CN102478924A - 散热模组 - Google Patents
散热模组 Download PDFInfo
- Publication number
- CN102478924A CN102478924A CN201010557632XA CN201010557632A CN102478924A CN 102478924 A CN102478924 A CN 102478924A CN 201010557632X A CN201010557632X A CN 201010557632XA CN 201010557632 A CN201010557632 A CN 201010557632A CN 102478924 A CN102478924 A CN 102478924A
- Authority
- CN
- China
- Prior art keywords
- fan
- heat radiation
- radiation module
- fin group
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
散热模组 | 100 |
散热鳍片组 | 10 |
散热片 | 11 |
穿孔 | 13 |
缺口 | 15 |
风扇 | 20 |
外壳 | 22 |
底板 | 221 |
顶板 | 222 |
侧板 | 223 |
入风口 | 23 |
叶轮 | 24 |
出风口 | 25 |
枢轴 | 26 |
固定片 | 27 |
固定孔 | 270 |
吸热板 | 30 |
固定架 | 40 |
支撑件 | 42 |
抵压板 | 421 |
固定臂 | 422 |
第一边框 | 423 |
第二边框 | 424 |
支撑臂 | 425 |
安装孔 | 426 |
固定柱 | 427 |
中心孔 | 428 |
凹槽 | 429 |
连接件 | 43 |
通孔 | 430 |
水平板 | 431 |
竖直板 | 432 |
凸耳 | 435 |
折边 | 436 |
枢轴孔 | 437 |
定位孔 | 439 |
螺钉 | 45 |
弹簧螺钉 | 46 |
热管 | 50 |
蒸发段 | 51 |
冷凝段 | 52 |
连接段 | 53 |
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010557632XA CN102478924A (zh) | 2010-11-24 | 2010-11-24 | 散热模组 |
US12/979,301 US20120125566A1 (en) | 2010-11-24 | 2010-12-27 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010557632XA CN102478924A (zh) | 2010-11-24 | 2010-11-24 | 散热模组 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102478924A true CN102478924A (zh) | 2012-05-30 |
Family
ID=46063220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010557632XA Pending CN102478924A (zh) | 2010-11-24 | 2010-11-24 | 散热模组 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120125566A1 (zh) |
CN (1) | CN102478924A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103576807A (zh) * | 2012-07-23 | 2014-02-12 | 鸿富锦精密工业(深圳)有限公司 | 散热模组 |
CN105744799A (zh) * | 2014-12-12 | 2016-07-06 | 鸿富锦精密工业(武汉)有限公司 | 散热装置及散热系统 |
CN109302827A (zh) * | 2017-07-25 | 2019-02-01 | 鸿富锦精密工业(武汉)有限公司 | 散热模组及采用该散热模组的电子装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI507859B (zh) * | 2010-12-31 | 2015-11-11 | Hon Hai Prec Ind Co Ltd | 散熱裝置 |
TW201405291A (zh) * | 2012-07-20 | 2014-02-01 | Hon Hai Prec Ind Co Ltd | 散熱模組 |
US11592881B2 (en) * | 2020-04-28 | 2023-02-28 | Dell Products L.P. | Tool-less apparatus and methods for sealing the flow of cooling fan air to a heat exchanger |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5421402A (en) * | 1994-11-22 | 1995-06-06 | Lin; Chuen-Sheng | Heat sink apparatus |
CN2454806Y (zh) * | 2000-08-09 | 2001-10-17 | 宏碁电脑股份有限公司 | 散热装置 |
CN2530350Y (zh) * | 2001-10-30 | 2003-01-08 | 戴胜熙 | 中央处理器的散热模组 |
US20050199370A1 (en) * | 2004-03-15 | 2005-09-15 | Huang Ming T. | Heat dissipation module for CPU |
US20060144558A1 (en) * | 2004-12-30 | 2006-07-06 | Inventec Corporation | Fan-driven heat dissipating device with enhanced air blowing efficiency |
US20070230125A1 (en) * | 2006-04-03 | 2007-10-04 | Aopen Inc. | Assembly of heat-dissipating device and circuit board |
US20080137301A1 (en) * | 2006-12-09 | 2008-06-12 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6711015B2 (en) * | 2002-02-04 | 2004-03-23 | Acer Inc. | Device for cooling CPU chip |
TW564971U (en) * | 2003-01-10 | 2003-12-01 | Hon Hai Prec Ind Co Ltd | A heat dissipating assembly |
US6901992B2 (en) * | 2003-06-25 | 2005-06-07 | Delphi Technologies, Inc. | Fastenerless mounting bracket for heat exchangers |
TWI256874B (en) * | 2004-05-10 | 2006-06-11 | Asustek Comp Inc | Heat sink assembly with rotatable fins |
TW200701871A (en) * | 2005-06-24 | 2007-01-01 | Micro Star Int Co Ltd | Heat dissipation device |
US7699094B2 (en) * | 2006-04-28 | 2010-04-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber heat sink |
CN101193531B (zh) * | 2006-11-29 | 2010-12-01 | 富准精密工业(深圳)有限公司 | 散热装置 |
US7661466B2 (en) * | 2007-04-18 | 2010-02-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fin also functioning as a supporting bracket |
TWM341877U (en) * | 2007-10-24 | 2008-10-01 | Akust Technology Co Ltd | Heat sink fan stand for memory card |
-
2010
- 2010-11-24 CN CN201010557632XA patent/CN102478924A/zh active Pending
- 2010-12-27 US US12/979,301 patent/US20120125566A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5421402A (en) * | 1994-11-22 | 1995-06-06 | Lin; Chuen-Sheng | Heat sink apparatus |
CN2454806Y (zh) * | 2000-08-09 | 2001-10-17 | 宏碁电脑股份有限公司 | 散热装置 |
CN2530350Y (zh) * | 2001-10-30 | 2003-01-08 | 戴胜熙 | 中央处理器的散热模组 |
US20050199370A1 (en) * | 2004-03-15 | 2005-09-15 | Huang Ming T. | Heat dissipation module for CPU |
US20060144558A1 (en) * | 2004-12-30 | 2006-07-06 | Inventec Corporation | Fan-driven heat dissipating device with enhanced air blowing efficiency |
US20070230125A1 (en) * | 2006-04-03 | 2007-10-04 | Aopen Inc. | Assembly of heat-dissipating device and circuit board |
US20080137301A1 (en) * | 2006-12-09 | 2008-06-12 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103576807A (zh) * | 2012-07-23 | 2014-02-12 | 鸿富锦精密工业(深圳)有限公司 | 散热模组 |
CN105744799A (zh) * | 2014-12-12 | 2016-07-06 | 鸿富锦精密工业(武汉)有限公司 | 散热装置及散热系统 |
CN109302827A (zh) * | 2017-07-25 | 2019-02-01 | 鸿富锦精密工业(武汉)有限公司 | 散热模组及采用该散热模组的电子装置 |
Also Published As
Publication number | Publication date |
---|---|
US20120125566A1 (en) | 2012-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170517 Address after: Guangdong, Chancheng Province West Industrial Zone, 35 North Road, Warburg, No. Applicant after: Quanyida Technology (Foshan) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. Applicant before: Foxconn Precision Industry Co., Ltd. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120530 |