CN102629541B - 喷淋头及其形成方法 - Google Patents

喷淋头及其形成方法 Download PDF

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Publication number
CN102629541B
CN102629541B CN201210124969.0A CN201210124969A CN102629541B CN 102629541 B CN102629541 B CN 102629541B CN 201210124969 A CN201210124969 A CN 201210124969A CN 102629541 B CN102629541 B CN 102629541B
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China
Prior art keywords
spray head
middle section
fringe region
oxide
layer
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CN201210124969.0A
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English (en)
Chinese (zh)
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CN102629541A (zh
Inventor
贺小明
万磊
倪图强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd.
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Advanced Micro Fabrication Equipment Inc Shanghai
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Priority to CN201210124969.0A priority Critical patent/CN102629541B/zh
Publication of CN102629541A publication Critical patent/CN102629541A/zh
Priority to TW101149901A priority patent/TW201344783A/zh
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  • Coating By Spraying Or Casting (AREA)
  • Drying Of Semiconductors (AREA)
CN201210124969.0A 2012-04-25 2012-04-25 喷淋头及其形成方法 Active CN102629541B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201210124969.0A CN102629541B (zh) 2012-04-25 2012-04-25 喷淋头及其形成方法
TW101149901A TW201344783A (zh) 2012-04-25 2012-12-25 噴淋頭及其形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210124969.0A CN102629541B (zh) 2012-04-25 2012-04-25 喷淋头及其形成方法

Publications (2)

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CN102629541A CN102629541A (zh) 2012-08-08
CN102629541B true CN102629541B (zh) 2016-02-17

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CN (1) CN102629541B (enExample)
TW (1) TW201344783A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI582823B (zh) * 2015-11-17 2017-05-11 弘潔科技股份有限公司 一種用於電漿反應室之氣體分散板
TWI859447B (zh) * 2020-06-17 2024-10-21 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 具有用於改善對腐蝕性化學環境的耐受性的稀土（氧）氟化物塗層之器件及用於製造和使用該等器件之方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1484712B (zh) * 2000-12-29 2010-04-21 兰姆研究公司 半导体工艺设备的氮化硼/氧化钇复合材料部件及其制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1501115B1 (en) * 2003-07-14 2009-07-01 FEI Company Dual beam system
US8124240B2 (en) * 2005-06-17 2012-02-28 Tohoku University Protective film structure of metal member, metal component employing protective film structure, and equipment for producing semiconductor or flat-plate display employing protective film structure
US9017765B2 (en) * 2008-11-12 2015-04-28 Applied Materials, Inc. Protective coatings resistant to reactive plasma processing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1484712B (zh) * 2000-12-29 2010-04-21 兰姆研究公司 半导体工艺设备的氮化硼/氧化钇复合材料部件及其制造方法

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TW201344783A (zh) 2013-11-01
CN102629541A (zh) 2012-08-08
TWI514464B (enExample) 2015-12-21

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Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai

Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd.

Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai

Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc.