WO2017063358A1

WO2017063358A1 - Optical communication module and carrier board

Info

Publication number: WO2017063358A1
Application number: PCT/CN2016/081725
Authority: WO
Inventors: 薛海韵; 曹彤彤; 刘丰满
Original assignee: 华为技术有限公司
Priority date: 2015-10-13
Filing date: 2016-05-11
Publication date: 2017-04-20
Also published as: CN106571871A

Abstract

An optical communication module and a carrier board. Taking the implementation of an optical communication module as an example, the optical communication module comprises an optical chip, an electric chip, a carrier board, and a wire; the carrier board comprises a waveguide and an optical signal can pass through the carrier board by means of the waveguide; the waveguide is a waveguide obtained by doping the carrier board; the optical chip and the electric chip are located at the same side of the carrier board, the wire is attached onto the carrier board, and an electrode of the optical chip is connected to an electrode of the electric chip by means of the wire; the optical chip is inversely placed on the carrier board with the front surface of the optical chip facing towards the waveguide; and the front surface of the optical chip is a portion of the optical chip comprising an optical device. The electrode of the optical chip can be interconnected with the electric chip by means of the wire on the carrier board, the distance between the optical chip and the electric chip is small and no additional wire is required, so that the problem of excessive loss caused by interconnection between the optical chip and the electric chip can be alleviated. Therefore, a miniaturized optical communication module is provided and signal quality is improved.

Description

Optical communication module and carrier board

Technical field

The present invention relates to the field of communications technologies, and in particular, to an optical communication module and a carrier board.

Background technique

In the field of communication technology, as data processing requirements continue to grow, future data centers will introduce more optical interconnect systems to increase communication bandwidth between cabinets, boards, inter-chips, and even on-chip. The optical transceiver module is an indispensable key module of the optical interconnection system. Ultra-small and highly integrated optical transceiver modules are more suitable for the enormous bandwidth requirements of optical interconnect systems.

In recent years, with the development of semiconductor technology, optical chips based on semiconductor materials have continuously achieved technological breakthroughs. Taking silicon-based electro-optic modulators as an example, the single-channel rate of a single chip reported by the experiment has reached more than 50 Gbps. However, if applied to an actual system, a high-speed optical chip requires a high-speed electric chip as a driving, and an integrated solution of the optical chip and the electric chip directly affects the size and performance index of the optical transceiver module.

FIG. 1 is a schematic structural diagram of an optical transceiver module, illustrating an integrated structure of an optical chip and an electrical chip. The front side of the optical chip 101 (the front side of the optical chip means the portion including the optical device 107) is placed on the carrier 106 upward, and the connection between the optical chip 101 and the electric chip 102 is by wire bonding. The wire bonding technique bonds the metal line 105 from the electrode 103 of the optical chip 101 to the electrode 103 of the electric chip 102 or the electrode 103 above the carrier 106 (shown in FIG. 1 as the electrode 103 soldered to the upper surface of the carrier 103). In the above integrated structure, the interconnection of the optical chip and the electric chip can be realized by the wire bonding structure. The optical chip faces upward, and the optical chip can be connected to an external optical transmission medium (such as an optical fiber) by means of grating coupling or side coupling.

However, in the connection structure shown in FIG. 1 above, a long metal wire connection is required between the optical chip and the electric chip, which causes a large attenuation when transmitting a high-speed electric signal, resulting in poor signal quality. In addition, when there are many interconnection channels in the device, the metal wires will be densely arranged and crosstalk between the lines will occur, which will also result in poor signal quality.

Summary of the invention

Embodiments of the present invention provide an optical communication module, a carrier board, and a manufacturing method for providing a small Modeled optical communication modules and improved signal quality.

On the one hand, the optical communication module includes an optical chip, an electric chip, a carrier board, and a wire for the problem that the optical chip and the electrical chip are excessively lost in the optical chip and the electronic chip integration solution. The carrier includes a waveguide through which an optical signal can pass; the waveguide is a waveguide obtained by doping the carrier; the waveguide is a channel for guiding light, and the optical signal When entering from one end of the waveguide, it will be transmitted from the other end; obtaining the waveguide by doping can solve the problem of high manufacturing cost due to opening the through hole, and the wavelength of the optical signal passing through the light guide can be conveniently controlled by doping. ;

The optical chip and the electric chip are located on the same side of the carrier, the wire is attached to the carrier, and the electrode of the optical chip is connected to the electrode of the optical chip through the wire;

The front surface of the optical chip is placed on the carrier plate in a reverse direction toward the waveguide; the front surface of the optical chip is a portion of the optical chip including the optical device.

