CN201509363U - Metal base plate assembled with a printed circuit board - Google Patents
Metal base plate assembled with a printed circuit board Download PDFInfo
- Publication number
- CN201509363U CN201509363U CN2009201633129U CN200920163312U CN201509363U CN 201509363 U CN201509363 U CN 201509363U CN 2009201633129 U CN2009201633129 U CN 2009201633129U CN 200920163312 U CN200920163312 U CN 200920163312U CN 201509363 U CN201509363 U CN 201509363U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- base plate
- groove
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The utility model discloses a metal base plate assembled with a printed circuit board. A groove is arranged one surface of the metal base plate which does not contact with the printed circuit board. The cross section shape, the size and the position of the groove are adjusted based on the actual stress deformation and printed circuit board layout condition and the stress generated during mechanical process of the metal base plate is completely eliminated by the groove and the base plate deformation is reduced to the most and the printed circuit board deformation due to metal base plate is greatly reduced after the printed circuit board and the metal base plate are mounted by cementation and nut and the damage on the printed circuit board is greatly reduced during deformation resilience process. In addition, the electronic product weight is reduced and the dissipation area of the metal base plate is increased by the groove.
Description
Technical field
The utility model relates to the electronic product processing technique field, relates in particular to metal substrate a kind of and PCB (PrintedCircuit Board, printed circuit board (PCB)) assembling.
Background technology
In the processing and making process of association area circuit boards such as electronics, communication, the assembling of pcb board usually is that pcb board is bonded on the metal substrate, and realize by screw.Metal substrate is out of shape because of producing stress in mechanical processing process easily because overall dimension is big, thinner thickness, and destroys pcb board easily after metal substrate and the PCB assembling in the stress springback process, has increased the percent defective of pcb board.Simultaneously, along with developing rapidly of electronics, communications industry, more and more higher requirement has been proposed product weight.
Existing patent documentation comprises: and metal liner base plate and European patent DE3831551A1 " Printedcircuit board ".
Chinese patent CN200620015205 has proposed a kind of metal substrate structural member, just be provided with two grooves that the transfer equipment guide rail is installed at metal substrate downside two ends, when transmitting metal substrate also with its direct location, the pallet grippers of having used when having saved assembling, be convenient to PCB is carried out surface encapsulation and assembling, be not easy to generate stress and problem on deformation but this scheme solves metal substrate.
A kind of printed circuit board (PCB) of the record of European patent DE3831551A1, disclose with PCB and carried out SMT (Surface Mounted Technology, surface mounting technology) Zu Zhuan metal substrate, on metal substrate, designed at least one and be used for fixing the jag of PCB components and parts, the PCB components and parts can be located and insert accurately and conveniently with the contact-making surface of pcb board.What this patent solved only is PCB components and parts installation questions, does not also solve metal substrate and is easy to generate stress and problem on deformation.
The utility model content
The technical problem that the utility model solves is, metal substrate a kind of and the printed circuit board (PCB) assembling is provided, and overcomes the defective that existing metal is easy to generate stress deformation substantially, alleviates the infringement that thus printed circuit board (PCB) is caused simultaneously.
The technical solution adopted in the utility model is, the metal substrate of described and printed circuit board (PCB) assembling, and the one side that does not contact with printed circuit board (PCB) at metal substrate is provided with groove.
Described groove is crisscross groove.
Described groove is at least one not staggered groove.
The shape of cross section of described groove is rectangle or U type or trapezoidal.
The shape of cross section of described groove, size and position all can be adjusted according to the layout situation of actual stress distortion and printed circuit board component.
