CN103984062B - The packaging technology of optical-electric module and optical-electric module - Google Patents
The packaging technology of optical-electric module and optical-electric module Download PDFInfo
- Publication number
- CN103984062B CN103984062B CN201310050110.4A CN201310050110A CN103984062B CN 103984062 B CN103984062 B CN 103984062B CN 201310050110 A CN201310050110 A CN 201310050110A CN 103984062 B CN103984062 B CN 103984062B
- Authority
- CN
- China
- Prior art keywords
- groove
- light
- optical
- layer
- electric module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012536 packaging technology Methods 0.000 title abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000006243 chemical reaction Methods 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 60
- 239000011247 coating layer Substances 0.000 claims description 11
- 239000003989 dielectric material Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- 239000013307 optical fiber Substances 0.000 description 10
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 235000013351 cheese Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Abstract
A packaging technology for optical-electric module and optical-electric module, optical-electric module, comprises a first substrate, a photo-electric conversion element, a light waveguide-layer and a light-guide device.First substrate has at least one step groove structure, and each step groove structure comprises one first groove, one second groove and a reflecting surface.First groove has one first degree of depth.Second groove has second degree of depth that is greater than first degree of depth.Reflecting surface is positioned at one end of the first groove.Photo-electric conversion element receives a light signal in order to launch a light signal to reflecting surface or via reflecting surface.Light waveguide-layer is arranged in the first groove.Light-guide device is configured in the second groove, and wherein light waveguide-layer and light-guide device are in order to transmitting optical signal, and the center of light waveguide-layer is mutually corresponding with the center of light-guide device.
Description
Technical field
The present invention relates to a kind of optical-electric module, and in particular to a kind of for the optical-electric module of optical communication and the packaging technology of optical-electric module.
Background technology
Optical communication is the effect utilizing the conversion of light/electricity and reach transmission of signal.Usually, an optical-electric module (being called light active member) is provided with at transmitting terminal, to transfer electric signal to light signal, and light signal transmits between transmitting terminal and receiving end by optical fiber (being called light passive device) or other light-guide devices, and be provided with another optical-electric module at receiving end, to transfer light signal to electric signal.
At transmitting terminal, the light intensity that optical-electric module provides and coupling efficiency determine that light signal is in the transmission quality of optical fiber and distance, therefore select the photo-electric conversion element that luminous intensity is comparatively strong, the light angle of divergence is less, the light intensity and coupling efficiency that promote optical-electric module can be reached.
But optical fiber, in capping procedure, is only merely fixed on substrate with cover plate by optical-electric module, usually cannot confirm whether optical fiber is aimed at photo-electric conversion element really, thus affects intensity and the coupling efficiency of optical signal transmission.Therefore, in the process of light signal transmission, how keeping the intensity of light signal, and maintain the correctness of light signal, is important topic quite deeply concerned in optical communication industry.
Summary of the invention
The object of the present invention is to provide the packaging technology of a kind of optical-electric module and optical-electric module, the quality of optical communication can be improved.
According to an aspect of the present invention, propose a kind of optical-electric module, comprise a first substrate, a photo-electric conversion element, a light waveguide-layer and a light-guide device.First substrate has at least one step groove structure, and each step groove structure comprises one first groove, one second groove and a reflecting surface.First groove has one first degree of depth.Second groove has second degree of depth that is greater than first degree of depth.Reflecting surface is positioned at one end of the first groove.Photo-electric conversion element receives a light signal in order to launch a light signal to reflecting surface or via reflecting surface.Light waveguide-layer is arranged in the first groove, in order to transmitting optical signal.Light-guide device is configured in the second groove, and wherein light waveguide-layer and light-guide device are in order to transmitting optical signal, and the center of light waveguide-layer is mutually corresponding with the center of light-guide device.
According to an aspect of the present invention, propose a kind of packaging technology of optical-electric module, comprise the following steps.First time etching one first substrate, to form one first groove in first substrate, the first groove has one first degree of depth.Second time etches first substrate, and to form the second groove on the position of second etch, the second groove has second degree of depth that is greater than first degree of depth.Form a light waveguide-layer in the first groove.One light-guide device is arranged in the second groove.There is provided a photo-electric conversion element, in order to launch or to receive a light signal, wherein light waveguide-layer and light-guide device are in order to transmit this light signal, and the center of light waveguide-layer is mutually corresponding with the center of light-guide device.