In one possible design, the carrier is a glass carrier in order to provide a less costly and adaptable doping process.

In one possible design, a solution for optically interconnecting the optical chip with the waveguide is also provided, the front face of the optical chip facing the waveguide comprising: a grating of the optical chip facing the waveguide.

In a possible design, the scheme using a grating may have a lower coupling efficiency of the optical signal if the waveguide is perpendicular to the grating. In order to improve the coupling efficiency of the optical signal, the waveguide has a tilt angle, and the tilt angle is the largest with the grating. Light is matched by the angle of incidence.

In a possible design, there is also provided a solution for improving the process tolerance of single mode optical coupling and improving the coupling tolerance between the optical chip and the waveguide, the waveguide being a refractive index grading optical channel, the waveguide The refractive index from the center to the carrier plate is getting smaller and smaller.

In a possible design, the manufacturing process may limit the optical chip and the waveguide between the optical chip and the waveguide, and the optical signal may be lost in the air between the optical chip and the waveguide. To reduce the loss, the light is reduced. A light guiding structure is further disposed between the front surface of the chip and the waveguide; the light guiding structure is in close contact with the waveguide and the front surface of the optical chip.

In one possible design, in order to conveniently interface with an external optical transmission medium (for example, an optical fiber), a side of the waveguide opposite to the optical chip is provided with a lens for changing a mode field or a transmission direction of the optical signal.

In another aspect, an embodiment of the present application provides a carrier board, including: a wire, one end of the wire is provided with an electrode for connecting the electric chip, and the other end is provided with an electrode for connecting the optical chip,

The carrier includes a waveguide through which an optical signal can pass; the waveguide is a waveguide obtained by doping the carrier; the waveguide is a channel for guiding light, and the optical signal is When one end of the waveguide enters, it will be transmitted from the other end; obtaining the waveguide by doping can solve the problem of high manufacturing cost due to opening the through hole, and the wavelength of the optical signal passing through the light guide can be conveniently controlled by doping;

If the optical chip is placed on the carrier plate, the front surface of the optical chip faces the waveguide; the front surface of the optical chip is a portion of the optical chip that includes the optical device.

In a possible design, if the optical chip adopts a grating scheme, if the waveguide is perpendicular to the grating, the coupling efficiency of the optical signal may be low. In order to improve the coupling efficiency of the optical signal, the waveguide has a tilt angle, and the tilt angle is The maximum light transmission through the incident angle of the grating of the optical chip to be placed on the carrier.

In three aspects, an embodiment of the present application provides a method for manufacturing an optical communication module, including:

Obtaining an optical chip, an electric chip, a carrier board, and a wire;

Doping the carrier to obtain a waveguide through which the optical signal can pass; the waveguide is a channel for guiding light, and the optical signal enters from one end of the waveguide and is transmitted from the other end; Obtaining the waveguide by doping can solve the problem of high manufacturing cost due to the opening of the via hole, and the wavelength of the optical signal passing through the light guide can be conveniently controlled by doping.

Disposing the optical chip and the electric chip on the same side of the carrier, attaching the wire to the carrier, and connecting the electrode of the optical chip and the optical chip by using the wire electrode;

In a possible design, the wire is attached to the carrier, and the electrode connecting the electrode of the optical chip and the electrode of the optical chip using the wire comprises:

Depositing a layer of metal on the surface of the carrier, applying a photoresist on the surface of the metal, and etching the metal to obtain the wire after exposure;

Two electrodes are fabricated on the wire, and the electrodes of the optical chip and the electrodes of the electrical chip are respectively soldered to the two electrodes of the wire.

In the process, the wire can be closely attached to the carrier plate by using a metal structure, and the manufacturing process is simple and accurate. The installation of the electric chip and the optical chip is also convenient.

In a possible design, in order to improve the coupling tolerance between the optical chip and the waveguide and improve the process tolerance of the single mode optical coupling, the doping of the carrier to obtain the waveguide includes:

Doping the carrier with different degrees of multi-aperture pattern, so that the waveguide forms an optical channel with a graded index of refraction, and the waveguide has a smaller refractive index from the center to the carrier;

Alternatively, the carrier plate is doped to different degrees by a multi-aperture pattern, and after the doping is formed by slow annealing to form a slow diffusion manner, the waveguide is formed into an optical path having a graded refractive index, the waveguide from the center to The refractive index in the direction of the carrier plate is getting smaller and smaller.

In a possible design, based on the structure using the grating, in order to further improve the coupling efficiency of the optical signal, the facing the optical chip toward the waveguide comprises: directing a grating of the optical chip toward the waveguide;

The carrier comprising a waveguide includes: fabricating a waveguide having a tilt angle on the carrier, the tilt angle matching a maximum light transmission angle of incidence of the grating.

In four aspects, an embodiment of the present application provides a method for manufacturing a carrier board, including:

Obtaining a carrier plate, doping the carrier plate to obtain the waveguide;

Depositing a layer of metal on the surface of the carrier, applying a photoresist on the surface of the metal, and etching the metal to obtain a wire after exposure;

Two electrodes are formed on the wire, the two electrodes are respectively used for connecting the electrode of the optical chip and the electrode of the electric chip; if the optical chip is placed upside down on the carrier, the front of the optical chip Towards the waveguide, an optical signal can be projected through the waveguide through the waveguide to a portion of the optical chip containing the optical device.

In a possible design, in order to improve the coupling tolerance between the optical chip and the waveguide, and improve the process tolerance of the single mode optical coupling, the doping of the carrier to obtain the waveguide includes:

Applying different degrees of doping to the carrier plate with different aperture patterns, so that the waveguide forms a refractive index gradually a variable optical channel, the waveguide having a smaller refractive index from the center to the carrier;

In a possible design, based on the structure using the grating, in order to further improve the coupling efficiency of the optical signal, the front side of the optical chip may face the waveguide: the grating of the optical chip faces the waveguide;

The doping the carrier to obtain the waveguide comprises: doping the carrier to obtain a waveguide having an oblique angle, the tilt angle matching a maximum light transmission incident angle of the grating.

It can be seen from the above technical solutions that the embodiment of the present invention has the following advantages: the optical chip is placed on the carrier board in reverse, and the light guide is obtained by doping the carrier board, and the optical chip is realized by the waveguide on the carrier board and the external part of the optical communication module. Optical signal communication of a specific wavelength; the electrode of the optical chip can be interconnected with the electric chip through a wire located on the carrier board, the optical chip is close to the electric chip, and no additional wires are needed, and the optical chip and the electrical chip interconnection loss can be reduced. Too large a problem; therefore, a miniaturized optical communication module is provided, and signal quality is improved.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention, Those skilled in the art can also obtain other drawings based on these drawings without paying for inventive labor.

1 is a schematic structural view of a prior art optical transceiver module;

2 is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

3 is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

4A is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

4B is a schematic view showing a refractive index of a waveguide according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of an optical communication module according to an embodiment of the present invention; FIG.

6 is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

7A is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

7B is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

8A is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

8B is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

8C is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

8D is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

8E is a schematic structural diagram of an optical communication module according to an embodiment of the present invention;

FIG. 9 is a schematic flowchart of a method according to an embodiment of the present invention;

FIG. 10 is a schematic flowchart of a method according to an embodiment of the present invention.

detailed description

The present invention will be further described in detail with reference to the accompanying drawings, in which . All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

The embodiments of the present invention are mainly directed to the problem that the optical chip and the electrical chip have excessive interconnect loss in the optical chip and the electrical chip integration solution. The interconnection scheme optical chip shown in FIG. 1 is placed in the positive direction on the carrier board, and the main reason for the forward placement is that since the optical device in the optical chip is located on the top layer of the optical chip, if the reverse placement is used, the optical device and the external device are coupled. The interface will be close to the carrier, which is difficult to achieve with external optical transmission medium, whether it is grating coupling or lateral coupling. The embodiment of the present invention proposes a glass carrier plate based on silica as a main component. By doping into a waveguide in the silica, the optical chip can adopt a grating to couple an external light signal propagated through the waveguide. Since the optical chip is inverted, the optical chip electrode can be directly connected to the carrier electrode, and the wire of the carrier plate is connected to the electrode of the electric chip to realize interconnection, so that the metal wire shown in FIG. 1 can be omitted, and the optical transmission loss can be reduced. Carrier boards are sometimes also referred to as substrates or substrates, which are commonly used as carriers for devices and wiring.

An embodiment of the present invention provides an optical communication module, as shown in FIG. 2, including: an optical chip 201, an electrical chip 202, a carrier 203, and a wire 205. The carrier 203 includes a waveguide 204 through which the optical signal can pass. 204 passes through the above carrier 203;

The optical chip 201 and the electrical chip 202 are located on the same side of the carrier 203, the wire 205 is attached to the carrier 203, and the electrode 206 of the optical chip 201 is connected to the electrode 206 of the optical chip 201 via the wire 205. ;

The front surface of the optical chip 201 is placed on the carrier 203 so as to face the waveguide 204. The front surface of the optical chip 201 is a portion of the optical chip 201 including the optical device 207.

In this embodiment, the waveguide 204 is a channel for guiding light, and an optical signal enters from one end of the waveguide 204 and is transmitted from the other end. The waveguide 204 may be obtained by a light guiding material filled in the through hole of the carrier 203, or may be obtained by other methods without providing a through hole. In this embodiment, the implementation manner of whether or not the through hole is opened is not limited. The function of the carrier 203 is to carry the chip. The integrated circuit board can be used. The board of the insulating material or the board of the semiconductor material can be used. The specific material of the carrier 203 is not limited by the embodiment of the present invention.

In this embodiment, the optical chip is placed on the carrier board in reverse direction, and the light guide is obtained by doping the carrier board. The optical chip communicates with the optical communication module to realize optical signal of a specific wavelength through the waveguide on the carrier board; the electrode of the optical chip can be By interconnecting the wires on the carrier board and the electric chip, the optical chip is close to the electric chip, and no additional wires are needed, which can reduce the problem of excessive loss of optical chip and electrical chip interconnection; therefore, providing miniaturized light Communication module and improve signal quality. In addition, since the optical chip is inverted, a heat dissipation structure can be disposed on the outer side of the optical chip to facilitate heat dissipation of the optical communication module.

The embodiment of the present invention provides a solution in which the waveguide 204 is a waveguide 204 obtained by doping the carrier 203.

The waveguide 204 can be obtained by doping, and there is a certain requirement for the material of the carrier 203. For example, an opaque integrated circuit board is generally not acceptable, and a material capable of doping to change the light guiding property can be used as a candidate. The carrier 203 is a material having a light transmitting property, and the carrier 203 of which material is specifically used is not limited to the embodiment of the present invention.

As a preferred example, the carrier 203 is a glass carrier 203.

The glass may be composed of silica as a main component, and may further contain other components. In the embodiment of the present invention, the specific component of the doping is determined according to the wavelength of the optical signal to be transmitted, which is not limited in this embodiment. Glass, as a relatively common and relatively low cost material, can be exemplified as a preferred implementation in this embodiment, but it should be noted that the composition of the glass is not necessarily based on silica, and the doping is obtained as a waveguide. The technical implementation may be based on other materials having light transmissive properties, and glass is not to be construed as limiting the uniqueness of the embodiments of the invention. In this embodiment, while solving the inversion of the optical chip 201, the use of the silica carrier 203 does not require etching the via hole, thereby reducing the process difficulty and cost; and the electrical interconnection loss of the silicon relative to the silicon. Smaller, it has more significant advantages in the application of high-speed interconnect technology in the future.

As an application example, the optical device of the optical chip 201 may be an input/output interface of the optical signal. The embodiment may be implemented by using a grating 207. The specific surface of the optical chip 201 facing the waveguide 204 includes: the grating of the optical chip 201. 207 faces the waveguide 204 described above.

The grating 207 is an optical device composed of a plurality of parallel slits of equal width and equal pitch. The commonly used grating 207 is made by engraving a large number of parallel indentations on the glass sheet, and the scoring is an opaque portion, and the smooth portion between the two indentations can transmit light, which is equivalent to a slit. The refined grating 207 is engraved with thousands or even tens of thousands of indentations in a width of 1 cm. Such a grating 207 that utilizes transmitted light diffraction is referred to as a transmission grating 207, which may be employed in this embodiment. In Fig. 2, the optical device and the grating 207 are shown in the same structure.

The specific structure of the optoelectronic integration scheme shown in FIG. 2 includes: an optical chip 201, an electric chip 202, a silica carrier 203, and electrical interconnections (wires 205).

The optical chip 201 may include an optical device layer, an electrode 206, and a grating 207 coupling interface. The optical device layer is a core part of the optical transceiver function, and usually includes a modulator or a detector. The electrode 206 is an interface integrated with the electrical chip 202 for inputting an external electrical signal to be modulated or an electrical signal obtained by the detector. Returning to the power chip 202; the grating 207 as a coupling interface is an interface with an external optical transmission medium for coupling the modulator-modulated optical signal to the optical transmission medium or coupling the optical signal in the optical transmission medium to the optical chip 201 .

The electrical chip 202 functions primarily as a driver or as a driver for the detector.

The silica carrier 203 is used on the one hand as an interconnect wiring carrier, and the surface of the carrier 203 may have electrodes 206 to be connected to the optical chip 201 and/or the electrode 206 of the electrical chip 202. On the other hand, doping is performed therein, and the waveguide 204 is formed as a light guiding path of the optical chip 201 and the external optical transmission medium.

The external optical transmission medium can transmit optical signals through the waveguide 204 and the grating 207 to achieve optical signal transmission.

Electrical interconnects are used to transmit electrical signals.

In the embodiment of the present invention, by using the method of inverting the optical chip 201, the electrode 206 of the optical chip 201 and the electrode 206 of the carrier 203 do not need to be wire bonded, and the optical chip 201 can be realized by directly using a flip-chip. Interconnection with the electrical chip 202. Due to the good interconnect characteristics of the silica carrier 203, the attenuation of the interconnect is small, and the attenuation of the flip-chip process is much less than the attenuation of the wire bonding technique, so the present invention can achieve a better optical chip 201 and electricity. Chips 202 are interconnected. At the same time, by forming the waveguide 204 by doping in the silica substrate, it is also ensured that light in the optical chip 201 can be introduced into the external optical transmission medium.

Based on the structure using the grating 207, in order to further improve the coupling efficiency of the optical signal, the present embodiment provides the following solution. As shown in FIG. 3, the waveguide 204 has a tilt angle, and the tilt angle and the maximum light transmittance of the grating 207 are incident. Angle matching.

In this embodiment, the coupling efficiency of the optical chip 201 and the silica carrier 203 waveguide 204 can be improved. By controlling the tilt angle of the doping ion implantation to match the maximum light transmission angle of incidence of the grating 207 of the optical chip 201, thereby forming the waveguide 204 having a certain inclination angle, the coupling efficiency of the optical chip 201 and the waveguide 204 of the silica carrier 203 can be improved.

In order to improve the coupling tolerance between the optical chip 201 and the waveguide 204 and improve the process tolerance of the single mode optical coupling, the present embodiment provides the following solution: as shown in FIG. 4A, the waveguide 204 is a refractive index grading optical. In the channel, the waveguide 204 has a smaller refractive index from the center to the carrier 203.

Please refer to FIG. 4B, where d1 and d2 respectively represent different apertures of the doping definition pattern, n is the refractive index, d2 corresponds to the waveguide 204 having a larger aperture in FIG. 4A, and d1 corresponds to the waveguide 204 having a smaller aperture in FIG. 4A. In this embodiment, the waveguide 204 is designed as a refractive index-grading optical channel, wherein d1 and d2 respectively represent different apertures of the doping defining pattern; in a specific embodiment, the refractive index of the optical channel can be defined by using different levels of doping levels of the multi-aperture pattern. At the rate, it is also possible to form a refractive index-grading optical channel by slow annealing to form a graded diffusion after doping.

Due to the manufacturing process, the optical chip 201 and the waveguide 204 may not be completely adhered to each other, and the optical signal may be lost in the air between the optical chip 201 and the waveguide 204. In order to reduce the loss, the embodiment of the present invention provides the following The solution is as shown in FIG. 5: a light guiding structure 208 is further disposed between the front surface of the optical chip 201 and the waveguide 204;

The light guiding structure 208 is in close contact with the waveguide 204 and the front surface of the optical chip 201.

The light guiding structure 208 may more specifically be: a light guiding structure 208 formed by adding an index matching liquid or an optical potting glue between the upper surface of the waveguide 204 in the silica carrier 203 and the grating 207 of the optical chip 201. The light guiding structure 208 can reduce the propagation loss of light outputted from the grating 207 of the optical chip 201 in the air, thereby increasing the coupling efficiency of the external optical transmission medium of the waveguide 204 domain in the silica.

In order to facilitate the docking of an external optical transmission medium (for example, an optical fiber), the embodiment of the present invention further provides a solution: as shown in FIG. 6, the waveguide 204 and the optical chip 201 are disposed on one side opposite to the optical chip 201 for changing an optical signal. The mode field or lens 209 in the direction of transmission.

In the configuration shown in Fig. 6, the lens 209 changes the transmission scheme by 90°, and the optical fiber can be connected to the optical communication module in parallel with the carrier 203. This structure facilitates the tight arrangement of the optical communication module.

FIG. 7A is a top plan view of an optical communication module according to an embodiment of the present invention. The number of the optical chip 201 and the electrical chip 202 can be configured as needed, thereby implementing integration of a plurality of optical communication modules. 7B is a bottom view of an optical communication module according to an embodiment of the present invention. Silica can achieve different refractive indices by doping with different dopants and different doping concentrations, so by controlling the dopant and its doping concentration, Real The highly doped light guiding channel is formed to form the waveguide 204 structure.

Based on the introduction of the optical communication module, the carrier 203 is an important component. The embodiment of the present invention further provides a carrier 203. As shown in FIG. 2, the device includes a wire 205, and one end of the wire 205 is provided. The electrode 206 is connected to the electrode chip 206, and the other end is provided with an electrode 206 for connecting the optical chip 201;

The carrier 203 includes a waveguide 204 through which the optical signal can pass through the carrier 204;

When the optical chip 201 is placed on the carrier 203, the front surface of the optical chip 201 faces the waveguide 204. The front surface of the optical chip 201 is a portion of the optical chip 201 that includes the optical device.

In this embodiment, the optical chip can be placed on the carrier board in reverse, and the optical chip can communicate with the optical communication module through the waveguide on the carrier board; the electrodes of the optical chip can be interconnected with the electrical chip through the wires on the carrier board. The distance between the optical chip and the electric chip is short, and no additional wires are required, which can reduce the problem of excessive loss of interconnection between the optical chip and the electric chip; therefore, a miniaturized optical communication module is provided, and signal quality is improved.

The embodiment of the present invention provides a solution in which the waveguide 204 is a waveguide 204 obtained by doping the carrier 203. The waveguide 204 can be obtained by doping, and the material of the corresponding carrier 203 has certain requirements. For example, an opaque integrated circuit board is generally not acceptable, and materials having the ability to be doped to change the light guiding property can be used as candidates. The carrier plate 203 of the material is not limited to the embodiment of the present invention.

As a preferred example, the carrier 203 is a glass carrier 203.

As an application example, the optical device of the optical chip 201 may be an input/output interface of the optical signal. Based on the structure using the grating 207, in order to further improve the coupling efficiency of the optical signal, the present embodiment provides the following solution, as shown in FIG. The waveguide 204 has an inclination angle which matches the maximum light transmission angle of incidence of the grating 207 of the optical chip 201 to be mounted on the carrier 203.

In the configuration shown in Figure 6, the lens 209 changes the transmission scheme by 90°, then the fiber can be parallel to The carrier board 203 is connected to the optical communication module, and this structure facilitates the tight arrangement of the optical communication module.

8A to FIG. 8E are diagrams showing a manufacturing process flow of an optical communication module according to an embodiment of the present invention, which can be referred to FIG. 2, FIG. 3, FIG. 4A, FIG. 5, FIG. 6, FIG.

