CN102473825B - 发光二极管和用于制造发光二极管的方法 - Google Patents

发光二极管和用于制造发光二极管的方法 Download PDF

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Publication number
CN102473825B
CN102473825B CN201080031876.2A CN201080031876A CN102473825B CN 102473825 B CN102473825 B CN 102473825B CN 201080031876 A CN201080031876 A CN 201080031876A CN 102473825 B CN102473825 B CN 102473825B
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CN
China
Prior art keywords
light
emitting diode
supporting mass
reflecting element
backlight unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080031876.2A
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English (en)
Chinese (zh)
Other versions
CN102473825A (zh
Inventor
格特鲁德·克劳特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102473825A publication Critical patent/CN102473825A/zh
Application granted granted Critical
Publication of CN102473825B publication Critical patent/CN102473825B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
CN201080031876.2A 2009-07-15 2010-06-29 发光二极管和用于制造发光二极管的方法 Expired - Fee Related CN102473825B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009033287A DE102009033287A1 (de) 2009-07-15 2009-07-15 Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
DE102009033287.1 2009-07-15
PCT/EP2010/059217 WO2011006754A1 (de) 2009-07-15 2010-06-29 Leuchtdiode und verfahren zur herstellung einer leuchtdiode

Publications (2)

Publication Number Publication Date
CN102473825A CN102473825A (zh) 2012-05-23
CN102473825B true CN102473825B (zh) 2015-02-25

Family

ID=42670645

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080031876.2A Expired - Fee Related CN102473825B (zh) 2009-07-15 2010-06-29 发光二极管和用于制造发光二极管的方法

Country Status (7)

Country Link
US (1) US8581288B2 (https=)
EP (1) EP2454765A1 (https=)
JP (1) JP5685249B2 (https=)
KR (1) KR101649287B1 (https=)
CN (1) CN102473825B (https=)
DE (1) DE102009033287A1 (https=)
WO (1) WO2011006754A1 (https=)

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* Cited by examiner, † Cited by third party
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DE102009058421A1 (de) * 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
DE102010026344A1 (de) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
ES2693677T3 (es) * 2011-11-17 2018-12-13 Lumens Co., Ltd. Paquete de un dispositivo emisor de luz y retroiluminación que incluye el mismo
WO2015068072A1 (en) * 2013-11-07 2015-05-14 Koninklijke Philips N.V. Substrate for led with total-internal reflection layer surrounding led
US10246348B2 (en) 2015-06-08 2019-04-02 Rayvio Corporation Ultraviolet disinfection system
US9834456B2 (en) 2015-06-08 2017-12-05 Rayvio Corporation Ultraviolet disinfection system
US9540252B1 (en) * 2015-06-08 2017-01-10 Rayvio Corporation Ultraviolet disinfection system
DE102017110850B4 (de) * 2017-05-18 2024-12-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
TWI648878B (zh) * 2018-05-15 2019-01-21 東貝光電科技股份有限公司 Led發光源、led發光源之製造方法及其直下式顯示器
DE102018132542A1 (de) 2018-12-17 2020-06-18 Osram Opto Semiconductors Gmbh Optoelektronische leuchtvorrichtung und herstellungsverfahren
CN113228312B (zh) 2018-12-27 2024-08-13 波主有限公司 半导体发光器件
KR20200129867A (ko) * 2019-05-10 2020-11-18 안상정 반도체 발광소자
DE112019006996B4 (de) * 2019-03-08 2025-07-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung optoelektronischer halbleiterbauelemente
KR102737389B1 (ko) * 2020-04-17 2024-12-03 닝보 선푸 엘이디 컴퍼니 리미티드 자외선 ｌｅｄ 장치
WO2024227770A1 (en) * 2023-05-03 2024-11-07 Ams-Osram International Gmbh Package for a semiconductor chip, optoelectronic semiconductor device, method for manufacturing a package for a semiconductor chip and method for manufacturing an optoelectronic semiconductor device
WO2024235649A1 (en) * 2023-05-17 2024-11-21 Ams-Osram International Gmbh Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device
DE102023136869A1 (de) * 2023-12-29 2025-07-03 Ams-Osram International Gmbh Herstellung eines strahlungsemittierenden bauelements

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996021168A1 (en) * 1995-01-06 1996-07-11 W.L. Gore & Associates, Inc. Light reflectant surface and method for making and using same
WO2003038912A2 (de) * 2001-10-31 2003-05-08 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement
US20040032728A1 (en) * 2002-08-19 2004-02-19 Robert Galli Optical assembly for LED chip package
CN1934715A (zh) * 2004-03-23 2007-03-21 奥斯兰姆奥普托半导体有限责任公司 具有多部件的壳体的光电子组件
CN101088172A (zh) * 2004-11-03 2007-12-12 特里多尼克光电子有限公司 具有颜色转换材料的发光二极管排布
US20080062688A1 (en) * 2006-09-11 2008-03-13 3M Innovative Properties Company Illumination devices and methods for making the same
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof

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JP3003500B2 (ja) 1994-04-28 2000-01-31 ダイキン工業株式会社 ポリテトラフルオロエチレン複合多孔膜
US6950220B2 (en) * 2002-03-18 2005-09-27 E Ink Corporation Electro-optic displays, and methods for driving same
ES2251893T1 (es) 2003-04-04 2006-05-16 Novozymes A/S Reduccion de la viscosidad de una pasta.
JP4183175B2 (ja) 2003-04-21 2008-11-19 京セラ株式会社 発光素子収納用パッケージおよび発光装置
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7537374B2 (en) * 2005-08-27 2009-05-26 3M Innovative Properties Company Edge-lit backlight having light recycling cavity with concave transflector
US7601989B2 (en) * 2007-03-27 2009-10-13 Philips Lumileds Lighting Company, Llc LED with porous diffusing reflector
US8469575B2 (en) * 2007-05-20 2013-06-25 3M Innovative Properties Company Backlight and display system using same
JP2009032943A (ja) 2007-07-27 2009-02-12 Japan Gore Tex Inc 発光素子用プリント配線基板
JP5702151B2 (ja) * 2008-02-07 2015-04-15 スリーエム イノベイティブ プロパティズ カンパニー 構造化フィルムを有する中空のバックライト
EP2252828A1 (en) * 2008-02-22 2010-11-24 3M Innovative Properties Company Backlights having selected output light flux distributions and display systems using same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996021168A1 (en) * 1995-01-06 1996-07-11 W.L. Gore & Associates, Inc. Light reflectant surface and method for making and using same
WO2003038912A2 (de) * 2001-10-31 2003-05-08 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement
US20040032728A1 (en) * 2002-08-19 2004-02-19 Robert Galli Optical assembly for LED chip package
CN1934715A (zh) * 2004-03-23 2007-03-21 奥斯兰姆奥普托半导体有限责任公司 具有多部件的壳体的光电子组件
CN101088172A (zh) * 2004-11-03 2007-12-12 特里多尼克光电子有限公司 具有颜色转换材料的发光二极管排布
US20080062688A1 (en) * 2006-09-11 2008-03-13 3M Innovative Properties Company Illumination devices and methods for making the same
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof

Also Published As

Publication number Publication date
CN102473825A (zh) 2012-05-23
WO2011006754A1 (de) 2011-01-20
US8581288B2 (en) 2013-11-12
DE102009033287A1 (de) 2011-01-20
KR101649287B1 (ko) 2016-08-18
KR20120039023A (ko) 2012-04-24
JP5685249B2 (ja) 2015-03-18
EP2454765A1 (de) 2012-05-23
US20120132947A1 (en) 2012-05-31
JP2012533182A (ja) 2012-12-20

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Granted publication date: 20150225

Termination date: 20190629