CN102694106A - 光源电路单元、照明器件和显示器件 - Google Patents

光源电路单元、照明器件和显示器件 Download PDF

Info

Publication number
CN102694106A
CN102694106A CN2012100708393A CN201210070839A CN102694106A CN 102694106 A CN102694106 A CN 102694106A CN 2012100708393 A CN2012100708393 A CN 2012100708393A CN 201210070839 A CN201210070839 A CN 201210070839A CN 102694106 A CN102694106 A CN 102694106A
Authority
CN
China
Prior art keywords
light source
wiring pattern
source circuit
circuit unit
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012100708393A
Other languages
English (en)
Chinese (zh)
Inventor
山本浩一
广瀬健人
勅使河原茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saturn Licensing LLC
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to CN201810269811.XA priority Critical patent/CN108493313A/zh
Publication of CN102694106A publication Critical patent/CN102694106A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN2012100708393A 2011-03-23 2012-03-16 光源电路单元、照明器件和显示器件 Pending CN102694106A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810269811.XA CN108493313A (zh) 2011-03-23 2012-03-16 光源电路单元、照明器件和显示器件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-064582 2011-03-23
JP2011064582A JP2012204370A (ja) 2011-03-23 2011-03-23 光源回路ユニットおよび照明装置、並びに表示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201810269811.XA Division CN108493313A (zh) 2011-03-23 2012-03-16 光源电路单元、照明器件和显示器件

Publications (1)

Publication Number Publication Date
CN102694106A true CN102694106A (zh) 2012-09-26

Family

ID=46859450

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2012100708393A Pending CN102694106A (zh) 2011-03-23 2012-03-16 光源电路单元、照明器件和显示器件
CN201810269811.XA Pending CN108493313A (zh) 2011-03-23 2012-03-16 光源电路单元、照明器件和显示器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810269811.XA Pending CN108493313A (zh) 2011-03-23 2012-03-16 光源电路单元、照明器件和显示器件

Country Status (6)

Country Link
US (1) US8829776B2 (enExample)
JP (1) JP2012204370A (enExample)
CN (2) CN102694106A (enExample)
BR (1) BR102012005930B1 (enExample)
IN (1) IN2012DE00766A (enExample)
RU (1) RU2595298C2 (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109031774A (zh) * 2017-06-12 2018-12-18 群创光电股份有限公司 显示器
CN112292559A (zh) * 2018-06-21 2021-01-29 昕诺飞控股有限公司 照明模块
CN113270437A (zh) * 2020-02-17 2021-08-17 京东方科技集团股份有限公司 背板及其制备方法、显示装置
CN114428421A (zh) * 2020-10-29 2022-05-03 海信视像科技股份有限公司 一种显示装置
CN114551695A (zh) * 2022-02-25 2022-05-27 合肥京东方瑞晟科技有限公司 发光基板及其制造方法、显示装置
CN114994980A (zh) * 2022-06-01 2022-09-02 Tcl华星光电技术有限公司 背光板及其制备方法、显示装置
US11703716B2 (en) 2020-04-28 2023-07-18 Hisense Visual Technology Co., Ltd. Display apparatus
US11796859B2 (en) 2020-03-25 2023-10-24 Hisense Visual Technology Co., Ltd. Display apparatus with micro light emitting diode light board
US11822183B2 (en) 2020-03-25 2023-11-21 Hisense Visual Technology Co., Ltd. Display apparatus
WO2024000411A1 (zh) * 2022-06-30 2024-01-04 京东方科技集团股份有限公司 发光基板及其制备方法、背光模组及显示装置