According to an aspect of the present invention, propose a kind of packaging technology of optical-electric module, comprise the following steps.Etch a first substrate, to form a groove in first substrate.Form a coating layer in groove, to make groove have stepped profile, and one first groove being divided into the degree of depth different trench area and one second groove.Form a light waveguide-layer on coating layer, and be arranged in the first groove.One light-guide device is arranged in the second groove.There is provided a photo-electric conversion element, in order to launch or to receive a light signal, wherein light waveguide-layer and light-guide device are in order to transmitting optical signal, and the center of light waveguide-layer is mutually corresponding with the center of light-guide device.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 illustrates the schematic diagram of the step groove structure according to an embodiment;
Fig. 2 A ~ Fig. 2 C illustrates the cross-sectional schematic of the second groove;
Fig. 3 A ~ Fig. 3 E illustrates the cross-sectional schematic of the first groove;
Fig. 4 A and Fig. 4 B illustrates the cross-sectional schematic of the optical-electric module according to an embodiment respectively;
Fig. 5 A and Fig. 5 B illustrates the schematic diagram of the optical-electric module according to another embodiment of the present invention;
Fig. 6 illustrates the schematic diagram of the optical-electric module according to another embodiment of the present invention;
Fig. 7 illustrates the schematic diagram of the optical-electric module according to another embodiment of the present invention;
Fig. 8 A ~ Fig. 8 F illustrates the process flow diagram of the packaging technology of optical-electric module in the first embodiment;
Fig. 9 A ~ Fig. 9 F illustrates the process flow diagram of the packaging technology of optical-electric module in the first embodiment;
Figure 10 A ~ Figure 10 E illustrates the process flow diagram of the packaging technology of optical-electric module in the 3rd embodiment.
Wherein, Reference numeral
100 ~ 103: optical-electric module
109: depression
110: first substrate
111: step groove structure
111 ': groove
112: reflecting surface
113: the first grooves
114: the first surface levels
115: the second grooves
116: vertical plane
116 ': inclined-plane
117: stepped profile
118: the second surface levels
120: photo-electric conversion element
121,122: electrode
123: wire
130: light waveguide-layer
131: the first end faces
132: glue-line
133: dielectric materials layer
134: coating layer
140: light-guide device
141: core
142: big envelope portion
143: the second end faces
150: second substrate
152: storage tank
W1: width
W2: width
L: light signal
H: highly
θ: angle
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present invention and principle of work are described in detail:
The optical-electric module of the present embodiment and packaging technology thereof, be on first substrate, form at least single order ladder groove structure, and be formed with a light waveguide-layer in step groove structure.Each step groove structure has the first groove and second groove of predetermined depth, the degree of depth by the second groove is greater than the degree of depth of the first groove, second groove can as the supporting part of optical fiber or other light-guide devices or blocking part, and the first groove can as the contraposition part of light waveguide-layer and light-guide device contraposition, mutually corresponding with the center of the center with light-guide device that make light waveguide-layer.
Please also refer to Fig. 1, it illustrates the schematic diagram of the step groove structure 111 according to an embodiment.The step groove structure 111 of multiple strip is formed on first substrate 110, and is arranged in parallel with each other along X-direction.In each step groove structure 111, a configurable optical fiber or other light-guide devices 140(are see Fig. 2 A ~ Fig. 2 C), the quantity of optical fiber is more, and port number and the transmission quantity of light signal L are more, relatively increases frequency range and the speed of Signal transmissions.In step groove structure 111, with the supporting part of darker the second groove 115 of the degree of depth as optical fiber or other light-guide devices 140, second groove 115 is such as dovetail groove (as shown in Figure 2 A), V-shaped groove (as shown in Figure 2 B) or deep-slotted chip breaker (as shown in Figure 2 C), but not as limit.In principle, the size necessary energy receiving optical fiber of the second groove 115 or other light-guide devices 140, its degree of depth such as 60 ~ 80 microns, is preferably 1/2 or 2/3 of the diameter being greater than light-guide device 140, but not as limit.
In addition, in FIG, in the Z-axis direction, though the width W 1 illustrating the first groove 113 is less than the width W 2 of the second groove 115 relatively, not as limit.In another embodiment, the width W 1 of the first groove 113 can equal the width W 2 of the second groove 115.
