JP5685249B2 - 発光ダイオードおよび発光ダイオードの製造方法 - Google Patents

発光ダイオードおよび発光ダイオードの製造方法 Download PDF

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Publication number
JP5685249B2
JP5685249B2 JP2012519958A JP2012519958A JP5685249B2 JP 5685249 B2 JP5685249 B2 JP 5685249B2 JP 2012519958 A JP2012519958 A JP 2012519958A JP 2012519958 A JP2012519958 A JP 2012519958A JP 5685249 B2 JP5685249 B2 JP 5685249B2
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Japan
Prior art keywords
emitting diode
light emitting
carrier
reflective element
synthetic material
Prior art date
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Expired - Fee Related
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JP2012519958A
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English (en)
Japanese (ja)
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JP2012533182A5 (https=
JP2012533182A (ja
Inventor
ゲルトルート クラウター
ゲルトルート クラウター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2012533182A publication Critical patent/JP2012533182A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2012519958A 2009-07-15 2010-06-29 発光ダイオードおよび発光ダイオードの製造方法 Expired - Fee Related JP5685249B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009033287A DE102009033287A1 (de) 2009-07-15 2009-07-15 Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
DE102009033287.1 2009-07-15
PCT/EP2010/059217 WO2011006754A1 (de) 2009-07-15 2010-06-29 Leuchtdiode und verfahren zur herstellung einer leuchtdiode

Publications (3)

Publication Number Publication Date
JP2012533182A JP2012533182A (ja) 2012-12-20
JP2012533182A5 JP2012533182A5 (https=) 2014-09-11
JP5685249B2 true JP5685249B2 (ja) 2015-03-18

Family

ID=42670645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012519958A Expired - Fee Related JP5685249B2 (ja) 2009-07-15 2010-06-29 発光ダイオードおよび発光ダイオードの製造方法

Country Status (7)

Country Link
US (1) US8581288B2 (https=)
EP (1) EP2454765A1 (https=)
JP (1) JP5685249B2 (https=)
KR (1) KR101649287B1 (https=)
CN (1) CN102473825B (https=)
DE (1) DE102009033287A1 (https=)
WO (1) WO2011006754A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009058421A1 (de) * 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
DE102010026344A1 (de) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
ES2693677T3 (es) * 2011-11-17 2018-12-13 Lumens Co., Ltd. Paquete de un dispositivo emisor de luz y retroiluminación que incluye el mismo
WO2015068072A1 (en) * 2013-11-07 2015-05-14 Koninklijke Philips N.V. Substrate for led with total-internal reflection layer surrounding led
US10246348B2 (en) 2015-06-08 2019-04-02 Rayvio Corporation Ultraviolet disinfection system
US9834456B2 (en) 2015-06-08 2017-12-05 Rayvio Corporation Ultraviolet disinfection system
US9540252B1 (en) * 2015-06-08 2017-01-10 Rayvio Corporation Ultraviolet disinfection system
DE102017110850B4 (de) * 2017-05-18 2024-12-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
TWI648878B (zh) * 2018-05-15 2019-01-21 東貝光電科技股份有限公司 Led發光源、led發光源之製造方法及其直下式顯示器
DE102018132542A1 (de) 2018-12-17 2020-06-18 Osram Opto Semiconductors Gmbh Optoelektronische leuchtvorrichtung und herstellungsverfahren
CN113228312B (zh) 2018-12-27 2024-08-13 波主有限公司 半导体发光器件
KR20200129867A (ko) * 2019-05-10 2020-11-18 안상정 반도체 발광소자
DE112019006996B4 (de) * 2019-03-08 2025-07-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung optoelektronischer halbleiterbauelemente
KR102737389B1 (ko) * 2020-04-17 2024-12-03 닝보 선푸 엘이디 컴퍼니 리미티드 자외선 ｌｅｄ 장치
WO2024227770A1 (en) * 2023-05-03 2024-11-07 Ams-Osram International Gmbh Package for a semiconductor chip, optoelectronic semiconductor device, method for manufacturing a package for a semiconductor chip and method for manufacturing an optoelectronic semiconductor device
WO2024235649A1 (en) * 2023-05-17 2024-11-21 Ams-Osram International Gmbh Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device
DE102023136869A1 (de) * 2023-12-29 2025-07-03 Ams-Osram International Gmbh Herstellung eines strahlungsemittierenden bauelements

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3003500B2 (ja) 1994-04-28 2000-01-31 ダイキン工業株式会社 ポリテトラフルオロエチレン複合多孔膜
US5596450A (en) * 1995-01-06 1997-01-21 W. L. Gore & Associates, Inc. Light reflectant surface and method for making and using same
DE10153259A1 (de) 2001-10-31 2003-05-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US6950220B2 (en) * 2002-03-18 2005-09-27 E Ink Corporation Electro-optic displays, and methods for driving same
US20040032728A1 (en) * 2002-08-19 2004-02-19 Robert Galli Optical assembly for LED chip package
ES2251893T1 (es) 2003-04-04 2006-05-16 Novozymes A/S Reduccion de la viscosidad de una pasta.
JP4183175B2 (ja) 2003-04-21 2008-11-19 京セラ株式会社 発光素子収納用パッケージおよび発光装置
DE102004014207A1 (de) * 2004-03-23 2005-10-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper
DE102004053116A1 (de) 2004-11-03 2006-05-04 Tridonic Optoelectronics Gmbh Leuchtdioden-Anordnung mit Farbkonversions-Material
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7537374B2 (en) * 2005-08-27 2009-05-26 3M Innovative Properties Company Edge-lit backlight having light recycling cavity with concave transflector
US8525402B2 (en) 2006-09-11 2013-09-03 3M Innovative Properties Company Illumination devices and methods for making the same
US7601989B2 (en) * 2007-03-27 2009-10-13 Philips Lumileds Lighting Company, Llc LED with porous diffusing reflector
US8469575B2 (en) * 2007-05-20 2013-06-25 3M Innovative Properties Company Backlight and display system using same
JP2009032943A (ja) 2007-07-27 2009-02-12 Japan Gore Tex Inc 発光素子用プリント配線基板
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
JP5702151B2 (ja) * 2008-02-07 2015-04-15 スリーエム イノベイティブ プロパティズ カンパニー 構造化フィルムを有する中空のバックライト
EP2252828A1 (en) * 2008-02-22 2010-11-24 3M Innovative Properties Company Backlights having selected output light flux distributions and display systems using same

Also Published As

Publication number Publication date
CN102473825A (zh) 2012-05-23
WO2011006754A1 (de) 2011-01-20
US8581288B2 (en) 2013-11-12
DE102009033287A1 (de) 2011-01-20
CN102473825B (zh) 2015-02-25
KR101649287B1 (ko) 2016-08-18
KR20120039023A (ko) 2012-04-24
EP2454765A1 (de) 2012-05-23
US20120132947A1 (en) 2012-05-31
JP2012533182A (ja) 2012-12-20

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