CN102681088A - Planar lightwave circuit splitter chip - Google Patents
Planar lightwave circuit splitter chip Download PDFInfo
- Publication number
- CN102681088A CN102681088A CN2012101071344A CN201210107134A CN102681088A CN 102681088 A CN102681088 A CN 102681088A CN 2012101071344 A CN2012101071344 A CN 2012101071344A CN 201210107134 A CN201210107134 A CN 201210107134A CN 102681088 A CN102681088 A CN 102681088A
- Authority
- CN
- China
- Prior art keywords
- core layer
- waveguide core
- weight portion
- splitter chip
- optical waveguide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a planar lightwave circuit splitter chip and belongs to the field of an optical passive device. The planar lightwave circuit splitter chip comprises a substrate, a waveguide core layer which is deposited on the substrate, an upper wrapping layer which is deposited on the waveguide core layer and a light path which is etched in the waveguide core layer. The planar lightwave circuit splitter chip is etched by using photoresist.
Description
Technical field
The present invention relates to a kind of planar optical waveguide splitter chip, belong to the optical passive component field.
Background technology
Development along with Fibre Optical Communication Technology; Fiber to the home (FTTH) has obtained fairly large commercialization and has demonstrated good growth momentum; Its distinguishing feature is that it adopts the EPON link, and bigger bandwidth is provided, and saves line resource; The reliability of enhancing line reduces environment and power requirement simultaneously.
In the FTTH network, optical branching device is a core devices wherein, is specially adapted to connect local side and terminal device in the EPON (EPON, BPON, GPON etc.), realizes the distribution of luminous power.
At present; The manufacture craft of optical branching device has been made to change into from the fused biconical taper formula basically and has been adopted integrated optics technique production; And planar optical waveguide is the basic element of character in the integrated optics; This technology is to adopt optical lithography on silicon dioxide substrates, to make, and the allocation set of luminous power is formed on a slice chip, and a slice chip can be realized 1 fen power division more than 32 tunnel.
Planar optical waveguide splitter adopts the planar optical waveguide chip technology exactly, and the planar optical waveguide chip is aimed at coupling with fiber array, and with the bonding product that forms of cementing agent.This product has good even dichroism, and integrated level is high, and characteristics such as operating wavelength range is wide, satisfies the request for utilization of FTTH comprehensively, and supports later communication dilatation, and is as shown in Figure 2.
But the problem that this product exists at present is a complex manufacturing technology, aims at Coupling device and costs an arm and a leg, and the product production capacity is not high, thereby causes production cost higher.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of planar optical waveguide splitter chip.
The technical solution adopted for the present invention to solve the technical problems is: a kind of planar optical waveguide splitter chip; Comprise: substrate, be deposited on on-chip waveguide core layer, be deposited on the top covering on the waveguide core layer and be etched in the light path in the waveguide core layer, the input of said light path, output terminal are provided with and the input locating slot and the output locating slot of naked fine coupling.
Said chip; It adopts photoresist to carry out etching, and said photoresist is by the resin of 15 weight portions, two (hexane alkane sulfonyl) diazomethanes of 0.5 weight portion; 0.2 (4-aminomethyl phenyl) diphenyl sulfonium PFOS ester of weight portion; 0.007 the N-methyl bicyclic hexyl amine of weight portion, the tetrabutylphosphoniuhydroxide hydroxide amine of 0.004 weight portion, 1.0 weight
1 of part, the propylene glycol monomethyl ether of 3-dimethyl-2-imidazolone and 70 weight portions is formed.
Said photoetching compositions has multiple good photoresist performance, comprises sensitivity, resolution, and film forms performance, coating performance, thermotolerance etc.; Scheme also have good performance on the tee section and the depth of focus again; Particularly be difficult to cause standing wave effect, also can form almost vertical and smooth limit face even have again in the substrate of high reflectivity.
The present invention solves problems such as apparatus expensive, complex process, the production capacity of planar type optical waveguide shunt in producing is not high; The locating slot of etching and bare fibre coupling on the input and output light path of planar optical waveguide chip; In the production of optical branching device, optical fiber is directly inserted the planar optical waveguide chip, and with ultra-violet curing glue bond and curing; Fix with mental package at last, thus the making of completion overall optical shunt.
Description of drawings:
Below in conjunction with accompanying drawing and embodiment the present invention is described further.
The level synoptic diagram of Fig. 1 planar optical waveguide of the present invention.
The light path synoptic diagram of the existing planar optical waveguide of Fig. 2.
Fig. 3 optical waveguide synoptic diagram of the present invention.
The flow sheet of Fig. 4 the present invention and shunt.
Among the figure: 1, substrate; 2, waveguide core layer; 3, top covering; 4, figure line; 5, light path; 6, input locating slot; 7, output locating slot.
Embodiment:
In conjunction with Fig. 1, a kind of planar optical waveguide splitter chip shown in 3; Comprise: substrate 1, be deposited on waveguide core layer 2 on the substrate 1, be deposited on the top covering 3 on the waveguide core layer 2 and be etched in the light path 5 in the waveguide core layer 2, it is characterized in that: the input of said light path 5, output terminal are provided with and the input locating slot 6 and the output locating slot 7 of naked fine coupling.
The method for making of a kind of planar optical waveguide splitter chip as shown in Figure 4, its operation steps is following: a a, substrate polishing is surperficial; B, on said substrate the deposition one waveguide core layer; C, will scheme line and be etched in the said waveguide core layer, aim at said waveguide core layer irradiation polarized light then, and make it form light path, and when forming light path, embed input locating slot and output locating slot with naked fine coupling at input, the output terminal of said light path; D, on waveguide core layer, deposit top covering again, and with its curing.
In figure line etching process, adopt photoetching compositions, it is by the resin of 15 weight portions, two (hexane alkane sulfonyl) diazomethanes of 0.5 weight portion; 0.2 (4-aminomethyl phenyl) diphenyl sulfonium PFOS ester of weight portion; 0.007 the N-methyl bicyclic hexyl amine of weight portion, the tetrabutylphosphoniuhydroxide hydroxide amine of 0.004 weight portion, 1 of 1.0 weight portions; The propylene glycol monomethyl ether of 3-dimethyl-2-imidazolone and 70 weight portions is formed.
Through after input locating slot 6 being set in light path and exporting locating slot 7; Make when making planar optical waveguide splitter more conveniently and convenient, when making planar optical waveguide splitter, only need at input locating slot 6 insertion and the naked fibres of a single core that are coupled; Insert and the ribbon fiber that is coupled at output locating slot 7; The coupling back adopts ultraviolet glue with its bonding and curing, fixes with mental package at last, tests then.
It below only is preferred embodiment of the present invention; Be not that the present invention is done any pro forma restriction; Every foundation technical spirit of the present invention all still belongs in the scope of technical scheme of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (2)
1. planar optical waveguide splitter chip; Comprise: substrate (1), be deposited on waveguide core layer (2) on the substrate (1), be deposited on the top covering (3) on the waveguide core layer (2) and be etched in the light path (5) in the waveguide core layer (2), it is characterized in that: input, the output terminal of said light path (5) be provided with and the input locating slot (6) of naked fine coupling with export locating slot (7).