Then, as shown in Fig. 3 A ~ Fig. 3 D, with more shallow the first groove 113 of the degree of depth as the contraposition part of light waveguide-layer 130 with above-mentioned light-guide device 140 contraposition, its degree of depth is such as 20 ~ 40 microns.First groove 113 is such as dovetail groove (as shown in Figure 3A), V-shaped groove (as shown in Figure 3 B), deep-slotted chip breaker (as shown in Figure 3 C) or rectangular channel (as shown in Figure 3 D), but not as limit.Light waveguide-layer 130 is such as formed in the first groove 113 in the mode of vapour deposition, coating, wire mark or spray printing, and its material can be the dielectric material (such as silicon dioxide, silicon nitride) of macromolecular material (such as polymer or polyimide) or high index of refraction.The cross sectional shape of light waveguide-layer 130 can be square (as shown in Figure 3A), rectangle, triangle (as shown in Figure 3 B), cheese (as shown in Figure 3 C) or trapezoid (as shown in Figure 3 D) etc., but the present invention is not as limit.
In addition, as indicated in figure 3e, more can form the dielectric materials layer 133 of a low-refraction in the first groove 113, and dielectric materials layer 133 is inserted and filled up in the space between light waveguide-layer 130 and first substrate 110, its material is such as silicon dioxide or silicon nitride.For example: the refractive index of dielectric materials layer 133 is 1.45, the refractive index of light waveguide-layer 130 is 1.58, and the refractive index of air is 1, and the refractive index of dielectric materials layer 133 is less than the refractive index of light waveguide-layer 130, but is greater than the refractive index of air.
Below propose the optical-electric module 100 ~ 103 of various embodiment, and be described in detail, embodiment only in order to illustrate as example, and is not used to the scope of limit the present invention for protection.
First embodiment
Please refer to Fig. 4 A and Fig. 4 B, it illustrates the cross-sectional schematic of the optical-electric module 100 according to an embodiment respectively.Optical-electric module 100 comprises first substrate 110, photo-electric conversion element 120, light waveguide-layer 130 and a light-guide device 140.Photo-electric conversion element 120 is such as arranged on the electrode 121 of first substrate 110 to cover brilliant mode, and relative with reflecting surface 112, in order to launch or to receive a light signal L.Wherein, reflecting surface 112 is a dip plane, the light signal L of transmitting terminal can be reflexed to light-guide device 140 via reflecting surface 112, to carry out transmitting optical signal L to receiving end by light waveguide-layer 130 and light-guide device 140.Equally, at the optical-electric module of receiving end, also can utilize above-mentioned reflecting surface, light signal L be reflexed to the photo-electric conversion element of receiving end, with receiving optical signals L.
The first groove 113 and the second groove 115 utilizing the step groove structure 111 of above-mentioned introduction to have, can make the center of light waveguide-layer 130 mutually corresponding with the center of light-guide device 140.As shown in fig. 4 a and fig. 4b, step groove structure 111 has reflecting surface 112 and a stepped profile 117.Stepped profile 117 comprises the first surface level 114,1 second surface level 118 of a connection reflecting surface 112 and the vertical plane 116(Fig. 4 A between the first surface level 114 and the second surface level 118) or an inclined-plane 116 ' (Fig. 4 B).The position of the first surface level 114 corresponds to first groove 113 of Fig. 1, and the position of the second surface level 118 corresponds to second groove 115 of Fig. 1, and the first surface level 114 is higher than the second surface level 118, to form the first groove 113 and the second groove 115 of different depth.
Reflecting surface 112 correspondence is positioned at one end of the first groove 113, and and has an angle theta between the first surface level 114, this angle theta such as 15 ~ 75 degree.In one embodiment, if form the semiconductor substrate (such as silicon substrate) of reflecting surface 112 with wet etching, the angle theta between reflecting surface 112 and the first surface level 114 can be 45 degree or 54.7 degree, but not as limit.
