JP2018014491A5 - - Google Patents
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- Publication number
- JP2018014491A5 JP2018014491A5 JP2017128341A JP2017128341A JP2018014491A5 JP 2018014491 A5 JP2018014491 A5 JP 2018014491A5 JP 2017128341 A JP2017128341 A JP 2017128341A JP 2017128341 A JP2017128341 A JP 2017128341A JP 2018014491 A5 JP2018014491 A5 JP 2018014491A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate support
- ceramic layer
- sidewalls
- side wall
- support according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 64
- 239000000919 ceramic Substances 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 17
- 239000011241 protective layer Substances 0.000 claims description 17
- 238000005498 polishing Methods 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000007517 polishing process Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662357513P | 2016-07-01 | 2016-07-01 | |
| US62/357,513 | 2016-07-01 | ||
| US15/594,091 US20180005867A1 (en) | 2016-07-01 | 2017-05-12 | Esc ceramic sidewall modification for particle and metals performance enhancements |
| US15/594,091 | 2017-05-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018014491A JP2018014491A (ja) | 2018-01-25 |
| JP2018014491A5 true JP2018014491A5 (enExample) | 2020-08-13 |
| JP7186494B2 JP7186494B2 (ja) | 2022-12-09 |
Family
ID=60807764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017128341A Active JP7186494B2 (ja) | 2016-07-01 | 2017-06-30 | 粒子性能および金属性能の改善のためのｅｓｃセラミック側壁の加工 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20180005867A1 (enExample) |
| JP (1) | JP7186494B2 (enExample) |
| KR (1) | KR20180004009A (enExample) |
| CN (1) | CN107579031A (enExample) |
| TW (1) | TW201812980A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11133211B2 (en) * | 2018-08-22 | 2021-09-28 | Lam Research Corporation | Ceramic baseplate with channels having non-square corners |
| JP2023537946A (ja) * | 2020-08-10 | 2023-09-06 | ラム リサーチ コーポレーション | 局所熱制御を備えた結合ヒータゾーンを含む多層構造を有する基板支持体 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6891263B2 (en) * | 2000-02-07 | 2005-05-10 | Ibiden Co., Ltd. | Ceramic substrate for a semiconductor production/inspection device |
| JP2001319967A (ja) | 2000-05-11 | 2001-11-16 | Ibiden Co Ltd | セラミック基板の製造方法 |
| US6613442B2 (en) * | 2000-12-29 | 2003-09-02 | Lam Research Corporation | Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof |
| JP4397271B2 (ja) | 2003-05-12 | 2010-01-13 | 東京エレクトロン株式会社 | 処理装置 |
| JP2008016709A (ja) | 2006-07-07 | 2008-01-24 | Shinko Electric Ind Co Ltd | 静電チャックおよびその製造方法 |
| US9543181B2 (en) * | 2008-07-30 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Replaceable electrostatic chuck sidewall shield |
| JP5876992B2 (ja) | 2011-04-12 | 2016-03-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| KR20150013627A (ko) | 2012-04-26 | 2015-02-05 | 어플라이드 머티어리얼스, 인코포레이티드 | Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치 |
| CN104241183B (zh) * | 2013-06-08 | 2017-09-08 | 中微半导体设备(上海)有限公司 | 静电吸盘的制造方法，静电吸盘及等离子体处理装置 |
| KR101385950B1 (ko) | 2013-09-16 | 2014-04-16 | 주식회사 펨빅스 | 정전척 및 정전척 제조 방법 |
| JP6296770B2 (ja) | 2013-11-29 | 2018-03-20 | 日本特殊陶業株式会社 | 基板載置装置 |
| KR20160015510A (ko) * | 2014-07-30 | 2016-02-15 | 삼성전자주식회사 | 정전척 어셈블리, 이를 구비하는 반도체 제조장치, 및 이를 이용한 플라즈마 처리방법 |
-
2017
- 2017-05-12 US US15/594,091 patent/US20180005867A1/en not_active Abandoned
- 2017-06-27 TW TW106121344A patent/TW201812980A/zh unknown
- 2017-06-28 KR KR1020170081734A patent/KR20180004009A/ko not_active Ceased
- 2017-06-30 JP JP2017128341A patent/JP7186494B2/ja active Active
- 2017-06-30 CN CN201710521432.0A patent/CN107579031A/zh active Pending
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