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004815A (ja) 2011-06-17 2013-01-07 Sony Corp 光源回路ユニットおよび照明装置、並びに表示装置
US9678267B2 (en) 2012-05-18 2017-06-13 Reald Spark, Llc Wide angle imaging directional backlights
US9235057B2 (en) 2012-05-18 2016-01-12 Reald Inc. Polarization recovery in a directional display device
US9188731B2 (en) 2012-05-18 2015-11-17 Reald Inc. Directional backlight
EP2850482B1 (en) 2012-05-18 2022-07-27 RealD Spark, LLC Controlling light sources of a directional backlight
US9350980B2 (en) * 2012-05-18 2016-05-24 Reald Inc. Crosstalk suppression in a directional backlight
KR20140020446A (ko) * 2012-08-08 2014-02-19 삼성디스플레이 주식회사 백라이트 어셈블리 및 이를 갖는 표시 장치
EP3011734A4 (en) 2013-06-17 2017-02-22 RealD Inc. Controlling light sources of a directional backlight
DE102013211640A1 (de) * 2013-06-20 2014-12-24 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung
EP3058562A4 (en) 2013-10-14 2017-07-26 RealD Spark, LLC Control of directional display
CN106062620B (zh) 2013-10-14 2020-02-07 瑞尔D斯帕克有限责任公司 用于定向背光源的光输入
US20160230955A1 (en) * 2014-05-27 2016-08-11 El Lighting Co., LTD. Optical module
JP6962521B2 (ja) 2014-06-26 2021-11-05 リアルディー スパーク エルエルシー 指向性プライバシーディスプレイ
EP3204686B1 (en) 2014-10-08 2019-07-17 RealD Spark, LLC Connection unit for a directional backlight
WO2016105541A1 (en) 2014-12-24 2016-06-30 Reald Inc. Adjustment of perceived roundness in stereoscopic image of a head
JP6414485B2 (ja) * 2015-02-27 2018-10-31 日亜化学工業株式会社 発光装置
JP2016162971A (ja) 2015-03-04 2016-09-05 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
RU2596062C1 (ru) 2015-03-20 2016-08-27 Автономная Некоммерческая Образовательная Организация Высшего Профессионального Образования "Сколковский Институт Науки И Технологий" Способ коррекции изображения глаз с использованием машинного обучения и способ машинного обучения
CN107636502B (zh) 2015-04-13 2021-08-10 瑞尔D斯帕克有限责任公司 广角成像定向背光源
KR101694702B1 (ko) * 2015-04-21 2017-01-11 우리이앤엘 주식회사 Led 광원 유닛 및 이를 이용한 백라이트 어셈블리
WO2016191598A1 (en) 2015-05-27 2016-12-01 Reald Inc. Wide angle imaging directional backlights
JP6506899B2 (ja) * 2015-10-08 2019-04-24 日亜化学工業株式会社 発光装置、集積型発光装置および発光モジュール
EP3369034B1 (en) 2015-10-26 2023-07-05 RealD Spark, LLC Intelligent privacy system, apparatus, and method thereof
US10459321B2 (en) 2015-11-10 2019-10-29 Reald Inc. Distortion matching polarization conversion systems and methods thereof
US10359561B2 (en) 2015-11-13 2019-07-23 Reald Spark, Llc Waveguide comprising surface relief feature and directional backlight, directional display device, and directional display apparatus comprising said waveguide
US10330843B2 (en) 2015-11-13 2019-06-25 Reald Spark, Llc Wide angle imaging directional backlights
WO2017120247A1 (en) 2016-01-05 2017-07-13 Reald Spark, Llc Gaze correction of multi-view images
JP2017152450A (ja) * 2016-02-22 2017-08-31 大日本印刷株式会社 Ｌｅｄ表示装置
US11079619B2 (en) 2016-05-19 2021-08-03 Reald Spark, Llc Wide angle imaging directional backlights
CN109496258A (zh) 2016-05-23 2019-03-19 瑞尔D斯帕克有限责任公司 广角成像定向背光源
EP3566094B1 (en) 2017-01-04 2023-12-06 RealD Spark, LLC Optical stack for imaging directional backlights
WO2018187154A1 (en) 2017-04-03 2018-10-11 Reald Spark, Llc Segmented imaging directional backlights
EP4293574A3 (en) 2017-08-08 2024-04-03 RealD Spark, LLC Adjusting a digital representation of a head region
WO2019090246A1 (en) 2017-11-06 2019-05-09 Reald Spark, Llc Privacy display apparatus
CN107966853A (zh) * 2017-11-17 2018-04-27 武汉华星光电技术有限公司 液晶显示器及其背光模组
CN111919162B (zh) 2018-01-25 2024-05-24 瑞尔D斯帕克有限责任公司 用于隐私显示器的触摸屏
CN110908180A (zh) * 2018-09-17 2020-03-24 夏普株式会社 照明装置、显示装置及照明装置的制造方法
JP7340166B2 (ja) * 2019-01-24 2023-09-07 大日本印刷株式会社 動植物育成用のｌｅｄ照明シート、動植物育成用のｌｅｄ照明モジュール、動植物の育成棚用の棚板、動植物の育成棚、及び動植物育成工場
JP7282620B2 (ja) 2019-07-04 2023-05-29 シャープ福山レーザー株式会社 画像表示素子
US11430921B2 (en) * 2019-12-17 2022-08-30 Intel Corporation Micro LED apparatus including color conversion structures and methods of manufacturing the same
CN111293148B (zh) * 2020-02-20 2022-08-19 绵阳京东方光电科技有限公司 显示装置、显示面板及其制造方法
US11821602B2 (en) 2020-09-16 2023-11-21 Reald Spark, Llc Vehicle external illumination device
CN118712309A (zh) 2020-11-20 2024-09-27 隆达电子股份有限公司 发光装置、背光板及显示面板
KR102931287B1 (ko) 2020-12-09 2026-02-27 삼성전자주식회사 디스플레이 장치 및 그 광원 장치
CN116325184A (zh) 2021-01-04 2023-06-23 三星电子株式会社 显示装置及其光源设备
WO2022246745A1 (zh) * 2021-05-27 2022-12-01 京东方科技集团股份有限公司 背光模组、其制作方法及显示装置
CN115966561A (zh) 2021-09-30 2023-04-14 日亚化学工业株式会社 发光装置
EP4344386A4 (en) * 2021-12-22 2024-11-27 Samsung Electronics Co., Ltd. Display device and light source device thereof
EP4365672A4 (en) 2022-01-28 2024-11-13 Samsung Electronics Co., Ltd. Display device and light source device thereof
KR20230116519A (ko) * 2022-01-28 2023-08-04 삼성전자주식회사 디스플레이 장치 및 그 광원 장치
WO2024030274A1 (en) 2022-08-02 2024-02-08 Reald Spark, Llc Pupil tracking near-eye display
US12282168B2 (en) 2022-08-11 2025-04-22 Reald Spark, Llc Anamorphic directional illumination device with selective light-guiding
CN220439650U (zh) * 2023-05-24 2024-02-02 漳州立达信光电子科技有限公司 灯丝基材、灯丝和灯具
JP2025173968A (ja) 2024-05-16 2025-11-28 アルプスアルパイン株式会社 透過型ｌｅｄディスプレイ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258296A (ja) * 2007-04-03 2008-10-23 Sony Corp 発光装置及び光源装置
CN101614339A (zh) * 2008-06-24 2009-12-30 夏普株式会社 发光装置、面光源及发光装置用封装件的制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04107349A (ja) 1990-08-23 1992-04-08 Toyota Motor Corp 四輪駆動車用パワーユニット
CN100587560C (zh) * 2003-04-01 2010-02-03 夏普株式会社 发光装置用组件、发光装置、背侧光照射装置、显示装置
JP2005039194A (ja) * 2003-06-26 2005-02-10 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
WO2007032116A1 (ja) * 2005-09-14 2007-03-22 Sharp Kabushiki Kaisha 液晶表示装置
KR20070045462A (ko) * 2005-10-27 2007-05-02 엘지이노텍 주식회사 발광 다이오드 패키지
US7646450B2 (en) * 2005-12-29 2010-01-12 Lg Display Co., Ltd. Light emitting diode array, method of manufacturing the same, backlight assembly having the same, and LCD having the same
JP4049186B2 (ja) 2006-01-26 2008-02-20 ソニー株式会社 光源装置
US20070228386A1 (en) * 2006-03-30 2007-10-04 Jin-Shown Shie Wire-bonding free packaging structure of light emitted diode
JP4935514B2 (ja) * 2006-09-01 2012-05-23 日亜化学工業株式会社 発光装置
RU2319991C1 (ru) * 2006-10-24 2008-03-20 Самсунг Электроникс Ко., Лтд. Жидкокристаллический дисплей
JP5010925B2 (ja) * 2007-01-12 2012-08-29 株式会社ジャパンディスプレイイースト 液晶表示モジュール
JP4521013B2 (ja) * 2007-05-15 2010-08-11 株式会社日立製作所 照明装置および該照明装置を用いた液晶表示装置
JP4107349B2 (ja) 2007-06-20 2008-06-25 ソニー株式会社 光源装置、表示装置
JP2009267289A (ja) * 2008-04-30 2009-11-12 Citizen Electronics Co Ltd 発光装置
JP2010103355A (ja) * 2008-10-24 2010-05-06 Alpine Electronics Inc バックライト用ｌｅｄモジュール
JP2010165572A (ja) * 2009-01-16 2010-07-29 Sony Corp 平面発光装置、パネル、および表示装置
KR20100094246A (ko) * 2009-02-18 2010-08-26 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258296A (ja) * 2007-04-03 2008-10-23 Sony Corp 発光装置及び光源装置
CN101614339A (zh) * 2008-06-24 2009-12-30 夏普株式会社 发光装置、面光源及发光装置用封装件的制造方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109031774A (zh) * 2017-06-12 2018-12-18 群创光电股份有限公司 显示器
CN112292559A (zh) * 2018-06-21 2021-01-29 昕诺飞控股有限公司 照明模块
CN112292559B (zh) * 2018-06-21 2024-03-08 昕诺飞控股有限公司 照明模块
CN113270437A (zh) * 2020-02-17 2021-08-17 京东方科技集团股份有限公司 背板及其制备方法、显示装置
WO2021164583A1 (zh) * 2020-02-17 2021-08-26 京东方科技集团股份有限公司 背板及其制备方法、显示装置
US11822183B2 (en) 2020-03-25 2023-11-21 Hisense Visual Technology Co., Ltd. Display apparatus
US11796859B2 (en) 2020-03-25 2023-10-24 Hisense Visual Technology Co., Ltd. Display apparatus with micro light emitting diode light board
US11703716B2 (en) 2020-04-28 2023-07-18 Hisense Visual Technology Co., Ltd. Display apparatus
CN114428421A (zh) * 2020-10-29 2022-05-03 海信视像科技股份有限公司 一种显示装置
CN114551695A (zh) * 2022-02-25 2022-05-27 合肥京东方瑞晟科技有限公司 发光基板及其制造方法、显示装置
CN114994980A (zh) * 2022-06-01 2022-09-02 Tcl华星光电技术有限公司 背光板及其制备方法、显示装置
CN114994980B (zh) * 2022-06-01 2024-01-26 Tcl华星光电技术有限公司 背光板及其制备方法、显示装置
WO2024000411A1 (zh) * 2022-06-30 2024-01-04 京东方科技集团股份有限公司 发光基板及其制备方法、背光模组及显示装置
CN117642688A (zh) * 2022-06-30 2024-03-01 京东方科技集团股份有限公司 发光基板及其制备方法、背光模组及显示装置
US12298621B2 (en) 2022-06-30 2025-05-13 Hefei BOE Ruisheng Technology Co., Ltd. Light-emitting substrate and manufacturing method thereof, backlight module and display apparatus

Also Published As

Publication number Publication date
JP2012204370A (ja) 2012-10-22
CN108493313A (zh) 2018-09-04
IN2012DE00766A (enExample) 2015-08-21
US8829776B2 (en) 2014-09-09
RU2595298C2 (ru) 2016-08-27
US20120243261A1 (en) 2012-09-27
BR102012005930A2 (pt) 2015-07-28
BR102012005930B1 (pt) 2020-09-24
RU2012110241A (ru) 2013-09-27

Similar Documents

Publication Publication Date Title
US8829776B2 (en) Light-source circuit unit, illumination device, and display device
US10411172B2 (en) Light source circuit unit, illuminator, and display
CN100587560C (zh) 发光装置用组件、发光装置、背侧光照射装置、显示装置
JP5768435B2 (ja) 発光装置
CN102954398B (zh) 发光模块和具有发光模块的背光单元
CN109917584B (zh) 照明装置和显示装置
CN102147080B (zh) 背光单元和使用该背光单元的显示装置
JP2013140823A (ja) 発光装置
CN204375793U (zh) Led发光装置
US20130020600A1 (en) Light emitting diode package
JP2004311467A (ja) 発光装置用パッケージ、発光装置
CN101834258A (zh) 发光元件的安装用封装、发光装置、背光和液晶显示装置
JP2012203997A5 (enExample)
JP2010238540A (ja) 発光モジュールおよびその製造方法
KR101946912B1 (ko) 광원모듈 및 이를 구비한 조명 시스템
CN102214619A (zh) 发光器件模块
JP6087098B2 (ja) 光源装置、ｌｅｄランプ、および液晶表示装置
JP2008160032A (ja) 発光装置
CN117673234A (zh) 一种布线基板、发光基板、背光模组和显示装置
KR101978941B1 (ko) 발광소자 패키지
KR20130072998A (ko) 발광소자 및 이를 구비한 조명 시스템

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20171101

Address after: American New York

Applicant after: Saturn licensing LLC

Address before: Tokyo, Japan, Japan

Applicant before: Sony Corp

RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20120926