2. a kind of planar optical waveguide splitter chip according to claim 1; It adopts photoresist to carry out etching, and said photoresist is by the resin of 15 weight portions, two (hexane alkane sulfonyl) diazomethanes of 0.5 weight portion; 0.2 (4-aminomethyl phenyl) diphenyl sulfonium PFOS ester of weight portion; 0.007 the N-methyl bicyclic hexyl amine of weight portion, the tetrabutylphosphoniuhydroxide hydroxide amine of 0.004 weight portion, 1 of 1.0 weight portions; The propylene glycol monomethyl ether of 3-dimethyl-2-imidazolone and 70 weight portions is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101071344A CN102681088A (en) | 2012-04-13 | 2012-04-13 | Planar lightwave circuit splitter chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101071344A CN102681088A (en) | 2012-04-13 | 2012-04-13 | Planar lightwave circuit splitter chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102681088A true CN102681088A (en) | 2012-09-19 |
Family
ID=46813279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101071344A Pending CN102681088A (en) | 2012-04-13 | 2012-04-13 | Planar lightwave circuit splitter chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102681088A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040076902A1 (en) * | 2001-10-19 | 2004-04-22 | Junji Nakanishi | Chemical amplification type positive resist composition |
| CN101762845A (en) * | 2010-01-27 | 2010-06-30 | 苏州新海宜通信科技股份有限公司 | Planar optical waveguide splitter chip and method for manufacturing same |
-
2012
- 2012-04-13 CN CN2012101071344A patent/CN102681088A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040076902A1 (en) * | 2001-10-19 | 2004-04-22 | Junji Nakanishi | Chemical amplification type positive resist composition |
| CN101762845A (en) * | 2010-01-27 | 2010-06-30 | 苏州新海宜通信科技股份有限公司 | Planar optical waveguide splitter chip and method for manufacturing same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102053318A (en) | Method for implementing face-down integration of arrayed waveguide grating (AWG) and laser device (LD) on silicon platform | |
| US11163120B2 (en) | Fiber attach enabled wafer level fanout | |
| US10393959B1 (en) | Photonic integrated circuit bonded with interposer | |
| CN109324372B (en) | Silicon optical waveguide end face coupler | |
| CN106405752A (en) | Optical component | |
| CN108091629A (en) | A kind of photoelectric chip integrated morphology | |
| CN207780304U (en) | Effectively high coupling ratios Optical Waveguide Modes spot conversion equipment | |
| CN102073109B (en) | Manufacturing method of QSFP (Quad Small Form-factor Pluggable) module subelement | |
| CN101762845A (en) | Planar optical waveguide splitter chip and method for manufacturing same | |
| CN207281327U (en) | A kind of Optical Waveguide Modes spot-size converter | |
| CN102280410A (en) | PLC wafer cutting method based on glass substrate | |
| CN201607539U (en) | Planar optical wave guide splitter chip | |
| CN103984062B (en) | The packaging technology of optical-electric module and optical-electric module | |
| CN104793298B (en) | Load board structure with side welding plate and manufacturing method of load board structure | |
| JP5819874B2 (en) | Method for producing optical functional element | |
| CN206684343U (en) | A kind of non-equidistant fiber array of more diameter optical fibers | |
| CN103713357B (en) | A kind of silicon-based optical waveguide polarization converter and preparation method thereof | |
| CN102681088A (en) | Planar lightwave circuit splitter chip | |
| CN104597567A (en) | Optical switch array module and chamfered optical fiber array packaging method | |
| CN103605192B (en) | Optical coupling device and manufacturing method thereof | |
| CN102062910B (en) | GPON (Gigabit-Capable PON) module basic unit and manufacturing method thereof | |
| US20180113256A1 (en) | Optical coupling system, corresponding device and method | |
| CN102062911A (en) | GPON (Gigabit-Capable PON) module basic unit and manufacturing method thereof | |
| CN207249168U (en) | A kind of fiber waveguide core wafer and fiber waveguide core | |
| CN115728866B (en) | Multilayer optical rewiring structure of silicon photonic chip and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: No. 198 Industrial Avenue, Jinyuan town Dayi County Sichuan city Chengdu province 611330 Applicant after: Sichuan Tianyi Kanghe Communication Co., Ltd. Address before: West Jinyuan town of Dayi County in Sichuan province 610000 Chengdu City No. 210 Applicant before: Sichuan Tianyi Kanghe Optoelectronic Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SICHUAN TIANYI KANGHE OPTOELECTRONIC CO., LTD. TO: SICHUAN TIANYI COMHEART TELECOM CO., LTD. |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120919 |