CN101762845A - Planar optical waveguide splitter chip and method for manufacturing same - Google Patents
Planar optical waveguide splitter chip and method for manufacturing same Download PDFInfo
- Publication number
- CN101762845A CN101762845A CN201010101440A CN201010101440A CN101762845A CN 101762845 A CN101762845 A CN 101762845A CN 201010101440 A CN201010101440 A CN 201010101440A CN 201010101440 A CN201010101440 A CN 201010101440A CN 101762845 A CN101762845 A CN 101762845A
- Authority
- CN
- China
- Prior art keywords
- core layer
- waveguide core
- light path
- substrate
- planar optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a planar optical waveguide splitter chip and a method for manufacturing the same and belongs to the field of optical passive devices. The planar optical waveguide splitter chip comprises a substrate, a waveguide core layer deposited on the substrate, an upper coating layer deposited on the waveguide core layer and a light path etched in the waveguide core layer, wherein an input end and an outer end of the light path are provided with an input positioning slot and an output positioning slot which are matched with naked fiber. The manufacturing method comprises the following operational steps of: a, polishing the surface of the substrate; b, depositing a waveguide core layer on the substrate; c, etching patterns in the waveguide core layer, irradiating polarized light on the waveguide core layer to from a light path, and while forming the light path, embedding the input end and the output end of the light path embedded in the input and output positioning slots which are matched with naked fiber; and d, depositing the upper coating layer on the waveguide core layer, and solidifying the upper coating layer. The method solves the problems of expensive equipment, complex process, low capacity and the like existing in the production of planar optical waveguide splitters.
Description
Technical field:
The present invention relates to a kind of planar optical waveguide splitter chip and preparation method thereof, belong to the optical passive component field.
Background technology:
Development along with Fibre Optical Communication Technology, Fiber to the home (FTTH) has obtained fairly large commercialization and has presented good growth momentum, its distinguishing feature is that it adopts the EPON link, bigger bandwidth is provided, save line resource, strengthen the reliability of circuit, simultaneously environment and power requirement are reduced.
In the FTTH network, optical branching device is a core devices wherein, is specially adapted to connect local side and terminal device in the EPON (EPON, BPON, GPON etc.), realizes the distribution of luminous power.
At present, the manufacture craft of optical branching device has been made to change into from the fused biconical taper formula substantially and has been adopted integrated optics technique production, and planar optical waveguide is the basic element of character in the integrated optics, this technology is to adopt optical lithography to make on silicon dioxide substrates, the allocation set of luminous power is formed on a slice chip, and a slice chip can be realized 1 fen power division more than 32 tunnel.
Planar optical waveguide splitter adopts the planar optical waveguide chip technology exactly, and the planar optical waveguide chip is aimed at coupling with fiber array, and with the bonding product that forms of cementing agent.This product has good even dichroism, and integrated level height, and characteristics such as operating wavelength range is wide satisfy the request for utilization of FTTH comprehensively, and support later communication dilatation.
The synoptic diagram of the planar optical waveguide splitter chip of the said goods as shown in Figure 2, its method for making: deposition one waveguide core layer and top covering on substrate, according to the design light path figure line is etched in the waveguide core layer, aim at waveguide core layer irradiation polarized light then, make it form light path, thereby the sandwich layer that contains optical waveguide has been deposited on the substrate, deposits top covering on sandwich layer again, and with its curing.
But the problem that this product exists at present is a complex manufacturing technology, aims at Coupling device and costs an arm and a leg, and the product production capacity is not high, thereby causes production cost higher.
Summary of the invention:
In order to solve the problems of the technologies described above, the invention provides a kind of planar optical waveguide splitter chip and preparation method thereof.
The technical solution adopted for the present invention to solve the technical problems is: a kind of planar optical waveguide splitter chip, comprise: substrate, be deposited on on-chip waveguide core layer, be deposited on the top covering on the waveguide core layer and be etched in light path in the waveguide core layer, the input of described light path, output terminal are provided with and the input locating slot and the output locating slot of naked fine coupling.
Its operation steps is as follows: a, with a substrate polishing surface; B, on described substrate the deposition one waveguide core layer; C, the figure line is etched in the described waveguide core layer, aims at described waveguide core layer irradiation polarized light then, make it form light path, and when forming light path, embed input locating slot and output locating slot with naked fine coupling at input, the output terminal of described light path; D, on waveguide core layer, deposit top covering again, and with its curing.
The present invention solves problems such as apparatus expensive, complex process, the production capacity of planar type optical waveguide shunt in producing is not high, employing is on the production technology basis of conventional planar chip of light waveguide, the locating slot of etching and bare fibre coupling on the input and output light path of planar optical waveguide chip, in the production of optical branching device, optical fiber is directly inserted the planar optical waveguide chip, and, fix with mental package at last, thereby finish the making of overall optical shunt with the ultra-violet curing glue bond and solidify.
Description of drawings:
The invention will be further described below in conjunction with drawings and Examples.
The level synoptic diagram of Fig. 1 planar optical waveguide of the present invention.
The light path synoptic diagram of the existing planar optical waveguide of Fig. 2.
Fig. 3 optical waveguide synoptic diagram of the present invention.
The flow sheet of Fig. 4 the present invention and shunt.
Among the figure: 1, substrate; 2, waveguide core layer; 3, top covering; 4, figure line; 5, light path; 6, input locating slot; 7, output locating slot.
Embodiment:
In conjunction with a kind of planar optical waveguide splitter chip shown in Fig. 1,3, comprise: substrate 1, be deposited on waveguide core layer 2 on the substrate 1, be deposited on the top covering 3 on the waveguide core layer 2 and be etched in light path 5 in the waveguide core layer 2, it is characterized in that: the input of described light path 5, output terminal are provided with and the input locating slot 6 and the output locating slot 7 of naked fine coupling.
The method for making of a kind of planar optical waveguide splitter chip as shown in Figure 4, its operation steps is as follows: a, with a substrate polishing surface; B, on described substrate the deposition one waveguide core layer; C, the figure line is etched in the described waveguide core layer, aims at described waveguide core layer irradiation polarized light then, make it form light path, and when forming light path, embed input locating slot and output locating slot with naked fine coupling at input, the output terminal of described light path; D, on waveguide core layer, deposit top covering again, and with its curing.
After input locating slot 6 and output locating slot 7 are set in light path, make when making planar optical waveguide splitter more convenient and convenient, when making planar optical waveguide splitter, only need to insert and the naked fibre of a single core that is coupled at input locating slot 6, insert and the ribbon fiber that is coupled at output locating slot 7, the coupling back adopts ultraviolet glue with its bonding and curing, fixes with mental package at last, tests then.
It below only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (2)
1. planar optical waveguide splitter chip, comprise: substrate (1), be deposited on waveguide core layer (2) on the substrate (1), be deposited on the top covering (3) on the waveguide core layer (2) and be etched in light path (5) in the waveguide core layer (2), it is characterized in that: input, the output terminal of described light path (5) is provided with and the input locating slot (6) of naked fine coupling and export locating slot (7).
2. the method for making of a planar optical waveguide splitter chip, its operation steps is as follows: a, with a substrate polishing surface; B, on described substrate the deposition one waveguide core layer; C, the figure line is etched in the described waveguide core layer, aims at described waveguide core layer irradiation polarized light then, make it form light path; D, on waveguide core layer, deposit top covering again, and with its curing; It is characterized in that: in the c step, when forming light path, at the input locating slot that input, output terminal embed and naked fibre mates and the output locating slot of described light path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010101440A CN101762845A (en) | 2010-01-27 | 2010-01-27 | Planar optical waveguide splitter chip and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010101440A CN101762845A (en) | 2010-01-27 | 2010-01-27 | Planar optical waveguide splitter chip and method for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101762845A true CN101762845A (en) | 2010-06-30 |
Family
ID=42494127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010101440A Pending CN101762845A (en) | 2010-01-27 | 2010-01-27 | Planar optical waveguide splitter chip and method for manufacturing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101762845A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053385A (en) * | 2011-01-30 | 2011-05-11 | 中北大学 | Speckle restraining device for laser light source based on MEMS (micro-electromechanical systems) technology |
| CN102681088A (en) * | 2012-04-13 | 2012-09-19 | 四川天邑康和光电子有限公司 | Planar lightwave circuit splitter chip |
| CN104007522A (en) * | 2014-05-26 | 2014-08-27 | 上海大学 | Coupling and packing system and method for full-automatic PLC subdivider |
| WO2023036104A1 (en) * | 2021-09-10 | 2023-03-16 | 中兴通讯股份有限公司 | Optical connector and manufacturing method |
-
2010
- 2010-01-27 CN CN201010101440A patent/CN101762845A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053385A (en) * | 2011-01-30 | 2011-05-11 | 中北大学 | Speckle restraining device for laser light source based on MEMS (micro-electromechanical systems) technology |
| CN102681088A (en) * | 2012-04-13 | 2012-09-19 | 四川天邑康和光电子有限公司 | Planar lightwave circuit splitter chip |
| CN104007522A (en) * | 2014-05-26 | 2014-08-27 | 上海大学 | Coupling and packing system and method for full-automatic PLC subdivider |
| CN104007522B (en) * | 2014-05-26 | 2016-02-17 | 上海大学 | Full-automatic PLC shunt coupling package system and method |
| WO2023036104A1 (en) * | 2021-09-10 | 2023-03-16 | 中兴通讯股份有限公司 | Optical connector and manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101620300A (en) | CMOS compatible integrated dielectric optical waveguide coupler and fabrication | |
| GB2587961A (en) | Electro-optical package and method of fabrication | |
| CN102053318A (en) | Method for implementing face-down integration of arrayed waveguide grating (AWG) and laser device (LD) on silicon platform | |
| US10393959B1 (en) | Photonic integrated circuit bonded with interposer | |
| CN105336795B (en) | Photon chip packaging structure based on grating interface, and manufacturing method for photon chip packaging structure | |
| CN101762845A (en) | Planar optical waveguide splitter chip and method for manufacturing same | |
| CN107346049A (en) | A kind of Optical Waveguide Modes spot-size converter and preparation method thereof | |
| CN106405752A (en) | Optical component | |
| CN112687672A (en) | Silicon-based photoelectron heterogeneous integrated interconnection module | |
| CN207281327U (en) | A kind of Optical Waveguide Modes spot-size converter | |
| CN102073109A (en) | Manufacturing method of QSFP (Quad Small Form-factor Pluggable) module subelement | |
| CN201607539U (en) | Planar optical wave guide splitter chip | |
| CN114624821A (en) | End face coupler based on multilayer waveguide material structure and preparation method thereof | |
| CN206684343U (en) | A kind of non-equidistant fiber array of more diameter optical fibers | |
| CN103713357B (en) | A kind of silicon-based optical waveguide polarization converter and preparation method thereof | |
| CN104460054A (en) | Lithium niobate photomodulator and manufacturing and packaging method thereof | |
| JP5819874B2 (en) | Method for producing optical functional element | |
| CN103235370A (en) | Coarse wavelength division multiplexer/demultiplexer based on planar optical waveguide and manufacturing method thereof | |
| CN102109639A (en) | Preparation method of chip based on planar light-wave circuit (PLC) splitter | |
| CN207249168U (en) | A kind of fiber waveguide core wafer and fiber waveguide core | |
| CN102681088A (en) | Planar lightwave circuit splitter chip | |
| CN109100833B (en) | Parallel coupling photoelectric integrated circuit board connector and manufacturing method thereof | |
| CN102062910A (en) | GPON (Gigabit-Capable PON) module basic unit and manufacturing method thereof | |
| CN102062911A (en) | GPON (Gigabit-Capable PON) module basic unit and manufacturing method thereof | |
| CN115728866B (en) | Multilayer optical rewiring structure of silicon photonic chip and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100630 |