In figs. 4 a and 4b, light-guide device 140 is such as glass optical fiber, fiber optic fibers, plastic or homologue, its big envelope portion 142 having a core 141 and be coated on core 141 periphery, and the refractive index in big envelope portion 142 is lower than the refractive index of core 141.The present embodiment is by step groove structure 111, light waveguide-layer 130 is alignd with the core 141 at light-guide device 140 center, make the center of light waveguide-layer 130 equal haply with the height H of the center of light-guide device 140, directly can transfer to core 141 by light waveguide-layer 130 to make light signal L.Therefore, in the process that light signal L transmits, energy loss reduces, therefore can keep the intensity of light signal L, and can increase coupling efficiency, and then improves the quality of optical communication.
In addition, light waveguide-layer 130 has one first end face 131, and the core 141 of light-guide device 140 has one second end face 143, and the first end face 131 is adjacent to the second end face 143.Therefore, almost enter the second end face 143 completely by the light signal L of the first end face 131, therefore can coupling efficiency be increased.In the present embodiment, the area of the first end face 131 can be less than or equal to the area of the second end face 143.Such as: the area of the first end face 131 is about about 90% ~ 80% of the area of the second end face 143, but not as limit.
Fig. 4 A and Fig. 4 B difference are: in figure 4b, inclined-plane 116 ' is between the first surface level 114 and the second surface level 118, distance between first end face 131 and the second end face 143 is strengthened, but because the core 141 of light waveguide-layer 130 with light-guide device 140 center aligns or mutually mate, therefore can not coupling efficiency be affected.In addition, optical-electric module 100 more comprises a glue-line 132, it is such as epoxy resin, it fills in the space between light waveguide-layer 130 and light-guide device 140, this glue-line 132 can in the process of capping, be engaged between first substrate 110 and cover plate (not illustrating), be fixed on first substrate 110 to make light-guide device 140.In addition, the refractive index of glue-line 132 is greater than the refractive index of air, and the refractive index between light waveguide-layer 130 and surrounding medium can be made to reduce, to avoid optical signal loss.
Second embodiment
Then, please refer to Fig. 5 A and Fig. 5 B, it illustrates the schematic diagram of the optical-electric module 101 according to another embodiment of the present invention.Similarly, the first groove 113 and the second groove 115 that the present embodiment utilizes the step groove structure 111 of above-mentioned introduction to have, make the center of light waveguide-layer 130 mutually corresponding with the center of light-guide device 140, that is, light waveguide-layer 130 aligns with the core 141 at light-guide device 140 center or mutually mates, to make the center of light waveguide-layer 130 equal haply with the height H of the center of light-guide device 140.Identical element represents with identical symbol, is not described in detail in this.
The present embodiment is only with above-described embodiment difference: photo-electric conversion element 120 is arranged on a second substrate 150 relative with first substrate 110, and relative with reflecting surface 112.Photo-electric conversion element 120 is such as electrically connected with the electrode 122 be arranged on first substrate 150 in the mode of the welding that goes between.As shown in Fig. 5 A and Fig. 5 B, second substrate 150 has a storage tank 152, and first substrate 110 is selectively provided with a depression 109 corresponding to storage tank 152.The position of depression 109 is corresponding with the position of the wire 123 welded that goes between.Depression 109 can increase the routing height between storage tank 152 and first substrate 110, to admit of the wire 123 of larger elastic space for lead-in wire welding.In addition, by the routing height that depression 109 increases, the distance between first substrate 110 with second substrate 150 can shorten relatively, and then shortens the vertical light path of light signal L, reduces light signal L loss.
3rd embodiment
Then, please refer to Fig. 6, it illustrates the schematic diagram of the optical-electric module 102 according to another embodiment of the present invention.The first groove 113 and the second groove 115 that the present embodiment utilizes the step groove structure 111 of above-mentioned introduction to have equally, make the center of light waveguide-layer 130 mutually corresponding with the center of light-guide device 140, that is, light waveguide-layer 130 aligns with the core 141 at light-guide device 140 center or mutually mates, and makes the center of light waveguide-layer 130 equal haply with the height H of the center of light-guide device 140.Identical element represents with identical symbol, is not described in detail in this.
The present embodiment and above-described embodiment difference are: optical-electric module 102 comprises a coating layer 134, it is formed in the groove 111 ' (please refer to Figure 10 A) of a predetermined depth of first substrate 110, to make groove 111 ', there is stepped profile, and the first surface level 114 and the second surface level 118 that height of formation is different, namely formed as above-mentioned the step groove structure 111 with the first groove 113 and the second groove 115 introduced.
