CN102438406B - 用于制造印刷电路板的抗蚀剂涂覆设备 - Google Patents

用于制造印刷电路板的抗蚀剂涂覆设备 Download PDF

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Publication number
CN102438406B
CN102438406B CN201110247236.1A CN201110247236A CN102438406B CN 102438406 B CN102438406 B CN 102438406B CN 201110247236 A CN201110247236 A CN 201110247236A CN 102438406 B CN102438406 B CN 102438406B
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China
Prior art keywords
unit
resist
copper
clad plate
master slice
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CN201110247236.1A
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English (en)
Chinese (zh)
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CN102438406A (zh
Inventor
金龙文
李溶雨
朴钟元
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN102438406A publication Critical patent/CN102438406A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
CN201110247236.1A 2010-08-26 2011-08-25 用于制造印刷电路板的抗蚀剂涂覆设备 Active CN102438406B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100082925A KR101075630B1 (ko) 2010-08-26 2010-08-26 인쇄 회로 기판 제조용 레지스트 도포 장치
KR10-2010-0082925 2010-08-26

Publications (2)

Publication Number Publication Date
CN102438406A CN102438406A (zh) 2012-05-02
CN102438406B true CN102438406B (zh) 2016-01-20

Family

ID=45033177

Family Applications (1)

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CN201110247236.1A Active CN102438406B (zh) 2010-08-26 2011-08-25 用于制造印刷电路板的抗蚀剂涂覆设备

Country Status (4)

Country Link
JP (1) JP2012049541A (ko)
KR (1) KR101075630B1 (ko)
CN (1) CN102438406B (ko)
TW (1) TWI434633B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103108493B (zh) * 2013-02-25 2016-01-20 上海夏普电器有限公司 一种电子线路板的防潮处理方法
CN106984478B (zh) * 2017-03-29 2022-12-06 王文潮 一种用于控制覆铜板流胶的生产工艺及配套设备
CN110769608A (zh) * 2019-11-11 2020-02-07 江苏上达电子有限公司 一种快速去除cof基板两端残铜的方法和设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268535A (en) * 1990-08-10 1993-12-07 Nippon Cmk Corp. Printed wiring board
US6515295B1 (en) * 2000-06-22 2003-02-04 Ushiodenki Kabushiki Kaisha Device for exposure of the peripheral area of a film circuit board

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62106864A (ja) * 1985-10-31 1987-05-18 Nec Home Electronics Ltd プリント基板のコ−テイング装置
JPS62154794A (ja) * 1985-12-27 1987-07-09 ノードソン株式会社 実装回路板への防湿絶縁剤の被覆方法
JPS63194388A (ja) * 1987-02-06 1988-08-11 株式会社豊田自動織機製作所 インクジエツト方式によるプリント基板作成方法
JPH0810396Y2 (ja) * 1989-09-27 1996-03-29 富士通テン株式会社 紫外線照射装置
JP2596250B2 (ja) * 1991-03-26 1997-04-02 凸版印刷株式会社 レジスト形成装置
JPH05152729A (ja) * 1991-12-02 1993-06-18 Hitachi Chem Co Ltd 回路用基板の端面封止方法
JPH08155368A (ja) * 1994-12-08 1996-06-18 Fujitsu Ten Ltd 液状物質の塗布方法及び液状物質の塗布装置
JPH11104542A (ja) * 1997-10-07 1999-04-20 Asahi Sunac Corp 基板への塗布剤の塗布システム
JP4309489B2 (ja) * 1998-04-09 2009-08-05 旭サナック株式会社 成膜装置
JP2000271942A (ja) * 1999-03-26 2000-10-03 Matsushita Electric Works Ltd シート状樹脂成形基材の端部処理装置
JP4292638B2 (ja) * 1999-08-23 2009-07-08 日立化成工業株式会社 配線板の製造方法
JP3863067B2 (ja) * 2002-06-04 2006-12-27 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体の製造方法
JP3861854B2 (ja) * 2003-05-28 2006-12-27 セイコーエプソン株式会社 電気回路の製造方法
JP2005197443A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd プリント配線板の製造方法
JP4477986B2 (ja) * 2004-10-26 2010-06-09 クボタ松下電工外装株式会社 板材の塗装方法
JP2008028153A (ja) * 2006-07-21 2008-02-07 Sumitomo Heavy Ind Ltd パタン作製装置及びパタン作製方法
JP4884871B2 (ja) * 2006-07-27 2012-02-29 東京エレクトロン株式会社 塗布方法及び塗布装置
KR101446950B1 (ko) * 2007-02-28 2014-10-07 삼성디스플레이 주식회사 잉크젯 헤드 어셈블리 및 이를 이용한 인쇄 방법
JP2009239215A (ja) 2008-03-28 2009-10-15 Kyocer Slc Technologies Corp 銅張積層板およびこれを用いた配線基板の製造方法ならびに銅張積層板の端面処理方法およびこれに用いる端面処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268535A (en) * 1990-08-10 1993-12-07 Nippon Cmk Corp. Printed wiring board
US6515295B1 (en) * 2000-06-22 2003-02-04 Ushiodenki Kabushiki Kaisha Device for exposure of the peripheral area of a film circuit board

Also Published As

Publication number Publication date
TWI434633B (zh) 2014-04-11
KR101075630B1 (ko) 2011-10-21
CN102438406A (zh) 2012-05-02
TW201218887A (en) 2012-05-01
JP2012049541A (ja) 2012-03-08

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