Figure 8A is a schematic view of the carrier 203; the carrier 203 is also referred to as a substrate; in Figure 8A the substrate is a glass carrier 203;

FIG. 8B is a schematic view showing the structure of the waveguide 204 by doping the glass carrier 203;

FIG. 8C is a schematic view showing deposition of a layer of metal 205 on the surface of the glass carrier 203;

8D is a photoresist 210 coated on a metal surface, and the metal 205 is etched to form an interconnect structure after exposure, that is, a structure used as a wire 205 connecting the electrical chip 202 and the optical chip 201;

Figure 8E is a schematic illustration of the fabrication of an electrode 206 on an interconnect (wire 205);

FIG. 2 is a schematic view of the optical chip 201 and the electrical chip 202 soldered by Flip-chip, and the optical chip 201 and the electrical chip 202 are interconnected.

Through the above process flow, the structure of the optical communication module of the photoelectric integration scheme provided by the embodiment of the present invention can be realized, and the optical chip 201 is connected to the external optical transmission medium through the waveguide 204 in the glass carrier 203. In addition, a heat conduction structure may be added to the upper surface of the optical communication module to improve heat dissipation of the optical communication module; this convenient characteristic is also not provided by the optical communication module shown in FIG.

The embodiments of the present invention can be mainly applied to optical interconnection applications of optical communication bands of 1310 nm to 1550 nm. The optical chips can be applied to optical chips based on other semiconductor materials such as III-IV materials, in addition to silicon-based optical chips. In addition, the optical chip coupling interface method according to the present invention is applicable to other vertically coupled structures in addition to the grating coupling.

Based on the above detailed description of the structure of the optical communication module, the embodiment of the present invention further provides a method for manufacturing an optical communication module, as shown in FIG.

901: Obtain an optical chip, an electric chip, a carrier, and a wire; doping the carrier to obtain a waveguide, and the optical signal can pass through the carrier through the waveguide;

902: The optical chip and the electrical chip are disposed on the same side of the carrier, the conductive wire is attached to the carrier, and the electrode of the optical chip and the electrode of the optical chip are connected by using the wire;

903: The front surface of the optical chip is vertically placed on the carrier plate, and the front surface of the optical chip is a portion of the optical chip including the optical device.

The above 902 and 903 do not have a certain order of execution, for example, it is also possible to place the optical chip and the electrical chip first, and then connect again; therefore, the above numbering should not be understood as an embodiment of the present invention. Limited.

Obtaining the waveguide by doping can solve the problem of high manufacturing cost due to the opening of the via hole, and the wavelength of the optical signal passing through the light guide can be conveniently controlled by doping.

The embodiment of the present invention further provides a specific manufacturing process of the carrier board. The electrode is attached to the carrier board, and the electrode of the optical chip and the electrode of the optical chip are connected by using the wire.

Depositing a layer of metal on the surface of the carrier plate, applying a photoresist on the surface of the metal, and etching the metal to obtain the wire after exposure;

Two electrodes are formed on the above-mentioned wires, and the electrodes of the optical chip and the electrodes of the electric chip are respectively soldered to the two electrodes of the above-mentioned wires.

In order to improve the coupling tolerance between the optical chip and the waveguide and improve the process tolerance of the single mode optical coupling, the present embodiment provides the following solution: as shown in FIG. 4A, the above carrier is doped to obtain the waveguide. include:

The above-mentioned carrier plate is doped with different degrees of multi-aperture pattern, so that the waveguide forms an optical channel with a gradual refractive index, and the refractive index of the waveguide from the center to the carrier plate is smaller and smaller;

Alternatively, the carrier plate is doped to different degrees by a multi-aperture pattern, and after the doping is formed by slow annealing to form a slow diffusion manner, the waveguide is formed into an optical path having a graded refractive index, and the waveguide is from the center to the carrier. The refractive index is getting smaller and smaller.

In order to further improve the coupling efficiency of the optical signal, the present embodiment provides the following solution. As shown in FIG. 3, the front surface of the optical chip facing the waveguide includes: directing the grating of the optical chip toward the waveguide. ;

The carrier board includes a waveguide including: a waveguide having a tilt angle formed on the carrier, wherein the tilt angle matches a maximum light transmission angle of incidence of the grating.

