CN102650072B - 复合电镀液 - Google Patents
复合电镀液 Download PDFInfo
- Publication number
- CN102650072B CN102650072B CN201210045704.1A CN201210045704A CN102650072B CN 102650072 B CN102650072 B CN 102650072B CN 201210045704 A CN201210045704 A CN 201210045704A CN 102650072 B CN102650072 B CN 102650072B
- Authority
- CN
- China
- Prior art keywords
- composite
- present
- plating
- electroplating
- carbon nanotubes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011038171A JP5631775B2 (ja) | 2011-02-24 | 2011-02-24 | 複合めっき液 |
| JP2011-038171 | 2011-02-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102650072A CN102650072A (zh) | 2012-08-29 |
| CN102650072B true CN102650072B (zh) | 2016-05-25 |
Family
ID=46692194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210045704.1A Active CN102650072B (zh) | 2011-02-24 | 2012-02-24 | 复合电镀液 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9476138B2 (https=) |
| JP (1) | JP5631775B2 (https=) |
| CN (1) | CN102650072B (https=) |
| TW (1) | TWI570278B (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104195619A (zh) * | 2014-09-17 | 2014-12-10 | 朱忠良 | 一种复合电镀液及使用所述复合电镀液进行电镀的方法 |
| JP6435546B2 (ja) * | 2014-10-17 | 2018-12-12 | ディップソール株式会社 | 銅−ニッケル合金電気めっき装置 |
| JP6531277B2 (ja) * | 2015-03-30 | 2019-06-19 | 株式会社 コーア | 無電解めっき液及び無電解めっき方法 |
| CN104928732A (zh) * | 2015-05-13 | 2015-09-23 | 中国石油天然气股份有限公司西南油气田分公司重庆天然气净化总厂 | 一种镍钨单壁碳纳米管复合镀液、镀膜及其制备方法 |
| US10316424B2 (en) | 2016-02-23 | 2019-06-11 | Samsung Electronics Co., Ltd. | Flexible electrically conductive structure, flexible wiring board, production method thereof, and electronic device includng the same |
| US11091847B2 (en) * | 2016-10-28 | 2021-08-17 | Unison Industries Llc | Method of manufacturing aircraft engine parts utilizing reusable and reconfigurable smart memory polymer mandrel |
| JP2019002034A (ja) * | 2017-06-13 | 2019-01-10 | 国立大学法人信州大学 | 銅・単層カーボンナノチューブ複合めっき方法 |
| CN109537030B (zh) * | 2018-11-26 | 2020-12-15 | 江苏科技大学 | 一种碳纳米颗粒溶液的制备方法及其在镍涂层中的应用 |
| CN111041540A (zh) * | 2019-12-24 | 2020-04-21 | 托伦斯半导体设备启东有限公司 | 一种半导体硅片耐磨处理工艺 |
| JP7795165B2 (ja) * | 2020-04-17 | 2026-01-07 | 国立研究開発法人産業技術総合研究所 | カーボンナノチューブ膜、分散液及びカーボンナノチューブ膜の製造方法 |
| JP2026054950A (ja) * | 2024-09-17 | 2026-03-30 | 晴夫 浜田 | 熱交換部材及びその製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1544707A (zh) * | 2003-11-13 | 2004-11-10 | 上海交通大学 | 复合电沉积制备镍基纳米碳管复合材料的方法 |
| CN1563505A (zh) * | 2004-03-16 | 2005-01-12 | 天津大学 | 脉冲镀镍基纳米复合镀层的方法及设备 |
| CN1725479A (zh) * | 2004-07-21 | 2006-01-25 | 鸿富锦精密工业(深圳)有限公司 | 一种热管及其制造方法 |
| JP2008231530A (ja) * | 2007-03-22 | 2008-10-02 | Furukawa Electric Co Ltd:The | 表面被覆材 |
| JP2010202918A (ja) * | 2009-03-02 | 2010-09-16 | Shinshu Univ | 複合めっき皮膜及びその形成方法並びに電解めっき液 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR813548A (fr) * | 1936-11-16 | 1937-06-03 | Mond Nickel Co Ltd | Procédé pour l'obtention de dépôts brillants ou semi-brillants de nickel |
| US3860949A (en) * | 1973-09-12 | 1975-01-14 | Rca Corp | Semiconductor mounting devices made by soldering flat surfaces to each other |
| JPS62109991A (ja) * | 1985-07-29 | 1987-05-21 | C Uyemura & Co Ltd | 電気めつき液 |
| US5051814A (en) * | 1987-04-15 | 1991-09-24 | The Board Of Trustees Of The Leland Stanford Junior University | Method of providing stress-free thermally-conducting attachment of two bodies |
| JPH04116191A (ja) * | 1990-09-04 | 1992-04-16 | C Uyemura & Co Ltd | 電気めっき方法 |
| EP1441047B1 (en) * | 2001-10-29 | 2016-01-20 | Hitachi Metals, Ltd. | Method for forming electroplated coating on surface of article |
| JP4032116B2 (ja) * | 2002-11-01 | 2008-01-16 | 国立大学法人信州大学 | 電子部品およびその製造方法 |
| US7112472B2 (en) * | 2003-06-25 | 2006-09-26 | Intel Corporation | Methods of fabricating a composite carbon nanotube thermal interface device |
| JP4324434B2 (ja) * | 2003-09-18 | 2009-09-02 | 新光電気工業株式会社 | 放熱部材及びその製造方法 |
| JP4489561B2 (ja) * | 2004-06-18 | 2010-06-23 | 国立大学法人信州大学 | 繊維状ナノカーボン・金属複合材料およびその製造方法 |
| US7906210B2 (en) | 2004-10-27 | 2011-03-15 | Nissei Plastic Industrial Co., Ltd. | Fibrous nanocarbon and metal composite and a method of manufacturing the same |
| KR100748228B1 (ko) * | 2006-02-28 | 2007-08-09 | 한국과학기술원 | 전기도금을 이용한 금속/탄소나노튜브 복합재료 제조방법 |
| JP2007262430A (ja) * | 2006-03-27 | 2007-10-11 | C Uyemura & Co Ltd | 電気めっき方法 |
| JP2008157912A (ja) * | 2006-11-28 | 2008-07-10 | Seiko Epson Corp | 時計部品、及び当該時計部品を備えた時計 |
| JP5266088B2 (ja) * | 2009-02-18 | 2013-08-21 | パナソニック株式会社 | 電磁シールド用めっき膜、電磁シールド基板及びその製造方法 |
| JP2010222707A (ja) * | 2010-06-07 | 2010-10-07 | Shinshu Univ | 無電解めっき方法および無電解めっき液 |
-
2011
- 2011-02-24 JP JP2011038171A patent/JP5631775B2/ja active Active
-
2012
- 2012-02-23 US US13/403,331 patent/US9476138B2/en active Active
- 2012-02-24 CN CN201210045704.1A patent/CN102650072B/zh active Active
- 2012-02-24 TW TW101106180A patent/TWI570278B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1544707A (zh) * | 2003-11-13 | 2004-11-10 | 上海交通大学 | 复合电沉积制备镍基纳米碳管复合材料的方法 |
| CN1563505A (zh) * | 2004-03-16 | 2005-01-12 | 天津大学 | 脉冲镀镍基纳米复合镀层的方法及设备 |
| CN1725479A (zh) * | 2004-07-21 | 2006-01-25 | 鸿富锦精密工业(深圳)有限公司 | 一种热管及其制造方法 |
| JP2008231530A (ja) * | 2007-03-22 | 2008-10-02 | Furukawa Electric Co Ltd:The | 表面被覆材 |
| JP2010202918A (ja) * | 2009-03-02 | 2010-09-16 | Shinshu Univ | 複合めっき皮膜及びその形成方法並びに電解めっき液 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5631775B2 (ja) | 2014-11-26 |
| JP2012172245A (ja) | 2012-09-10 |
| US20120216997A1 (en) | 2012-08-30 |
| US9476138B2 (en) | 2016-10-25 |
| TWI570278B (zh) | 2017-02-11 |
| TW201235515A (en) | 2012-09-01 |
| CN102650072A (zh) | 2012-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102650072B (zh) | 复合电镀液 | |
| CN105325067B (zh) | 导电散热片及包括导电散热片的电气部件和电子产品 | |
| US9513070B2 (en) | Radiation member | |
| Hagio et al. | Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface | |
| CN114761623B (zh) | 复合镀材及其制造方法 | |
| CN1720355A (zh) | 电镀构造物及其制造方法 | |
| CN104499032A (zh) | 一种用于在基材表面电镀形成Ni/石墨烯复合导热薄膜的镀液 | |
| US9136200B2 (en) | Heat radiating component and method of producing same | |
| Chen et al. | Surfactant-assisted electrodeposition of Au–Co/WS2 self-lubricating coating from WS2 suspended cyanide electrolyte | |
| WO2007029395A1 (ja) | ナノカーボン/アルミニウム複合材、その製造方法及びこれに用いるめっき液 | |
| CN101287862B (zh) | 复合电镀材料的制造方法 | |
| CN108555286B (zh) | 一种核壳结构的镍包铜微米片、其制备方法及其应用 | |
| CN104195619A (zh) | 一种复合电镀液及使用所述复合电镀液进行电镀的方法 | |
| JP5566743B2 (ja) | 銅合金微粒子の製造方法 | |
| JP2014025100A (ja) | リン、ホウ素及びカーボンナノチューブを含む無電解めっき皮膜 | |
| CN1769541A (zh) | 纳米碳纤维和金属的复合材料及其制造方法 | |
| CN114250492B (zh) | 一种层状复合材料及其制备方法和应用 | |
| JP2006028636A (ja) | 繊維状ナノカーボン・金属複合材料およびその製造方法 | |
| CN106152002B (zh) | 发光二极管的散热板设备、用于汽车的头灯及制备方法 | |
| CN110629260A (zh) | 一种无氰电镀纳米金电解液及制备方法和利用其制备纳米金镀层的方法 | |
| Dietrich et al. | Ultrasound technique as a tool for high-rate incorporation of Al2O3 in NiCo layers | |
| JP5453605B2 (ja) | 無電解Cuめっき液および無電解Cuめっき方法 | |
| KR101166782B1 (ko) | Cnt 성장용 촉매 또는 c, cnt, 풀러린을 도핑한 모재 기판 및 그 제조 방법 | |
| JP2007162080A (ja) | 熱伝導部材、自動車用部品及びその製造方法 | |
| US20260078969A1 (en) | Heat exchange member and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |