CN102498564B - 带散热器的功率模块用基板的制造方法、带散热器的功率模块用基板及功率模块 - Google Patents

带散热器的功率模块用基板的制造方法、带散热器的功率模块用基板及功率模块 Download PDF

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Publication number
CN102498564B
CN102498564B CN201080039784.9A CN201080039784A CN102498564B CN 102498564 B CN102498564 B CN 102498564B CN 201080039784 A CN201080039784 A CN 201080039784A CN 102498564 B CN102498564 B CN 102498564B
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China
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heat sink
metal plate
ceramic substrate
metal
substrate
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Expired - Fee Related
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CN201080039784.9A
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English (en)
Chinese (zh)
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CN102498564A (zh
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殿村宏史
长友义幸
黑光祥郎
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
CN201080039784.9A 2009-09-09 2010-09-07 带散热器的功率模块用基板的制造方法、带散热器的功率模块用基板及功率模块 Expired - Fee Related CN102498564B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2009208438 2009-09-09
JP2009-208438 2009-09-09
JP2009208439 2009-09-09
JP2009-208439 2009-09-09
JP2009-252114 2009-11-02
JP2009252114 2009-11-02
JP2009-252115 2009-11-02
JP2009252115 2009-11-02
PCT/JP2010/065316 WO2011030754A1 (ja) 2009-09-09 2010-09-07 ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンク付パワーモジュール用基板及びパワーモジュール

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CN102498564A CN102498564A (zh) 2012-06-13
CN102498564B true CN102498564B (zh) 2015-08-26

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CN201080039784.9A Expired - Fee Related CN102498564B (zh) 2009-09-09 2010-09-07 带散热器的功率模块用基板的制造方法、带散热器的功率模块用基板及功率模块

Country Status (7)

Country Link
US (1) US9076755B2 (https=)
EP (1) EP2477217B1 (https=)
KR (1) KR101690820B1 (https=)
CN (1) CN102498564B (https=)
IN (1) IN2012DN02727A (https=)
TW (1) TWI521651B (https=)
WO (1) WO2011030754A1 (https=)

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WO2013089099A1 (ja) * 2011-12-12 2013-06-20 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、フラックス成分侵入防止層形成用ペーストおよび接合体の接合方法
JP5403129B2 (ja) * 2012-03-30 2014-01-29 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、及びパワーモジュール用基板の製造方法
JP5918008B2 (ja) * 2012-05-08 2016-05-18 昭和電工株式会社 冷却器の製造方法
JP5549958B2 (ja) 2012-09-21 2014-07-16 三菱マテリアル株式会社 アルミニウム部材と銅部材との接合構造
TWI600126B (zh) * 2012-10-16 2017-09-21 三菱綜合材料股份有限公司 附散熱座功率模組用基板，附散熱座功率模組，及附散熱座功率模組用基板之製造方法
JP6307832B2 (ja) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール
JP2014165456A (ja) * 2013-02-27 2014-09-08 Fujitsu Mobile Communications Ltd 電子機器及び電子機器のリアケース
JP6621076B2 (ja) * 2013-03-29 2019-12-18 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板及びパワーモジュール
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JP6079505B2 (ja) * 2013-08-26 2017-02-15 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
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JP6341822B2 (ja) * 2014-09-26 2018-06-13 三菱電機株式会社 半導体装置
EP3208839B1 (en) * 2014-10-16 2021-07-28 Mitsubishi Materials Corporation Substrate with cooler for power modules and method for producing same
CN105742252B (zh) * 2014-12-09 2019-05-07 台达电子工业股份有限公司 一种功率模块及其制造方法
US9693488B2 (en) * 2015-02-13 2017-06-27 Deere & Company Electronic assembly with one or more heat sinks
JP6332108B2 (ja) * 2015-03-30 2018-05-30 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
CN104779228B (zh) * 2015-04-14 2018-09-28 天津大学 一种功率半导体模块三维封装的结构和方法
CN208369332U (zh) * 2017-05-17 2019-01-11 德昌电机(深圳)有限公司 一种电机、电路板及应用该电机的引擎冷却模组
KR102505443B1 (ko) * 2017-11-16 2023-03-03 삼성전기주식회사 인쇄회로기판
CN113133264B (zh) * 2019-12-30 2023-06-23 惠州视维新技术有限公司 一种散热结构、散热结构的制作方法及显示装置
EP3852138B1 (en) 2020-01-20 2023-11-08 Infineon Technologies Austria AG An electronic module comprising a semiconductor package connected to a fluid heatsink
JP7363613B2 (ja) * 2020-03-13 2023-10-18 三菱マテリアル株式会社 ヒートシンク一体型絶縁回路基板
CN115039217A (zh) * 2020-03-18 2022-09-09 三菱综合材料株式会社 绝缘电路基板
TWI759199B (zh) * 2021-05-07 2022-03-21 艾姆勒車電股份有限公司 具有非矩形散熱層的散熱基材結構
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Publication number Publication date
KR20120062751A (ko) 2012-06-14
IN2012DN02727A (https=) 2015-09-11
CN102498564A (zh) 2012-06-13
TW201140764A (en) 2011-11-16
US20130010429A1 (en) 2013-01-10
EP2477217B1 (en) 2019-05-08
US9076755B2 (en) 2015-07-07
KR101690820B1 (ko) 2016-12-28
WO2011030754A1 (ja) 2011-03-17
TWI521651B (zh) 2016-02-11
EP2477217A1 (en) 2012-07-18
EP2477217A4 (en) 2018-01-24

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