CN215010907U

CN215010907U - PCB circuit board SMT paster is used prevents warping board and is warp tool

Info

Publication number: CN215010907U
Application number: CN202121207928.9U
Authority: CN
Inventors: 姬海丰
Original assignee: Kunshan Shengchang Electronics Co ltd
Current assignee: Kunshan Shengchang Electronics Co ltd
Priority date: 2021-06-01
Filing date: 2021-06-01
Publication date: 2021-12-03
Anticipated expiration: 2031-06-01

Abstract

The utility model discloses a proof warp board deformation tool that PCB circuit board SMT paster was used, including upper cover and lower cover, the upper cover can be buckled and set up the lower cover, the upper cover is equipped with two-dimensional code identification area, air vent and a plurality of paster and passes through the hole; the lower cover is provided with a circuit board accommodating groove, the circuit board accommodating groove is filled with vent holes, and magnetic round blocks are arranged around the circuit board accommodating groove. After the PCB circuit board was placed on the circuit board holding tank, the upper cover passed through the laminating of magnetism disk block absorption with the lower cover for the complete pressfitting of PCB circuit board is between upper cover and lower cover, can prevent that the PCB circuit board from suffering the high temperature and taking place the condition that warp, reduces the defective rate.

Description

PCB circuit board SMT paster is used prevents warping board and is warp tool

Technical Field

The utility model relates to a circuit board processing technology field specifically is a proof warp board deformation tool that PCB circuit board SMT paster was used.

Background

SMT: is a surface mount technology called surface mount or surface mount technology. Is the most popular technology and process in the electronic assembly industry at present. The surface-mounted component without pins or short leads is mounted on the surface of a printed circuit board or other substrates and is soldered and assembled by methods such as reflow soldering or dip soldering. The SMT surface mounting technology comprises the following procedures: printing, dispensing, curing, reflow soldering, cleaning and detecting. In the solidification and reflow soldering stage of SMT processing of the ultrathin PCB, the ultrathin PCB is easily affected by high temperature to warp and deform, the rejection rate is increased, and the production cost of the circuit board is increased.

SUMMERY OF THE UTILITY MODEL

Utility model purpose: problem and not enough to the existence among the above-mentioned prior art, the utility model aims at providing a proof warp board deformation jig that PCB circuit board SMT paster was used.

The technical scheme is as follows: in order to achieve the purpose, the warp-preventing board deformation jig for SMT (surface mount technology) chip mounting of the PCB comprises an upper cover and a lower cover, wherein the upper cover can be buckled on the lower cover, and a two-dimensional code identification area, an air vent and a plurality of chip through holes are arranged on the upper cover; the lower cover is provided with a circuit board accommodating groove, the circuit board accommodating groove is filled with vent holes, and magnetic round blocks are arranged around the circuit board accommodating groove.

Furthermore, two trapezoidal grooves I are respectively arranged on two sides of the upper cover in parallel.

Furthermore, trapezoidal grooves II are formed in the left side and the right side of the lower cover, and the size of each trapezoidal groove II is larger than that of each trapezoidal groove I.

Further, the two-dimensional code identification area comprises an installation piece, the two ends of the installation piece are fixed on the lower cover through bolts, and the two-dimensional code is printed in the middle of the installation piece.

Furthermore, four corners of the circuit board accommodating groove are provided with semicircular grooves.

Further, the depth of the semicircular groove is larger than that of the circuit board accommodating groove.

Furthermore, the patch penetration holes comprise a first penetration hole, a second penetration hole, a third penetration hole, a fourth penetration hole, a fifth penetration hole and a sixth penetration hole, the penetration holes are formed in positions corresponding to elements on the PCB, and air vents are formed in two sides of the first penetration hole.

Above-mentioned technical scheme can see out, the beneficial effects of the utility model are that:

a PCB circuit board SMT paster be used prevents warping board and warp tool, the PCB circuit board is placed circuit board holding tank back on, the upper cover adsorbs the laminating through the magnetism disk with the lower cover for the complete pressfitting of PCB circuit board can prevent that the PCB circuit board from suffering high temperature and taking place the condition that warp and warp, reduces the defective rate between upper cover and lower cover.

Drawings

Fig. 1 is a schematic structural view of a lower cover of the present invention;

fig. 2 is a schematic structural diagram of the upper cover of the present invention.

Detailed Description

The invention will be further elucidated with reference to the drawings and the specific embodiments.

As shown in fig. 1-2, a fixture for preventing warping of a PCB for SMT chip mounting,

the patch identification device comprises an upper cover 1 and a lower cover 2, wherein the upper cover 1 can be buckled on the lower cover 2, and a two-dimensional code identification area 11, an air vent 2 and a plurality of patch through holes 13 are arranged on the upper cover 1; be equipped with circuit board holding tank 21 on the lower cover 2, be full of air vent 3 in the circuit board holding tank 21, be equipped with magnetism disk 212 around the circuit board holding tank 21.

Two trapezoidal grooves I14 are respectively arranged on two sides of the upper cover 1 in parallel.

In this embodiment, the left side and the right side of the lower cover 2 are provided with a second trapezoidal groove 22, and the size of the second trapezoidal groove 22 is larger than that of the first trapezoidal groove 14.

In this embodiment, the two-dimensional code identification area 11 includes an installation sheet 111, two ends of the installation sheet 111 are fixed to the lower cover 2 by bolts 112, and a two-dimensional code 113 is printed in the middle of the installation sheet 111.

In this embodiment, the four corners of the circuit board accommodating groove 21 are provided with semicircular grooves 211.

In this embodiment, the depth of the semicircular groove 211 is greater than the depth of the circuit board accommodating groove 21.

In this embodiment, the patch through hole 13 includes a first through hole 131, a second through hole 132, a third through hole 133, a fourth through hole 134, a fifth through hole 135, and a sixth through hole 136, the through holes are formed at positions corresponding to elements on the PCB, and the two sides of the first through hole 131 are provided with the vent holes 3.

The examples are given solely for the purpose of illustration and are not intended to limit the scope of the invention, which is to be determined by those skilled in the art after reading the present disclosure, and all such equivalents are intended to fall within the scope of the invention as defined in the claims appended hereto.

Claims

1. The utility model provides a PCB circuit board SMT paster is used prevents warping board and warp tool which characterized in that: the patch identification device comprises an upper cover (1) and a lower cover (2), wherein the upper cover (1) can be buckled on the lower cover (2), and a two-dimensional code identification area (11), an air vent (3) and a plurality of patch through holes (13) are arranged on the upper cover (1); be equipped with circuit board holding tank (21) on lower cover (2), air vent (3) are covered fully in circuit board holding tank (21), be equipped with magnetism disk (212) around circuit board holding tank (21).

2. The jig of claim 1, wherein the jig is used for preventing the deformation of the warped plate for SMT (surface mount technology) mounting of the PCB and the circuit board, and comprises: two trapezoidal grooves I (14) are respectively arranged on two sides of the upper cover (1) in parallel.

3. The jig of claim 2, wherein the jig is used for preventing the deformation of the warped plate for SMT (surface mount technology) mounting of the PCB and the circuit board, and is characterized in that: the left side and the right side of the lower cover (2) are provided with a second trapezoidal groove (22), and the size of the second trapezoidal groove (22) is larger than that of the first trapezoidal groove (14).

4. The jig of claim 1, wherein the jig is used for preventing the deformation of the warped plate for SMT (surface mount technology) mounting of the PCB and the circuit board, and comprises: the two-dimensional code identification area (11) comprises an installation sheet (111), two ends of the installation sheet (111) are fixed on the lower cover (2) through bolts (112), and a two-dimensional code (113) is printed in the middle of the installation sheet (111).

5. The jig of claim 1, wherein the jig is used for preventing the deformation of the warped plate for SMT (surface mount technology) mounting of the PCB and the circuit board, and comprises: and semicircular grooves (211) are formed in four corners of the circuit board accommodating groove (21).

6. The jig of claim 5, wherein the jig is used for preventing the deformation of the warped plate for SMT of the PCB and the PCB, and comprises: the depth of the semicircular groove (211) is greater than that of the circuit board accommodating groove (21).

7. The jig of claim 1, wherein the jig is used for preventing the deformation of the warped plate for SMT (surface mount technology) mounting of the PCB and the circuit board, and comprises: the patch transmission hole (13) comprises a first transmission hole (131), a second transmission hole (132), a third transmission hole (133), a fourth transmission hole (134), a fifth transmission hole (135) and a sixth transmission hole (136), the transmission holes are formed in positions corresponding to elements on the PCB, and ventilation holes (3) are formed in two sides of the first transmission hole (131).