CN102534589B - Copper block surface brown oxidation method - Google Patents

Copper block surface brown oxidation method Download PDF

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Publication number
CN102534589B
CN102534589B CN 201110444976 CN201110444976A CN102534589B CN 102534589 B CN102534589 B CN 102534589B CN 201110444976 CN201110444976 CN 201110444976 CN 201110444976 A CN201110444976 A CN 201110444976A CN 102534589 B CN102534589 B CN 102534589B
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brown
chassis
oxidation
copper billet
cover plate
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CN 201110444976
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Chinese (zh)
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CN102534589A (en
Inventor
纪成光
曾志军
杜红兵
陶伟
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Shengyi Electronics Co Ltd
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Dongguan Shengyi Electronics Co Ltd
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Abstract

The invention relates to a copper block surface brown oxidation method which comprises the following steps: step one, providing a brown oxidation tool clamp which comprises a chassis and a cover plate covering the chassis, wherein a plurality of accepting grooves arranged with intervals are disposed on the chassis, and a plurality of uniformly-distributed through holes are disposed respectively on the chassis and the cover plate and correspond to the accepting grooves; step two, opening the cover plate, putting copper blocks to be treated by brown oxidation in the accepting grooves of the chassis of the brown oxidation tool clamp; step three, covering the cover plate of the brown oxidation tool clamp on the chassis so as to cover the copper blocks to be treated by brown oxidation in the accepting grooves; step four, putting brown oxidation tool clamp with the copper blocks to be treated by brown oxidation on a brown oxidation production line, performing brown oxidation treatment of the copper block surfaces; step five, after the brown oxidation treatment is completed, opening the cover plate, taking out the copper blocks treated by brown oxidation. The copper block surface brown oxidation method of the invention is convenient for operation, and can realize surface brown oxidation treatment of small-size copper blocks.

Description

The brown method for oxidation in copper billet surface
Technical field
The present invention relates to printed circuit board (pcb) and make the field, relate in particular to the brown method for oxidation in a kind of copper billet surface.
Background technology
Bury the copper billet pcb board refers to imbed copper billet in local location, individual layers pcb board, be embedded in the copper billet surface and need carry out the processing of brown oxidation or black oxidation usually, to improve the bonding strength of copper billet and prepreg.Brown oxidation production line in the existing PCB manufacturing processed mostly is sea line roller rumble transmission design, for the less copper billet of size (size is smaller or equal to 70mm * 80mm), if directly carry out brown oxidation, very easily clamp, fall cylinder, even can not carry out brown oxidation.Therefore, the existing small size copper billet surface of imbedding adopts black oxidation to handle usually, but there is following shortcoming in copper billet surface black oxide treatment: 1, adopt the black oxidation Hanging Basket vertically to soak, oxidation treatment time is longer, and production efficiency is low, the production cost height; 2, be combined reliability with prepreg lower for the copper billet handled of black oxidation, is prone to the defective that copper billet separates with prepreg during pb-free solder, reduce built-in or in bury the copper billet pcb board work reliability and electric property.
Summary of the invention
Therefore, the object of the present invention is to provide the brown method for oxidation in a kind of copper billet surface, can realize the surperficial brown oxidation that the copper billet to reduced size carries out.
For achieving the above object, the invention provides the brown method for oxidation in a kind of copper billet surface, comprise the steps:
Step 1: brown oxidation frock clamp is provided, this brown oxidation frock clamp comprises the chassis and is covered on cover plate on this chassis, this chassis is provided with several accepting grooves that is set in distance, corresponding accepting groove offers several through holes that are evenly distributed respectively on described chassis and the cover plate, and the size of described through hole is less than the size of the copper billet for the treatment of brown oxide treatment;
Step 2: open cover plate, the copper billet for the treatment of brown oxide treatment is put into the accepting groove on the chassis of brown oxidation frock clamp;
Step 3: the cover plate of brown oxidation frock clamp covered on the chassis be covered in the accepting groove with the copper billet that will treat brown oxide treatment;
Step 4: the brown oxidation frock clamp that will put into the copper billet for the treatment of brown oxide treatment is put in brown oxidation production line, and brown oxide treatment is carried out on the copper billet surface;
Step 5; After finishing brown oxide treatment, open cover plate, the copper billet from the chassis of brown oxidation frock clamp after the brown oxide treatment of taking-up.
The chassis of described brown oxidation frock clamp comprises base plate and is around in described base plate framework on every side, and surround a receiving space by described base plate and framework, be provided with crisscross several crossbeams in this receiving space described receiving space is separated into described several accepting grooves, be provided with reinforced bulkhead around the described cover plate.
The chassis of described brown oxidation frock clamp adopts hinge to be connected with cover plate.
The material of described chassis and cover plate is Stainless Steel Alloy or titanium alloy.
Spacing between the described through hole is 0.5-1mm.
Described chassis and cover plate are made by the light central layer, the accepting groove on the described chassis recessed blind groove in light central layer surface of serving as reasons, through hole on the described chassis comprises a large-size through hole that is positioned at the accepting groove centre and is distributed in described large-size through hole several reduced size through holes on every side that the size of described large-size through hole is less than the size of the copper billet for the treatment of surperficial brown oxidation in the accepting groove.
Described accepting groove and large-size through hole are all rectangular, described reduced size through hole is rounded, the set through hole of corresponding accepting groove is the long strip shape through hole on the described cover plate, the width of described through hole is less than the size of accepting groove at this width, and less than the size of the copper billet for the treatment of surperficial brown oxidation in the accepting groove at this width.
The chassis of described brown oxidation frock clamp adopts pin to be connected with cover plate.
Described chassis and cover plate are square, and the through hole on described chassis and the cover plate is square or rhombus.
Described accepting groove is square, and the size of accepting groove is smaller or equal to 70mm * 80mm.
Beneficial effect of the present invention: the brown method for oxidation in copper billet of the present invention surface, by adopting brown oxidation frock clamp to hold copper billet, several accepting grooves that are set in distance are set on the chassis of brown oxidation frock clamp hold and carry copper billet, and cover plate is set comes the cover cap copper billet, (size is less than the surperficial brown oxide treatment of copper billet of 70mm * 80mm) can to realize small size, this brown method for oxidation in copper billet surface, easy to operate; By at cover plate and chassis through hole being set, be conducive to brown oxidation liquid medicine and fully contact the copper billet surface, improve the oxidation effectiveness on copper billet surface, thereby improve the bonding strength of copper billet and prepreg, prevent that effectively copper billet from separating with prepreg, guarantee built-in or in bury copper billet pcb board reliability and reach pb-free solder (260 ℃ of top temperatures) requirement, improve built-in or in bury the copper billet pcb board work reliability and electric property.
For further setting forth technique means and the effect that the present invention takes for the predetermined purpose of realization, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, and the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention is described in detail, will make technical scheme of the present invention and other beneficial effects apparent.
In the accompanying drawing,
Fig. 1 is the schematic flow sheet of the brown method for oxidation in copper billet of the present invention surface;
Fig. 2 is the structural representation of a frock clamp of the brown method for oxidation employing in copper billet of the present invention surface;
Fig. 3 assembles synoptic diagram for the plane of another frock clamp that the brown method for oxidation in copper billet of the present invention surface adopts;
Fig. 4 is the decomposing schematic representation of frock clamp shown in Figure 3;
Fig. 5 is that Fig. 4 is along the sectional view of A-A line.
Embodiment
As shown in Figure 1, the brown method for oxidation in copper billet of the present invention surface comprises the steps:
Step 1: brown oxidation frock clamp is provided, this brown oxidation frock clamp comprises the chassis and is covered on cover plate on this chassis, this chassis is provided with several accepting grooves that is set in distance, corresponding accepting groove offers several through holes that are evenly distributed respectively on described chassis and the cover plate, and the size of described through hole is less than the size of the copper billet for the treatment of brown oxide treatment;
Step 2: open cover plate, the copper billet for the treatment of brown oxide treatment is put into the accepting groove on the chassis of brown oxidation frock clamp;
Step 3: the cover plate of brown oxidation frock clamp covered on the chassis be covered in the accepting groove with the copper billet that will treat brown oxide treatment;
Step 4: the brown oxidation frock clamp that will put into the copper billet for the treatment of brown oxide treatment is put in brown oxidation production line, and brown oxide treatment is carried out on the copper billet surface;
Step 5; After finishing brown oxide treatment, open cover plate, the copper billet from the chassis of brown oxidation frock clamp after the brown oxide treatment of taking-up.
As shown in Figure 2, be the structural representation of the employed frock clamp of the copper billet of the present invention brown method for oxidation in surface.This frock clamp comprises chassis 10 and cover plate 20, and this chassis 10 adopts hinge 30 to be connected with cover plate 20, and this chassis 10 is provided with several accepting grooves 15 that are set in distance.Chassis 10 comprises base plate 11 and is around in described base plate 11 framework 16 on every side, and surround a receiving space 13 by described base plate 11 and framework 16, be provided with crisscross several crossbeams 14 in this receiving space 13 described receiving space 13 is separated into described several accepting grooves 15.Corresponding accepting groove 15 offers several through holes 12,21 that are evenly distributed respectively on described chassis 10 and the cover plate 20, and described through hole 12,21 size are less than the size of the copper billet for the treatment of brown oxide treatment.Be provided with reinforced bulkhead 22 around the described cover plate 20, to strengthen the rigidity of cover plate 20.
Described chassis 10 is Stainless Steel Alloy or titanium alloy with the material of cover plate 20.
Spacing between the described through hole 12,21 is 0.5-1mm.
Described chassis 10 and cover plate 20 are square, and the through hole 12 on described chassis 10 and the cover plate 20,21 is square or rhombus.
Described accepting groove 15 is square, and the size of accepting groove 15 is smaller or equal to 70mm * 80mm.
To shown in Figure 5, be the structural representation of employed another frock clamp of the copper billet brown method for oxidation in surface of the present invention as Fig. 3.This frock clamp comprises chassis 10a and cover plate 20a, and described chassis 10a adopts pin 30a to be connected with cover plate 20a, and this chassis 10a is provided with several accepting grooves 15a that is set in distance.Described chassis 10a goes up corresponding accepting groove 15a with cover plate 20a and offers several through holes 12a, the 21a that is evenly distributed respectively.
Described chassis 10a and cover plate 20a are made by the light central layer, the accepting groove 15a of the described chassis 10a recessed blind groove in light central layer surface of serving as reasons, through hole 12a on the described chassis 10a comprises a large-size through hole 121 that is positioned at accepting groove 15a centre and is distributed in described large-size through hole 121 several reduced size through holes 122 on every side that the size of described large-size through hole 121 is less than the size for the treatment of the copper billet of surperficial brown oxidation among the accepting groove 15a.
Described accepting groove 15a and large-size through hole 121 are all rectangular, described reduced size through hole 122 is rounded, it is the long strip shape through hole that described cover plate 20a goes up the set through hole 21a of corresponding accepting groove 15a, the width of described through hole 21a is less than the size of accepting groove 15a at this width, and less than treating among the accepting groove 15a that the copper billet of surperficial brown oxidation is in the size of this width.
Described chassis 10a and cover plate 20a are square, and through hole 12a, the 21a on described chassis 10a and the cover plate 20a is square or rhombus.
Described accepting groove 15a is square, and the size of accepting groove 15a is smaller or equal to 70mm * 80mm.
The brown method for oxidation in copper billet of the present invention surface, by adopting brown oxidation frock clamp to hold copper billet, several accepting grooves that are set in distance are set on the chassis of brown oxidation frock clamp hold and carry copper billet, and cover plate is set comes the cover cap copper billet, (size is less than the surperficial brown oxide treatment of copper billet of 70mm * 80mm) can to realize small size, this brown method for oxidation in copper billet surface, easy to operate; By at cover plate and chassis through hole being set, be conducive to brown oxidation liquid medicine and fully contact the copper billet surface, improve the oxidation effectiveness on copper billet surface, thereby improve the bonding strength of copper billet and prepreg, prevent that effectively copper billet from separating with prepreg, guarantee built-in or in bury copper billet pcb board reliability and reach pb-free solder (260 ℃ of top temperatures) requirement, improve built-in or in bury the copper billet pcb board work reliability and electric property.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of accompanying Claim of the present invention.

Claims (5)

1. the brown method for oxidation in copper billet surface is characterized in that, comprises the steps:
Step 1: brown oxidation frock clamp is provided, this brown oxidation frock clamp comprises the chassis and is covered on cover plate on this chassis, this chassis is provided with several accepting grooves that is set in distance, corresponding accepting groove offers several through holes that are evenly distributed respectively on described chassis and the cover plate, and the size of described through hole is less than the size of the copper billet for the treatment of brown oxide treatment;
Step 2: open cover plate, the copper billet for the treatment of brown oxide treatment is put into the accepting groove on the chassis of brown oxidation frock clamp;
Step 3: the cover plate of brown oxidation frock clamp covered on the chassis be covered in the accepting groove with the copper billet that will treat brown oxide treatment;
Step 4: the brown oxidation frock clamp that will put into the copper billet for the treatment of brown oxide treatment is put in brown oxidation production line, and brown oxide treatment is carried out on the copper billet surface;
Step 5; After finishing brown oxide treatment, open cover plate, the copper billet from the chassis of brown oxidation frock clamp after the brown oxide treatment of taking-up;
Described chassis and cover plate are made by the light central layer, the accepting groove on the described chassis recessed blind groove in light central layer surface of serving as reasons, through hole on the described chassis comprises a large-size through hole that is positioned at the accepting groove centre and is distributed in described large-size through hole several reduced size through holes on every side that the size of described large-size through hole is less than the size of the copper billet for the treatment of surperficial brown oxidation in the accepting groove.
2. the brown method for oxidation in copper billet as claimed in claim 1 surface, it is characterized in that, described accepting groove and large-size through hole are all rectangular, described reduced size through hole is rounded, the set through hole of corresponding accepting groove is the long strip shape through hole on the described cover plate, the width of described through hole is less than the size of accepting groove at this width, and less than the size of the copper billet for the treatment of surperficial brown oxidation in the accepting groove at this width.
3. the brown method for oxidation in copper billet surface as claimed in claim 1 is characterized in that, the chassis of described brown oxidation frock clamp adopts pin to be connected with cover plate.
4. the brown method for oxidation in copper billet surface as claimed in claim 1 is characterized in that described chassis and cover plate are square, and the through hole on described chassis and the cover plate is square or rhombus.
5. the brown method for oxidation in copper billet surface as claimed in claim 4 is characterized in that described accepting groove is square, and the size of accepting groove is smaller or equal to 70mm * 80mm.
CN 201110444976 2011-12-26 2011-12-26 Copper block surface brown oxidation method Active CN102534589B (en)

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Application Number Priority Date Filing Date Title
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105636363B (en) * 2016-03-21 2018-10-09 奥士康科技股份有限公司 Multi-layer PCB core material brown film crashing
CN106211630A (en) * 2016-08-31 2016-12-07 开平依利安达电子第三有限公司 A kind of circuit board manufacturing jig of brown copper billet
CN114521068B (en) * 2020-11-19 2024-01-30 健鼎(无锡)电子有限公司 Method for browning copper block
CN114521069B (en) * 2020-11-19 2024-02-23 健鼎(无锡)电子有限公司 Copper block browning jig and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3244860A1 (en) * 1982-12-03 1984-06-07 Siemens AG, 1000 Berlin und 8000 München Apparatus for oxidising copper surfaces, in particular on printed circuit boards, by means of a horizontal continuous process
EP0730395A2 (en) * 1995-03-03 1996-09-04 Rockwell International Corporation Method of transporting and applying a surface treatment liquid using gas bubbles
CN101325842A (en) * 2007-06-15 2008-12-17 富葵精密组件(深圳)有限公司 Tool for flexible circuit board
CN201440756U (en) * 2009-07-21 2010-04-21 东莞康源电子有限公司 Sheet browned tin tool

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11202503A (en) * 1998-01-14 1999-07-30 Hitachi Cable Ltd Photomask fixing jig

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3244860A1 (en) * 1982-12-03 1984-06-07 Siemens AG, 1000 Berlin und 8000 München Apparatus for oxidising copper surfaces, in particular on printed circuit boards, by means of a horizontal continuous process
EP0730395A2 (en) * 1995-03-03 1996-09-04 Rockwell International Corporation Method of transporting and applying a surface treatment liquid using gas bubbles
CN101325842A (en) * 2007-06-15 2008-12-17 富葵精密组件(深圳)有限公司 Tool for flexible circuit board
CN201440756U (en) * 2009-07-21 2010-04-21 东莞康源电子有限公司 Sheet browned tin tool

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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of

Patentee after: Shengyi electronic Limited by Share Ltd

Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China

Patentee before: Dongguan Shengyi Electronics Ltd.