CN102696101B - 静电夹盘及其整修方法 - Google Patents

静电夹盘及其整修方法 Download PDF

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Publication number
CN102696101B
CN102696101B CN201080059991.0A CN201080059991A CN102696101B CN 102696101 B CN102696101 B CN 102696101B CN 201080059991 A CN201080059991 A CN 201080059991A CN 102696101 B CN102696101 B CN 102696101B
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CN
China
Prior art keywords
plate
metal cooling
cooling plate
ceramic plate
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080059991.0A
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English (en)
Chinese (zh)
Other versions
CN102696101A (zh
Inventor
阿丽萨·哈特
约翰·C·博伊德
莉莎·帕尔马
阿拉斯代尔·登特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
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ASM Nutool Inc
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Publication date
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of CN102696101A publication Critical patent/CN102696101A/zh
Application granted granted Critical
Publication of CN102696101B publication Critical patent/CN102696101B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
CN201080059991.0A 2009-12-29 2010-12-20 静电夹盘及其整修方法 Active CN102696101B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/648,638 US8597448B2 (en) 2009-12-29 2009-12-29 Electrostatic chucks and methods for refurbishing same
US12/648,638 2009-12-29
PCT/US2010/061348 WO2011090650A2 (en) 2009-12-29 2010-12-20 Electrostatic chucks and methods for refurbishing same

Publications (2)

Publication Number Publication Date
CN102696101A CN102696101A (zh) 2012-09-26
CN102696101B true CN102696101B (zh) 2016-04-06

Family

ID=44186004

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080059991.0A Active CN102696101B (zh) 2009-12-29 2010-12-20 静电夹盘及其整修方法

Country Status (7)

Country Link
US (2) US8597448B2 (enExample)
JP (1) JP5769264B2 (enExample)
KR (1) KR101821425B1 (enExample)
CN (1) CN102696101B (enExample)
SG (2) SG181503A1 (enExample)
TW (1) TWI488257B (enExample)
WO (1) WO2011090650A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8597448B2 (en) 2009-12-29 2013-12-03 Novellus Systems, Inc. Electrostatic chucks and methods for refurbishing same
US9054148B2 (en) * 2011-08-26 2015-06-09 Lam Research Corporation Method for performing hot water seal on electrostatic chuck
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
US9999947B2 (en) * 2015-05-01 2018-06-19 Component Re-Engineering Company, Inc. Method for repairing heaters and chucks used in semiconductor processing
KR20170016547A (ko) 2015-08-03 2017-02-14 삼성전자주식회사 척 테이블 및 그를 포함하는 기판 제조 장치
US10020218B2 (en) 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
US10147610B1 (en) 2017-05-30 2018-12-04 Lam Research Corporation Substrate pedestal module including metallized ceramic tubes for RF and gas delivery
KR102071674B1 (ko) * 2017-07-19 2020-01-30 주식회사 임나노텍 레이저 용접을 이용한 반도체 스퍼터링 정전척의 리사이클링 시스템
US11488852B2 (en) 2019-05-31 2022-11-01 Applied Materials, Inc. Methods and apparatus for reducing high voltage arcing in semiconductor process chambers
JP7633794B2 (ja) * 2020-03-26 2025-02-20 三星電子株式会社 静電チャック装置
JP2023004738A (ja) * 2021-06-28 2023-01-17 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板載置台の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3513891A (en) * 1967-06-16 1970-05-26 Production Machines Inc Chuck for veneer lathe inner spindle
CN2786784Y (zh) * 2004-03-31 2006-06-07 应用材料公司 可拆卸静电吸盘
US20080089001A1 (en) * 2006-10-13 2008-04-17 Applied Materials, Inc. Detachable electrostatic chuck having sealing assembly
US20080143379A1 (en) * 2006-12-15 2008-06-19 Richard Norman Reprogrammable circuit board with alignment-insensitive support for multiple component contact types

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581874A (en) * 1994-03-28 1996-12-10 Tokyo Electron Limited Method of forming a bonding portion
JP3485390B2 (ja) * 1995-07-28 2004-01-13 京セラ株式会社 静電チャック
JP4311600B2 (ja) * 2001-01-30 2009-08-12 日本碍子株式会社 静電チャック用接合構造体及びその製造方法
JP4003932B2 (ja) * 2002-03-07 2007-11-07 日本碍子株式会社 セラミックス−金属接合体
JP4451098B2 (ja) 2002-08-22 2010-04-14 住友大阪セメント株式会社 サセプタ装置
JP4402949B2 (ja) 2003-12-26 2010-01-20 株式会社クリエイティブ テクノロジー 双極型静電チャックの再生方法
US7208325B2 (en) * 2005-01-18 2007-04-24 Applied Materials, Inc. Refreshing wafers having low-k dielectric materials
JP4425850B2 (ja) * 2005-11-07 2010-03-03 日本碍子株式会社 基板載置部材の分離方法及び再利用方法
US9202736B2 (en) * 2007-07-31 2015-12-01 Applied Materials, Inc. Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
JP2011100889A (ja) * 2009-11-06 2011-05-19 Mitsui Eng & Shipbuild Co Ltd 静電チャック、静電チャック製造方法、および静電チャック再生方法
US8597448B2 (en) 2009-12-29 2013-12-03 Novellus Systems, Inc. Electrostatic chucks and methods for refurbishing same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3513891A (en) * 1967-06-16 1970-05-26 Production Machines Inc Chuck for veneer lathe inner spindle
CN2786784Y (zh) * 2004-03-31 2006-06-07 应用材料公司 可拆卸静电吸盘
US20080089001A1 (en) * 2006-10-13 2008-04-17 Applied Materials, Inc. Detachable electrostatic chuck having sealing assembly
US20080143379A1 (en) * 2006-12-15 2008-06-19 Richard Norman Reprogrammable circuit board with alignment-insensitive support for multiple component contact types

Also Published As

Publication number Publication date
JP5769264B2 (ja) 2015-08-26
US8968503B2 (en) 2015-03-03
CN102696101A (zh) 2012-09-26
KR101821425B1 (ko) 2018-01-23
SG10201408733PA (en) 2015-02-27
SG181503A1 (en) 2012-07-30
WO2011090650A2 (en) 2011-07-28
TWI488257B (zh) 2015-06-11
TW201138017A (en) 2011-11-01
US20110155299A1 (en) 2011-06-30
JP2013516084A (ja) 2013-05-09
US20140124123A1 (en) 2014-05-08
US8597448B2 (en) 2013-12-03
KR20120120165A (ko) 2012-11-01
WO2011090650A3 (en) 2011-11-10

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