Coating layer 134 is such as the dielectric material of low-refraction, and its material can be silicon dioxide or silicon nitride.For example: the refractive index of coating layer 134 is 1.45, the refractive index of light waveguide-layer 130 is 1.58, and the refractive index of coating layer 134 is less than the refractive index of light waveguide-layer 130, but is greater than the refractive index of air.
4th embodiment
Then, please refer to Fig. 7, it illustrates the schematic diagram of the optical-electric module 103 according to another embodiment of the present invention.The present embodiment is identical with the configuration mode of the second embodiment, and namely photo-electric conversion element 120 is arranged on a second substrate 150 relative with first substrate 110, and relative with reflecting surface 112.Identical element represents with identical symbol, is not described in detail in this.
The present embodiment and the second embodiment difference are: optical-electric module 103 comprises a coating layer 134, it is formed in the groove of a predetermined depth of first substrate 110, to make groove, there is stepped profile, and the first surface level 114 and the second surface level 118 that height of formation is different, namely formed as above-mentioned the step groove structure 111 with the first groove 113 and the second groove 115 introduced, make the center of light waveguide-layer 130 mutually corresponding with the center of light-guide device 140, that is, light waveguide-layer 130 aligns with the core 141 at light-guide device 140 center or mutually mates, make the center of light waveguide-layer 130 equal haply with the height H of the center of light-guide device 140.
Below for the packaging technology of the optical-electric module of different embodiment, be described in detail, embodiment only in order to illustrate as example, and is not used to the scope of limit the present invention for protection.
Please refer to Fig. 8 A ~ Fig. 8 F and Fig. 9 A ~ Fig. 9 F, it illustrates the process flow diagram of the packaging technology of optical-electric module 100 in the first embodiment.First, in Fig. 8 A and Fig. 9 A, providing a first substrate 110, such as, is silicon substrate or other semiconductor substrates.Then, in Fig. 8 B and Fig. 9 B, such as, in the mode of wet etching, form the first groove 113 of a predetermined depth in first substrate 110, and the reflecting surface 112 forming an inclination is in one end of the first groove 113.The degree of depth of the first groove 113 is such as 20 ~ 40 microns.Then, in Fig. 8 C and Fig. 9 C, the second groove 115 of a predetermined depth is formed in first substrate 110, the second groove 115 that namely Formation Depth is darker on the position of second etch.The degree of depth of the second groove 115 is such as 60 ~ 80 microns.Therefore, a ladder groove structure 111 can be formed in first substrate 110.
In Fig. 8 C, such as, in the mode of dry ecthing, form a vertical plane 116 between the first surface level 114 and the second surface level 118.Or, in Fig. 9 C, such as, in the mode of wet etching, form an inclined-plane 116 ' between the first surface level 114 and the second surface level 118.
Then, in Fig. 8 D and Fig. 9 D, a light waveguide-layer 130 is formed in the first groove 113.In Fig. 8 E and Fig. 9 E, a photo-electric conversion element 120 is arranged on first substrate 110, and relative with reflecting surface 112.Or, in another embodiment, photo-electric conversion element 120 can be configured on a second substrate 150 relative with first substrate 110, and relative with reflecting surface 112, the optical-electric module 101 as described in the second embodiment.
Then, in Fig. 8 F and Fig. 9 F, a light-guide device 140 is arranged in the second groove 115, wherein the center of light waveguide-layer 130 and the center of light-guide device 140 mutually corresponding.
In addition, in Fig. 9 F, more can be formed in the space of glue-line 132 between light waveguide-layer 130 and light-guide device 140.
Then, please refer to Figure 10 A ~ Figure 10 E, it illustrates the process flow diagram of the packaging technology of optical-electric module 102 in the 3rd embodiment.First, in Figure 10 A, such as, in the mode of wet etching, form the groove 111 ' of a predetermined depth in first substrate 110, and form a reflecting surface 112 in one end of groove 111 '.The degree of depth of groove 111 ' is such as 60 ~ 80 microns.Then, in fig. 1 ob, form a coating layer 134 in groove 111 ', to make groove 111 ' have stepped profile, and groove 111 ' is divided into one first different groove 113 and one second groove 115 of the degree of depth.The degree of depth of the first groove 113 is such as 20 ~ 40 microns, and the degree of depth of the second groove 115 is such as 60 ~ 80 microns.Therefore, step groove structure 111 can be formed in first substrate 110.
