CN102534589A - Copper block surface brown oxidation method - Google Patents
Copper block surface brown oxidation method Download PDFInfo
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- CN102534589A CN102534589A CN2011104449764A CN201110444976A CN102534589A CN 102534589 A CN102534589 A CN 102534589A CN 2011104449764 A CN2011104449764 A CN 2011104449764A CN 201110444976 A CN201110444976 A CN 201110444976A CN 102534589 A CN102534589 A CN 102534589A
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- brown
- oxidation
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- copper billet
- cover plate
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Abstract
The invention relates to a copper block surface brown oxidation method which comprises the following steps: step one, providing a brown oxidation tool clamp which comprises a chassis and a cover plate covering the chassis, wherein a plurality of accepting grooves arranged with intervals are disposed on the chassis, and a plurality of uniformly-distributed through holes are disposed respectively on the chassis and the cover plate and correspond to the accepting grooves; step two, opening the cover plate, putting copper blocks to be treated by brown oxidation in the accepting grooves of the chassis of the brown oxidation tool clamp; step three, covering the cover plate of the brown oxidation tool clamp on the chassis so as to cover the copper blocks to be treated by brown oxidation in the accepting grooves; step four, putting brown oxidation tool clamp with the copper blocks to be treated by brown oxidation on a brown oxidation production line, performing brown oxidation treatment of the copper block surfaces; step five, after the brown oxidation treatment is completed, opening the cover plate, taking out the copper blocks treated by brown oxidation. The copper block surface brown oxidation method of the invention is convenient for operation, and can realize surface brown oxidation treatment of small-size copper blocks.
Description
Technical field
The present invention relates to printed circuit board (pcb) and make the field, relate in particular to the brown method for oxidation in a kind of copper billet surface.
Background technology
Bury the copper billet pcb board and be meant the pcb board of in local location, individual layers, imbedding copper billet, be embedded in the copper billet surface and need carry out the processing of brown oxidation or black oxidation usually, to improve the bonding strength of copper billet and prepreg.Mostly brown oxidation production line in the existing PCB manufacturing processed is sea line roller rumble transmission design, for the less copper billet of size (size is smaller or equal to 70mm * 80mm), if directly carry out brown oxidation, very easily clamp, fall cylinder, even can not carry out brown oxidation.Therefore, the existing small size copper billet surface of imbedding adopts black oxidation to handle usually, but there is following shortcoming in copper billet surface black oxide treatment: 1, adopt the black oxidation Hanging Basket vertically to soak, oxidation treatment time is longer, and production efficiency is low, and production cost is high; 2, the copper billet handled of black oxidation combines safety lower with prepreg, is prone to the isolating defective of copper billet and prepreg during pb-free solder, reduce built-in or in bury the copper billet pcb board work reliability and electric property.
Summary of the invention
Therefore, the object of the present invention is to provide the brown method for oxidation in a kind of copper billet surface, can realize the surperficial brown oxidation that the copper billet to reduced size carries out.
For realizing above-mentioned purpose, the present invention provides a kind of copper billet surface brown method for oxidation, comprises the steps:
Step 1: brown oxidation frock clamp is provided; This brown oxidation frock clamp comprises the chassis and is covered on the cover plate on this chassis; This chassis is provided with several accepting grooves that is set in distance; Corresponding accepting groove offers several through holes that are evenly distributed respectively on said chassis and the cover plate, and the size of said through hole is less than the size of the copper billet of treating brown oxide treatment;
Step 2: open cover plate, the copper billet of treating brown oxide treatment is put into the accepting groove on the chassis of brown oxidation frock clamp;
Step 3: the cover plate of brown oxidation frock clamp covered on the chassis be covered in the accepting groove with the copper billet that will treat brown oxide treatment;
Step 4: the brown oxidation frock clamp that will put into the copper billet of treating brown oxide treatment is put in brown oxidation production line, and brown oxide treatment is carried out on the copper billet surface;
The chassis of said brown oxidation frock clamp comprises base plate and is around in said base plate framework on every side; And surround a receiving space by said base plate and framework; Be provided with crisscross several crossbeams in this receiving space said receiving space is separated into said several accepting grooves, be provided with reinforced bulkhead around the said cover plate.
The chassis of said brown oxidation frock clamp adopts hinge to be connected with cover plate.
The material of said chassis and cover plate is Stainless Steel Alloy or titanium alloy.
Spacing between the said through hole is 0.5-1mm.
Said chassis and cover plate are processed by the light central layer; The accepting groove on the said chassis recessed blind groove in light central layer surface of serving as reasons; Through hole on the said chassis comprises and is positioned at large-size through hole of accepting groove intermediary and is distributed in several reduced size through holes around the said large-size through hole that the size of said large-size through hole is less than the size of the copper billet of treating surperficial brown oxidation in the accepting groove.
