CN102473655A - 电子部件的制造方法及电子部件 - Google Patents
电子部件的制造方法及电子部件 Download PDFInfo
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- CN102473655A CN102473655A CN2010800317100A CN201080031710A CN102473655A CN 102473655 A CN102473655 A CN 102473655A CN 2010800317100 A CN2010800317100 A CN 2010800317100A CN 201080031710 A CN201080031710 A CN 201080031710A CN 102473655 A CN102473655 A CN 102473655A
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- electronic unit
- welding electrode
- resin
- thermosetting resin
- scolder
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Images
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
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Abstract
本发明的电子部件制造方法是将具有连接用金属电极的第1电子部件和具有连接用焊接电极的第2电子部件接合的焊接接合方法,其特征在于,顺次进行下述工序:在上述第1电子部件及上述第2电子部件的焊接接合面中的至少一方形成含有热固性树脂的树脂层的第1工序;形成上述含有热固性树脂的树脂层后,将上述第1电子部件的连接用金属电极和上述第2电子部件的连接用焊接电极以对置方式对位,在比上述连接用焊接电极的焊料的熔点低的温度下进行加热及加压,由此使上述连接用金属电极和上述连接用焊接电极对接的第2工序;将上述对接的第1电子部件和第2电子部件边通过加压流体进行加压,边在比上述连接用焊接电极的焊料的熔点高的温度下进行加热,使上述连接用焊接电极的焊料与上述连接用金属电极熔融接合的第3工序;将上述含有热固性树脂的树脂层在比上述连接用焊接电极的焊料的熔点低的温度下进行加热,由此使其固化的第4工序。
Description
技术领域
本发明涉及电子部件的制造方法及电子部件。
背景技术
随着近年来电子设备的高功能化及轻薄短小化的要求,半导体封装等电子部件的高密度集成化、高密度安装化逐步发展。为了得到小型化、多管脚化的电子部件的电连接,可使用焊接接合。焊接接合例如应用于半导体芯片相互间的导通焊接接合部、倒装片中搭载的封装之类半导体芯片-电路基板间的导通焊接接合部、电路基板-电路基板间的导通焊接接合部。进而,随着电子部件的薄化、小型化、窄间距接合的要求,在焊接接合部填充利用了毛细管现象的液态密封树脂(底部填充材料),补强焊接接合部,确保焊接接合部分的可靠性。
但是,随着电子部件的薄化、小型化,焊接接合部窄间距化/窄间隙化。因此,存在即使在焊接接合后供给液态的密封树脂(底部填充材料),液态密封树脂(底部填充材料)也没有遍布到间隙间,难以完全填充焊接接合部的问题。
为了避免该问题,研究了在焊接接合前,预先供给具有助焊剂作用的液态或膜状的密封用树脂(底部填充材料),在焊接接合的同时将间隙间填充的方法(参见专利文献1、2)。
现有技术文献
专利文献
专利文献1:日本特开平10-173005号公报
专利文献2:日本特开2003-100809号公报
发明内容
但是,即使采用上述方法,也难以完全填充窄间距/窄间隙的焊接接合部,有时出现产生空隙及空穴的问题。
本发明鉴于上述情况,能够提供电子部件的制造方法及电子部件,所述电子部件的制造方法是将电子部件相互间焊接接合、将焊接接合部的空隙用含有热固性树脂的树脂层填充、补强焊接接合部的电子部件制造方法,能够抑制空穴(气隙)的产生,进而也能够抑制空隙(气泡)的产生。
该目的由下述(1)~(10)中记载的本发明来实现。
(1)一种电子部件的制造方法,其特征在于,是将具有连接用金属电极的第1电子部件和具有连接用焊接电极的第2电子部件接合的焊接接合方法,顺次进行如下工序:在上述第1电子部件及上述第2电子部件的焊接接合面中的至少一方形成含有热固性树脂的树脂层的第1工序;形成上述含有热固性树脂的树脂层后,将上述第1电子部件的连接用金属电极和上述第2电子部件的连接用焊接电极以对置方式对位,在比上述连接用焊接电极的焊料的熔点低的温度下进行加热及加压,由此使上述连接用金属电极和上述连接用焊接电极对接(当接)的第2工序;将上述对接的第1电子部件和第2电子部件边通过加压流体进行加压,边在比上述连接用焊接电极的焊料的熔点高的温度下进行加热,使上述连接用焊接电极的焊料与上述连接用金属电极熔融接合的第3工序;将上述含有热固性树脂的树脂层在比上述连接用焊接电极的焊料的熔点低的温度下进行加热,由此使其固化的第4工序。
(2)一种电子部件的制造方法,其特征在于,是将具有连接用金属电极的第1电子部件和具有连接用焊接电极的第2电子部件接合的焊接接合方法,顺次进行如下工序:在上述第1电子部件及上述第2电子部件的焊接接合面中的至少一方形成含有热固性树脂的树脂层的第1工序;在形成上述含有热固性树脂的树脂层后,将上述第1电子部件的连接用金属电极和上述第2电子部件的连接用焊接电极以对置方式对位,在上述连接用焊接电极的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热及加压,由此使上述连接用金属电极和上述连接用焊接电极对接的第2工序;将上述对接的第1电子部件和第2电子部件边通过加压流体进行加压,边在上述连接用焊接电极的焊料的热膨胀系数变得大于30×10-6/℃的温度下进行加热,使上述连接用焊接电极的焊料与上述连接用金属电极熔融接合的第3工序;将上述含有热固性树脂的树脂层在上述连接用焊接电极的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热,由此使其固化的第4工序。
(3)如(1)或(2)所述的电子部件的制造方法,其特征在于,第2工序中的上述加热温度为190℃以下的温度,第3工序中的上述加热温度为高于210℃的温度,第4工序中的上述加热温度为210℃以下的温度。
(4)如(1)~(3)中的任一项所述的电子部件的制造方法,其特征在于,上述第1电子部件具有的上述连接用金属电极是连接用焊接电极。
(5)如(1)~(4)中的任一项所述的电子部件的制造方法,其特征在于,在第3工序之后、第4工序之前,冷却至比上述连接用焊接电极的焊料的熔点低的温度后,释放由上述加压流体进行的加压。
(6)如(5)所述的电子部件的制造方法,其特征在于,比上述连接用焊接电极的焊料的熔点低的温度是200℃以下的温度。
(7)如(1)~(6)中的任一项所述的电子部件的制造方法,其特征在于,上述第4工序边通过加压流体加压边进行。
(8)如(1)~(7)中的任一项所述的电子部件的制造方法,其特征在于,上述热固性树脂含有环氧树脂。
(9)如(1)~(8)中的任一项所述的电子部件的制造方法,其特征在于,上述含有热固性树脂的树脂层含有助焊剂活性化合物。
(10)一种电子部件,其使用(1)~(9)中的任一项所述的电子部件的制造方法而制成。
根据本发明,可提供电子部件的制造方法及电子部件,所述电子部件的制造方法是将电子部件相互间焊接接合、将焊接接合部的空隙用含有热固性树脂的粘合层填充、补强焊接接合部的电子部件制造方法,能够抑制焊接接合部产生空穴(气隙),进而也能够抑制空隙(气泡)的产生。
附图说明
[图1]表示本发明的电子部件的一例的剖面图。
[图2]表示本发明的电子部件的变形例的工序剖面图。
[图3]表示本发明的第1实施方式中的电子部件的制造方法的工序剖面图。
[图4]表示本发明的第1实施方式中的电子部件的制造方法的工序剖面图。
[图5]表示本发明的第2实施方式中的电子部件的制造方法的工序剖面图。
[图6]表示本发明的第2实施方式中的电子部件的制造方法的工序剖面图。
[图7]表示本发明的第3实施方式中的电子部件的制造方法的工序剖面图。
[图8]表示本发明的第3实施方式中的电子部件的制造方法的工序剖面图。
具体实施方式
以下,详细说明本发明的电子部件的制造方法及电子部件。
[电子部件]
使用图1说明本发明的电子部件。图1是表示本发明的电子部件的一例的剖面图。应予说明,在以下的说明中,以图中的上侧为“上”、下侧为“下”。
图1所示的电子部件10为倒装片结构的封装,具有:半导体芯片3,支撑半导体芯片3的内插板(インタ一ポ一ザ一)(基板)1,形成了规定图案的金属电极2,多个具有导电性的焊接电极(焊料凸块)4,含有热固性树脂的树脂层5。如图1所示,电子部件10具备:金属电极2和焊接电极(焊料凸块)4熔融接合而成的焊接接合部6,树脂层5固化而成的密封部7,内插板(基板)1和半导体芯片3电连接而成的接合体8。
内插板1的金属电极2和半导体芯片3的焊接电极4通过金属键接合,内插板1和半导体芯片3电连接。
另外,内插板1和半导体芯片3之间的间隙填充有含有热固性树脂的树脂层5。
内插板1为绝缘基板,例如由聚酰亚胺·环氧·氰酸酯·双马来酰亚胺三嗪(BT树脂)等各种树脂材料构成。该内插板1的平面形状通常为正方形、长方形等四边形。另外,内插板1上可以贯通其厚度方向、形成未图示的多个过孔(through-holes,贯通孔)。
金属电极2是在内插板1的上面(一侧的表面)使用Cu而形成。例如,可以将在基板上贴合铜箔而成的铜覆盖层叠板(銅張り積層板)的铜箔蚀刻成规定的电路形状而得到。
应予说明,金属电极2只要是导电性金属材料即可,例如可使用Cu、Al、Ni、焊接材料等而形成。另外,出于防止金属电极2的氧化、提高与焊接电极的接合性的目的,可以以通过镀覆或蒸镀等方法使Ag、Sn、Au等金属覆盖金属电极2的方式而构成。
焊接电极4的形状没有特别限定,可以举出球状、椭圆状、圆柱状、圆锥状等。焊接电极4没有特别限定,优选为选自Sn、Ag、Bi、Zn、Cu、Zn、In、Sb、Pb等中的金属的合金,特别优选为Sn-Pb、Sn-Ag、Sn-Ag-Cu、Sn-Bi,进而,更优选不含可能影响环境或人体的Pb的Sn-Ag、Sn-Ag-Cu、Sn-Bi、Sn-Zn-Bi。
焊接电极4可以通过例如在金属电极上实施镀覆、网版印刷、焊料糊剂涂布等方法而得到。
树脂层5含有热固性树脂。出于提高将内插板1和半导体芯片3接合及粘合后的可靠性的目的,树脂层5只要含有热固性树脂,就没有特别限定,常温下可以为液态也可以为膜状。
通过树脂层5,可具有提高内插板1和半导体芯片3的接合强度的功能,并且能够防止异物、水分浸入间隙。因此,可以得到可靠性高的电子部件10。另外,为了可以提高构成焊接电极4的焊料成分的润湿性、能够促进金属电极2和焊接电极4的金属键合、可以确实地获得介由焊接接合部6的导通,优选树脂层5含有助焊剂活性化合物。进而,树脂层5在常温下为膜状时,出于赋予膜形成能力的目的,优选含有成膜性树脂。
热固性树脂在内插板1和半导体芯片3的接合体8中,具有通过由该热固性树脂的固化物构成的密封部7而将邻接的焊接接合部6相互间绝缘的功能,而且具有将内插板1和半导体芯片3固定的功能。
作为这样的热固性树脂,没有特别限定,例如可以举出环氧树脂、氧杂环丁烷树脂、酚醛树脂、(甲基)丙烯酸酯树脂、不饱和聚酯树脂、邻苯二甲酸二烯丙基酯树脂、马来酰亚胺树脂等,其中,优选使用环氧树脂。环氧树脂的固化性和保存性、固化物的耐热性、耐湿性、耐化学试剂性等优异,所以优选用作热固性树脂。
作为环氧树脂,可以使用室温下为固态的环氧树脂和室温下为液态的环氧树脂中的任一种,也可以包含它们双方。通过使用这样的环氧树脂而构成,能够进一步提高热固性树脂的熔融行为的设计自由度。
作为室温下为固态的环氧树脂,没有特别限定,例如可以举出双酚A型环氧树脂、双酚F型环氧树脂、双酚AD型环氧树脂、双酚E型环氧树脂等双酚型环氧树脂,苯酚酚醛清漆型环氧树脂、甲酚酚醛清漆型环氧树脂等酚醛清漆型环氧树脂,N,N-二缩水甘油基苯胺、N,N-二缩水甘油基甲苯胺、二氨基二苯基甲烷型缩水甘油基胺、氨基苯酚型缩水甘油基胺之类的芳香族缩水甘油基胺型环氧树脂,对苯二酚型环氧树脂、联苯芳烷基型环氧树脂等联苯型环氧树脂,茋型环氧树脂、三苯酚甲烷型环氧树脂、三苯酚丙烷型环氧树脂、烷基改性三苯酚甲烷型环氧树脂、含三嗪核的环氧树脂、双环戊二烯改性苯酚型环氧树脂、萘酚型环氧树脂、萘型环氧树脂、具有亚苯基和/或亚联苯基骨架的苯酚芳烷基型环氧树脂、具有亚苯基和/或亚联苯基骨架的萘酚芳烷基型环氧树脂等芳烷基型环氧树脂等环氧树脂等,可以使用它们中的1种或组合2种以上进行使用。
另外,作为室温下为液态的环氧树脂,没有特别限定,可以举出双酚A型环氧树脂及双酚F型环氧树脂等,可以使用它们中的1种或组合2种以上进行使用。
室温下为液态的环氧树脂的环氧当量优选为150~300,更优选为160~250,进一步优选为170~220。由此,能够防止热固性树脂的固化物的收缩率变大,从而确实地防止因密封部7而导致内插板1和半导体芯片3的接合体8发生翘曲。
另外,含有热固性树脂的树脂层5中的热固性树脂的配合量优选为25~90重量%左右,更优选为35~80重量%左右。由此,在使热固性树脂固化时,能够得到良好的固化性,而且能够进行含有热固性树脂的树脂层5的良好熔融行为的设计。
另外,含有热固性树脂的树脂层5优选含有固化剂。由此,能够进一步提高热固性树脂的固化性。
作为固化剂,没有特别限定,例如可以举出苯酚类、胺类、硫醇类。它们中,在使用环氧树脂作为热固性树脂的情况下,优选使用苯酚类。由此,在含有热固性树脂的树脂层5中,能够得到与环氧树脂的良好反应性,进而能够得到该含有热固性树脂的树脂层5中包含的环氧树脂固化时的低尺寸变化及固化后的适当物性(例如耐热性、耐湿性等)。
另外,作为苯酚类,没有特别限定,优选具有2个以上能够与环氧树脂反应的官能团。由此,能够提高含有热固性树脂的树脂层5中的环氧树脂的固化物的特性(例如耐热性、耐湿性等)。
作为这样的苯酚类,具体而言,例如可以举出双酚A、四甲基双酚A、二烯丙基双酚A、联苯酚、双酚F、二烯丙基双酚F、三苯酚、四苯酚、苯酚酚醛清漆类、甲酚酚醛清漆类等。其中,优选使用苯酚酚醛清漆类及甲酚酚醛清漆类。由此,能够使含有热固性树脂的树脂层5的熔融粘度适当,可以提高与环氧树脂的反应性。进而,能够进一步优化含有热固性树脂的树脂层5中的环氧树脂的固化物的特性(例如耐热性、耐湿性等)。
另外,在使用苯酚酚醛清漆类作为固化剂时,含有热固性树脂的树脂层5中的固化剂的配合量优选为5~30重量%左右,更优选为10~25重量%左右。由此,在含有热固性树脂的树脂层5中,能够使热固性树脂确实地固化,而且在含有热固性树脂的树脂层5中,可防止热固性树脂和未反应的固化剂残留,能够适当地防止因存在该残留物而导致的迁移的发生。
应予说明,热固性树脂为环氧树脂的情况下,苯酚酚醛清漆树脂的配合量可以按相对于环氧树脂的当量比进行限定。
具体而言,苯酚酚醛清漆类相对于环氧树脂的当量比优选为0.5~1.2左右,更优选为0.6~1.1左右,进一步优选为0.7~0.98左右。通过设定为该范围内,能够取得与前述同样的效果。
作为胺类,具体而言,例如可以举出乙二胺、1,3-二氨基丙烷、1,4-二氨基丁烷、二亚乙基三胺、三亚乙基四胺、四亚乙基五胺、五亚乙基六胺、二亚丙基二胺、二乙基氨基丙基胺、三(甲基氨基)己烷、二甲基氨基丙基胺、二乙基氨基丙基胺、甲基亚氨基双丙基胺、六亚甲基二胺、二氨基二苯基甲烷、二氨基二苯基砜、异佛尔酮二胺、烯二胺(menthenediamine)、异佛尔酮二胺、双(4-氨基-3-甲基二环己基)甲烷、二氨基二环己基甲烷、N-氨基乙基哌嗪、3,9-双(3-氨基丙基)2,4,8,10-四氧杂螺(5,5)十一碳烷、2,5-二甲基六亚甲基二胺、三甲基六亚甲基二胺、亚氨基双丙基胺、双(六亚甲基)三胺、间苯二甲胺、间苯二胺、二氨基二乙基苯基甲烷、聚醚二胺等。
进而,除了上述固化剂外,还可以使用例如熔点在150℃以上的咪唑化合物。由此,热固性树脂的固化性提高,能够缩短工序。
作为该熔点在150℃以上的咪唑化合物,可以举出2-甲基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-苯基-4,5-二羟基甲基咪唑、2-苯基咪唑、2-乙基咪唑、2-乙基-4-甲基咪唑、2-苯基-4-甲基咪唑等。应予说明,咪唑化合物的熔点的上限没有特别限定,例如只要对应于含有热固性树脂的树脂层5的粘合温度适当选择即可。
使用该咪唑化合物作为固化剂的情况下,含有热固性树脂的树脂层5中的固化剂的配合量优选为0.005~10重量%左右,更优选为0.01~5重量%左右。由此,能够更有效地发挥作为热固性树脂的固化催化剂的功能,从而在含有热固性树脂的树脂层5中能够提高热固性树脂的固化性,而且能够抑制含有热固性树脂的树脂层5的保存性降低。
应予说明,上述固化剂可以单独使用,也可以组合2种以上进行使用。
另外,含有热固性树脂的树脂层5可以进一步含有无机填充材料。由此,能够降低树脂层5的线膨胀系数,从而能够提高可靠性。另外,含有热固性树脂的树脂层5除了上述成分外,为了提高树脂的相溶性、稳定性、操作性等各种特性,还可以适当配合各种添加剂等。
本发明的助焊剂活性化合物具有如下功能:在后述说明的第3工序中,内插板1和半导体芯片3被加压流体加压、加热时,将焊接电极4的表面还原。由此,能够提高构成焊接电极4的焊料成分的润湿性,能够促进金属电极2和焊接电极4的金属键合。结果,能够确实地获得介由焊接接合部6的导通。
另外,优选这样的助焊剂活性化合物具有与热固性树脂键合的官能团。由此,助焊剂活性化合物在热固性树脂因加热而固化时,也作为固化剂发挥作用而附加到热固性树脂上。其结果,在形成的内插板1和半导体芯片3的接合体8所具备的含有热固性树脂的树脂层5中,能够适当抑制因助焊剂活性化合物残渣导致的离子迁移的发生。另外,通过助焊剂活性化合物附加到热固性树脂上,从而可得到能够提高热固性树脂的固化物的弹性模量和/或玻璃化转变温度的效果。
考虑到以上情况,作为具有助焊剂活性的化合物,优选使用具有羧基和/或酚性羟基的化合物。
应予说明,具有羧基和/或酚性羟基的助焊剂活性化合物是指分子中至少存在1个以上羧基和/或酚性羟基的化合物,可以是液态也可以是固体。
它们中,作为具有羧基的助焊剂活性化合物,可以举出脂肪族酸酐、脂环式酸酐、芳香族酸酐、脂肪族羧酸、芳香族羧酸等。
另外,作为脂肪族酸酐,可以举出琥珀酸酐、聚己二酸酐、聚壬二酸酐、聚癸二酸酐等。
作为脂环式酸酐,可以举出甲基四氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、甲基纳迪克酸酐(methylhymic anhydride)、六氢邻苯二甲酸酐、四氢邻苯二甲酸酐、三烷基四氢邻苯二甲酸酐、甲基环己烯二羧酸酐等。
作为芳香族酸酐,可以举出邻苯二甲酸酐、偏苯三酸酐、均苯四甲酸酐、二苯甲酮四羧酸酐、乙二醇双偏苯三酸酯、丙三醇三偏苯三酸酯等。
作为脂肪族羧酸,可以举出下述通式(1)所示的化合物或甲酸、乙酸、丙酸、丁酸、戊酸、三甲基乙酸、己酸、辛酸、月桂酸、肉豆蔻酸、棕榈酸、硬脂酸、丙烯酸、甲基丙烯酸、巴豆酸、油酸、富马酸、马来酸、草酸、丙二酸、琥珀酸等。
HOOC-(CH2)n-COOH (1)
(其中,式中,n表示0~20的整数。)
作为芳香族羧酸,可以举出苯甲酸、邻苯二甲酸、间苯二甲酸、对苯二甲酸、连苯三酸、偏苯三酸、均苯三酸、偏苯四酸、连苯四酸(プレ一トニ酸)、均苯四甲酸、苯六甲酸、甲苯甲酸、二甲苯甲酸、2,3-二甲基苯甲酸、3,5-二甲基苯甲酸、2,3,4-连三甲苯酸(プレ一ニチル酸)、甲苯甲酸、肉桂酸、水杨酸、2,3-二羟基苯甲酸、2,4-二羟基苯甲酸、龙胆酸(2,5-二羟基苯甲酸)、2,6-二羟基苯甲酸、3,5-二羟基苯甲酸、没食子酸(3,4,5-三羟基苯甲酸)、1,4-二羟基-2-萘甲酸、3,5-二羟基-2-萘甲酸等萘甲酸衍生物;酚酞啉;双酚酸等。
它们中,考虑到助焊剂活性化合物具有的活度、热固性树脂固化时排气的产生量、以及内插板1和半导体芯片3的接合体8具备的密封部7的弹性模量或玻璃化转变温度等的平衡,优选使用上述通式(1)表示的化合物,更优选式中的n为3~10左右的化合物。由此,在内插板1和半导体芯片3的接合体8中,能够抑制热固性树脂的固化物的弹性模量增加,而且能够提高该固化物和内插板1或半导体芯片3的粘合性。
上述通式(1)表示的化合物中,作为n为3~10的化合物,例如可以举出n=3的戊二酸〔HOOC-(CH2)3-COOH〕、n=4的己二酸〔HOOC-(CH2)4-COOH〕、n=5的庚二酸〔HOOC-(CH2)5-COOH〕、n=8的癸二酸〔HOOC-(CH2)8-COOH〕及n=10的〔HOOC-(CH2)10-COOH〕等。
进而,作为具有酚性羟基的助焊剂活性化合物,可以举出苯酚类,具体而言,例如可以举出苯酚、邻甲酚、2,6-二甲苯酚、对甲酚、间甲酚、邻乙基苯酚、2,4-二甲苯酚、2,5-二甲苯酚、间乙基苯酚、2,3-二甲苯酚、2,4,6-三甲基苯酚、3,5-二甲苯酚、对叔丁基苯酚、儿茶酚、对叔戊基苯酚、间苯二酚、对辛基苯酚、对苯基苯酚、双酚A、双酚F、双酚AF、联苯酚、二烯丙基双酚F、二烯丙基双酚A、三苯酚、四苯酚等含有酚性羟基的单体类、苯酚酚醛清漆树脂、邻甲酚酚醛清漆树脂、双酚F酚醛清漆树脂、双酚A酚醛清漆树脂等。
上述具有羧基和/或酚性羟基的助焊剂活性化合物通过与环氧树脂之类热固性树脂的反应而被三维引入其中。
因此,从提高固化后的环氧树脂的三维网络的形成的观点考虑,优选1分子中具有至少2个能够加成在环氧树脂上的酚性羟基且一分子中具有至少1个直接键合在对焊料显示助焊剂作用(还原作用)的芳香族上的羧基的化合物。
作为该助焊剂活性化合物,可以举出2,3-二羟基苯甲酸、2,4-二羟基苯甲酸、龙胆酸(2,5-二羟基苯甲酸)、2,6-二羟基苯甲酸、3,4-二羟基苯甲酸、没食子酸(3,4,5-三羟基苯甲酸)等苯甲酸衍生物;1,4-二羟基-2-萘甲酸、3,5-二羟基-2-萘甲酸、3,7-二羟基-2-萘甲酸等萘甲酸衍生物;酚酞啉;及双酚酸等,但优选兼具热固性树脂固化后的物性及助焊剂作用的、龙胆酸(2,5-二羟基苯甲酸)、2,6-二羟基苯甲酸、酚酞啉。这些助焊剂活性化合物可以单独使用或组合2种以上进行使用。
另外,含有热固性树脂的树脂层5中的助焊剂活性化合物的配合量优选为1~30重量%左右,更优选为3~25重量%左右。由此,能够提高含有热固性树脂的树脂层5中的助焊剂活性,而且在内插板1和半导体芯片3的接合体8所具备的密封部7中,可防止残留热固性树脂和未反应的助焊剂活性化合物,能够适当地防止由该残留物的存在所导致的迁移的发生。
另外,这样的助焊剂活性化合物优选均匀地分散在含有热固性树脂的树脂层5中。如上所述,通过均匀地分散,助焊剂活性化合物能够有效率地移动到金属电极2和焊接电极4的界面,使它们相互间直接接触。其结果是能够提高焊接接合部6的连接可靠性。
含有热固性树脂的树脂层5为膜状的情况下,优选含有成膜性树脂。作为成膜性树脂,例如可以举出(甲基)丙烯酸系树脂、苯氧基树脂、聚酯树脂、聚氨酯树脂、聚酰亚胺树脂、硅氧烷改性聚酰亚胺树脂、聚丁二烯、聚丙烯、苯乙烯-丁二烯-苯乙烯共聚物、苯乙烯-乙烯-丁烯-苯乙烯共聚物、聚缩醛树脂、聚乙烯醇缩丁醛树脂、聚乙烯醇缩乙醛树脂、丁基橡胶、氯丁二烯橡胶、聚酰胺树脂、丙烯腈-丁二烯共聚物、丙烯腈-丁二烯-丙烯酸共聚物、丙烯腈-丁二烯-苯乙烯共聚物、聚乙酸乙烯基酯、尼龙等。特别优选膜形成能力和与内插板1、半导体芯片3的密合性优异的(甲基)丙烯酸系树脂、苯氧基树脂、聚酰亚胺树脂。另外,上述成膜性树脂可以使用上述示例中的1种或组合使用2种以上。
应予说明,本实施方式中,(甲基)丙烯酸系树脂是指(甲基)丙烯酸及其衍生物的聚合物、或者(甲基)丙烯酸及其衍生物与其他单体的共聚物。此处,表述为(甲基)丙烯酸等时,是指丙烯酸或甲基丙烯酸。
作为(甲基)丙烯酸系树脂,具体可以举出聚丙烯酸、聚甲基丙烯酸、聚丙烯酸甲酯、聚丙烯酸乙酯、聚丙烯酸丁酯、聚丙烯酸-2-乙基己酯等聚丙烯酸酯,聚甲基丙烯酸甲酯、聚甲基丙烯酸乙酯、聚甲基丙烯酸丁酯等聚甲基丙烯酸酯,聚丙烯腈、聚甲基丙烯腈、聚丙烯酰胺、丙烯酸丁酯-丙烯酸乙酯-丙烯腈共聚物、丙烯腈-丁二烯共聚物、丙烯腈-丁二烯-丙烯酸共聚物、丙烯腈-丁二烯-苯乙烯共聚物、丙烯腈-苯乙烯共聚物、甲基丙烯酸甲酯-苯乙烯共聚物、甲基丙烯酸甲酯-丙烯腈共聚物、甲基丙烯酸甲酯-α-甲基苯乙烯共聚物、丙烯酸丁酯-丙烯酸乙酯-丙烯腈-甲基丙烯酸2-羟基乙酯-甲基丙烯酸共聚物、丙烯酸丁酯-丙烯酸乙酯-丙烯腈-甲基丙烯酸2-羟基乙酯-丙烯酸共聚物、丙烯酸丁酯-丙烯腈-甲基丙烯酸2-羟基乙酯共聚物、丙烯酸丁酯-丙烯腈-丙烯酸共聚物、丙烯酸丁酯-丙烯酸乙酯-丙烯腈共聚物、丙烯酸乙酯-丙烯腈-N,N二甲基丙烯酰胺共聚物等。它们中,优选丙烯酸丁酯-丙烯酸乙酯-丙烯腈共聚物-甲基丙烯酸2-羟基乙酯-甲基丙烯酸、丙烯酸乙酯-丙烯腈-N,N二甲基丙烯酰胺。
应予说明,通过使用使具有腈基、环氧基、羟基、羧基等官能团的单体共聚而得的(甲基)丙烯酸系树脂,能够提高含有热固性树脂的树脂层5对内插板1及半导体芯片3的密合性、以及与热固性树脂等的相容性。
这样的(甲基)丙烯酸系树脂中,具有上述官能团的单体的使用量没有特别限定,相对于(甲基)丙烯酸系树脂的总重量,优选为0.1~50mol%左右,更优选为0.5~45mol%左右,进一步优选为1~40mol%左右。通过设定在该范围内,能够使含有热固性树脂的树脂层5对内插板1、半导体芯片3的密合性优异,而且可适当地防止含有热固性树脂的树脂层5的粘结力变得过强,从而提高操作性。
上述(甲基)丙烯酸系树脂的重均分子量没有特别限定,优选为10万以上,更优选为15万~100万左右,进一步优选为25万~90万左右。通过将重均分子量设定在上述范围内,能够提高含有热固性树脂的树脂层5的成膜性。
另外,使用苯氧基树脂作为成膜性树脂的情况下,优选使用其数均分子量为5000~15000左右的苯氧基树脂。通过使用该数均分子量的苯氧基树脂,可以抑制含有热固性树脂的树脂层5的流动性,使含有热固性树脂的树脂层5的厚度均匀。
上述苯氧基树脂的骨架没有特别限定,例如可以举出双酚A型,双酚F型、联苯骨架型等。它们中,优选饱和吸水率在1%以下的苯氧基树脂。由此,即使在内插板1和半导体芯片3的接合体8形成时、暴露于高温条件下的情况下,也可以抑制因含有热固性树脂的树脂层5而导致的发泡、剥离等的发生。
应予说明,饱和吸水率可以如下算出:采用将苯氧基树脂加工成厚度25μm的膜并在100℃环境中干燥1小时(绝对干燥状态)时刻的重量,和将该膜进一步放置在40℃、90%RH环境的恒温高湿槽中每隔24小时测定重量变化、重量变化饱和时刻的重量,通过下述式(2)进行计算。
饱和吸水率(%)={(饱和时刻的重量)-(绝对干燥时刻的重量)}/(绝对干燥时刻的重量)×100 (2)
另外,使用聚酰亚胺树脂作为成膜性树脂时,作为聚酰亚胺树脂,可以举出重复单元中具有酰亚胺键的树脂。
作为该聚酰亚胺树脂,例如可以举出使二胺和酸二酐反应、将得到的聚酰胺酸加热、脱水闭环而得到的聚酰亚胺树脂。作为二胺,可以举出作为芳香族二胺的3,3′-二甲基-4,4′-二氨基联苯、4,6-二甲基-间苯二胺、2,5-二甲基-对苯二胺,作为硅氧烷二胺的1,3-双(3-氨基丙基)-1,1,3,3-四甲基二硅氧烷等,可以使用它们中的1种或组合使用2种以上。
另外,作为酸二酐,可以举出3,3,4,4′-联苯四甲酸、均苯四甲酸二酐、4,4′-氧双邻苯二甲酸酐等。
应予说明,该聚酰亚胺树脂可以使用可溶于后述溶剂的树脂,也可以使用不溶于后述溶剂的树脂,优选可溶于溶剂的树脂。特别是硅氧烷改性聚酰亚胺树脂能够溶于各种溶剂,所以优选使用。
该含有热固性树脂的树脂层5在常温下为液态时,例如可以称量热固性树脂、根据需要而使用的助焊剂活性化合物、成膜性树脂、其他成分,用3辊磨进行分散混炼,在真空下进行脱泡处理而得到。
该含有热固性树脂的树脂层5在常温下为膜状时,例如可以使热固性树脂、根据需要而使用的助焊剂活性化合物、成膜性树脂、其他成分溶于溶剂中来制备接合片形成用材料(液态材料),然后,将该接合片形成用材料涂布在聚酯片等实施了剥离处理的基材上,在规定的温度下除去溶剂,使其干燥而得到。
应予说明,作为这里使用的溶剂,例如可以举出丙酮、甲基乙基酮、甲基异丁基酮、DIBK(二异丁基酮)、环己酮、DAA(二丙酮醇)等酮类,苯、二甲苯、甲苯等芳香烃类,甲基醇、乙基醇、异丙基醇、正丁基醇等醇类,甲基溶纤剂、乙基溶纤剂、丁基溶纤剂、甲基溶纤剂乙酸酯、乙基溶纤剂乙酸酯、BCSA(丁基溶纤剂乙酸酯)等溶纤剂系,NMP(N-甲基-2-吡咯烷酮)、THF(四氢呋喃)、DMF(二甲基甲酰胺)、DBE(二元酸酯)、EEP(3-乙氧基丙酸乙酯)、DMC(碳酸二甲酯)等。
另外,含有热固性树脂的树脂层5的厚度(平均)没有特别限定,优选为5~300μm左右,更优选为10~200μm左右。
应予说明,本发明的电子部件不限定于电子部件10,可以进行各种变形。例如,虽然以上对使用Cu形成金属电极2的情况进行了说明,但也可以如图2所示是使用了焊接材料的焊接电极12。电子部件20:在图1所示的电子部件10中,内插板1上的金属电极2变为焊接电极12,除此之外为完全相同的构成,由内插板11的焊接电极12和半导体芯片13的焊接电极14构成。
图2是表示本发明的电子部件的变形例的工序剖面图。如图2(a)所示,形成了内插板11上的焊接电极12。电子部件20通过内插板11上的焊接电极12和半导体芯片13的焊接电极14进行金属键合,从而形成焊接接合部15,内插板11和半导体芯片13电连接。
另外,使用图1及图2,说明了将内插板和半导体芯片接合的电子部件的情况,但接合的部分没有特别限定,可以将选自刚性基板、挠性基板、半导体芯片、半导体晶片等的部分适当组合。
[电子部件的制造方法]
使用图3~8说明本发明的电子部件的制造方法。
(第1实施方式)
图3、4是表示本发明的第1实施方式中的电子部件的制造方法的工序剖面图。
[1A-1]首先,准备形成了金属电极22的内插板21和形成了焊接电极24的半导体芯片23。
在本实施方式中,如图3(a)所示,在内插板21上形成金属电极22。另外,如图3(a)所示,在半导体芯片23上形成焊接电极24。
[1A-2]接着,如图3(b)所示,在形成了金属电极22的内插板21的金属电极22侧,形成含有热固性树脂的树脂层25(第1工序)。
作为形成上述含有热固性树脂的树脂层25的方法,例如可以通过层压、涂布、印刷等方法而得到。本实施方式中,虽然形成在内插板21的金属电极22侧,但也可以形成在形成了焊接电极24的半导体芯片23的焊接电极24侧。另外,还可以在内插板21的金属电极22侧以及半导体芯片23的焊接电极24侧的两侧形成含有热固性树脂的树脂层25。
将含有热固性树脂的树脂层25层压在形成了金属电极22的内插板21的金属电极22侧的条件没有特别限定,例如可以在温度50℃~150℃的条件下进行。如果层压温度在上述范围的温度以下,则有时对内插板21的密合性不足,在搬送内插板时,含有热固性树脂的树脂层25发生剥离。另外,如果层压温度在上述范围的温度以上,则含有热固性树脂的树脂层25发生固化,含有热固性树脂的树脂层25的流动性降低,所以在使金属电极22和焊接电极24熔融接合时,有时在金属电极22和焊接电极24之间残留含有热固性树脂的树脂层25,无法形成良好的焊接接合部。
另外,将含有热固性树脂的树脂层25涂布、印刷在形成了金属电极22的内插板21的金属电极22侧的条件没有特别限定,例如可以举出旋涂法、网版印刷等,其中,优选网版印刷。
[1A-3]接着,如图3(c)所示,内插板21的金属电极22和半导体芯片23的焊接电极24以对置方式定位。然后,如图4(a)所示,通过在比焊接电极24的焊料的熔点低的温度下进行加热及加压,从而使金属电极22和焊接电极24对接,形成内插板21和半导体芯片23的层叠体30(第2工序)。
作为上述定位的方法,没有特别限定,可以通过利用对准标记的方法等而将内插板21的金属电极22和半导体芯片23的焊接电极24以对置方式定位。
使金属电极22和焊接电极24对接时的加热是在比焊接电极24的焊料的熔点低的温度下进行。通过使加热温度为比焊接电极24的焊料的熔点低的温度,从而能够防止在金属电极22和焊接电极24之间存在含有热固性树脂的树脂层25、发生接合不良,进而,在使金属电极22熔融接合于焊接电极24时(后述)能够确保含有热固性树脂的树脂层25的流动性,能够覆盖金属电极22及焊接电极24的表面,所以能够更有效率地除去金属电极22及焊接电极24表面的氧化膜。
更具体为190℃以下,优选为180℃以下,特别优选为170℃以下。通过使对接时的加热温度在上述范围以下,从而在使金属电极22熔融接合于焊接电极24时(后述),能够确保含有热固性树脂的树脂层25的流动性。
[1A-4]然后,如图4(b)所示,在通过加压流体对使金属电极22与焊接电极24对接的内插板21和半导体芯片23的层叠体30进行加压的状态下,在比焊接电极24的焊料的熔点高的温度下加热,由此使金属电极22和焊接电极24熔融接合,形成焊接接合部26(第3工序)。
通过使加热温度为比焊接电极24的焊料的熔点高的温度,从而焊接电极24的焊料充分地润湿扩展,所以能够确实地使金属电极22和焊接电极24熔融接合,形成焊接接合部26。
更具体为200℃以上,优选为205℃以上,特别优选为210℃以上。通过使第3工序中的加热温度在上述范围以上,从而焊接电极24的焊料充分润湿扩展,所以能够使金属电极22和焊接电极24确实地熔融接合,形成焊接接合部26。
作为在上述第3工序中的通过加压流体进行加压的状态下、在比焊接电极24的焊料的熔点高的温度下对内插板21和半导体芯片23的层叠体30进行加热的方法,没有特别限定,可以举出在压力容器内设置内插板21和半导体芯片23的层叠体30,然后,边将加压流体导入压力容器内而进行加压,边将内插板21和半导体芯片23的层叠体30加热的方法。
进而,具体而言,可以举出下述方法:在加压烘箱中设置内插板21和半导体芯片23的层叠体30,边在加压烘箱内导入加压用气体,边在加压烘箱中对处理对象物进行加热。另外,上述加压用气体没有特别限定,可以举出氮气、空气等,优选能够更有效率地防止金属电极22及焊接电极24的氧化的氮气。
上述第3工序中通过加压流体进行的加压条件没有特别限定,可以在0.2~1MPa等条件下进行,优选为0.3~0.9MPa,特别优选为0.4~0.8MPa。通过使利用加压流体的加压条件为上述范围,从而能够确实地使金属电极22和焊接电极24熔融接合,抑制含有热固性树脂的树脂层中的空穴(气隙)及空隙(气泡)的产生。认为这是因为通过气压和含有热固性树脂的树脂层25中的空穴(气隙)及空隙(气泡)的压力差,空穴(气隙)及空隙(气泡)被压缩,空穴(气隙)及空隙(气泡)扩散到含有热固性树脂的树脂层中,能够抑制空穴(气隙)及空隙(气泡)的产生。
进而,第3工序中,优选在冷却至比焊接电极24的焊料的熔点低的温度后,释放用加压流体进行的加压。由此,能够防止内插板21和半导体芯片23的间隔扩大而产生接合不良。
更具体而言,释放加压的温度为200℃以下,优选为190℃以下,特别优选为180℃以下,由此能够防止内插板21和半导体芯片23的间隔扩大而产生接合不良。
[1A-5]接下来,如图4(c)所示,将使金属电极22和焊接电极24熔融接合而成的内插板21和半导体芯片23的层叠体30在比焊接电极24的焊料的熔点低的温度下进行加热,使含有热固性树脂的树脂层25固化,形成密封部27,得到内插板21和半导体芯片23的接合体40(第4工序)。
此时,通过设为比焊接电极24的焊料的熔点低的温度,从而能够防止焊接接合部26再熔融而导致电连接变得不稳定。例如,加热温度优选为210℃以下。
应予说明,内插板21和半导体芯片23的层叠体30的加热除了在规定的单一温度下进行加热外,例如也可以进行:在150℃加热30分钟后,在180℃加热30分钟的分步固化;在150℃热压接30秒后,在180℃烘箱固化60分钟的后固化。
另外,使含有热固性树脂的树脂层25固化时,优选与上述工序[1A-4]同样地利用加压流体进行加压。利用加压流体进行的加压条件可以采用与上述工序[1A-4]同样的条件进行。由此,通过气压与含有热固性树脂的树脂层25中的空穴(气隙)及空隙(气泡)的压力差,压缩空穴(气隙)及空隙(气泡),空穴(气隙)及空隙(气泡)在含有热固性树脂的树脂层25中扩散,能够进一步提高可抑制空穴(气隙)及空隙(气泡)的产生的效果。
如上所述,通过在利用加压流体进行加压的状态下在比焊接电极24的焊料的熔点高的温度下进行熔融接合,然后,在比焊接电极24的焊料的熔点低的温度下使含有热固性树脂的树脂层25固化,从而内插板21和半导体芯片23电连接,进而能够形成内插板21和半导体芯片23被固定的内插板21和半导体芯片23的接合体40。该内插板21和半导体芯片23的接合体40因为在利用加压流体加压的状态下在比焊接电极24的焊料的熔点高的温度下熔融接合,所以能够得到空穴及空隙的产生少的内插板21和半导体芯片23的接合体40。
此处,在本发明中,内插板21和半导体芯片23(第1电子部件及第2电子部件)相互间介由焊接接合部26之类固化物而电连接。因此,在电子部件10驱动时,即使半导体芯片23的发热使得由热固性树脂构成的密封部27膨胀,也能够适当地防止该电连接被切断,能够在第1电子部件及第2电子部件间得到稳定的导通。即,能够在第1电子部件及第2电子部件间得到连接可靠性优异的电连接。
焊接接合部26的厚度、即内插板21和半导体芯片23的接合体40中的焊接接合部26的厚度(平均)没有特别限定,优选为3~300μm左右,更优选为5~150μm左右。这样通过缩小内插板21和半导体芯片23的隔离距离,从而也可以减小电子部件10作为整体的厚度,进而能够实现电子部件10的轻量化。
(第2实施方式)
图5、6是表示本发明的第2实施方式中的电子部件制造方法的工序剖面图。第1实施方式在第2工序中在比焊接电极24的焊料的熔点低的温度下进行加热及加压,在第3工序中在比焊接电极24的焊料的熔点高的温度下进行加热,在第4工序中在比焊接电极24的焊料的熔点低的温度下进行加热,与此相对,第2实施方式在第2工序中在焊接电极24的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热及加压,在第3工序中在焊接电极24的焊料的热膨胀系数变得大于30×10-6/℃的温度下进行加热,在第4工序中在焊接电极24的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热。除此之外,与第1实施方式相同,所以省略详细的说明。
如图5(a)、(b)所示,在形成了金属电极22的内插板21的金属电极22侧,形成含有热固性树脂的树脂层25(第1工序)。
[2A-3]接着,如图5(c)所示,将内插板21的金属电极22和半导体芯片23的焊接电极24以对置方式定位。然后,如图6(a)所示,通过在焊接电极24的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热及加压,从而使金属电极22和焊接电极24对接,形成内插板21和半导体芯片23的层叠体30(第2工序)。
应予说明,焊接电极24的焊料的热膨胀系数可以通过以下的方法求出。
焊料的熔点以上的热膨胀系数可以通过金属材料物性值计算软件·数据库JMatPro(Sente Software社制)而算出。
焊料的熔点以下的热膨胀系数可以通过热机械特性分析装置(模式:压缩、荷重:50N、升温速度:5℃/分钟)而算出。
更具体而言为190℃以下,优选为180℃以下,特别优选为170℃以下。通过使对接时的加热温度在上述范围以下,从而能够在使金属电极22与焊接电极24熔融接合时(后述),确保含有热固性树脂的树脂层25的流动性。
[2A-4]接着,如图6(b)所示,在利用加压流体对使金属电极22和焊接电极24对接的内插板21和半导体芯片23的层叠体30进行加压的状态下,在焊接电极24的焊料的热膨胀系数变得大于30×10-6/℃的温度下进行加热,由此使金属电极22与焊接电极24熔融接合,形成焊接接合部26(第3工序)。
作为在上述第3工序中的利用加压流体进行加压的状态下、在焊接电极24的焊料的热膨胀系数变得大于30×10-6/℃的温度下对内插板21和半导体芯片23的层叠体30进行加热的方法,可以使用与上述工序[2A-4]同样的方法。
进而,在第3工序中,优选在冷却至焊接电极34的焊料的热膨胀系数达到30×10-6/℃以下的温度后将加压释放,由此能够防止内插板31和半导体芯片33的间隔扩大而发生接合不良。
更具体而言为200℃以上,优选为205℃以上,特别优选为210℃以上。通过将第3工序中的加热温度设定为上述范围以上,从而焊接电极24的焊料充分地润湿扩展,所以能够使金属电极22和焊接电极24确实地熔融接合,形成焊接接合部26。
[2A-5]接着,如图6(c)所示,将使金属电极22和焊接电极24熔融接合而成的内插板21和半导体芯片23的层叠体30在焊接电极24的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热,使含有热固性树脂的树脂层25固化,形成密封部27,得到内插板21和半导体芯片23的接合体40(第4工序)。
此时,通过在焊接电极24的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热、使含有热固性树脂的树脂层25固化,从而能够防止焊接接合部26再熔融而导致电连接变得不稳定。例如,加热温度优选为210℃以下。
第2实施方式中也能够取得与第1实施方式同样的效果。
(第3实施方式)
图7、8是表示本发明的第3实施方式的电子部件制造方法的工序剖面图。在第1、2实施方式中,说明了使用金属电极22的例子。第3实施方式是使用焊接电极32的例子,除此之外,与第2实施方式相同,所以省略详细的说明。
[3A-1]首先,准备形成了焊接电极32的内插板31和形成了焊接电极34的半导体芯片33。此处,焊接电极32和焊接电极34可以是相同材质,也可以是不同材质。
本实施方式中,如图7(a)所示,在内插板31上形成焊接电极32,在半导体芯片33上形成焊接电极34。
[3A-2]接着,如图7(b)所示,在形成了焊接电极32的内插板31的金属电极32侧,形成含有热固性树脂的树脂层35(第1工序)。
[3A-3]接着,如图7(c)所示,内插板31的焊接电极32和半导体芯片33的焊接电极34以对置方式定位。然后,如图8(a)所示,在焊接电极32及焊接电极34的焊料的热膨胀系数达到30×10-6/℃以下并且含有热固性树脂的树脂层35的固化度在80%以下的温度下进行加热及加压,由此使焊接电极32和焊接电极34对接,形成内插板31和半导体芯片33的层叠体50(第2工序)。
[3A-4]接着,如图8(b)所示,在利用加压流体对使焊接电极32和焊接电极34对接的内插板31和半导体芯片33的层叠体50进行加压的状态下,在焊接电极32和焊接电极34中的至少一方的焊料的热膨胀系数变得大于30×10-6/℃的温度下进行加热,由此使上述焊接电极32和焊接电极34熔融接合,形成焊接接合部36。(第3工序)。
作为在上述第3工序中的利用加压流体进行加压的状态下、在焊接电极32或焊接电极34的焊料的热膨胀系数变得大于30×10-6/℃的温度下对内插板31和半导体芯片33的层叠体50进行加热的方法,可以使用与上述工序[3A-4]同样的方法。
进而,在第3工序中,优选冷却至比焊接电极32及焊接电极34的焊料的熔点低的温度后,释放利用加压流体进行的加压。由此,能够防止内插板31和半导体芯片33的间隔扩展而发生接合不良。
更具体而言,在第3工序中,优选冷却至焊接电极34的焊料的热膨胀系数达到30×10-6/℃以下的温度后释放加压,由此能够防止内插板31和半导体芯片33的间隔扩展而发生接合不良。
进一步具体而言,释放加压的温度为200℃以下,优选为190℃以下,特别优选为180℃以下,由此能够防止内插板31和半导体芯片33的间隔扩展而发生接合不良。
[3A-5]接着,如图8(c)所示,将使焊接电极32和焊接电极34熔融接合而成的内插板31和半导体芯片33的层叠体50在焊接电极32及焊接电极34的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热,使含有热固性树脂的树脂层35固化,形成密封部37,得到内插板31和半导体芯片33的接合体60(第4工序)。
此时,通过在焊接电极32及焊接电极34的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热、使含有热固性树脂的树脂层35固化,从而可以防止焊接接合部36再熔融而导致电连接变得不稳定。
另外,在使含有热固性树脂的树脂层35固化时,优选与上述工序[3A-4]同样地利用加压流体进行加压。利用加压流体进行的加压条件可以使用与上述工序[3A-4]同样的方法。由此,利用气压和含有热固性树脂的树脂层35中的空穴(气隙)及空隙(气泡)的压力差,压缩空穴(气隙)及空隙(气泡),空穴(气隙)及空隙(气泡)在含有热固性树脂的树脂层中扩散,能够进一步提高可抑制空穴(气隙)及空隙(气泡)的产生的效果。
此处,在本发明中,内插板31和半导体芯片33(第1电子部件及第2电子部件)相互间介由焊接接合部36之类的固化物进行电连接。因此,在电子部件20驱动时,即使半导体芯片33的发热使得由热固性树脂构成的密封部37膨胀,也能够适当地防止该电连接被切断,能够在第1电子部件及第2电子部件间得到稳定的导通。即,能够在第1电子部件及第2电子部件间得到连接可靠性优异的电连接。
焊接接合部36的厚度、即内插板31和半导体芯片33的接合体60中的焊接接合部36的厚度(平均)没有特别限定,优选为3~300μm左右,更优选为5~150μm左右。这样通过缩小内插板31和半导体芯片33的隔离距离,从而也能够减小电子部件20作为整体的厚度,进而能够实现电子部件20的轻量化。
另外,通过在利用加压流体进行加压的状态下在比焊接电极32和焊接电极34中的至少一方的焊料的熔点高的温度下进行熔融接合、接着在比焊接电极32及焊接电极34的焊料的熔点低的温度下使含有热固性树脂的树脂层35固化,从而内插板31和半导体芯片33电连接,进而能够形成内插板31和半导体芯片33被固定的内插板31和半导体芯片33的接合体60。该内插板31和半导体芯片33的接合体60因为在利用加压流体进行加压的状态下在比焊接电极34的焊料的熔点高的温度下熔融接合,所以能够得到空穴及空隙的产生少的内插板31和半导体芯片33的接合体60。
第3实施方式也能够获得与第2实施方式同样的效果。
以上说明了本发明的电子部件的制造方法及电子部件,但本发明并不限定于此。例如,本发明的电子部件的制造方法可以适用于半导体元件和基板、基板和基板、半导体元件和半导体元件、半导体元件和半导体晶片、半导体晶片和半导体晶片等需要焊接连接的电子部件/构件的连接。
实施例
(实施例1)
1.含有热固性树脂的树脂层用树脂清漆的制备
将苯酚酚醛清漆树脂(住友Bakelite社制、PR55617)15.0重量份、液态双酚A型环氧树脂(大日本油墨化学工业社制、EPICLON-840S)45.0重量份、作为助焊剂活性化合物的酚酞啉(东京化成工业社制)15.0重量份、作为成膜性树脂的双酚A型苯氧基树脂(东都化成社制、YP-50)24.4重量份、作为固化促进剂的2-苯基-4-甲基咪唑(四国化成工业社制、2P4MZ)0.1重量份、作为硅烷偶联剂的β-(3,4环氧环己基)乙基三甲氧基硅烷(信越化学工业社制、KBM-303)0.5重量份溶于甲基乙基酮,制备成树脂浓度为50%的树脂清漆。
2.含有热固性树脂的树脂层(膜)的制备
将得到的树脂清漆在基材聚酯膜(东丽株式会社制、Lumirror)上涂布成厚度50μm,在100℃干燥5分钟,得到厚度25μm的含有热固性树脂的树脂层(膜)。
3.电子部件的制造
<第1工序>
在具有焊料凸块(Sn96.5/Ag3.5、熔点221℃)的半导体元件(尺寸10mm×10mm、厚度0.3mm)上,用真空辊式层压装置在100℃、0.8MPa、30秒的条件下层压得到的含有热固性树脂的树脂层(膜),得到附带含有热固性树脂的树脂层的半导体元件。
<第2工序>
接着,准备具有Ni/Au垫的电路基板,附带含有热固性树脂的树脂层的半导体元件的焊料凸块和Ni/Au垫以重叠方式进行对位,利用倒装片焊接器(涉谷工业株式会社社制DP-200)在120℃、0.05MPa、7秒的条件下进行焊料凸块和Ni/Au垫的对接,得到电路基板/半导体元件的层叠体。
<第3工序>
将得到的电路基板/半导体元件的层叠体置于市售的加压对应型烘箱中并利用氮气环境将烘箱的内部以0.5MPa的压力进行加压,同时在230℃加热10分钟,使焊料凸块和Ni/Au垫熔融接合。
<第4工序>
将使焊料凸块和Ni/Au垫接合而成的电路基板/半导体元件的层叠体投入市售的加热型烘箱中,施加180℃、60分钟的热经历,由此使含有热固性树脂的树脂层固化,制造出电子部件。
(实施例2)
在实施例1的第2工序中,将使其对接的温度从120℃变为150℃,除此之外,与实施例1同样地制造电子部件。
(实施例3)
在实施例1的第2工序中,将使其对接的温度从120℃变为180℃,除此之外,与实施例1同样地制造电子部件。
(实施例4)
在实施例1的第3工序中,将使其接合的压力从0.5MPa变为0.3MPa,除此之外,与实施例1同样地制造电子部件。
(实施例5)
在实施例1的第3工序中,将使其接合的压力从0.5MPa变为0.8MPa,除此之外,与实施例1同样地制造电子部件。
(实施例6)
在实施例1的第3工序中,将使其接合的环境从氮气变为空气,除此之外,与实施例1同样地制造电子部件。
(实施例7)
在实施例1的第4工序中,代替在市售的加热型烘箱中于180℃使含有热固性树脂的树脂层固化60分钟而在市售的加压对应型烘箱中在氮气环境、180℃、0.5MPa下使其固化60分钟,除此之外,与实施例1同样地制造电子部件。
(实施例8)
在实施例1的第2工序中,代替具有Ni/Au垫的电路基板而使用焊料凸块(Sn96.5/Ag3.5、熔点221℃),在第4工序中,代替在市售的加热型烘箱中于180℃使含有热固性树脂的树脂层固化60分钟而在市售的加压对应型烘箱中在氮气环境、180℃、0.5MPa下使其固化60分钟,除此之外,与实施例1同样地制造电子部件。
(参考例1)
在实施例1的第1工序中,代替焊料凸块(Sn96.5/Ag3.5、熔点221℃)而使用焊料凸块(Sn63/Pb37、熔点183℃),另外,在第3工序中,将使其接合的温度从230℃变为195℃,进而,在第4工序中,代替在市售的加热型烘箱中于180℃使含有热固性树脂的树脂层固化60分钟而在市售的加压对应型烘箱中在氮气环境、165℃、0.5MPa下使其固化120分钟,除此之外,与实施例1同样地制造电子部件。
(参考例2)
在实施例1的第1工序中,代替焊料凸块(Sn96.5/Ag3.5、熔点221℃)而使用焊料凸块(Sn89/Zn8/Bi3、熔点195℃),另外,在第3工序中,将使其接合的温度从230℃变为210℃,进而,在第4工序中,代替在市售的加热型烘箱中于180℃使含有热固性树脂的树脂层固化60分钟而在市售的加压对应型烘箱中在氮气环境、180℃、0.5MPa下使其固化60分钟,除此之外,与实施例1同样地制造电子部件。
(比较例1)
在实施例1的第3工序中,将压力从0.5MPa变为常压,除此之外,与实施例1同样地制造电子部件。
(比较例2)
在实施例1的第2工序中,将焊接温度由120℃变为240℃,除此之外,与实施例1同样地制造电子部件。
(比较例3)
在实施例1的第4工序中,将固化温度从180℃变为240℃,除此之外,与实施例1同样地制造电子部件。
4.焊料的热膨胀系数的算出
焊料的熔点以上的热膨胀系数通过金属材料物性值计算软件·数据库JMatPro(Sente Software社制)而算出。
焊料的熔点以下的热膨胀系数通过热机械特性分析装置(模式:压缩、荷重:50N、升温速度:5℃/分钟)而算出。
5.电子部件的评价
<空穴及空隙>
将得到的电子部件切断,研磨固化物的剖面。然后,任意选择10处被半导体元件、电路基板及邻接的2个焊接接合部所包围的部分,用金属显微镜观察各部分的微空隙的有无。各符号如下所述。
○:10处全部未观察到微空隙的情况
×:即使有1处观察到微空隙的情况
<导通可靠性>
对于得到的电子部件,利用数码万用表测定任意选择的邻接的2处焊接接合部的连接电阻。然后,除此之外,任意选择9点邻接的2处焊接接合部,同样地测定连接电阻,进行合计10点的导通连接的测定。
各符号如下所述。
○:10点全部导通的情况
×:即使有1点存在导通不良的情况
<电极间绝缘性>
对于得到的电子部件,利用数码万用表测定任意选择的邻接的2处焊接接合部的绝缘电阻。然后,除此之外,任意选择9点邻接的2处焊接接合部,同样地测定绝缘电阻,进行合计10点的导通连接的测定。
○:10点全部保持绝缘性的情况
×:即使有1点发生短路(short)的情况
[表1]
由表1可知,实施例1~8、及参考例1及2中得到的电子部件在密封部没有观察到空穴及空隙。另外,实施例1~8、及参考例1及2的电子部件的导通可靠性也优异。由此,暗示了焊料凸块和Ni/Au垫确实地熔融接合。
本申请要求以在2009年7月17日提交的日本专利申请特愿2009-168817为基础的优先权,将其公开的全部内容援引于此。
Claims (10)
1.一种电子部件的制造方法,其特征在于,是将具有连接用金属电极的第1电子部件和具有连接用焊接电极的第2电子部件接合的焊接接合方法,顺次进行如下工序:
在所述第1电子部件及所述第2电子部件的焊接接合面中的至少一方形成含有热固性树脂的树脂层的第1工序,
形成所述含有热固性树脂的树脂层后,将所述第1电子部件的连接用金属电极和所述第2电子部件的连接用焊接电极以对置方式对位,在比所述连接用焊接电极的焊料的熔点低的温度下进行加热及加压,由此使所述连接用金属电极和所述连接用焊接电极对接的第2工序,
将所述对接的第1电子部件和第2电子部件边通过加压流体进行加压,边在比所述连接用焊接电极的焊料的熔点高的温度下进行加热,使所述连接用焊接电极的焊料与所述连接用金属电极熔融接合的第3工序,
将所述含有热固性树脂的树脂层在比所述连接用焊接电极的焊料的熔点低的温度下进行加热,由此使其固化的第4工序。
2.一种电子部件的制造方法,其特征在于,是将具有连接用金属电极的第1电子部件和具有连接用焊接电极的第2电子部件接合的焊接接合方法,顺次进行如下工序:
在所述第1电子部件及所述第2电子部件的焊接接合面中的至少一方形成含有热固性树脂的树脂层的第1工序,
在形成所述含有热固性树脂的树脂层后,将所述第1电子部件的连接用金属电极和所述第2电子部件的连接用焊接电极以对置方式对位,在所述连接用焊接电极的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热及加压,由此使所述连接用金属电极和所述连接用焊接电极对接的第2工序,
将所述对接的第1电子部件和第2电子部件边通过加压流体进行加压,边在所述连接用焊接电极的焊料的热膨胀系数变得大于30×10-6/℃的温度下进行加热,使所述连接用焊接电极的焊料与所述连接用金属电极熔融接合的第3工序,
将所述含有热固性树脂的树脂层在所述连接用焊接电极的焊料的热膨胀系数达到30×10-6/℃以下的温度下进行加热,由此使其固化的第4工序。
3.如权利要求1或2所述的电子部件的制造方法,其特征在于,
第2工序中的所述加热温度为190℃以下的温度,
第3工序中的所述加热温度为高于210℃的温度,
第4工序中的所述加热温度为210℃以下的温度。
4.如权利要求1~3中的任一项所述的电子部件的制造方法,其特征在于,所述第1电子部件具有的所述连接用金属电极是连接用焊接电极。
5.如权利要求1~4中的任一项所述的电子部件的制造方法,其特征在于,在第3工序之后、第4工序之前,冷却至比所述连接用焊接电极的焊料的熔点低的温度后,释放由所述加压流体进行的加压。
6.如权利要求5所述的电子部件的制造方法,其特征在于,比所述连接用焊接电极的焊料的熔点低的温度是200℃以下的温度。
7.如权利要求1~6中的任一项所述的电子部件的制造方法,其特征在于,所述第4工序边通过加压流体加压边进行。
8.如权利要求1~7中的任一项所述的电子部件的制造方法,其特征在于,所述热固性树脂含有环氧树脂。
9.如权利要求1~8中的任一项所述的电子部件的制造方法,其特征在于,所述含有热固性树脂的树脂层含有助焊剂活性化合物。
10.一种电子部件,其使用权利要求1~9中的任一项所述的电子部件的制造方法而制成。
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