Then, in fig 1 oc, a light waveguide-layer 130 is formed on coating layer 134.In Figure 10 E, a light-guide device 140 is arranged in the second groove 115, wherein the center of light waveguide-layer 130 and the center of light-guide device 140 mutually corresponding.
In addition, in figure 10d, a photo-electric conversion element 120 is arranged on first substrate 110, and relative with reflecting surface 112.Or, in another embodiment, photo-electric conversion element 120 can be configured on a second substrate 150 relative with first substrate 110, and relative with reflecting surface 112, optical-electric module 103 as described in the fourth embodiment.
Optical-electric module disclosed by the above embodiment of the present invention and packaging technology thereof, be the first groove and the second groove that utilize step groove structure to have, make light waveguide-layer equal with the height of the center of light-guide device.Therefore, the intensity of light signal can be kept in the process that light signal transmits, improve coupling efficiency, and maintain the correctness of light signal, and then improve the quality of optical communication.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection domain that all should belong to the claim appended by the present invention.
Claims (12)
1. an optical-electric module, is characterized in that, comprising:
One first substrate, has at least one step groove structure, and this step groove structure comprises:
One first groove, has one first degree of depth;
One second groove, has second degree of depth that is greater than this first degree of depth; And
One reflecting surface, is positioned at one end of this first groove;
One photo-electric conversion element, receives a light signal in order to launch a light signal to this reflecting surface or via this reflecting surface;
One light waveguide-layer, is arranged in this first groove;
One light-guide device, is configured in this second groove, and wherein this light waveguide-layer and this light-guide device are in order to transmit this light signal, and the center of this light waveguide-layer is mutually corresponding with the center of this light-guide device; And
One second substrate, be oppositely arranged with this first substrate and have in a storage tank, this photo-electric conversion element is arranged in this storage tank, and this first substrate is provided with a depression relative to this storage tank, and the position of this depression is corresponding with the position that lead-in wire welds a wire of this photo-electric conversion element.
2. optical-electric module according to claim 1, is characterized in that, the center of this light waveguide-layer is equal with the height of the center of this light-guide device.
3. optical-electric module according to claim 1, is characterized in that, this photo-electric conversion element is relative with this reflecting surface.
4. optical-electric module according to claim 1, is characterized in that, this light waveguide-layer has one first end face, and the center of this light-guide device has a core, and this core has one second end face, and this first end face is adjacent to this second end face.
5. optical-electric module according to claim 4, is characterized in that, the area of this first end face is less than or equal to the area of this second end face.
6. optical-electric module according to claim 1, it is characterized in that, this step groove structure has a stepped profile, this stepped profile comprises the first surface level of this reflecting surface of connection, one second surface level and the vertical plane between this first surface level and this second surface level or an inclined-plane, and this first surface level is higher than this second surface level.
7. optical-electric module according to claim 1, is characterized in that, more comprises a coating layer, is formed in a groove of this first substrate, to make this groove have a stepped profile, and this groove area is divided into this first groove and this second groove that the degree of depth is different.
8. optical-electric module according to claim 1, is characterized in that, this first groove and this second groove are dovetail groove, V-shaped groove, deep-slotted chip breaker or rectangular channel.
9. optical-electric module according to claim 1, is characterized in that, the step groove structure of multiple strip is formed on this first substrate, and is arranged in parallel with each other.
10. optical-electric module according to claim 1, is characterized in that, the width of this first groove is less than or equal to the width of this second groove relatively.
11. optical-electric modules according to claim 1, is characterized in that, more comprise a dielectric materials layer, are formed at this first groove, and insert in the space between this first substrate and this light waveguide-layer.