Adopt technique scheme, the utility model has following advantage at least:
The metal substrate of assembling with printed circuit board (PCB) described in the utility model, the one side that does not contact with printed circuit board (PCB) at metal substrate is provided with groove.The shape of cross section of groove, size and position all can be adjusted according to actual stress distortion and printed circuit board layout situation, fully eliminated the stress that produces in the metal substrate mechanical processing process by groove, at utmost reduced base plate deformation, greatly reduce after printed circuit board (PCB) plate and metal substrate install by bonding and screw, the distortion of metal substrate distortion causing printed circuit board (PCB), and the infringement that in the deformation resilience process, printed circuit board (PCB) is caused.In addition,, also reduced electronic product weight, increased the metal substrate area of dissipation owing to be provided with groove.
Description of drawings
Elevational sectional view when Fig. 1 is the utility model metal substrate and printed circuit board (PCB) assembling;
Fig. 2 is provided with the vertical view of groove one side for the utility model metal substrate.
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined purpose is taked, below in conjunction with accompanying drawing and preferred embodiment, to the metal substrate of described and the printed circuit board (PCB) assembling that the utility model proposes, describe in detail as after.
The metal substrate of assembling with printed circuit board (PCB) described in the utility model, as shown in Figure 1, the one side that does not contact with printed circuit board (PCB) 1 at metal substrate is provided with groove 2, groove 2 can be set to crisscross groove, as shown in Figure 2, also can be at least one not staggered groove, the shape of cross section of groove 2 is a rectangle, also can be U type or trapezoidal, groove cross section shape, size with and the position of the one side setting that do not contact at metal substrate with printed circuit board (PCB) all can adjust according to the layout situation of actual stress distortion and printed circuit board component.
Explanation by embodiment, can be to reach technological means and the effect that predetermined purpose takes to be able to more deeply and concrete understanding to the utility model, yet appended diagram only provide with reference to the usefulness of explanation, be not to be used for the utility model is limited.
Claims (4)
1. a metal substrate of assembling with printed circuit board (PCB) is characterized in that the one side that does not contact with printed circuit board (PCB) at metal substrate is provided with groove.
2. according to the described metal substrate of assembling with printed circuit board (PCB) of claim 1, it is characterized in that described groove is crisscross groove.
3. according to the described metal substrate of assembling with printed circuit board (PCB) of claim 1, it is characterized in that described groove is at least one staggered groove.
4. according to claim 1 or the 2 or 3 described metal substrates of assembling with printed circuit board (PCB), it is characterized in that the shape of cross section of described groove is rectangle or U type or trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201633129U CN201509363U (en) | 2009-07-07 | 2009-07-07 | Metal base plate assembled with a printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201633129U CN201509363U (en) | 2009-07-07 | 2009-07-07 | Metal base plate assembled with a printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201509363U true CN201509363U (en) | 2010-06-16 |
Family
ID=42470481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201633129U Expired - Fee Related CN201509363U (en) | 2009-07-07 | 2009-07-07 | Metal base plate assembled with a printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201509363U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102377919A (en) * | 2010-08-17 | 2012-03-14 | 深圳富泰宏精密工业有限公司 | Camera module and portable electronic device utilizing same |
| CN103227154A (en) * | 2012-01-27 | 2013-07-31 | 英飞凌科技股份有限公司 | Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with pressed baseplate |
| CN103258805A (en) * | 2013-04-17 | 2013-08-21 | 南通富士通微电子股份有限公司 | Semiconductor device chip scale package structure |
| AT14114U1 (en) * | 2013-09-20 | 2015-04-15 | Mikroelektronik Ges Mit Beschränkter Haftung Ab | Support plate for a power electronics module |
| WO2016197645A1 (en) * | 2016-01-08 | 2016-12-15 | 中兴通讯股份有限公司 | Electronic device, and method and system for compensating stress-sensitive parameter |
| WO2020098380A1 (en) * | 2018-11-16 | 2020-05-22 | 京东方科技集团股份有限公司 | Backplane, backlight module, and display device |
| WO2021109964A1 (en) * | 2019-12-06 | 2021-06-10 | 阳光电源股份有限公司 | Radiator and electrical device |
-
2009
- 2009-07-07 CN CN2009201633129U patent/CN201509363U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102377919A (en) * | 2010-08-17 | 2012-03-14 | 深圳富泰宏精密工业有限公司 | Camera module and portable electronic device utilizing same |
| CN103227154B (en) * | 2012-01-27 | 2017-05-03 | 英飞凌科技股份有限公司 | Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with pressed baseplate |
| CN103227154A (en) * | 2012-01-27 | 2013-07-31 | 英飞凌科技股份有限公司 | Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with pressed baseplate |
| CN103258805A (en) * | 2013-04-17 | 2013-08-21 | 南通富士通微电子股份有限公司 | Semiconductor device chip scale package structure |
| CN103258805B (en) * | 2013-04-17 | 2015-11-25 | 南通富士通微电子股份有限公司 | semiconductor device chip scale package structure |
| AT14114U1 (en) * | 2013-09-20 | 2015-04-15 | Mikroelektronik Ges Mit Beschränkter Haftung Ab | Support plate for a power electronics module |
| WO2016197645A1 (en) * | 2016-01-08 | 2016-12-15 | 中兴通讯股份有限公司 | Electronic device, and method and system for compensating stress-sensitive parameter |
| CN106960067A (en) * | 2016-01-08 | 2017-07-18 | 中兴通讯股份有限公司 | A kind of electronic installation, the compensation method of stress sensitive parameter and system |
| US11140771B2 (en) | 2016-01-08 | 2021-10-05 | Xi'an Zhongxing New Software Co., Ltd. | Electronic device, and method and system for compensating stress-sensitive parameter |
| CN106960067B (en) * | 2016-01-08 | 2021-11-12 | 中兴通讯股份有限公司 | Electronic device, and method and system for compensating stress sensitive parameters |
| WO2020098380A1 (en) * | 2018-11-16 | 2020-05-22 | 京东方科技集团股份有限公司 | Backplane, backlight module, and display device |
| US11243581B2 (en) | 2018-11-16 | 2022-02-08 | Beijing Boe Technology Development Co., Ltd. | Backplate, backlight module and display device |
| WO2021109964A1 (en) * | 2019-12-06 | 2021-06-10 | 阳光电源股份有限公司 | Radiator and electrical device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201509363U (en) | Metal base plate assembled with a printed circuit board | |
| EP1909377A4 (en) | Drive circuit of motor and outdoor unit of air conditioner | |
| TW200634915A (en) | Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus | |
| CN201112783Y (en) | Electric connector | |
| CN111083885A (en) | Laminating method and device for metal-based printed circuit board | |
| WO2009037833A1 (en) | Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module | |
| CN101636070B (en) | Fixing and matching structure | |
| CN201298543Y (en) | Fixing mould of lapping and packaging piece | |
| KR200456269Y1 (en) | Clip type terminal | |
| KR100853319B1 (en) | An angle adjusting and arraying apparatus of number of pcbs for a pcb surface mounting screen printer | |
| CN105101630A (en) | Printed circuit board panel and manufacturing method thereof | |
| CN101641007B (en) | Chip mounter suction nozzle | |
| CN101426361A (en) | Chip mounter | |
| CN207733137U (en) | A kind of lateral Fast Installation enclosed structure | |
| CN204191028U (en) | A kind of chip mounter PCB connecting gear with positioning function | |
| CN203327477U (en) | Supporting member with shielding function for mobile phone | |
| CN105578786A (en) | Processing and positioning component for pcb | |
| CN206260206U (en) | A kind of loading plate structure of LED chip mounter | |
| CN111615263A (en) | Laminating method and device for metal-based printed circuit board | |
| CN220606183U (en) | Novel jig for BGA dense products | |
| CN101489359A (en) | Method for avoiding solder bridge | |
| CN221203059U (en) | Isolation supporting plate with magnetic piece fixing spring piece | |
| CN219718600U (en) | Shockproof copper-clad plate mounting structure | |
| CN220511342U (en) | Circuit board resin plug hole structure | |
| KR20140047909A (en) | Screen printer having support device of stencil mask |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20170707 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |