CN102576658A - 真空处理装置、图表显示方法 - Google Patents

真空处理装置、图表显示方法 Download PDF

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Publication number
CN102576658A
CN102576658A CN201080047322.1A CN201080047322A CN102576658A CN 102576658 A CN102576658 A CN 102576658A CN 201080047322 A CN201080047322 A CN 201080047322A CN 102576658 A CN102576658 A CN 102576658A
Authority
CN
China
Prior art keywords
constantly
axle
measured value
line
diagram
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201080047322.1A
Other languages
English (en)
Chinese (zh)
Inventor
山根克己
猿渡治郎
平木勉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009243901A external-priority patent/JP5033858B2/ja
Priority claimed from JP2009243903A external-priority patent/JP5133323B2/ja
Priority claimed from JP2009243902A external-priority patent/JP5133322B2/ja
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of CN102576658A publication Critical patent/CN102576658A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Measurement Of Unknown Time Intervals (AREA)
CN201080047322.1A 2009-10-22 2010-10-08 真空处理装置、图表显示方法 Pending CN102576658A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2009243901A JP5033858B2 (ja) 2009-10-22 2009-10-22 真空処理装置、グラフ線表示方法
JP2009243903A JP5133323B2 (ja) 2009-10-22 2009-10-22 真空処理装置、グラフ線表示方法
JP2009243902A JP5133322B2 (ja) 2009-10-22 2009-10-22 真空処理装置、グラフ線表示方法
JP2009-243901 2009-10-22
JP2009-243903 2009-10-22
JP2009-243902 2009-10-22
PCT/JP2010/067719 WO2011048961A1 (ja) 2009-10-22 2010-10-08 真空処理装置、グラフ表示方法

Publications (1)

Publication Number Publication Date
CN102576658A true CN102576658A (zh) 2012-07-11

Family

ID=43900190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080047322.1A Pending CN102576658A (zh) 2009-10-22 2010-10-08 真空处理装置、图表显示方法

Country Status (4)

Country Link
KR (1) KR20130028038A (ja)
CN (1) CN102576658A (ja)
TW (1) TWI448857B (ja)
WO (1) WO2011048961A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1700215A (zh) * 2004-05-18 2005-11-23 通用电气公司 用来获得数据的系统、方法以及产品
JP2006237052A (ja) * 2005-02-22 2006-09-07 Nikon System:Kk 情報表示方法、情報表示プログラム、情報表示装置及びデバイス製造システム、並びに基板処理装置
CN101082940A (zh) * 2006-05-31 2007-12-05 株式会社日立制作所 作业动作分析方法、分析装置以及分析程序
CN101303752A (zh) * 2007-05-11 2008-11-12 夏普株式会社 图表描绘装置和方法、成品率分析方法和提高支援系统
WO2008146736A1 (ja) * 2007-05-29 2008-12-04 Tokyo Electron Limited データ表示装置、データ表示方法、プログラム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4980675B2 (ja) * 2006-08-25 2012-07-18 株式会社日立ハイテクノロジーズ 稼働状況を提示することができる装置
JP4934485B2 (ja) * 2007-04-17 2012-05-16 日置電機株式会社 記録波形の表示方法およびその装置
JP2009146932A (ja) * 2007-12-11 2009-07-02 Ulvac Japan Ltd 基板搬送装置、基板搬送方法及び真空処理装置
KR101486553B1 (ko) * 2008-03-20 2015-01-26 주식회사 원익아이피에스 진공처리장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1700215A (zh) * 2004-05-18 2005-11-23 通用电气公司 用来获得数据的系统、方法以及产品
JP2006237052A (ja) * 2005-02-22 2006-09-07 Nikon System:Kk 情報表示方法、情報表示プログラム、情報表示装置及びデバイス製造システム、並びに基板処理装置
CN101082940A (zh) * 2006-05-31 2007-12-05 株式会社日立制作所 作业动作分析方法、分析装置以及分析程序
CN101303752A (zh) * 2007-05-11 2008-11-12 夏普株式会社 图表描绘装置和方法、成品率分析方法和提高支援系统
WO2008146736A1 (ja) * 2007-05-29 2008-12-04 Tokyo Electron Limited データ表示装置、データ表示方法、プログラム

Also Published As

Publication number Publication date
TWI448857B (zh) 2014-08-11
WO2011048961A1 (ja) 2011-04-28
KR20130028038A (ko) 2013-03-18
TW201133167A (en) 2011-10-01

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PB01 Publication
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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120711