CN102421829B - 由包含聚合物和表面改性六方氮化硼颗粒的浇铸组合物制得的薄膜 - Google Patents

由包含聚合物和表面改性六方氮化硼颗粒的浇铸组合物制得的薄膜 Download PDF

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Publication number
CN102421829B
CN102421829B CN201080020671.4A CN201080020671A CN102421829B CN 102421829 B CN102421829 B CN 102421829B CN 201080020671 A CN201080020671 A CN 201080020671A CN 102421829 B CN102421829 B CN 102421829B
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polymer
film
boron nitride
hexagonal boron
nitride particles
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Expired - Fee Related
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CN201080020671.4A
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Chinese (zh)
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CN102421829A (zh
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P-Y·林
G·P·拉金德兰
G·E·扎尔
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H—ELECTRICITY
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  • Chemical & Material Sciences (AREA)
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  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
CN201080020671.4A 2009-05-13 2010-05-12 由包含聚合物和表面改性六方氮化硼颗粒的浇铸组合物制得的薄膜 Expired - Fee Related CN102421829B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/465,090 2009-05-13
US12/465090 2009-05-13
US12/465,090 US8784980B2 (en) 2009-05-13 2009-05-13 Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
PCT/US2010/034471 WO2010132519A2 (en) 2009-05-13 2010-05-12 A film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles

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CN102421829A CN102421829A (zh) 2012-04-18
CN102421829B true CN102421829B (zh) 2014-05-07

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CN201080020671.4A Expired - Fee Related CN102421829B (zh) 2009-05-13 2010-05-12 由包含聚合物和表面改性六方氮化硼颗粒的浇铸组合物制得的薄膜

Country Status (6)

Country Link
US (1) US8784980B2 (enExample)
EP (1) EP2430083A4 (enExample)
JP (1) JP5597700B2 (enExample)
KR (1) KR20120026539A (enExample)
CN (1) CN102421829B (enExample)
WO (1) WO2010132519A2 (enExample)

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US8440292B2 (en) * 2009-05-13 2013-05-14 E I Du Pont De Nemours And Company Multi-layer article for flexible printed circuits
US8258346B2 (en) * 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles
US8288466B2 (en) * 2009-05-13 2012-10-16 E I Du Pont De Nemours And Company Composite of a polymer and surface modified hexagonal boron nitride particles
US8784980B2 (en) 2009-05-13 2014-07-22 E I Du Pont De Nemours And Company Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
CN102516766B (zh) * 2011-11-29 2013-12-04 苏州大学 一种六方氮化硼/热固性树脂复合材料及其制备方法
KR102235501B1 (ko) * 2014-09-12 2021-04-05 엘지이노텍 주식회사 무기충전재 및 이를 포함하는 에폭시 수지 조성물
KR102318231B1 (ko) 2015-01-29 2021-10-27 엘지이노텍 주식회사 무기충전재, 이를 포함하는 수지 조성물, 그리고 이를 이용한 방열 기판
KR101721753B1 (ko) * 2015-04-22 2017-03-30 한국과학기술원 고품질 육방정 질화붕소 나노시트 제조 방법 및 이를 이용하여 제조된 육방정 질화붕소 나노시트
JP6838053B2 (ja) * 2015-09-09 2021-03-03 ペプシコ・インク 六方晶窒化ホウ素を含むポリマーを提供するためのプロセス
JP6581481B2 (ja) * 2015-11-19 2019-09-25 積水化学工業株式会社 窒化ホウ素ナノチューブ及び熱硬化性材料
TWI708805B (zh) * 2015-12-30 2020-11-01 美商聖高拜陶器塑膠公司 改質氮化物顆粒、寡聚物官能化氮化物顆粒、基於聚合物之複合材料及其形成方法
JP6721219B2 (ja) * 2016-03-14 2020-07-08 ナミックス株式会社 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法
CN107189091A (zh) * 2016-03-15 2017-09-22 Bgt材料有限公司 六方氮化硼薄片的制造方法
CN108794867B (zh) * 2017-04-28 2021-02-12 中国石油化工股份有限公司 聚乙烯薄膜用母料、吹膜用聚乙烯组合物及其制备方法
CN109135267B (zh) * 2017-06-15 2021-04-27 中国科学院化学研究所 一种表面胺基化的氮化硼/尼龙复合材料及其制备方法和用途
CN116334581A (zh) * 2023-03-24 2023-06-27 深圳市金广利薄膜材料有限公司 一种新材料薄膜及其制备方法

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US8784980B2 (en) 2014-07-22
KR20120026539A (ko) 2012-03-19
EP2430083A4 (en) 2015-03-04
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