CN102449762A - 存储器装置 - Google Patents

存储器装置 Download PDF

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CN102449762A
CN102449762A CN2010800139103A CN201080013910A CN102449762A CN 102449762 A CN102449762 A CN 102449762A CN 2010800139103 A CN2010800139103 A CN 2010800139103A CN 201080013910 A CN201080013910 A CN 201080013910A CN 102449762 A CN102449762 A CN 102449762A
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flash memory
memory component
piling
storage arrangement
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CN102449762B (zh
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孙日欣
李振华
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Shenzhen Bai Dimensional Storage Polytron Technologies Inc
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BIWIN Tech Ltd
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Abstract

多通道闪存装置包括芯片堆叠的闪存芯片。由于使用堆叠的芯片构造，所以该闪存装置是紧凑的，同时由于其多数据通道构造而提供高速性能。具体示例是包括4个并行数据通道的4块堆叠闪存芯片的闪存。本发明减轻了已知芯片堆叠闪存装置的瓶颈问题。

Description

存储器装置
技术领域
本发明涉及存储器装置，更具体地涉及包括诸如闪存电路片或芯片之类的闪存部件的堆叠的存储器装置。本发明还涉及包括闪存部件的堆叠组件的电子设备。
背景技术
作为电子数据存储的存储器装置对于很多电子设备的操作来说是必需的，尤其是对于通过计算机或微处理器控制或可控的电子设备来说。这种存储器装置包括USB存储棒、固态盘(SSD)、移动互联网装置(MID)等。在各种类型的存储器装置中，闪存由于其较高的性价比、高数据存储密度、固态和非易失性而变得越来越流行。尽管闪存已经体现了超越之前的存储器装置的实质改进和优势，但对于更高数据存储容量的不断增长的需求意味着总是存在着将更多闪存装入单个紧凑封装的需求。
图1和图1A示意性地示出了现有技术中的堆叠闪存组件，其利用高层结构来增大数据存储容量。该存储器组件包括多个闪存芯片102、104、106、108，其中数据访问端子以级联方式连接。不过，由于堆叠中的底部闪存部件的数据访问瓶颈，这种堆叠闪存组件的性能整体上不令人满意。此外，一个闪存部件上的损坏的数据访问端子(或存取端子)还可能导致堆叠中其它闪存部件上的对应数据访问端子失效。
发明内容
根据本发明提供了一种包括安装在基板上的多个闪存组件的堆叠的存储器装置，其中每个闪存部件包括诸如数据输入和数据输出端子的数据访问端子的集合，并且所述多个闪存部件中每一个的每个数据访问端子单独接合在基板上，并且能够通过基板上的触点端子单独访问。存储器装置利用了高层或芯片堆叠结构的优点，同时由于对闪存部件堆叠组件的各个组件的单独或并行数据访问而减轻了上述瓶颈效应。
在基板上提供可单独访问的数据端子，意味着该存储器装置包括芯片堆叠构造，并且同时有助于多通道数据通信。例如，对于本发明的具有4块堆叠闪存芯片的存储器装置，可使用4个数据通道。这种多通道功能是有利的，因为其有助于并行数据访问和数据传输，从而为公众提供了紧凑且快速的存储器装置。
在一个实施例中，至少堆叠中的闪存部件的数据输入和数据输出端子可以通过接合线接合至基板。闪存部件的全部接合线可以位于闪存部件的横向一端或一侧。使芯片的全部接合线处在单个横向端部，意味着可以为堆叠中的相邻芯片的引线接合保留相对的横向端部处的空间。堆叠中相邻闪存部件上的接合线可以接合在与上述横向一端或一侧相对的横向一侧处。通过将闪存部件堆叠为使得接合线位于堆叠的直接相对端部的触点部分处，提供了更多空间以便将接合线连接至基板，尤其是当接合线为裸导线时。
在一个实施例中，堆叠中的闪存部件的定向相对堆叠中紧邻的闪存部件偏移大约90度。这为接合线连接提供了更多空间，并能够更有效地利用堆叠周围的空间。在这个实施例中，闪存部件的堆叠配置为使得夹在紧邻的两个闪存部件之间的闪存部件的接合线位于相邻闪存部件的接合横向侧的中间。
堆叠中的闪存部件的接合线可以接合在闪存部件的横向一端处，并且堆叠中的闪存部件的接合横向端部可以分布于实质上或基本上螺旋的路径上。这进一步为接合线连接提供了对堆叠周围空间的更佳的利用。
通常，堆叠可以被闪存部件的接合线围绕，或者被所述堆叠的至少4个横向侧上的接合线围绕。本领域技术人员能够理解，这种构造与图1和图1A的现有技术构造相比，其空间利用效率更高并且更有利。
此外，堆叠可以构造为使得堆叠的相对横向端部上的接合线关于堆叠的中心平面对称分布。这提供了相对现有设计更平衡的堆叠结构，并允许可靠地堆叠更多的闪存部件。
作为示例，数据访问端子可以通过接合线接合至基板，并且接合线构造为使得堆叠的下部闪存部件上的接合线被堆叠中更高的接合线套叠(nest)。如图2A和图3A所例示的这种套叠构造，提供了在堆叠的一个横向侧边上或在基板的一个局部区域上连接更多接合线的灵活性，从而使得在基板上进行闪存部件的芯片堆叠以及单独I/O访问变得可行或实用。
例如，接合线可以构造为使得堆叠底部的闪存部件被接合至所述堆叠的接合线的集合围绕。这种构造提供了一种灵巧的接合线配置，以减少堆叠的同一横向侧边上的接合线之间的交叉。
作为增加或作为替换方案，接合线可以围绕整个堆叠外围分布。类似地，这提供了对堆叠周围基板上的空间的更有效利用，以进行有效的单独I/O连接。
在一个实施例中，堆叠的闪存部件的接合部分从紧靠其下的闪存部件凸出。这有利地提供了额外的净空间，以用于接合线从闪存部件到基板走线，同时优化了芯片堆叠的空间效率。
作为示例，堆叠中的闪存部件被定向为实质上垂直于堆叠中的紧邻闪存部件。这种垂直构造提供了对堆叠周围和基板上的空间的有效利用，以进行单独的I/O访问。
作为示例，基板可以包括印刷电路板，其包括多层印刷电路板。多层PCB提供了更大的灵活性，允许从基板单独访问更多的闪存部件访问端子。
优选地，堆叠可以包括4块闪存组件，每个闪存组件包括数据输入和数据输出端子的通道，并且所述4块闪存部件的4个通道能够在基板上被单独访问。包括这种存储器芯片堆叠的存储器装置提供更快的数据I/O速度，因为相比传统芯片堆叠闪存的仅单个通道，可用4个数据通道。
作为示例，堆叠可以包括N个闪存部件，其中N＝2n，n为整数。
通常，数据输入和数据输出端子的集合总体形成通信通道，并且触点端子还包括电压端子和其它非数据端子。
存储器装置还可以包括数据控制器，其中数据控制器构造为并行访问多个闪存部件的数据输入和数据输出端子。
存储器装置可以是包括了至少一个根据本发明的存储器装置的数据存储设备的一部分，其中所述数据存储设备包括USB存储棒、固态硬盘等。
附图说明
下面通过示例并参照附图对本发明进行说明，附图中：
图1和图1A分别是现有技术堆叠闪存组件的侧视图和透视图，
图2和图2A分别示出了例示本发明第一实施例的存储器装置的侧视图和示意透视图，
图3和图3A分别示出了例示本发明第二实施例的存储器装置的侧视图和示意透视图，
图4是示出了图2的存储器装置的引线接合与引线接合端子之间的关系的示意平面图，
图5和图5A分别是图示了图2、图3、图8的存储器装置与作为USB装置的示例应用的示意框图，
图6A和图6B分别是例示了图2中装置的PCB上的触点端子的分布以及一个触点区域的放大图的示意图，
图7是更详细地示出了图2中装置的I/O(输入/输出端子)的示意透视图，和
图8和图8A是分别以组合以及部分组合的形式图示了本发明第三实施例的闪存组件的示意透视图。
具体实施方式
作为存储器装置示例的图2及图2A的闪存组件100包括4块闪存芯片102、104、106、和108的堆叠，每个闪存芯片均具有多个触点端子120或触点端口，以同外部进行电连接。每个存储器芯片都预先制造为固态和非易失性存储器单元，并具有确定的存储容量。当前可以获得容量为1、2、4、或8GB的闪存芯片。当然，单个存储器芯片或电路片的存储容量取决于芯片尺寸，并且预计将随着对芯片设计和制造技术的进一步改进而提高密度。本示例中使用的存储器芯片是具有10.8mm×13mm的示例尺寸的矩形芯片。例如，通过将4块1GB的芯片堆叠在一起，可以形成单个4GB的闪存片。类似地，通过堆叠4块4GB的闪存芯片能够形成单个16GB的闪存。
每个存储器芯片102-108的触点端子120包括诸如数据输入和数据输出端子的数据访问端子130，以及诸如控制端子和电源端子的其它端子140。数据访问端子总体定义了用于访问芯片的多位数据通信通道。每个芯片上的I/O端子的数量通常由字节大小确定。例如，如果字节大小为8位，则每个数据通信通道可以包括8个I/O端子以便于进行8位通信。类似地，如果字节大小为16位，则16个I/O端子可以总体定义一个通信通道。由于可用数据的单位取决于字节大小，因此存储器装置的速度很大程度上由数据通信通道的速度确定，因为所有关于芯片的数据传输均要通过通信通道。
作为闪存部件示例的闪存芯片使用“芯片堆叠”技术以高层方式堆叠，并且相邻的闪存芯片(即该芯片上方和下方的芯片)通过涂敷绝缘胶110的薄膜结合在一起。包括该胶合芯片堆叠的组件随后通过涂敷绝缘胶薄膜而胶合至作为基板示例的PCB 150上。存储器芯片上的触点端子通过接合线112连接至PCB上的触点端子。
图2、图2A和图4更清楚地示出，芯片的所有触点端子均处在位于芯片一个横向端部处的触点部分上。芯片的堆叠配置为使得在堆叠后暴露触点部分，以允许进行外部电连接。芯片的触点部分从堆叠凸出并且从堆叠中的相邻芯片上悬突，从而为接合线从芯片连接至基板的路径和空间。如图2和图4更清楚地示出，芯片上的每个I/O端子都通过接合线112单独接合在基板上，于是芯片上的每个I/O端子(及数据)都能够被直接访问，而不会干扰其它芯片上的I/O端子或被其干扰。这种单独的I/O连接配置便于在使用芯片堆叠结构的同时进行并行数据访问，如图5所示意性例示的。如图6A和6B所示，PCB布置为使得芯片的全部接触端子均位于PCB上的特定区域内。这种PCB上的局部连接布置便于对堆叠中的单个芯片的单个端子进行方便的识别和跟踪。
图2和图2A更清楚地示出，各个芯片布置为一个芯片的触点部分位于一个横向端部，而相邻芯片的触点部分位于直接相对的横向端部。这种交错堆叠有助于更佳的平衡及对称堆叠，以便获得更稳定的结构，并使得更多的芯片能够被堆叠在堆叠中，从而进一步提高存储容量。此外，这种堆叠构造还提供了更空间有效的构造，便于在从芯片扩展至PCB时接合线进行协调。
图3和图3A的堆叠组件200具有与图2和图2A基本相同的结构，并使用相同的标号来指示相同、共用、或等价的部分。代替在存储器芯片之间涂敷绝缘胶的薄膜，堆叠组件200包括厚绝缘胶层210，该层还用作相邻芯片之间的隔离片。绝缘隔离片提供足够的间隔，使得接合线一开始就能够向上延伸而不会受到上方芯片的阻碍，并且不需要类似图2实施例中的向后退缩的芯片。特别是可以看出，该组件的各个芯片的横向端部或者引线接合端部基本上是平直的。
图8和图8A的堆叠组件300示意性示出了闪存装置的第三实施例。闪存芯片和PCB的结构与连接与图2中的实施例相同，除了芯片的触点部分的定向有些不同以外。类似地，使用相同的标号来指示相同、共用、或等价的部分。具体来说，一个芯片的定向与其相邻芯片的定向垂直，使得相邻的各个芯片的定向(特别是芯片的触点部分)具有90度的偏离。在这种配置中，置于PCB上的触点端子构造为绕着堆叠分布并围绕该堆叠，于是在PCB上为引线接合提供更多的空间。
图5和图5A图示了作为本发明的一个方便应用的用作USB存储棒的存储器装置的示例应用。
尽管已经参照上述示例实施例对本发明进行了描述，但本领域技术人员应当理解，这些实施例仅用作参考，而不应看作对本发明范围的限制。例如，尽管在一个示例中使用矩形芯片，但还可以使用如正方向、圆形、或椭圆形的其它形状作为芯片形状。此外，尽管示例堆叠包括4块芯片，但应当理解可以将超过4块芯片堆叠在一起，并且存储器装置可以从超过一个堆叠组合得到。

Claims (20)

1.一种存储器装置，包括安装在基板上的多个闪存部件的堆叠，其中每个闪存部件包括诸如数据输入端子和数据输出端子的数据访问端子的集合，并且所述多个闪存部件中每一个的每个数据访问端子单独接合在基板上，并且能够通过基板上的触点端子单独访问。
2.根据权利要求1的存储器装置，其中至少堆叠中的闪存部件的数据输入端子和数据输出端子通过接合线接合至基板，并且闪存部件的全部接合线位于闪存部件的横向一端或一侧。
3.根据权利要求2的存储器装置，其中堆叠中的相邻闪存部件上的接合线被接合到与所述横向一端或一侧相对的横向一侧上。
4.根据权利要求2的存储器装置，其中堆叠中的闪存部件的定向相对堆叠中紧邻的闪存部件偏移90度。
5.根据权利要求4的存储器装置，其中闪存部件的堆叠配置为使得夹在紧邻的两个闪存部件之间的闪存部件的接合线位于相邻闪存部件的接合横向侧的中间。
6.根据前述权利要求中任一项的存储器装置，其中堆叠中的闪存部件的接合线被接合在闪存部件的横向一端处，并且堆叠中的闪存部件的接合横向端部位于实质上螺旋的路径上。
7.根据前述权利要求中任一项的存储器装置，其中所述堆叠被闪存部件的接合线围绕，或者被所述堆叠的至少4个横向侧上的接合线围绕。
8.根据前述权利要求中任一项的存储器装置，其中所述堆叠构造为使得堆叠的相对横向端部上的接合线相对堆叠的中心平面对称分布。
9.根据前述权利要求中任一项的存储器装置，其中所述数据访问端子通过接合线接合至基板，并且接合线构造为使得堆叠上的下部闪存部件上的接合线被堆叠中更高的接合线套叠。
10.根据权利要求1-9中任一项的存储器装置，其中接合线构造为使得堆叠底部的闪存部件由接合至所述堆叠的接合线的集合围绕。
11.根据前述权利要求中任一项的存储器装置，其中所述接合线围绕堆叠的整个外围分布。
12.根据前述权利要求中任一项的存储器装置，其中所述堆叠的闪存部件的接合部分从紧靠其下的闪存部件凸出。
13.根据前述权利要求中任一项的存储器装置，其中堆叠中的闪存部件被定向为实质上垂直于堆叠中的紧邻闪存部件。
14.根据前述权利要求中任一项的存储器装置，其中每个闪存部件包括闪存部件的芯片。
15.根据前述权利要求中任一项的存储器装置，其中所述基板包括印刷电路板，其包括多层印刷电路板。
16.根据前述权利要求中任一项的存储器装置，其中所述堆叠包括至少4个闪存部件，每个闪存部件包括数据输入端子和数据输出端子的通道；并且所述4个闪存部件的4个通道能够在基板上被单独访问。
17.根据前述权利要求中任一项的存储器装置，其中所述堆叠包括N个闪存部件，其中N＝2n，n为整数。
18.根据前述权利要求中任一项的存储器装置，其中数据输入端子和数据输出端子的集合总体形成通信通道，并且触点端子还包括电压端子和其它非数据端子。
19.根据前述权利要求中任一项的存储器装置，还包括数据控制器，其中所述数据控制器构造为并行访问多个闪存部件的数据输入端子和数据输出端子。
20.一种数据存储设备，其包括根据前述权利要求中任一项的至少一个存储器装置，其中所述数据存储器设备包括USB存储棒、固态硬盘等。
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Address after: 518055, Guangdong, Nanshan District, Taoyuan Shenzhen street, with the rich industrial city, No. 4 factory building, 1 floor, 2 floor, 4 floor, 5 floor

Patentee after: Shenzhen Bai dimensional storage Polytron Technologies Inc

Address before: 518000, Guangdong, Nanshan District, Taoyuan Shenzhen street, with the rich industrial city, No. 4 factory building, 1 floor, 2 floor, 4 floor, 5 floor

Patentee before: Biwin Storage Technology Limited

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Address after: 518000 floors 1-3 and 4 of buildings 4 and 8, zone 2, Zhongguan honghualing Industrial South Zone, No. 1213 Liuxian Avenue, Pingshan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong

Patentee after: BIWIN STORAGE TECHNOLOGY Co.,Ltd.

Address before: 518055 1st floor, 2nd floor, 4th floor, 5th floor, No.4 factory building, tongfuyu industrial city, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province

Patentee before: BIWIN STORAGE TECHNOLOGY Co.,Ltd.