12. optical-electric modules according to claim 1, is characterized in that, more comprise a glue-line, fill in the space between this light waveguide-layer and this light-guide device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310050110.4A CN103984062B (en) | 2013-02-08 | 2013-02-08 | The packaging technology of optical-electric module and optical-electric module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310050110.4A CN103984062B (en) | 2013-02-08 | 2013-02-08 | The packaging technology of optical-electric module and optical-electric module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103984062A CN103984062A (en) | 2014-08-13 |
| CN103984062B true CN103984062B (en) | 2015-10-14 |
Family
ID=51276103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310050110.4A Expired - Fee Related CN103984062B (en) | 2013-02-08 | 2013-02-08 | The packaging technology of optical-electric module and optical-electric module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103984062B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016161843A (en) * | 2015-03-04 | 2016-09-05 | 住友ベークライト株式会社 | Optical waveguide with connector and electronic apparatus |
| JP6219887B2 (en) * | 2015-06-25 | 2017-10-25 | Ｎｔｔエレクトロニクス株式会社 | Optical waveguide device |
| CN112987170A (en) * | 2016-10-29 | 2021-06-18 | 华为技术有限公司 | Optical device and method of manufacturing the same |
| CN111522102A (en) * | 2019-02-01 | 2020-08-11 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114660721B (en) * | 2020-12-23 | 2024-04-12 | 联合微电子中心有限责任公司 | End face coupling packaging structure of silicon-based photoelectronic chip and forming method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0219358B1 (en) * | 1985-10-16 | 1991-03-06 | BRITISH TELECOMMUNICATIONS public limited company | Radiation deflector assembly |
| JPH0954227A (en) * | 1995-08-11 | 1997-02-25 | Nippon Telegr & Teleph Corp <Ntt> | Molded substrate for optical packaging and its production |
| CN102692684A (en) * | 2011-03-24 | 2012-09-26 | 源杰科技股份有限公司 | Photoelectric module |
| CN102834754A (en) * | 2010-02-23 | 2012-12-19 | 松下电器产业株式会社 | Optical module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6908779B2 (en) * | 2002-01-16 | 2005-06-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for manufacturing the same |
-
2013
- 2013-02-08 CN CN201310050110.4A patent/CN103984062B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0219358B1 (en) * | 1985-10-16 | 1991-03-06 | BRITISH TELECOMMUNICATIONS public limited company | Radiation deflector assembly |
| JPH0954227A (en) * | 1995-08-11 | 1997-02-25 | Nippon Telegr & Teleph Corp <Ntt> | Molded substrate for optical packaging and its production |
| CN102834754A (en) * | 2010-02-23 | 2012-12-19 | 松下电器产业株式会社 | Optical module |
| CN102692684A (en) * | 2011-03-24 | 2012-09-26 | 源杰科技股份有限公司 | Photoelectric module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103984062A (en) | 2014-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103984062B (en) | The packaging technology of optical-electric module and optical-electric module | |
| US9664858B2 (en) | Optical photonic circuit coupling | |
| CN107003478B (en) | Optical coupling device | |
| US8992100B2 (en) | Bidirectional optical transmission and receiving device | |
| US9766416B1 (en) | Optical module and method of manufacturing the same | |
| US9091819B2 (en) | Grating edge coupler and method of forming same | |
| US6973248B2 (en) | Planar optical component, and a coupling device for coupling light between a planar optical component and an optical assembly | |
| US20110299808A1 (en) | Optical Waveguide and Optical Waveguide Module | |
| US9900098B2 (en) | Optical device module and optical communication network system using the same | |
| CN107407778B (en) | Optically coupled waveguide | |
| CN102694050B (en) | Optical receiver | |
| CN103650140A (en) | Wafer scale packaging platform for transceivers | |
| US10746934B2 (en) | Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips | |
| CN103676031B (en) | Optical communications module | |
| CN103370644A (en) | Optical circuit board | |
| US20160356969A1 (en) | Optical Coupling Device and Optical Coupling Unit | |
| CN103163600B (en) | Optical coupler module and preparation method thereof | |
| KR100793296B1 (en) | Spherical lens-type reflective mirror and method for manufacturing the same and optical interconnection module having the spherical lens-type reflective mirror | |
| CN104793298B (en) | Load board structure with side welding plate and manufacturing method of load board structure | |
| CN202306053U (en) | Optical attenuator capable of being modulated | |
| US9459409B2 (en) | Optical coupling device | |
| WO2017063358A1 (en) | Optical communication module and carrier board | |
| CN217846688U (en) | Probe optical fiber, wafer and optical fiber and optical waveguide coupling structure | |
| CN110456449B (en) | Array single-mode device and fiber grating demodulator | |
| CN114114533B (en) | Three-dimensional optical waveguide modulation structure and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151014 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |