CN102608873A - Workbench and exposure apparatus using the same - Google Patents
Workbench and exposure apparatus using the same Download PDFInfo
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- CN102608873A CN102608873A CN2012100182655A CN201210018265A CN102608873A CN 102608873 A CN102608873 A CN 102608873A CN 2012100182655 A CN2012100182655 A CN 2012100182655A CN 201210018265 A CN201210018265 A CN 201210018265A CN 102608873 A CN102608873 A CN 102608873A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides a workbench and an exposure apparatus using the same, wherein workpieces are held through vacuum adsorption and the warping of workpieces can be corrected at the same time. If a workpiece (W) is delivered, a pin (5a) rises and receives the workpiece (W). Then the pin (5a) descends, so that the workpiece (W) is placed on a workbench (4). A collar member (7) descends with the pin (5a) together and the lower surface of the collar member (7) tightly adheres to the upper surface of a cover member (6). Through the tight cohesion of the collar member (7) with the cover member (6), the through hole (4c) of the workbench is closed. If a vacuum adsorption hole (4b) is vacuumized, the space between the workbench and the workbench is decompressed and the workpiece is absorbed to the workbench. When the pin (5a) descends, the through hole is sealed through the collar member (7) and the cover member (6). Therefore, the atmosphere does not flow into the through hole. Even if the workpiece is deformed to be a reverse bowl, the workpiece can be absorbed securely.
Description
Technical field
The present invention relates to keep processed such as will making public substrate worktable and use the exposure device of this worktable, relate in particular to adsorbable maintenance produce warpage substrates such as wafer (workpiece) worktable and use the exposure device of this worktable.
Background technology
In the operation of making semiconductor, printed base plate, crystal liquid substrate etc. (below be also referred to as workpiece), during the processed of making public etc., use absorption to keep the worktable of workpiece in order to make workpiece not cause off normal.
Fig. 6 representes to possess the schematic configuration like the exposure device of above-mentioned worktable.
In addition, in the exposure device, the exposure device that does not possess projecting lens is arranged also.
Illumination part 1 possesses: radiate the lamp 1a that contains ultraviolet light and reflect from mirror 1b of the light of lamp 1a etc.
The surface of worktable 4 is formed with vacuum suction groove 4a, and is provided with a plurality of vacuum suction hole 4b that is communicated with this vacuum suction groove.Worktable 4 is connected with pipe arrangement 11; When keeping workpiece W; Give vacuum via vacuum suction hole 4b to vacuum suction groove 4a from this pipe arrangement 11, this external with workpiece W when worktable 4 unloads, from this pipe arrangement 11 via vacuum suction hole 4b to vacuum suction groove 4a air supply.
The action of simple declaration exposure device.
(i), the workpiece W of printed base plate etc. is placed on the worktable 4 of exposure device 10 through not shown conveying mechanism.Be coated with resist on the surface of workpiece W (forming a figuratum side).Vacuum suction hole 4b via worktable 4 gives vacuum to vacuum suction groove 4a, and workpiece W is adsorbed and remains on the worktable 4.
(ii) the giving in exposure-processed of vacuum to worktable 4 continuing, and moves to avoid workpiece W.
(iii) if exposure-processed finishes, then transfer valve 12, and the absorption that stops the giving of vacuum of vacuum suction hole 4b (vacuum suction groove 4a) removed workpiece W keeps, to vacuum suction hole 4b air supply.Thus, from vacuum suction groove 4a ejection air, workpiece W is broken away from from worktable 4, is transported to outside the exposure device 10 through not shown conveying mechanism.
Then, to the detailed construction and the action specification of the part of worktable.
Fig. 7, Fig. 8 are the cut-open view of the part of worktable, and the figure of the action till workpiece and vacuum suction keep is accepted in expression from the conveying mechanism of workpiece.
As shown in the drawing, worktable 4 is formed with the through hole 4c that is used for accepting from workpiece conveying mechanism 20 the pin 5a discrepancy usefulness of workpiece W.Pin 5a is a plurality of (more than 3), and through hole 4c is set up the amount of the quantity of pin.
Rear side at worktable 4 is provided with pin driving mechanism (for example cylinder) 5 up and down, and through driving mechanism 5 about this pin, a plurality of pin 5a synchronously move up and down via through hole 4c.
When pin 5a had risen, the front end of pin 5a was positioned at and more leans on upward than the surface of worktable 4, and when having descended, the front end of pin 5a is positioned at than the surface of worktable 4 and more leans on.
Utilize Fig. 7, Fig. 8 that the action of worktable is described.
Shown in Fig. 7 (a), workpiece W is maintained on the arm 121 of workpiece conveying mechanism 120 and is transported on the worktable 4.
Shown in Fig. 7 (b), pin 5a is through pin driving mechanism 5 risings up and down, and pin 5a accepts workpiece W from arm 21.
Shown in Fig. 8 (c), it is right-hand that the arm 21 of workpiece conveying mechanism 20 is kept out of the way drawing, and pin 5a is through pin driving mechanism 5 declines up and down.Workpiece W places worktable 4.Vacuum suction hole 4b is endowed vacuum, and workpiece W is adsorbed and remains on the worktable 4.
Moreover, as using a plurality of pins to carry out the example in the past of the handing-over of the wafer between conveying arm and worktable, patent documentation 1 is for example arranged.
The look-ahead technique document
Patent documentation
Patent documentation 1: japanese kokai publication sho 63-141342 communique
Brief summary of the invention
The problem that invention will solve
Recently; As workpiece, use to paste the workpiece (for example at the workpiece of pasting Silicon Wafer on the glass substrate) that 2 different substrates of expansivity form gradually or formed expansivity different with substrate layer workpiece (for example on sapphire substrate, having formed the workpiece of gallium nitride layer) etc.Under the situation of such workpiece,, then can produce warpage or distortion because of the coefficient of thermal expansion of material up and down is different if in preceding operation, heat cooling repeatedly.
For example, in the manufacturing of LED, use the workpiece that on round sapphire substrate, has formed gallium nitride layer.Under the situation of such workpiece, because of carrying out repeatedly of the heating cooling processing in the preceding operation, substrate is towards the big material side warpage of expansion coefficient.
For example, under the situation of the workpiece that has formed gallium nitride layer on the sapphire substrate about 500 μ m, the crystallizing layer of gallium nitride is grown up on sapphire substrate with about 800 ℃.This moment, workpiece was smooth, but along with cooling, the big sapphire substrate of expansion coefficient shrinks than the crystallizing layer of gallium nitride biglyyer, so workpiece is towards sapphire substrate side warpage (the sapphire substrate side becomes concave side).Diameter at workpiece is under the situation about
, can produce the warpage about about 200 μ m～250 μ m.
To the workpiece of distortion like this, use exposure device to form pattern sometimes at gallium nitride layer.For this reason, make sapphire substrate place downside and workpiece is placed on the worktable of exposure device.But, as the back-off bowl, be deformed into central portion and expand into convex if be placed on the workpiece of worktable like this, then can produce worktable and can not adsorb the problem that keeps workpiece.Below utilize Fig. 9 to describe.
Fig. 9 is with as the back-off bowl, being deformed into the figure that the protruding workpiece W of central portion is placed on the state of Fig. 7, worktable 4 shown in Figure 8.
Under this state, if give vacuum, then should be that the atmosphere of (downside of workpiece W) between worktable 4 and the workpiece W is discharged to the vacuum suction hole 4b of worktable 4, the distortion of workpiece W obtains correcting back absorption and remains in worktable 4.
But worktable 4 is formed with the through hole 4c that the pin 5a that is used for using with conveying mechanism 20 handing-over workpiece W is run through as stated.Therefore, as shown in Figure 9 when having given vacuum to vacuum suction hole 4b, from inflow atmosphere such as this through hole 4c.Therefore, the space between worktable 4 and workpiece W can not be depressurized, and workpiece W can not adsorb and remains in worktable 4.Therefore can not carry out exposure-processed.
As stated; In worktable in the past; Even will be with pasting the workpiece that 2 different substrates of expansivity form or having formed the workpiece etc. of the expansivity layer different and become by warpage significantly as bowl-shape workpiece adsorbs and remains in worktable through the heating cooling processing in the preceding operation with substrate; Also can in the space between worktable and workpiece, flow into atmosphere and can not adsorb maintenance, appearance can not be carried out the situation of exposure-processed.
Summary of the invention
The present invention is used to address the above problem, and the objective of the invention is in adsorb the worktable that keeps substrate (workpiece) through vacuum suction, even bowl back-off that kind is deformed into the protruding workpiece of central portion, also can corrects its warpage and keeps with whole absorption.
Solve the means that problem is used
As stated, be provided with at worktable and be used to join the pin of workpiece, and be formed with the through hole that this pin passes.Therefore, if the workpiece warpage becomes to protruding bowl-shape of upside, then atmosphere flows into the worktable surface from this through hole, the situation that appearance can not be reduced pressure to the space between workpiece and the worktable.
For this reason, be provided with following mechanism in the present invention: when absorption keeps workpiece, just can not block above-mentioned through hole to the mobile obstruction of bringing of above-mentioned pin.
Particularly, cover is set, the big but opening littler of the diameter of the pin that this cover is formed with than in through hole, moves up and down than the diameter of through hole in the open lower side of the through hole of worktable; In addition, be provided with axle collar parts at above-mentioned pin, these axle collar parts are littler and bigger than the opening diameter of above-mentioned cover than the diameter of above-mentioned through hole.And, when above-mentioned pin has descended, make the lower surface of axle collar parts connect airtight upper surface in cover, block above-mentioned through hole.Under this state, give vacuum through vacuum suction hole to worktable, do not make atmosphere flow into and can atmosphere between worktable and the workpiece be discharged from through hole, even and workpiece significantly warpage become bowl-shape, also can workpiece absorption be remained on the worktable.
Based on above content, among the present invention as following the solution problem.
(1) a kind of table device is characterized in that, possesses: worktable is formed with the vacuum suction hole that is supplied to vacuum, and on above-below direction, is formed with through hole on the surface; Pin moves up and down in above-mentioned through hole; And pin reciprocating mechanism; Open lower side at the through hole of worktable is provided with the cover that is formed with opening, and the diameter of the pin that this aperture efficiency moves up and down in through hole is big, and littler than the diameter of through hole; Above-mentioned table device is equipped with axle collar parts, and these axle collar parts connect airtight in above-mentioned pin, and littler and bigger than the diameter of the opening of above-mentioned cover than the diameter of above-mentioned through hole, when above-mentioned pin descended, the lower surface of axle collar parts connected airtight the upper surface in cover.
(2) a kind of exposure device is characterized in that, possesses: the light injection part, penetrate light; Mask platform keeps forming figuratum mask; And worktable, keeping workpiece, the pattern transfer that is formed on the aforementioned mask arrives this workpiece; Above-mentioned worktable is the described worktable of claim 1.
The invention effect
In the present invention; When pin descended, axle collar parts through being installed on pin and be arranged on the cover below the worktable had sealed the end that the pin that is formed on worktable passes the through hole of usefulness; Therefore constitute: when making worktable absorption keep workpiece, the sealing pin passes an end of the through hole of usefulness.Thus, even be deformed into workpiece like bowl back-off shape, also can correct the distortion and remain in worktable with whole absorption.
Description of drawings
Fig. 1 is the cut-open view (1) of the worktable part of the embodiment of the invention.
Fig. 2 is the cut-open view (2) of the worktable part of the embodiment of the invention.
Fig. 3 is the figure of schematic configuration of the exposure device of the expression worktable that possesses the embodiment of the invention.
Fig. 4 is the figure that amplifies expression cover, pin, axle collar parts.
Fig. 5 is the figure of formation example of situation that is illustrated in the arranged outside members of frame of spring.
Fig. 6 is the figure of the schematic configuration of expression exposure device.
Fig. 7 is the figure of the cut-open view (1) of representing the part of worktable in the past.
Fig. 8 is the figure of the cut-open view (2) of representing the part of worktable in the past.
Fig. 9 is that expression will be deformed into the figure of state that the protruding workpiece W of central portion is placed on the worktable of Fig. 7, Fig. 8.
Symbol description
1: illumination part
1a: lamp
1b: mirror
2: mask platform
3: projecting lens
4: worktable
4a: vacuum suction groove
4b: vacuum suction hole
4c: through hole
5: pin is driving mechanism up and down
5a: pin
5b: support
5c: axle
6: cover
6a: opening
7: axle collar parts
8: spring
9a, 9b: members of frame
10: exposure device
20: the workpiece conveying mechanism
21: arm
M: mask
W: workpiece
Embodiment
Fig. 1, Fig. 2 are the cut-open view of the worktable part of the embodiment of the invention, and after Fig. 1 (a)～Fig. 2 (c) expression utilized the workpiece conveying mechanism that workpiece is delivered to worktable, absorption remained in the operation till the worktable.
In figure, to giving identical symbol, be formed with vacuum suction groove 4a on the surface of worktable 4, and be provided with a plurality of vacuum suction hole 4b that is communicated with this vacuum suction groove 4a with above-mentioned Fig. 7, the identical structure of structure shown in Figure 8.And, being formed with the through hole 4c that is used for pin 5a discrepancy, this pin 5a is used for accepting workpiece W from the arm 21 of workpiece conveying mechanism 20, or workpiece W is delivered to arm 21.
Rear side at worktable 4 is provided with pin driving mechanism 5 up and down, and pin 5a is a plurality of, is provided with at least more than 3.The platform 5b that driving mechanism 5 has cylinder 5d and on the axle 5c of cylinder 5d, installs about the pin.
A plurality of pin 5a all are installed on this 5b.Through axle the moving up and down of 5c of cylinder, platform 5b moves up and down, and a plurality of pin 5a also synchronously move up and down.
Each opening at the downside of the through hole 4c of worktable 4 is provided with a plurality of covers 6.Cover 6 has the opening 6a of pin 5a through usefulness.
The opening 6a of cover 6 is bigger than the diameter of pin 5a, between pin 5a and cover 6, has the gap.But the diameter of this opening 6a is littler than the diameter of through hole 4c.As the material of cover 6, be preferably soft resin, for example rubber.
On the other hand, around each pin 5a, columniform axle collar parts 7 are installed.Axle collar parts 7 for example are fluororesin.Axle collar parts 7 have the through hole with the thickness same diameter of pin 5a, will sell 5a and insert in this through hole.Between pin 5a and axle collar parts 7, be coated with sticker.Sticker is fixed in pin 5a with axle collar parts 7, and the gap between filling pin 5a and the axle collar parts 7.
Fig. 3 is the schematic configuration that possesses the exposure device of above-mentioned worktable.To giving identical symbol with the above-mentioned identical structure of structure shown in Figure 6.
As shown in Figure 3, exposure device 10 possesses illumination part 1, and illumination part 1 possesses lamp 1a and reflects from the mirror 1b of the light of lamp 1a etc., penetrates to contain ultraviolet light.In addition, exposure device 10 possesses: form figuratum mask M; The mask platform 2 that keeps this mask M; Keeping being coated with the worktable 4 of workpiece W of wafer or the printed base plate etc. of resist; And on the workpiece W that remains on the worktable 4 projecting lens 3 etc. of the pattern image of projection print plate M.
Be provided with vacuum suction groove 4a on the surface of worktable 4, and be provided with the vacuum suction hole 4b that is communicated with this vacuum suction groove 4a.In addition, like Fig. 1, the through hole 4c that is provided with shown in Figure 2, pin 5a is driven and in through hole 4c, is moved up and down by driving mechanism 5 up and down.At pin 5a axle collar parts 7 are installed, in addition, cover 6 presses on the open lower side of above-mentioned through hole 4c.
In addition, as stated, worktable 4 is connected with pipe arrangement 11; When keeping workpiece W; Give vacuum via this pipe arrangement 11 pairs of vacuum suction holes 4b or vacuum suction groove 4a, and when worktable 4 unloads workpiece, via this pipe arrangement 11 pairs of vacuum suction holes 4b or vacuum suction groove 4a air supply.
The action of exposure device is identical with action shown in Figure 6, on worktable 4, through conveying mechanism (not shown), places the workpiece W that is being coated with resist on surface (upper surface).
Workpiece W for example is above-mentioned 2 different structures that substrate forms of stickup expansivity, or on substrate, forms coefficient of thermal expansion structure of different layers etc., because the thermal expansivity of material difference produces the workpiece of warpage or distortion up and down.
For example, under the situation of the structure that forms gallium nitride layer on the sapphire substrate, workpiece W can be towards sapphire substrate side warpage, and central portion is expanded to convex as the back-off bowl.Like this, the face of workpiece W is different with the coefficient of thermal expansion of another face, is that downside is placed on the worktable 4 with the little face of coefficient of thermal expansion (sapphire substrate side).
Under this state, shine exposure light via mask M, projecting lens 3 to workpiece W from illumination part 1, carry out exposure-processed.Giving in the exposure-processed of workpiece W of vacuum to worktable 4 continuing, and moves to avoid workpiece W.
If exposure-processed finishes, then as stated, the absorption that stops the giving of vacuum of vacuum suction hole 4b (vacuum suction groove 4a) removed workpiece W keeps, and to vacuum suction hole 4b air supply.Thus, workpiece W is unloaded from worktable 4,, be transported to outside the exposure device 10 through not shown conveying mechanism.
Use Fig. 1, Fig. 2 explanation to accept the action till workpiece keeps to vacuum suction from the conveying mechanism of workpiece in the present invention.
Shown in Fig. 1 (a), workpiece W remains on the arm 21 of workpiece conveying mechanism 20, is delivered on the worktable 4.
As scheme shown in the l (b), pin 5a is through pin driving mechanism 5 risings up and down, and pin 5a accepts workpiece W from arm 21.In addition, the spring 8 that cover 6 is pressed on the lower surface of worktable 4 also shrinks.Axle collar parts 7 also rise with pin 5a, and axle collar parts 7 separate with cover 6.
Fig. 4 is the figure that amplifies expression cover 6, pin 5a, axle collar parts 7.Fig. 4 (a) expression pin 5a rises the synoptic diagram of the state that axle collar parts 7 separate with cover 6.
Shown in Fig. 1 (c), the arm 21 of workpiece conveying mechanism 20 is kept out of the way to drawing is right-hand, pin 5a through pin up and down driving mechanism 5 descend.Workpiece W is placed on worktable 4.Axle collar parts 7 also descend with pin 5a, and the lower surface of axle collar parts 7 connects airtight in the upper surface by the cover 6 that is provided with through hole 4c lower surface partly that is pressed in worktable 4.The synoptic diagram of the state that Fig. 4 (b) expression axle collar parts 7 and cover 6 connect airtight.
Through connecting airtight of axle collar parts 7 and cover 6, the through hole of worktable 4 is closed.In addition, cover 6 is pressed in worktable 4 through spring 8, so worktable 4 also connects airtight with cover 6, and gap between the two also almost completely is closed.
Under this state; If give vacuum, then can not flow into air, shown in Fig. 2 (c) from through hole 4c to vacuum suction hole 4b; Even workpiece W is out of shape as the bowl back-off, also reduced pressure through the vacuum of giving to vacuum suction hole 4b reliably in the space between workpiece W and worktable.Thus, workpiece W is pushed by atmospheric pressure, thereby distortion obtains correcting, and presses on worktable 4 and be adsorbed maintenance.That is, the warpage of workpiece W obtains correcting by the strong hand, and as above-mentioned shown in Figure 3, workpiece W becomes smooth, and the whole face of workpiece W connects airtight in worktable 4.Therefore, under this state, can carry out exposure-processed to workpiece W.
Constitute in the present embodiment: will sell pin that 5a drives along the vertical direction up and down on the platform 5b of driving mechanism 5, via spring 8 mounting cover parts 6, when pin 5a had risen, cover 6 pressed on the lower surface of worktable 4 through spring 8.
Therefore, even the position of pin 5a (selling the position of driving mechanism 5 up and down) what squint on about drawing, cover 6 also correspondingly moves, and the relative position of axle collar parts 7 and cover 6 can not change.Therefore; Even make the diameter of the opening 6a of cover 6 form for a short time for the inflow that prevents atmosphere; And make between axle collar parts 7 and cover 6 to be difficult for producing the gap, also can not cause because of pin 5a and cover 6 frictions and pin 5 mobile caused obstruction or produce the problem of fragment because of friction.
Fig. 5 is the figure of structure example that is illustrated in the situation of members of frame 9a that arranged outside restraining spring 8 left and right directions of spring 8 move, 9b.Through such formation, can further keep selling the position relationship of 5a and cover 6.
In addition; Can constitute can precision carry out well pin up and down assembling, the pin of driving mechanism 5 and worktable 4 driving mechanism 5 is constant with the relative position of worktable 4 up and down; And can make the core of pin 5a in the through hole 4c of worktable 4 under the situation that precision on the above-below direction well moves, also can cover 6 be installed in the lower surface of worktable 4 through sticker etc.
Claims (2)
1. table device is characterized in that possessing:
Worktable is formed with the vacuum suction hole that is endowed vacuum, and on above-below direction, is formed with through hole on the surface;
Pin moves up and down in above-mentioned through hole; And
The pin reciprocating mechanism;
Open lower side at the through hole of worktable is provided with the cover that is formed with like under shed, and the diameter of the pin that this aperture efficiency moves up and down in through hole is big, and littler than the diameter of through hole;
Be equipped with on like upper/lower positions and connect airtight in above-mentioned pin, littler and than the big axle collar parts of diameter of the opening of above-mentioned cover, above-mentioned position is: when above-mentioned pin descended, the lower surface of axle collar parts connected airtight the upper surface in cover than the diameter of above-mentioned through hole.
2. exposure device is characterized in that possessing:
The light injection part penetrates light;
Mask platform keeps forming figuratum mask; And
Worktable keeps workpiece, and the pattern transfer that is formed on the aforementioned mask arrives this workpiece;
Above-mentioned worktable is the described worktable of claim 1.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP010739/2011 | 2011-01-21 | ||
| JP2011010739A JP2012151407A (en) | 2011-01-21 | 2011-01-21 | Work stage and exposure device using work stage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102608873A true CN102608873A (en) | 2012-07-25 |
Family
ID=46526343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100182655A Pending CN102608873A (en) | 2011-01-21 | 2012-01-20 | Workbench and exposure apparatus using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2012151407A (en) |
| KR (1) | KR20120085180A (en) |
| CN (1) | CN102608873A (en) |
| TW (1) | TW201250392A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018129933A1 (en) * | 2017-01-11 | 2018-07-19 | 惠科股份有限公司 | Exposure machine, and method and system for preventing same from causing image offset |
| CN109333016A (en) * | 2018-11-19 | 2019-02-15 | Oppo（重庆）智能科技有限公司 | Processing method, housing unit and the electronic equipment of housing unit |
| CN111075836A (en) * | 2018-10-18 | 2020-04-28 | 株式会社关原制作所 | Slider, table device, industrial machine, and method for suppressing warpage of slider |
| CN111913363A (en) * | 2019-05-09 | 2020-11-10 | 株式会社阿迪泰克工程 | Direct writing type exposure device |
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| JP6189646B2 (en) * | 2013-05-30 | 2017-08-30 | 東レエンジニアリング株式会社 | Transport device |
| JP6543061B2 (en) * | 2015-03-20 | 2019-07-10 | 株式会社オーク製作所 | Exposure apparatus using substrate correction jig, and substrate correction jig |
| KR101958694B1 (en) * | 2016-03-03 | 2019-03-19 | 에이피시스템 주식회사 | Substrate supporting module for ELA apparatus |
| JP7016825B2 (en) * | 2018-05-30 | 2022-02-07 | キヤノン株式会社 | Method of manufacturing substrate holding device, exposure device and article |
| JP7007744B2 (en) * | 2019-11-20 | 2022-01-25 | 株式会社ニューギン | Distribution control mechanism |
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| CN111075836A (en) * | 2018-10-18 | 2020-04-28 | 株式会社关原制作所 | Slider, table device, industrial machine, and method for suppressing warpage of slider |
| CN111075836B (en) * | 2018-10-18 | 2022-09-27 | 株式会社关原制作所 | Slider, table device, industrial machine, and method for suppressing warpage of slider |
| CN109333016A (en) * | 2018-11-19 | 2019-02-15 | Oppo（重庆）智能科技有限公司 | Processing method, housing unit and the electronic equipment of housing unit |
| CN111913363A (en) * | 2019-05-09 | 2020-11-10 | 株式会社阿迪泰克工程 | Direct writing type exposure device |
| CN111913363B (en) * | 2019-05-09 | 2024-05-17 | 株式会社阿迪泰克工程 | Direct-writing type exposure device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120085180A (en) | 2012-07-31 |
| JP2012151407A (en) | 2012-08-09 |
| TW201250392A (en) | 2012-12-16 |
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