CN105636363A - Rapid forming method for brown oxidization film for PCB with multi-layer inner cores - Google Patents
Rapid forming method for brown oxidization film for PCB with multi-layer inner cores Download PDFInfo
- Publication number
- CN105636363A CN105636363A CN201610158416.5A CN201610158416A CN105636363A CN 105636363 A CN105636363 A CN 105636363A CN 201610158416 A CN201610158416 A CN 201610158416A CN 105636363 A CN105636363 A CN 105636363A
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- China
- Prior art keywords
- brown
- copper coin
- liquid medicine
- transmission device
- brownification
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
The invention provides a rapid forming method for a brown oxidization film for a PCB with multi-layer inner cores. The rapid forming method comprises a pretreatment step, a brownification step and a post-treatment step. The method is simple and ingenious in design, can rapidly form the brown oxidization film on the surface of a copper plate and improves the brownification efficiency; transmission of the copper plate is stable; the damage to a board of the copper plate can be completely avoided; brownification on the surface of the copper plate is uniform and complete; and the qualified rate of brownification of the copper plate reaches 99%. The obtained product is good in quality; the surface of the copper plate is completely soaked into a liquid medicine; circulation of the liquid medicine is not hindered; the resistance in the transmission process is small; various surfaces can evenly and fully react with the liquid medicine for copper metallization; the reaction rate is greatly improved; the micro-etching and brownification capabilities and rates of the brownification liquid medicine are improved; the brownification parameters are stable and controllable; the capacity requirements can be met; and the production cost is reduced.
Description
Technical field
The present invention relates to the method that brown film is formed, particularly relate to multi-layer PCB core material brown film short-term training method.
Background technology
Pcb board, also known as printed circuit board (PCB), printed-wiring board (PWB), is called for short printed board, it is base material taking insulcrete, it is cut into certain size, at least with a conductive pattern on it, and be furnished with hole (such as unit piece bores, fastener hole, plated through-hole etc.), and realize being interconnected between electronic devices and components. It is adopt electronic printing art to make due to this kind of plate, therefore it is called as " printing " circuit card. This kind of circuit card needs through one brown operation in process of production, brown operation is used to improve the roughness of copper face, strengthen the bonding force of prepreg and copper face, also define one layer of barrier film on copper surface when brown copper surface, it can effectively stop prepreg and copper face at high temperature water generation reaction thus produce plate bursting situation after causing.
Whether circuit board surface brown is evenly one of Primary Reference index of brown effect, and brown service line transmits whether steady, whether the contact of circuit card and brown liquid medicine is completely with evenly, transfer rate in brown process all directly affects aforementioned circuit core plate surface brown degree of uniformity, by this, the design of transmission device on multibond operating line is very important.
At present, as shown in Figure 1, it includes anchor 1 to the structure of the transmission device on multibond operating line that PCB industry is conventional, is provided with plural number root cross bar 4 in described anchor 1, and described cross bar 4 is provided with a plurality of roller 5. This structure is in use, copper coin is placed on roller, copper coin is not fixed, and in transmitting procedure, easily rubs, damage plate face, the contact area of copper coin and roller is big, directly affects copper coin and the contact area of brown liquid medicine, and the cycle rate of liquid medicine is had certain obstruction, easily cause liquid medicine circulation uneven, and then cause copper coin brown uneven.
The transfer rate of existing brown line is generally 3.0-3.5m/min, along with constantly increasing of pcb board sublayer number, after the supporting quantity of internal layer Core and pressing, the number ratio of plank, has generally reached 5:1 (namely 5 core materials are pressed into one piece of plank, L12 laminate) at present, even higher, original transfer rate can not meet the brown of each size copper coin, and transfer rate is relatively slow, and efficiency is low, equipment consume is big, cost height.
In addition, existing brown technique brown groove liquid medicine proportioning is: the H2O2 of the concentration 50% of 1269T liquid medicine/3% volume of the H2SO4/5% volume of the concentration 50% of DI water/5% volume of 60% volume. This proportioning is relative with the quick Forming ability of brown film slowly to copper face microetch ability, gentle, limits brown segment length and brown linear velocity to a certain extent, and efficiency is low, brown film quality easily regard sb. as an outsider see rubescent, the quality defects such as membrane thickness unevenness.
Summary of the invention
Technical problem to be solved by this invention is, overcomes the above-mentioned defect that prior art exists, it is provided that a kind of brown is even, efficiency much higher layer PCB core material brown film short-term training method.
The technical solution adopted for the present invention to solve the technical problems is, multi-layer PCB core material brown film short-term training method, comprises the following steps:
(1) pre-treatment: the copper coin of brown is treated in gripping, clears up the rubbish of residual on copper coin inner plating face and dust;
(2) brown: the both sides of the edge through step (1) pretreated copper coin are fixed on transmission device, the upper surface of copper coin and lower surface are all immersed in brown liquid medicine, and the transmission speed of described transmission device and the brown length of copper coin are suitable;
(3) aftertreatment: the copper coin after step (2) brown is taken off from transmission device, receives plate, check the plate face brown quality of copper coin.
Further, in described step (2), the proportioning change of brown liquid medicine is suitable with the transmission speed of transmission device.
Further, in described step (2), the proportioning of brown liquid medicine is the deionized water of 78% volume, and the concentration of 8% volume is the H of 50%2SO4, the 1269T series brown liquid medicine of 8% volume, the concentration of 6% volume is the H of 50%2O2��
Further, in described step (2), the brown length of copper coin is 3.8m, and the transmission speed of transmission device is 3-4m/S (preferred 3.5m/S).
Further, in described step (2), the brown length of copper coin is 5m, and the transmission speed of transmission device is 4.5-5.5m/S (preferred 5m/S).
Further, in described step (2), the both sides of the edge of copper coin are fixed on transmission device by gripping unit.
Further, described gripping unit is clip, and the arrangement mode of gripping unit such as is at the spacing arrangement.
Compared with prior art, the present invention has the following advantages: method is simple, designs ingenious; Brown film can be formed fast on copper coin surface, brown efficiency improves, the transmission of copper coin is steady, the damage in copper coin plate face can be avoided completely, the brown on copper coin surface is evenly complete, the qualification rate of copper coin brown is up to 99%, products obtained therefrom quality is good, the both sides of the edge of copper coin are fixed on transmission device, and the upper surface of copper coin and lower surface are all immersed in brown liquid medicine, and the surface of copper coin is fully immersed in liquid medicine, the circulation of liquid medicine can not be hindered, transmitting procedure resistance is little, the equilibrium of each surface energy and sufficient and liquid medicine reaction copper, and speed of reaction improves greatly; Improve the microetch of brown liquid, the ability of brown and speed, brown parameter stability is controlled, can meet production capacity demand, reduces production cost, the proportioning change of brown liquid medicine is suitable with the transmission speed of transmission device, and the transmission speed of transmission device and the brown length of copper coin are suitable.
Accompanying drawing explanation
Fig. 1 is the structural representation of the transmission device of existing multi-layer PCB core material brown film short-term training;
Fig. 2 is the structural representation of the transmission device of one embodiment of the invention multi-layer PCB core material brown film short-term training.
Embodiment
Below in conjunction with drawings and Examples, the present invention will be further described.
Embodiment 1
The present embodiment comprises the following steps:
(1) pre-treatment: the copper coin of brown is treated in gripping, clears up the rubbish of residual on copper coin inner plating face and dust;
(2) brown: being fixed on the both sides of the edge through step (1) pretreated copper coin on transmission device, the upper surface of copper coin and lower surface are all immersed in brown liquid medicine, the transmission speed of transmission device and the brown length of copper coin are suitable;
The proportioning change of brown liquid medicine is suitable with the transmission speed of transmission device, and the proportioning of brown liquid medicine is the deionized water of 78% volume, and the concentration of 8% volume is the H of 50%2SO4, the 1269T series brown liquid medicine of 8% volume, the concentration of 6% volume is the H of 50%2O2;
The brown length of copper coin is 3.8m, and the transmission speed of transmission device is 3.2m/S;
The both sides of the edge of copper coin are fixed on transmission device by clip 3, and the arrangement mode of clip 3 such as is at the spacing arrangement.
(3) aftertreatment: the copper coin after step (2) brown is taken off from transmission device, receives plate, check the plate face brown quality of copper coin.
With reference to accompanying drawing 2, transmission device comprises anchor 1, and the solid chain 2 in the inner side of anchor 1, chain 2 is connected with a plurality of clip 3, and the arrangement mode of clip 3 such as is at the spacing arrangement, and copper coin fixed by clip 3.
Brown film can be formed fast on copper coin surface, brown efficiency improves, the transmission of copper coin is steady, avoiding the damage in copper coin plate face completely, the brown on copper coin surface is evenly complete, and the qualification rate of copper coin brown is up to 99%, improve the microetch of brown liquid, the ability of brown and speed, brown parameter stability is controlled, can meet production capacity demand, reduces production cost.
Embodiment 2
The difference of the present embodiment and embodiment 1 is only, the brown length of copper coin is 3.8m, and the transmission speed of chain 2 is 2.8m/S; All the other are substantially the same manner as Example 1.
Brown film can be formed fast on copper coin surface, brown efficiency improves, the transmission of copper coin is steady, avoiding the damage in copper coin plate face completely, the brown on copper coin surface is evenly complete, and the qualification rate of copper coin brown is up to 100%, improve the microetch of brown liquid, the ability of brown and speed, brown parameter stability is controlled, can meet production capacity demand, reduces production cost.
Embodiment 3
The difference of the present embodiment and embodiment 1 is only, the brown length of copper coin is 5m, and the transmission speed of chain 2 is 4.8m/S; All the other are substantially the same manner as Example 1.
Brown film can be formed fast on copper coin surface, brown efficiency improves, the transmission of copper coin is steady, avoiding the damage in copper coin plate face completely, the brown on copper coin surface is evenly complete, and the qualification rate of copper coin brown is up to 100%, improve the microetch of brown liquid, the ability of brown and speed, brown parameter stability is controlled, can meet production capacity demand, reduces production cost.
Embodiment 4
The difference of the present embodiment and embodiment 1 is only, the brown length of copper coin is 5m, and the transmission speed of chain 2 is 5.2m/S; All the other are substantially the same manner as Example 1.
Brown film can be formed fast on copper coin surface, brown efficiency improves, the transmission of copper coin is steady, avoiding the damage in copper coin plate face completely, the brown on copper coin surface is evenly complete, and the qualification rate of copper coin brown is up to 100%, improve the microetch of brown liquid, the ability of brown and speed, brown parameter stability is controlled, can meet production capacity demand, reduces production cost.
Claims (9)
1. multi-layer PCB core material brown film short-term training method, it is characterised in that, comprise the following steps:
(1) pre-treatment: the copper coin of brown is treated in gripping, clears up the rubbish of residual on copper coin inner plating face and dust;
(2) brown: the both sides of the edge through step (1) pretreated copper coin are fixed on transmission device, the upper surface of copper coin and lower surface are all immersed in brown liquid medicine, and the transmission speed of described transmission device and the brown length of copper coin are suitable;
(3) aftertreatment: the copper coin after step (2) brown is taken off from transmission device, receives plate, check the plate face brown quality of copper coin.
2. multi-layer PCB core material brown film short-term training method according to claim 1, it is characterised in that, in described step (2), the proportioning change of brown liquid medicine is suitable with the transmission speed of transmission device.
3. multi-layer PCB core material brown film short-term training method according to claim 1 and 2, it is characterised in that, in described step (2), the proportioning of brown liquid medicine is the deionized water of 78% volume, and the concentration of 8% volume is the H of 50%2SO4, the 1269T series brown liquid medicine of 8% volume, the concentration of 6% volume is the H of 50%2O2��
4. multi-layer PCB core material brown film short-term training method according to claim 1, it is characterised in that, in described step (2), the brown length of copper coin is 3.8m, and the transmission speed of transmission device is 3-4m/S.
5. multi-layer PCB core material brown film short-term training method according to claim 4, it is characterised in that, in described step (2), the brown length of copper coin is 3.8m, and the transmission speed of transmission device is 3.5m/S.
6. multi-layer PCB core material brown film short-term training method according to claim 1, it is characterised in that, in described step (2), the brown length of copper coin is 5m, and the transmission speed of transmission device is 4.5-5.5m/S.
7. multi-layer PCB core material brown film short-term training method according to claim 6, it is characterised in that, in described step (2), the brown length of copper coin is 5m, and the transmission speed of transmission device is 5m/S.
8. multi-layer PCB core material brown film short-term training method according to claim 1, it is characterised in that, in described step (2), the both sides of the edge of copper coin are fixed on transmission device by gripping unit.
9. multi-layer PCB core material brown film short-term training method according to claim 8, it is characterised in that, described gripping unit is clip, and the arrangement mode of gripping unit such as is at the spacing arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610158416.5A CN105636363B (en) | 2016-03-21 | 2016-03-21 | Multi-layer PCB core material brown film crashing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610158416.5A CN105636363B (en) | 2016-03-21 | 2016-03-21 | Multi-layer PCB core material brown film crashing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105636363A true CN105636363A (en) | 2016-06-01 |
| CN105636363B CN105636363B (en) | 2018-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610158416.5A Active CN105636363B (en) | 2016-03-21 | 2016-03-21 | Multi-layer PCB core material brown film crashing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113334899A (en) * | 2021-04-16 | 2021-09-03 | 江西新永海电子科技有限公司 | Manufacturing method of rigid copper-clad plate |
| CN116156784A (en) * | 2023-04-25 | 2023-05-23 | 四川托璞勒科技有限公司 | PCB brown ization processing apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534589A (en) * | 2011-12-26 | 2012-07-04 | 东莞生益电子有限公司 | Copper block surface brown oxidation method |
| CN202967542U (en) * | 2012-10-19 | 2013-06-05 | 亚智科技股份有限公司 | Substrate conveying system |
| CN104320927A (en) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | HDI printed circuit board copper foil brownification device with rolling type soft brush |
-
2016
- 2016-03-21 CN CN201610158416.5A patent/CN105636363B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534589A (en) * | 2011-12-26 | 2012-07-04 | 东莞生益电子有限公司 | Copper block surface brown oxidation method |
| CN202967542U (en) * | 2012-10-19 | 2013-06-05 | 亚智科技股份有限公司 | Substrate conveying system |
| CN104320927A (en) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | HDI printed circuit board copper foil brownification device with rolling type soft brush |
Non-Patent Citations (1)
| Title |
|---|
| 王恒义 等: ""水平棕化处理工艺的应用"", 《第七届全国印制电路学术年会论文集》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113334899A (en) * | 2021-04-16 | 2021-09-03 | 江西新永海电子科技有限公司 | Manufacturing method of rigid copper-clad plate |
| CN116156784A (en) * | 2023-04-25 | 2023-05-23 | 四川托璞勒科技有限公司 | PCB brown ization processing apparatus |
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| Publication number | Publication date |
|---|---|
| CN105636363B (en) | 2018-10-09 |
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