CN113334899A - Manufacturing method of rigid copper-clad plate - Google Patents
Manufacturing method of rigid copper-clad plate Download PDFInfo
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- CN113334899A CN113334899A CN202110409099.0A CN202110409099A CN113334899A CN 113334899 A CN113334899 A CN 113334899A CN 202110409099 A CN202110409099 A CN 202110409099A CN 113334899 A CN113334899 A CN 113334899A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a manufacturing method of a rigid copper-clad plate, and relates to the technical field of copper-clad plates. The manufacturing method of the rigid copper-clad plate comprises the following steps: s1, core plate dust removal treatment: placing the core board to be browned in an ultrasonic processor, and cleaning the residual garbage and dust on the surface of the inner layer board of the core board by using a dust removal device; s2, browning: adding laboratory water, strong acid and browning reagent into a solution tank, and introducing a strong oxidant. According to the manufacturing method of the rigid copper-clad plate, the polysulfone and the like are used for modifying the epoxy resin, so that the copper-clad plate has good dielectric property, heat resistance and dimensional stability, the cost is greatly reduced, the advantage of the flexible copper-clad plate is added, the dielectric property and the heat resistance of the base material are improved by using the resin, the defects of the rigid copper-clad plate are effectively avoided, and the modified epoxy resin is used for heat sealing, so that the rigid copper-clad plate is low in cost, stable in property, long in storage time and low in curing shrinkage rate.
Description
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a manufacturing method of a rigid copper-clad plate.
Background
In the manufacturing method of the rigid copper-clad plate in the prior art, the high-performance matrix resin is expensive, the production cost is high, so that the manufacturing cost of the rigid copper-clad plate is greatly increased, the problems of unstable property, short storage time and high curing shrinkage rate easily occur in the low-cost adhesive, and meanwhile, the manufacturing cost is high and more core plates are used in the existing pressing mode.
In order to solve the problems, the inventor provides a manufacturing method of a rigid copper-clad plate, wherein polysulfone and the like are used for modifying epoxy resin, so that the copper-clad plate has good dielectric property, heat resistance and dimensional stability, meanwhile, the cost is greatly reduced, the advantage of the flexible copper-clad plate is added, the dielectric property and the heat resistance of a base material are improved by using resin, the self defect of the rigid copper-clad plate is effectively avoided, and the modified epoxy resin is used for heat sealing, so that the rigid copper-clad plate is low in cost, stable in property, long in storage time and low in curing shrinkage rate.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a manufacturing method of a rigid copper-clad plate, which has the advantages of low cost and good stability and solves the problems of high cost and low stability.
(II) technical scheme
In order to achieve the purposes of low cost and good stability, the invention is realized by the following technical scheme: a manufacturing method of a rigid copper-clad plate comprises the following steps:
s1, core plate dust removal treatment: placing the core board to be browned in an ultrasonic processor, and cleaning the residual garbage and dust on the surface of the inner layer board of the core board by using a dust removal device;
s2, browning: adding laboratory water, strong acid and browning liquid medicine into a solution tank, introducing a strong oxidant, soaking the core plate to be browned in the browning liquid medicine for 15-25s, taking out the core plate after the browning is finished, and recovering browned wastewater;
s3, preparing glue solution: adding tall oil fatty acid and a sodium hydride solution into a reaction container for reaction, filtering the solution, removing the solvent, electrolyzing for 10-20s, adding ammonia water, adjusting the pH value to 2-3, removing the obtained solution, dropwise adding a 2-butanone solution to obtain a mixed solution, adding a triphenylmethyl hydroperoxide solution into the reaction container, continuously reacting, slowly adding a mixed solution of m-xylene diamine, m-aminobenzylamine and biphenyl diamine, reacting, filtering, adding a 2-butanone solution, extracting, drying at 50-70 ℃, preparing epoxy resin, adding polysulfone and a dimethylformamide solvent into the container, stirring until the polysulfone and the dimethylformamide solvent are dissolved, and obtaining modified epoxy resin;
s4, stacking and laminating: coating the modified epoxy resin on an insulating substrate, drying, arranging boards, hot-press molding and processing, aligning and stacking the insulating substrate, copper foil and a core board subjected to browning treatment, sequentially stacking the copper foil, the insulating substrate, the core board, the insulating substrate and the copper foil, placing laminated boards on the upper side and the lower side, putting the laminated boards into a vacuum machine for discharging bubbles, and pressing at 140-205 ℃ and 0.5-2MPa of an upper heating plate and a lower heating plate to thermally seal the multilayer board;
s5, board splitting and cutting: and carrying out plate separation and cutting on the taken out multilayer copper-clad plate, and carrying out subsequent treatment procedures.
Preferably, the ultrasonic treatment in the step S1 is performed for 0.5-1h, and the ultrasonic frequency is 60-80KHz, so that the dust and dust inside the core plate to be browned can be conveniently treated.
Preferably, the hydrogen hydroxide in the step S2 is 6% by volume of H with a concentration of 50%2O27-8% by volume of strong acid, 50% H2SO4The volume of laboratory water is 70-80%, the volume of browning chemical liquid is 7-8%, and ozone is introduced when the browning wastewater is recovered, so that the copper in the browning wastewater can be conveniently recovered through the ozone.
Preferably, the molar ratio of the tall oil fatty acid to the sodium hydride solution in the step S3 is 1: 1.2.
Preferably, the electrolysis condition in step S3 is current of 5-10A and voltage of 4-6V.
Preferably, the molar ratio of the mixed solution to the triphenylmethyl hydroperoxide solution in the step S3 is 1: 0.2-0.5.
Preferably, the polysulfone in step S3: dimethylformamide: the mass ratio of the epoxy resin is (10-100): (5-40): (10-100), therefore, the dielectric property, heat resistance and dimensional stability of the copper-clad plate are improved.
(III) advantageous effects
Compared with the prior art, the invention provides a manufacturing method of a rigid copper-clad plate, which has the following beneficial effects:
1. according to the manufacturing method of the rigid copper-clad plate, the polysulfone and the like are utilized to modify the epoxy resin, so that the copper-clad plate has good dielectricity, heat resistance and dimensional stability, meanwhile, the cost is greatly reduced, the advantage of the flexible copper-clad plate is added in the traditional rigid copper-clad plate manufacturing process, the dielectricity and heat resistance of the base material are improved by utilizing the resin, the defects of the rigid copper-clad plate are effectively avoided, and the practicability is greatly improved.
2. The manufacturing method of the rigid copper-clad plate carries out heat sealing by utilizing the modified epoxy resin, has low cost, stable property, long storage time, low curing shrinkage rate, stable property in the manufacturing process, convenient use and greatly improved reliability of the rigid copper-clad plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention is further described below by way of examples:
the first embodiment is as follows:
a manufacturing method of a rigid copper-clad plate comprises the following steps:
s1, core plate dust removal treatment: placing the core plate to be browned in an ultrasonic processor, carrying out ultrasonic treatment for 0.5h at the ultrasonic frequency of 60KHz, and cleaning the residual garbage and dust on the surface of the inner layer plate of the core plate by using a dust removal device;
s2, browning: in solution70% laboratory water, 6% by volume of 50% H are added to the tank2O27% browning lotion, 7% by volume of 50% H2SO4Soaking the core plate to be browned in the brownification medicinal liquid for 15s, taking out the core plate after the brownification is finished, and recovering brownification waste water;
s3, preparing glue solution: adding tall oil fatty acid and sodium hydride solution into a reaction vessel for reaction, wherein the molar ratio of the tall oil fatty acid to the sodium hydride solution is 1:1.2, filtering the solution, removing the solvent, electrolyzing for 10s under the electrolysis condition of 5A current and 4V voltage, adding ammonia water, adjusting the pH value to 2, removing the obtained solution, dropwise adding 2-butanone solution to obtain a mixed solution, wherein the molar ratio of the mixed solution to the triphenylmethyl hydroperoxide solution is 1:0.2, adding the triphenylmethyl hydroperoxide solution into the reaction vessel, continuously reacting, slowly adding the mixed solution of m-xylene diamine, m-aminobenzylamine and biphenyl diamine, reacting, filtering, adding the 2-butanone solution, extracting, drying at 50 ℃ to prepare epoxy resin, adding polysulfone and dimethylformamide solvent, and placing in a container, wherein the weight ratio of dimethylformamide: the mass ratio of the epoxy resin is 10: 5: 10, stirring until the mixture is dissolved to obtain modified epoxy resin;
s4, stacking and laminating: coating the modified epoxy resin on an insulating substrate, drying, arranging boards, hot-press molding and processing, aligning and stacking the insulating substrate, copper foil and a core board subjected to browning treatment, sequentially stacking the copper foil, the insulating substrate, the core board, the insulating substrate and the copper foil, placing laminated boards on the upper side and the lower side, putting the laminated boards into a vacuum machine for discharging bubbles, and pressing the laminated boards at 140 ℃ and 0.5MPa of an upper heating plate and a lower heating plate to thermally seal the multilayer board;
s5, board splitting and cutting: and carrying out plate separation and cutting on the taken out multilayer copper-clad plate, and carrying out subsequent treatment procedures.
Example two:
s1, core plate dust removal treatment: placing the core plate to be browned in an ultrasonic processor, carrying out ultrasonic treatment for 0.7h at the ultrasonic frequency of 70KHz, and cleaning the residual garbage and dust on the surface of the inner layer plate of the core plate by using a dust removal device;
s2, browning: 75% laboratory water, 6% by volume of 50% H, was added to the solution tank2O27% browning lotion, 7% by volume of 50% H2SO4Soaking the core plate to be browned in the brownification medicinal liquid for 20s, taking out the core plate after the brownification is finished, and recovering brownification waste water;
s3, preparing glue solution: adding tall oil fatty acid and a sodium hydride solution into a reaction container for reaction, wherein the molar ratio of the tall oil fatty acid to the sodium hydride solution is 1:1.2, filtering the solution, removing a solvent, electrolyzing for 15s under the electrolysis condition of current 6A and voltage 5V, adding ammonia water, adjusting the pH value to 2, removing the obtained solution, dropwise adding a 2-butanone solution to obtain a mixed solution, wherein the molar ratio of the mixed solution to a triphenylmethyl hydroperoxide solution is 1:0.3, adding the triphenylmethyl hydroperoxide solution into the reaction container, continuously reacting, slowly adding a mixed solution of m-xylene diamine, m-aminobenzylamine and biphenyl diamine, reacting, filtering, adding the 2-butanone solution, extracting, drying at 60 ℃ to prepare epoxy resin, adding polysulfone and dimethylformamide solvents into the container, and dimethylformamide: the mass ratio of the epoxy resin is 50: 20: 50, stirring until the mixture is dissolved to obtain modified epoxy resin;
s4, stacking and laminating: coating the modified epoxy resin on an insulating substrate, drying, arranging boards, hot-press molding and processing, aligning and stacking the insulating substrate, copper foil and a core board subjected to browning treatment, sequentially stacking the copper foil, the insulating substrate, the core board, the insulating substrate and the copper foil, placing laminated boards on the upper side and the lower side, putting the laminated boards into a vacuum machine for discharging bubbles, and pressing the laminated boards at 200 ℃ and 1MPa with an upper heating plate and a lower heating plate to thermally bond the multilayer board;
s5, board splitting and cutting: and carrying out plate separation and cutting on the taken out multilayer copper-clad plate, and carrying out subsequent treatment procedures.
Example three:
s1, core plate dust removal treatment: placing the core plate to be browned in an ultrasonic processor, carrying out ultrasonic treatment for 1h at the ultrasonic frequency of 80KHz, and cleaning the residual garbage and dust on the surface of the inner layer plate of the core plate by using a dust removal device;
s2, browning: 80% laboratory water, 6% by volume of 50% H, was added to the solution tank2O28 percent of browning lotion and 7 to 8 percent of H with the volume concentration of 50 percent2SO4Soaking the core plate to be browned in the brownification medicinal liquid for 25s, taking out the core plate after the brownification is finished, and recovering brownification waste water;
s3, preparing glue solution: adding tall oil fatty acid and a sodium hydride solution into a reaction container for reaction, wherein the molar ratio of the tall oil fatty acid to the sodium hydride solution is 1:1.2, filtering the solution, removing a solvent, electrolyzing for 20s under the electrolysis condition of current 10A and voltage 6V, adding ammonia water, adjusting the pH value to 3, removing the obtained solution, dropwise adding a 2-butanone solution to obtain a mixed solution, wherein the molar ratio of the mixed solution to a triphenylmethyl hydroperoxide solution is 1:0.5, adding the triphenylmethyl hydroperoxide solution into the reaction container, continuously reacting, slowly adding a mixed solution of m-xylene diamine, m-aminobenzylamine and biphenyl diamine, reacting, filtering, adding the 2-butanone solution, extracting, drying at 70 ℃ to prepare epoxy resin, adding polysulfone and dimethylformamide solvents into the container, and dimethylformamide: the mass ratio of the epoxy resin is 100: 40: 100, stirring until the mixture is dissolved to obtain modified epoxy resin;
s4, stacking and laminating: coating the modified epoxy resin on an insulating substrate, drying, arranging boards, hot-press molding and processing, aligning and stacking the insulating substrate, copper foil and a core board subjected to browning treatment, sequentially stacking the copper foil, the insulating substrate, the core board, the insulating substrate and the copper foil, placing laminated boards on the upper side and the lower side, putting the laminated boards into a vacuum machine for discharging bubbles, and pressing the laminated boards at 205 ℃ and 2MPa by an upper heating plate and a lower heating plate to thermally bond the multilayer board;
s5, board splitting and cutting: and carrying out plate separation and cutting on the taken out multilayer copper-clad plate, and carrying out subsequent treatment procedures.
In conclusion, according to the manufacturing method of the rigid copper-clad plate, the polysulfone and the like are used for modifying the epoxy resin, so that the copper-clad plate has good dielectricity, heat resistance and dimensional stability, and meanwhile, the cost is greatly reduced.
The manufacturing method of the rigid copper-clad plate carries out heat sealing by utilizing the modified epoxy resin, has low cost, stable property, long storage time, low curing shrinkage rate, stable property in the manufacturing process, convenient use and greatly improved reliability of the rigid copper-clad plate.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The manufacturing method of the rigid copper-clad plate comprises the following steps of:
s1, core plate dust removal treatment: placing the core board to be browned in an ultrasonic processor, and cleaning the residual garbage and dust on the surface of the inner layer board of the core board by using a dust removal device;
s2, browning: adding laboratory water, strong acid and browning liquid medicine into a solution tank, introducing a strong oxidant, soaking the core plate to be browned in the browning liquid medicine for 15-25s, taking out the core plate after the browning is finished, and recovering browned wastewater;
s3, preparing glue solution: adding tall oil fatty acid and a sodium hydride solution into a reaction container for reaction, filtering the solution, removing the solvent, electrolyzing for 10-20s, adding ammonia water, adjusting the pH value to 2-3, removing the obtained solution, dropwise adding a 2-butanone solution to obtain a mixed solution, adding a triphenylmethyl hydroperoxide solution into the reaction container, continuously reacting, slowly adding a mixed solution of m-xylene diamine, m-aminobenzylamine and biphenyl diamine, reacting, filtering, adding a 2-butanone solution, extracting, drying at 50-70 ℃, preparing epoxy resin, adding polysulfone and a dimethylformamide solvent into the container, stirring until the polysulfone and the dimethylformamide solvent are dissolved, and obtaining modified epoxy resin;
s4, stacking and laminating: coating the modified epoxy resin on an insulating substrate, drying, arranging boards, hot-press molding and processing, aligning and stacking the insulating substrate, copper foil and a core board subjected to browning treatment, sequentially stacking the copper foil, the insulating substrate, the core board, the insulating substrate and the copper foil, placing laminated boards on the upper side and the lower side, putting the laminated boards into a vacuum machine for discharging bubbles, and pressing at 140-205 ℃ and 0.5-2MPa of an upper heating plate and a lower heating plate to thermally seal the multilayer board;
s5, board splitting and cutting: and carrying out plate separation and cutting on the taken out multilayer copper-clad plate, and carrying out subsequent treatment procedures.
2. The manufacturing method of the rigid copper-clad plate according to claim 1, characterized in that: and in the step S1, ultrasonic treatment is carried out for 0.5-1h, and the ultrasonic frequency is 60-80 KHz.
3. The manufacturing method of the rigid copper-clad plate according to claim 1, characterized in that: the hydrogen hydroxide in the step S2 is 6% by volume of H with the concentration of 50%2O27-8% by volume of strong acid, 50% H2SO4The volume of laboratory water is 70-80%, the volume of browning chemical liquid is 7-8%, and ozone is introduced when the browning wastewater is recovered.
4. The manufacturing method of the rigid copper-clad plate according to claim 1, characterized in that: the molar ratio of tall oil fatty acid to sodium hydride solution in step S3 was 1: 1.2.
5. The manufacturing method of the rigid copper-clad plate according to claim 1, characterized in that: the electrolysis condition in the step S3 is 5-10A of current and 4-6V of voltage.
6. The manufacturing method of the rigid copper-clad plate according to claim 1, characterized in that: the molar ratio of the mixed solution to the triphenylmethyl hydroperoxide solution in the step S3 is 1: 0.2-0.5.
7. The manufacturing method of the rigid copper-clad plate according to claim 1, characterized in that: polysulfone in said step S3: dimethylformamide: the mass ratio of the epoxy resin is (10-100): (5-40): (10-100).
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Citations (6)
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| JPH1135916A (en) * | 1997-07-18 | 1999-02-09 | Sumitomo Bakelite Co Ltd | Layer insulation adhesive for multilayer printed wiring board |
| CN102796346A (en) * | 2011-06-01 | 2012-11-28 | 深圳光启高等理工研究院 | Modified epoxy resin and method for preparing base material based on modified epoxy resin |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
| CN105636363A (en) * | 2016-03-21 | 2016-06-01 | 奥士康科技股份有限公司 | Rapid forming method for brown oxidization film for PCB with multi-layer inner cores |
| CN110278661A (en) * | 2019-07-23 | 2019-09-24 | 昆山欧贝达电子科技有限公司 | Preparation method of multilayer copper-clad plate |
| CN110790898A (en) * | 2019-08-31 | 2020-02-14 | 王世茸 | Modified epoxy resin and preparation method thereof |
-
2021
- 2021-04-16 CN CN202110409099.0A patent/CN113334899A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1135916A (en) * | 1997-07-18 | 1999-02-09 | Sumitomo Bakelite Co Ltd | Layer insulation adhesive for multilayer printed wiring board |
| CN102796346A (en) * | 2011-06-01 | 2012-11-28 | 深圳光启高等理工研究院 | Modified epoxy resin and method for preparing base material based on modified epoxy resin |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
| CN105636363A (en) * | 2016-03-21 | 2016-06-01 | 奥士康科技股份有限公司 | Rapid forming method for brown oxidization film for PCB with multi-layer inner cores |
| CN110278661A (en) * | 2019-07-23 | 2019-09-24 | 昆山欧贝达电子科技有限公司 | Preparation method of multilayer copper-clad plate |
| CN110790898A (en) * | 2019-08-31 | 2020-02-14 | 王世茸 | Modified epoxy resin and preparation method thereof |
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