CN111465195A - Method for plugging large-aperture aluminum substrate with resin - Google Patents
Method for plugging large-aperture aluminum substrate with resin Download PDFInfo
- Publication number
- CN111465195A CN111465195A CN202010269707.8A CN202010269707A CN111465195A CN 111465195 A CN111465195 A CN 111465195A CN 202010269707 A CN202010269707 A CN 202010269707A CN 111465195 A CN111465195 A CN 111465195A
- Authority
- CN
- China
- Prior art keywords
- air guide
- hole
- aluminum
- resin
- aluminum sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 110
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 110
- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 239000011347 resin Substances 0.000 title claims abstract description 50
- 229920005989 resin Polymers 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000011087 paperboard Substances 0.000 claims abstract description 37
- 238000005553 drilling Methods 0.000 claims abstract description 3
- 239000000123 paper Substances 0.000 claims description 3
- 238000010923 batch production Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A method for plugging a large-aperture aluminum substrate with resin comprises the following steps: fixing an air guide plate on the table top, and fixing an air guide aluminum sheet on the air guide plate; an aluminum substrate is arranged above the air guide aluminum sheet, the aluminum substrate comprises a PCB and a hole plugging aluminum sheet arranged above the PCB, and a hole A needing resin hole plugging is formed in the aluminum substrate; placing a paper board on the air guide aluminum sheet, and fixing the aluminum substrate on the paper board; drilling air guide holes in positions corresponding to the holes A before the hole plugging aluminum sheet, the air guide aluminum sheet and the paper board are fixed, and performing resin hole plugging on the holes A after the hole plugging aluminum sheet, the PCB, the paper board, the air guide aluminum sheet and the air guide plate are sequentially placed and aligned; after the resin is plugged, baking the fixed paper board, the PCB and the plug hole aluminum sheet; and removing the paperboard after baking, and carrying out resin grinding on the hole A on the aluminum substrate. The invention can avoid the problems of resin hole plugging cavities, incomplete filling and the like, is beneficial to improving the hole plugging efficiency of the aluminum substrate, reducing the cost and improving the product quality, and is suitable for batch production.
Description
Technical Field
The invention relates to the field of PCBs (printed circuit boards), in particular to a method for plugging a large-aperture aluminum substrate with resin.
Background
Along with the rapid development of the electronic industry, the volume of electronic products is smaller and smaller, the power density is larger and larger, more and more heat is generated when components run, the power density and reliability of the products are reduced by the accumulated heat, the service life of the products is shortened, how to dissipate heat becomes the most troublesome problem for developers of electronic products, a metal substrate is undoubtedly the best choice for solving the problems, and an aluminum substrate in the metal substrate is widely adopted due to the advantages of light weight, good oxidation resistance, good heat dissipation and the like.
The embedded high-heat-conductivity aluminum substrate is a novel process technology, a hole (the diameter of the hole is usually more than 1.0 mm) which is 0.12mm larger than the single side of the through hole of the PCB needs to be pre-drilled at the position of the through hole on the PCB corresponding to the aluminum substrate, and then the hole on the aluminum plate is filled with high-heat-conductivity resin printing ink, so that the insulation between the subsequent through hole and the aluminum plate is ensured. However, the maximum hole plugging capacity of the common resin hole plugging method is 0.6mm under the current equipment and process limitations, the quality of the aluminum substrate manufactured by using the common resin hole plugging method cannot be guaranteed, and the problem that the resin cannot be filled or the filling effect is poor due to the fact that the resin flows too fast usually occurs.
Disclosure of Invention
The invention provides a method for plugging a hole in a large-aperture aluminum substrate by resin, aiming at solving the problems that the filling cannot be carried out and the filling effect is poor when the hole in the conventional aluminum substrate is plugged by the resin with a large aperture diameter larger than 0.6 mm.
A method for plugging a large-aperture aluminum substrate with resin comprises the following steps:
fixing an air guide plate on the table top, and fixing an air guide aluminum sheet on the air guide plate;
an aluminum substrate is arranged above the air guide aluminum sheet, the aluminum substrate comprises a PCB and a hole plugging aluminum sheet arranged above the PCB, and a hole A needing resin hole plugging is formed in the aluminum substrate;
placing a paper board on the air guide aluminum sheet, and fixing the aluminum substrate on the paper board, wherein the paper board can prevent ink in subsequent resin hole plugging from being adhered by the air guide aluminum sheet or the air guide plate;
drilling an air guide hole in the position corresponding to the hole A before fixing the hole plugging aluminum sheet, the air guide aluminum sheet and the paper board, and performing resin hole plugging on the hole A after the hole plugging aluminum sheet, the PCB, the paper board, the air guide aluminum sheet and the air guide plate are sequentially placed and aligned, wherein the ink can be prevented from flowing away from the bottom of the hole by the air guide aluminum sheet;
after the resin is plugged, baking the fixed paper board, the PCB and the plug hole aluminum sheet;
and removing the paperboard after baking, and carrying out resin grinding on the hole A on the aluminum substrate.
In one embodiment, the aluminum substrates are provided with a plurality of aluminum substrates, and paper boards are arranged between adjacent aluminum substrates.
In one embodiment, the pore diameter of the air guide hole is less than or equal to 0.3 mm.
In one embodiment, the air guide aluminum sheet is positioned on the air guide plate by a PIN.
In one embodiment, the positions of the positioning holes on the aluminum substrate and the air guide aluminum sheet correspond to the positions of the pin nails.
In one embodiment, the paperboard is white paper.
The invention provides a method for plugging a hole in a large-aperture aluminum substrate by resin, wherein before a hole plugging aluminum sheet is subjected to resin hole plugging, an air guide aluminum sheet and a paperboard are placed between an air guide plate and a PCB (printed Circuit Board), so that the problem that resin ink in a hole A is reversely adhered back by the air guide plate can be avoided, and the problems of resin hole plugging holes, incomplete filling and the like are avoided; the method is simple and practical, the resin filling effect of the aluminum substrate is good, the efficiency of hole plugging of the aluminum substrate is improved, the cost is reduced, the product quality is improved, and the method is suitable for batch production.
Drawings
Fig. 1 is a schematic view of a resin plugging method for a large-aperture aluminum substrate according to an embodiment of the present invention.
Detailed Description
The technical contents of the present invention will be further described with reference to the accompanying drawings and examples.
Referring to the attached figure 1, the method for plugging the hole by the resin of the large-aperture aluminum substrate comprises the following steps:
fixing an air guide plate 5 on the table top 6, fixing an air guide aluminum sheet 4 on the air guide plate 5, and positioning the air guide aluminum sheet 4 on the air guide plate 5 through PIN nails;
an aluminum substrate 1 is arranged above the air guide aluminum sheet 4, the aluminum substrate 1 comprises a PCB 12 and a hole plugging aluminum sheet 11 arranged above the PCB, and a hole A needing resin hole plugging is formed in the aluminum substrate 1;
placing a paper board 3 on an air guiding aluminum sheet 4, and fixing an aluminum substrate 1 on the paper board 3, wherein in one embodiment, the paper board 3 is white paper;
and air guide holes are drilled in the positions corresponding to the holes A before the aluminum substrate 1, the air guide aluminum sheets 4 and the paper boards 3 are fixed, and the hole diameter of each air guide hole is less than or equal to 0.3mm, preferably 0.3 mm. After the hole plugging aluminum sheet 11, the PCB 12, the paper board 3, the air guide aluminum sheet 4 and the air guide plate 5 are sequentially placed and aligned, the positions of the positioning holes on the aluminum substrate 1 and the air guide aluminum sheet 4 correspond to the positions of the pin nails, the hole A is subjected to resin hole plugging, the air guide aluminum sheet 4 has a supporting effect, resin ink is prevented from flowing away from the bottom of the hole due to no support when the hole diameter is large, and the paper board 3 can prevent the ink in the hole from being reversely adhered away by the ink or the air guide aluminum sheet in the air guide hole when the aluminum substrate is replaced for hole;
after the resin is filled in the holes, baking the fixed paper board 3, the PCB 12 and the aluminum substrate 1;
the paperboard 3 is removed after baking, the holes A in the aluminum substrate 1 are subjected to resin grinding, the paperboard 3 can be directly torn off, the product quality is normal, the hole plugging has no quality problems such as bubbles, gummosis, resin protrusion or depression, and the like, and the product failure rate is reduced.
In one embodiment, the aluminum substrates are provided with a plurality of aluminum substrates, the paper boards are arranged between the adjacent aluminum substrates, the aluminum substrates and the paper boards are the same in number, the aluminum substrates and the paper boards are suitable for batch production, and the practicability is high.
In the prior art, the processing capacity of resin hole plugging requires that the aperture is smaller than 0.6mm, the invention can realize the resin hole plugging for the through hole with the aperture larger than 0.6mm on the aluminum substrate, and can avoid the problems of cavities, incomplete hole plugging and the like in the resin hole plugging process, thereby improving the processing capacity of the resin hole plugging process.
The invention provides a method for plugging a hole in a large-aperture aluminum substrate by resin, wherein before a hole plugging aluminum sheet is subjected to resin hole plugging, an air guide aluminum sheet and a paperboard are placed between an air guide plate and a PCB (printed Circuit Board), so that the problem that resin ink in a hole A is reversely adhered back by the air guide plate can be avoided, and the problems of resin hole plugging holes, incomplete filling and the like are avoided; the method is simple and practical, the resin filling effect of the aluminum substrate is good, the efficiency of hole plugging of the aluminum substrate is improved, the cost is reduced, the product quality is improved, and the method is suitable for batch production.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (6)
1. A method for plugging a hole in a large-aperture aluminum substrate resin is characterized by comprising the following steps: the method comprises the following steps:
an air guide plate (5) is fixed on the table top (6), and an air guide aluminum sheet (4) is fixed on the air guide plate (5);
an aluminum substrate (1) is arranged above the air guide aluminum sheet (4), the aluminum substrate (1) comprises a PCB (printed circuit board) and a hole plugging aluminum sheet (11) arranged above the PCB, and a hole A needing resin hole plugging is formed in the aluminum substrate;
placing a paper board (3) on the air guide aluminum sheet (4), and fixing the aluminum substrate (1) on the paper board (3);
drilling air guide holes in positions corresponding to the holes A before fixing the hole plugging aluminum sheet (11), the air guide aluminum sheet (4) and the paper board (3), and performing resin hole plugging on the holes A after the hole plugging aluminum sheet (11), the PCB (12), the paper board (3), the air guide aluminum sheet (4) and the air guide plate (5) are sequentially placed and aligned;
after resin is filled in the holes, baking the fixed paper board (3), the PCB (12) and the hole filling aluminum sheet (11);
after baking, the paper board (3) is removed, and the hole A on the aluminum substrate (1) is subjected to resin grinding.
2. The method of claim 1, wherein the method comprises the following steps: the aluminum substrates are provided with a plurality of aluminum substrates, and paper boards (3) are arranged between the adjacent aluminum substrates.
3. The method of claim 1, wherein the method comprises the following steps: the aperture of the air guide hole is less than or equal to 0.3 mm.
4. The method of claim 1, wherein the method comprises the following steps:
the air guide aluminum sheet (4) is positioned on the air guide plate (5) through PIN nails.
5. The method of claim 4, wherein the method comprises the following steps:
the positions of the positioning holes in the aluminum substrate and the air guide aluminum sheet (4) correspond to the positions of the pin nails.
6. The method for plugging the hole by the resin of the large-aperture aluminum substrate according to the claim 1 or 2, wherein: the paper board (3) is white paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010269707.8A CN111465195A (en) | 2020-04-08 | 2020-04-08 | Method for plugging large-aperture aluminum substrate with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010269707.8A CN111465195A (en) | 2020-04-08 | 2020-04-08 | Method for plugging large-aperture aluminum substrate with resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111465195A true CN111465195A (en) | 2020-07-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010269707.8A Pending CN111465195A (en) | 2020-04-08 | 2020-04-08 | Method for plugging large-aperture aluminum substrate with resin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111465195A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677095A (en) * | 2021-08-17 | 2021-11-19 | 东莞市若美电子科技有限公司 | Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005353900A (en) * | 2004-06-11 | 2005-12-22 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board, and supporting plate for filling holes |
| US20070048897A1 (en) * | 2005-09-01 | 2007-03-01 | Endicott Interconnect Technologies, Inc. | Method and apparatus for depositing conductive paste in circuitized substrate openings |
| CN203072260U (en) * | 2012-11-02 | 2013-07-17 | 深圳市迅捷兴电路技术有限公司 | Antivacuum resin plughole apparatus |
| CN108347833A (en) * | 2018-03-15 | 2018-07-31 | 深圳市景旺电子股份有限公司 | A kind of technique of filling holes with resin |
-
2020
- 2020-04-08 CN CN202010269707.8A patent/CN111465195A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005353900A (en) * | 2004-06-11 | 2005-12-22 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board, and supporting plate for filling holes |
| US20070048897A1 (en) * | 2005-09-01 | 2007-03-01 | Endicott Interconnect Technologies, Inc. | Method and apparatus for depositing conductive paste in circuitized substrate openings |
| CN203072260U (en) * | 2012-11-02 | 2013-07-17 | 深圳市迅捷兴电路技术有限公司 | Antivacuum resin plughole apparatus |
| CN108347833A (en) * | 2018-03-15 | 2018-07-31 | 深圳市景旺电子股份有限公司 | A kind of technique of filling holes with resin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677095A (en) * | 2021-08-17 | 2021-11-19 | 东莞市若美电子科技有限公司 | Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging |
| CN113677095B (en) * | 2021-08-17 | 2022-05-31 | 东莞市若美电子科技有限公司 | Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200728 |