Said accepting groove and large-size through hole are all rectangular; Said reduced size through hole is rounded; The set through hole of corresponding accepting groove is the long strip shape through hole on the said cover plate; The width of said through hole is less than the size of accepting groove at this width, and less than the size of the copper billet of treating surperficial brown oxidation in the accepting groove at this width.
The chassis of said brown oxidation frock clamp adopts pin to be connected with cover plate.
Said chassis and cover plate are square, and the through hole on said chassis and the cover plate is square or rhombus.
Said accepting groove is square, and the size of accepting groove is smaller or equal to 70mm * 80mm.
Beneficial effect of the present invention: the brown method for oxidation in copper billet of the present invention surface; Through adopting brown oxidation frock clamp to hold copper billet; Several accepting grooves that are set in distance are set on the chassis of brown oxidation frock clamp hold and carry copper billet, and cover plate is set comes the cover cap copper billet, (size is less than the surperficial brown oxide treatment of copper billet of 70mm * 80mm) can to realize small size; This brown method for oxidation in copper billet surface, easy to operate; Through on cover plate and chassis, through hole being set; Help brown oxidation liquid medicine and fully contact the copper billet surface; Improve the oxidation effectiveness on copper billet surface, thereby improve the bonding strength of copper billet and prepreg, prevent that effectively copper billet from separating with prepreg; Guarantee built-in or in bury copper billet pcb board safety and reach pb-free solder (260 ℃ of top temperatures) requirement, improve built-in or in bury the copper billet pcb board work reliability and electric property.
For further setting forth technique means and the effect that the present invention takes for the predetermined purpose of realization; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effects obvious.
In the accompanying drawing,
Fig. 1 is the schematic flow sheet of the brown method for oxidation in copper billet of the present invention surface;
Fig. 2 is the structural representation of a frock clamp of the brown method for oxidation employing in copper billet of the present invention surface;
Fig. 3 assembles synoptic diagram for the plane of another frock clamp that the brown method for oxidation in copper billet of the present invention surface adopts;
Fig. 4 is the decomposing schematic representation of frock clamp shown in Figure 3;
Fig. 5 is the sectional view of Fig. 4 along the A-A line.
Embodiment
As shown in Figure 1, the brown method for oxidation in copper billet of the present invention surface comprises the steps:
Step 1: brown oxidation frock clamp is provided; This brown oxidation frock clamp comprises the chassis and is covered on the cover plate on this chassis; This chassis is provided with several accepting grooves that is set in distance; Corresponding accepting groove offers several through holes that are evenly distributed respectively on said chassis and the cover plate, and the size of said through hole is less than the size of the copper billet of treating brown oxide treatment;
Step 2: open cover plate, the copper billet of treating brown oxide treatment is put into the accepting groove on the chassis of brown oxidation frock clamp;
Step 3: the cover plate of brown oxidation frock clamp covered on the chassis be covered in the accepting groove with the copper billet that will treat brown oxide treatment;
Step 4: the brown oxidation frock clamp that will put into the copper billet of treating brown oxide treatment is put in brown oxidation production line, and brown oxide treatment is carried out on the copper billet surface;
As shown in Figure 2, be the structural representation of the employed frock clamp of the copper billet brown method for oxidation in surface of the present invention.This frock clamp comprises chassis 10 and cover plate 20, and this chassis 10 adopts hinge 30 to be connected with cover plate 20, and this chassis 10 is provided with several accepting grooves 15 that are set in distance.Chassis 10 comprises base plate 11 and is around in said base plate 11 framework 12 on every side; And surround a receiving space 13 by said base plate 11 and framework 12, be provided with crisscross several crossbeams 14 in this receiving space 13 said receiving space 13 is separated into said several accepting grooves 15.Corresponding accepting groove 15 offers several through holes 12,21 that are evenly distributed respectively on said chassis 10 and the cover plate 20, and the size of said through hole 12,21 is less than the size of the copper billet of treating brown oxide treatment.Be provided with reinforced bulkhead 22 around the said cover plate 20, to strengthen the rigidity of cover plate 20.
Said chassis 10 is Stainless Steel Alloy or titanium alloy with the material of cover plate 20.
Said through hole 12, the spacing between 21 are 0.5-1mm.
Said chassis 10 and cover plate 20 are square, and the through hole 12,21 on said chassis 10 and the cover plate 20 is square or rhombus.
Said accepting groove 15 is square, and the size of accepting groove 15 is smaller or equal to 70mm * 80mm.
To shown in Figure 5, be the structural representation of employed another frock clamp of the copper billet brown method for oxidation in surface of the present invention like Fig. 3.This frock clamp comprises chassis 10a and cover plate 20a, and said chassis 10a adopts pin 30a to be connected with cover plate 20a, and this chassis 10a is provided with several accepting grooves 15a that is set in distance.Said chassis 10a goes up corresponding accepting groove 15a with cover plate 20a and offers several through holes 12a, the 21a that is evenly distributed respectively.
Said chassis 10a and cover plate 20a are processed by the light central layer; The accepting groove 15a of the said chassis 10a recessed blind groove in light central layer surface of serving as reasons; Through hole 12a on the said chassis 10a comprises and is positioned at large-size through hole 121 of accepting groove 15a intermediary and is distributed in several reduced size through holes 122 around the said large-size through hole 121 that the size of said large-size through hole 121 is less than the size of treating the copper billet of surperficial brown oxidation among the accepting groove 15a.
Said accepting groove 15a and large-size through hole 121 are all rectangular; Said reduced size through hole 122 is rounded; It is the long strip shape through hole that said cover plate 20a goes up the set through hole 21a of corresponding accepting groove 15a; The width of said through hole 21a is less than the size of accepting groove 15a at this width, and less than treating the size of the copper billet of surperficial brown oxidation at this width among the accepting groove 15a.
Said chassis 10a and cover plate 20a are square, and the through hole 12a on said chassis 10a and the cover plate 20a, 21a are square or rhombus.
Said accepting groove 15a is square, and the size of accepting groove 15a is smaller or equal to 70mm * 80mm.
The brown method for oxidation in copper billet of the present invention surface; Through adopting brown oxidation frock clamp to hold copper billet; Several accepting grooves that are set in distance are set on the chassis of brown oxidation frock clamp hold and carry copper billet, and cover plate is set comes the cover cap copper billet, (size is less than the surperficial brown oxide treatment of copper billet of 70mm * 80mm) can to realize small size; This brown method for oxidation in copper billet surface, easy to operate; Through on cover plate and chassis, through hole being set; Help brown oxidation liquid medicine and fully contact the copper billet surface; Improve the oxidation effectiveness on copper billet surface, thereby improve the bonding strength of copper billet and prepreg, prevent that effectively copper billet from separating with prepreg; Guarantee built-in or in bury copper billet pcb board safety and reach pb-free solder (260 ℃ of top temperatures) requirement, improve built-in or in bury the copper billet pcb board work reliability and electric property.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of accompanying Claim of the present invention.
Claims (10)
1. the brown method for oxidation in copper billet surface is characterized in that, comprises the steps:
Step 1: brown oxidation frock clamp is provided; This brown oxidation frock clamp comprises the chassis and is covered on the cover plate on this chassis; This chassis is provided with several accepting grooves that is set in distance; Corresponding accepting groove offers several through holes that are evenly distributed respectively on said chassis and the cover plate, and the size of said through hole is less than the size of the copper billet of treating brown oxide treatment;
Step 2: open cover plate, the copper billet of treating brown oxide treatment is put into the accepting groove on the chassis of brown oxidation frock clamp;
Step 3: the cover plate of brown oxidation frock clamp covered on the chassis be covered in the accepting groove with the copper billet that will treat brown oxide treatment;
Step 4: the brown oxidation frock clamp that will put into the copper billet of treating brown oxide treatment is put in brown oxidation production line, and brown oxide treatment is carried out on the copper billet surface;
Step 5; After accomplishing brown oxide treatment, open cover plate, the copper billet from the chassis of brown oxidation frock clamp after the brown oxide treatment of taking-up.
2. the brown method for oxidation in copper billet as claimed in claim 1 surface; It is characterized in that; The chassis of said brown oxidation frock clamp comprises base plate and is around in said base plate framework on every side; And surround a receiving space by said base plate and framework, and be provided with crisscross several crossbeams in this receiving space said receiving space is separated into said several accepting grooves, be provided with reinforced bulkhead around the said cover plate.
3. the brown method for oxidation in copper billet as claimed in claim 2 surface is characterized in that, the chassis of said brown oxidation frock clamp adopts hinge to be connected with cover plate.
4. the brown method for oxidation in copper billet as claimed in claim 2 surface is characterized in that the material of said chassis and cover plate is Stainless Steel Alloy or titanium alloy.
5. the brown method for oxidation in copper billet as claimed in claim 1 surface is characterized in that the spacing between the said through hole is 0.5-1mm.
6. the brown method for oxidation in copper billet as claimed in claim 1 surface; It is characterized in that; Said chassis and cover plate are processed by the light central layer; The accepting groove on the said chassis recessed blind groove in light central layer surface of serving as reasons, the through hole on the said chassis comprise and are positioned at large-size through hole of accepting groove intermediary and are distributed in several reduced size through holes around the said large-size through hole that the size of said large-size through hole is less than the size of the copper billet of treating surperficial brown oxidation in the accepting groove.
7. the brown method for oxidation in copper billet as claimed in claim 6 surface is characterized in that said accepting groove and large-size through hole are all rectangular, and said reduced size through hole is rounded.The set through hole of corresponding accepting groove is the long strip shape through hole on the said cover plate, and the width of said through hole is less than the size of accepting groove at this width, and less than the size of the copper billet of treating surperficial brown oxidation in the accepting groove at this width.
8. the brown method for oxidation in copper billet as claimed in claim 6 surface is characterized in that, the chassis of said brown oxidation frock clamp adopts pin to be connected with cover plate.
9. the brown method for oxidation in copper billet as claimed in claim 1 surface is characterized in that said chassis and cover plate are square, and the through hole on said chassis and the cover plate is square or rhombus.
10. the brown method for oxidation in copper billet as claimed in claim 9 surface is characterized in that said accepting groove is square, and the size of accepting groove is smaller or equal to 70mm * 80mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110444976 CN102534589B (en) | 2011-12-26 | 2011-12-26 | Copper block surface brown oxidation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110444976 CN102534589B (en) | 2011-12-26 | 2011-12-26 | Copper block surface brown oxidation method |
Publications (2)
| Publication Number | Publication Date |
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| CN102534589A true CN102534589A (en) | 2012-07-04 |
| CN102534589B CN102534589B (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110444976 Active CN102534589B (en) | 2011-12-26 | 2011-12-26 | Copper block surface brown oxidation method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636363A (en) * | 2016-03-21 | 2016-06-01 | 奥士康科技股份有限公司 | Rapid forming method for brown oxidization film for PCB with multi-layer inner cores |
| CN106211630A (en) * | 2016-08-31 | 2016-12-07 | 开平依利安达电子第三有限公司 | A kind of circuit board manufacturing jig of brown copper billet |
| KR20220068864A (en) * | 2020-11-19 | 2022-05-26 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Copper block browning fixture and manufacturing method thereof |
| KR20220068863A (en) * | 2020-11-19 | 2022-05-26 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Copper block browning method |
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| DE3244860A1 (en) * | 1982-12-03 | 1984-06-07 | Siemens AG, 1000 Berlin und 8000 München | Apparatus for oxidising copper surfaces, in particular on printed circuit boards, by means of a horizontal continuous process |
| EP0730395A2 (en) * | 1995-03-03 | 1996-09-04 | Rockwell International Corporation | Method of transporting and applying a surface treatment liquid using gas bubbles |
| JPH11202503A (en) * | 1998-01-14 | 1999-07-30 | Hitachi Cable Ltd | Photomask fixing jig |
| CN101325842A (en) * | 2007-06-15 | 2008-12-17 | 富葵精密组件(深圳)有限公司 | Tool for flexible circuit board |
| CN201440756U (en) * | 2009-07-21 | 2010-04-21 | 东莞康源电子有限公司 | Sheet browned tin tool |
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2011
- 2011-12-26 CN CN 201110444976 patent/CN102534589B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| DE3244860A1 (en) * | 1982-12-03 | 1984-06-07 | Siemens AG, 1000 Berlin und 8000 München | Apparatus for oxidising copper surfaces, in particular on printed circuit boards, by means of a horizontal continuous process |
| EP0730395A2 (en) * | 1995-03-03 | 1996-09-04 | Rockwell International Corporation | Method of transporting and applying a surface treatment liquid using gas bubbles |
| JPH11202503A (en) * | 1998-01-14 | 1999-07-30 | Hitachi Cable Ltd | Photomask fixing jig |
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| CN201440756U (en) * | 2009-07-21 | 2010-04-21 | 东莞康源电子有限公司 | Sheet browned tin tool |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636363A (en) * | 2016-03-21 | 2016-06-01 | 奥士康科技股份有限公司 | Rapid forming method for brown oxidization film for PCB with multi-layer inner cores |
| CN105636363B (en) * | 2016-03-21 | 2018-10-09 | 奥士康科技股份有限公司 | Multi-layer PCB core material brown film crashing |
| CN106211630A (en) * | 2016-08-31 | 2016-12-07 | 开平依利安达电子第三有限公司 | A kind of circuit board manufacturing jig of brown copper billet |
| KR20220068864A (en) * | 2020-11-19 | 2022-05-26 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Copper block browning fixture and manufacturing method thereof |
| KR20220068863A (en) * | 2020-11-19 | 2022-05-26 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Copper block browning method |
| KR102605363B1 (en) * | 2020-11-19 | 2023-11-23 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Copper block browning fixture and manufacturing method thereof |
| KR102616800B1 (en) * | 2020-11-19 | 2023-12-21 | 트리포드 (우시) 일렉트로닉 씨오., 엘티디. | Copper block browning method |
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| CN102534589B (en) | 2013-09-25 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |