TWI514464B - - Google Patents

Info

Publication number
TWI514464B
TWI514464B TW101149901A TW101149901A TWI514464B TW I514464 B TWI514464 B TW I514464B TW 101149901 A TW101149901 A TW 101149901A TW 101149901 A TW101149901 A TW 101149901A TW I514464 B TWI514464 B TW I514464B
Authority
TW
Taiwan
Application number
TW101149901A
Other languages
Chinese (zh)
Other versions
TW201344783A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201344783A publication Critical patent/TW201344783A/zh
Application granted granted Critical
Publication of TWI514464B publication Critical patent/TWI514464B/zh

Links

TW101149901A 2012-04-25 2012-12-25 噴淋頭及其形成方法 TW201344783A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210124969.0A CN102629541B (zh) 2012-04-25 2012-04-25 喷淋头及其形成方法

Publications (2)

Publication Number Publication Date
TW201344783A TW201344783A (zh) 2013-11-01
TWI514464B true TWI514464B (enExample) 2015-12-21

Family

ID=46587779

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101149901A TW201344783A (zh) 2012-04-25 2012-12-25 噴淋頭及其形成方法

Country Status (2)

Country Link
CN (1) CN102629541B (enExample)
TW (1) TW201344783A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI582823B (zh) * 2015-11-17 2017-05-11 弘潔科技股份有限公司 一種用於電漿反應室之氣體分散板
TWI859447B (zh) * 2020-06-17 2024-10-21 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 具有用於改善對腐蝕性化學環境的耐受性的稀土(氧)氟化物塗層之器件及用於製造和使用該等器件之方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW533494B (en) * 2000-12-29 2003-05-21 Lam Res Corp Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof
TW200712251A (en) * 2005-06-17 2007-04-01 Univ Tohoku Protection film structure for a metal member, metal parts using the protection film structure, and semiconductor of flat display production apparatus using the protection film structure
TW201026632A (en) * 2008-11-12 2010-07-16 Applied Materials Inc Protective coatings resistant to reactive plasma processing

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1501115B1 (en) * 2003-07-14 2009-07-01 FEI Company Dual beam system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW533494B (en) * 2000-12-29 2003-05-21 Lam Res Corp Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof
TW200712251A (en) * 2005-06-17 2007-04-01 Univ Tohoku Protection film structure for a metal member, metal parts using the protection film structure, and semiconductor of flat display production apparatus using the protection film structure
TW201026632A (en) * 2008-11-12 2010-07-16 Applied Materials Inc Protective coatings resistant to reactive plasma processing

Also Published As

Publication number Publication date
TW201344783A (zh) 2013-11-01
CN102629541A (zh) 2012-08-08
CN102629541B (zh) 2016-02-17

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