CN102597877A - 感光性树脂组合物、以及使用其的感光性元件、抗蚀剂图形的制造方法、引线框的制造方法、印刷线路板和印刷线路板的制造方法 - Google Patents

感光性树脂组合物、以及使用其的感光性元件、抗蚀剂图形的制造方法、引线框的制造方法、印刷线路板和印刷线路板的制造方法 Download PDF

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Publication number
CN102597877A
CN102597877A CN2011800043618A CN201180004361A CN102597877A CN 102597877 A CN102597877 A CN 102597877A CN 2011800043618 A CN2011800043618 A CN 2011800043618A CN 201180004361 A CN201180004361 A CN 201180004361A CN 102597877 A CN102597877 A CN 102597877A
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China
Prior art keywords
methyl
resist
quality
photo
sensitive resin
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Pending
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CN2011800043618A
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English (en)
Chinese (zh)
Inventor
岩下健一
栉田昌孝
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Showa Denko Materials Co ltd
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Hitachi Chemical Co Ltd
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Publication date
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Publication of CN102597877A publication Critical patent/CN102597877A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN2011800043618A 2010-07-30 2011-06-10 感光性树脂组合物、以及使用其的感光性元件、抗蚀剂图形的制造方法、引线框的制造方法、印刷线路板和印刷线路板的制造方法 Pending CN102597877A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010173083 2010-07-30
JP2010-173083 2010-07-30
PCT/JP2011/063389 WO2012014580A1 (ja) 2010-07-30 2011-06-10 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターン製造方法、リードフレームの製造方法、プリント配線板、及びプリント配線板の製造方法

Related Child Applications (1)

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CN201210352844.3A Division CN102854750B (zh) 2010-07-30 2011-06-10 感光性树脂组合物、感光性元件、抗蚀剂图形制法、引线框制法及线路板制法

Publications (1)

Publication Number Publication Date
CN102597877A true CN102597877A (zh) 2012-07-18

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CN2011800043618A Pending CN102597877A (zh) 2010-07-30 2011-06-10 感光性树脂组合物、以及使用其的感光性元件、抗蚀剂图形的制造方法、引线框的制造方法、印刷线路板和印刷线路板的制造方法
CN201210352844.3A Active CN102854750B (zh) 2010-07-30 2011-06-10 感光性树脂组合物、感光性元件、抗蚀剂图形制法、引线框制法及线路板制法

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Country Status (5)

Country Link
JP (1) JP4849197B1 (ja)
KR (1) KR20130095631A (ja)
CN (2) CN102597877A (ja)
TW (1) TWI507820B (ja)
WO (1) WO2012014580A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104303106B (zh) * 2012-05-31 2018-08-07 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及配线板的制造方法
JP2013249452A (ja) * 2012-06-04 2013-12-12 Hitachi Chemical Co Ltd 液状硬化性樹脂組成物、画像表示用装置、及び画像表示用装置の製造方法
EP4151410A1 (en) * 2021-09-17 2023-03-22 Arkema France Photosensitive composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002059433A (ja) * 2000-08-22 2002-02-26 Showa Highpolymer Co Ltd 化粧板の成形方法
JP2005084537A (ja) * 2003-09-10 2005-03-31 Asahi Kasei Electronics Co Ltd サンドブラスト用感光性樹脂組成物およびその用途
CN1934497A (zh) * 2004-03-24 2007-03-21 捷时雅株式会社 负型感放射线性树脂组合物
CN101558356A (zh) * 2006-12-19 2009-10-14 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷电路板的制造方法
CN101568883A (zh) * 2006-12-27 2009-10-28 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007032215A1 (ja) * 2005-09-12 2007-03-22 Fujifilm Corporation 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
JP4711862B2 (ja) * 2006-03-08 2011-06-29 富士フイルム株式会社 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
JP5093226B2 (ja) * 2007-03-20 2012-12-12 Ｊｓｒ株式会社 感放射線性樹脂組成物
KR20080092839A (ko) * 2007-04-12 2008-10-16 칫소가부시키가이샤 잉크젯용 잉크
JP4879157B2 (ja) * 2007-12-27 2012-02-22 富士フイルム株式会社 ホログラフィック記録用化合物、ホログラフィック記録用組成物、およびホログラフィック記録媒体
WO2010002129A2 (ko) * 2008-07-01 2010-01-07 주식회사 엘지화학 복수의 광개시제를 포함한 감광성 수지 조성물, 이를 이용한 투명 박막층 및 액정 표시 장치
JP5223923B2 (ja) * 2008-07-31 2013-06-26 日立化成株式会社 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002059433A (ja) * 2000-08-22 2002-02-26 Showa Highpolymer Co Ltd 化粧板の成形方法
JP2005084537A (ja) * 2003-09-10 2005-03-31 Asahi Kasei Electronics Co Ltd サンドブラスト用感光性樹脂組成物およびその用途
CN1934497A (zh) * 2004-03-24 2007-03-21 捷时雅株式会社 负型感放射线性树脂组合物
CN101558356A (zh) * 2006-12-19 2009-10-14 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷电路板的制造方法
CN101568883A (zh) * 2006-12-27 2009-10-28 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法

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Publication number Publication date
JPWO2012014580A1 (ja) 2013-09-12
CN102854750A (zh) 2013-01-02
CN102854750B (zh) 2014-08-27
TW201216002A (en) 2012-04-16
KR20130095631A (ko) 2013-08-28
TWI507820B (zh) 2015-11-11
WO2012014580A1 (ja) 2012-02-02
JP4849197B1 (ja) 2012-01-11

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Application publication date: 20120718