kind of high-power aluminium nitride ceramics substrate 300 tile load sheets that the embodiment of the invention provided have been carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as limitation of the present invention, and all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (3)
1. high-power aluminium nitride ceramics substrate 300 tile load sheets; It is characterized in that: it comprises that one is of a size of the aluminium nitride substrate of 9.5*9.5*1mm, and the front of said aluminium nitride substrate is printed with back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead; Said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said circuit is provided with large bonding pad, and said resistance adopts the large tracts of land resistive arrangement.
2. high-power aluminium nitride ceramics substrate 300 tile load sheets according to claim 1, it is characterized in that: be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
3. high-power aluminium nitride ceramics substrate 300 tile load sheets according to claim 1, it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102166426A CN102709647A (en) | 2012-06-28 | 2012-06-28 | 300-watt loading sheet of high-power aluminum nitride ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102166426A CN102709647A (en) | 2012-06-28 | 2012-06-28 | 300-watt loading sheet of high-power aluminum nitride ceramic substrate |
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| Publication Number | Publication Date |
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| CN102709647A true CN102709647A (en) | 2012-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012102166426A Pending CN102709647A (en) | 2012-06-28 | 2012-06-28 | 300-watt loading sheet of high-power aluminum nitride ceramic substrate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
-
2012
- 2012-06-28 CN CN2012102166426A patent/CN102709647A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
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Application publication date: 20121003 |