Based on the above detailed description of the structure of the optical communication module, the carrier board is an important component thereof. The embodiment of the present invention further provides a method for manufacturing a carrier board, as shown in FIG. 10, including:

1001: obtaining a carrier plate, doping the carrier plate to obtain the waveguide;

1002: depositing a layer of metal on the surface of the carrier plate, applying a photoresist on the surface of the metal, and etching the metal to obtain a wire after exposure;

1003: two electrodes are formed on the wire, the two electrodes are respectively used for connecting the electrode of the optical chip and the electrode of the electric chip; if the optical chip is placed on the carrier, the front side of the optical chip faces the above The waveguide, the optical signal can be projected through the waveguide through the carrier to a portion of the optical chip including the optical device.

In this embodiment, the waveguide is obtained by doping, and no through hole is required, which reduces the process difficulty and the production cost. In addition, the optical chip can be placed on the carrier board in reverse, and the optical chip can communicate with the optical signal of the specific wavelength through the waveguide on the carrier board; the electrodes of the optical chip can be interconnected with the electrical chip through the wires on the carrier board. The distance between the optical chip and the electric chip is short, and no additional wires are needed, which can reduce the problem of excessive loss of interconnection between the optical chip and the electric chip; therefore, a miniaturized optical communication module is provided, and signal quality is improved.

In order to further improve the coupling efficiency of the optical signal, the present embodiment provides the following solution. As shown in FIG. 3, the front surface of the optical chip faces the waveguide, and the grating of the optical chip faces the waveguide.

The doping the carrier plate to obtain the waveguide includes: doping the carrier plate to obtain a waveguide having an oblique angle, and the tilt angle matches a maximum light transmission incident angle of the grating.

The above is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the embodiments of the present invention. All should be covered by the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

An optical communication module comprising: an optical chip, an electric chip, a carrier board, and a wire; wherein the carrier board comprises a waveguide through which an optical signal can pass through the waveguide; the waveguide is adopted a waveguide obtained by doping the carrier;

The optical chip and the electric chip are located on the same side of the carrier, the wire is attached to the carrier, and the electrode of the optical chip is connected to the electrode of the optical chip through the wire;

The front surface of the optical chip is placed on the carrier plate in a reverse direction toward the waveguide; the front surface of the optical chip is a portion of the optical chip including the optical device.
The optical communication module according to claim 1, wherein said carrier is a glass carrier.
The optical communication module according to claim 1, wherein the front side of the optical chip faces the waveguide comprises: a grating of the optical chip facing the waveguide.
The optical communication module according to claim 3, wherein

The waveguide has a tilt angle that matches the maximum light transmission angle of incidence of the grating.
The optical communication module according to claim 1, wherein said waveguide is an optical path having a graded refractive index, and said waveguide has a refractive index which is smaller from a center to a carrier.
The optical communication module according to any one of claims 1 to 5, wherein a light guiding structure is further disposed between the front surface of the optical chip and the waveguide;

The light guiding structure is in close contact with the waveguide and the front surface of the optical chip.
The optical communication module according to any one of claims 1 to 5, characterized in that the side of the waveguide opposite to the optical chip is provided with a lens for changing a mode field or a transmission direction of the optical signal.
A carrier board comprising: a wire, one end of which is provided with an electrode for connecting an electric chip, and the other end is provided with an electrode for connecting the optical chip, wherein

The carrier includes a waveguide through which an optical signal can pass through the waveguide; the waveguide is a waveguide obtained by doping the carrier;

If the optical chip is placed on the carrier plate, the front surface of the optical chip faces the waveguide; the front surface of the optical chip is a portion of the optical chip that includes the optical device.
The carrier of claim 8 wherein said carrier is a glass carrier.
A carrier according to claim 8 wherein:

The waveguide has a tilt angle that is light with an optical chip to be disposed on the carrier The maximum light of the grid is matched by the incident angle.
The carrier according to any one of claims 8 to 10, wherein the waveguide is an optical path having a graded index of refraction, and the waveguide has a smaller refractive index from the center to the carrier.
The carrier according to any one of claims 8 to 10, characterized in that the side of the waveguide opposite to the optical chip is provided with a lens for changing a mode field or a transmission direction of the optical signal.