CN102403982A - 压电装置 - Google Patents

压电装置 Download PDF

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Publication number
CN102403982A
CN102403982A CN2011102453996A CN201110245399A CN102403982A CN 102403982 A CN102403982 A CN 102403982A CN 2011102453996 A CN2011102453996 A CN 2011102453996A CN 201110245399 A CN201110245399 A CN 201110245399A CN 102403982 A CN102403982 A CN 102403982A
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China
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Pending
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CN2011102453996A
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English (en)
Chinese (zh)
Inventor
高桥岳宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Publication of CN102403982A publication Critical patent/CN102403982A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN2011102453996A 2010-09-16 2011-08-22 压电装置 Pending CN102403982A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-207861 2010-09-16
JP2010207861A JP5595196B2 (ja) 2010-09-16 2010-09-16 圧電デバイス

Publications (1)

Publication Number Publication Date
CN102403982A true CN102403982A (zh) 2012-04-04

Family

ID=45817118

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011102453996A Pending CN102403982A (zh) 2010-09-16 2011-08-22 压电装置

Country Status (4)

Country Link
US (1) US8896185B2 (https=)
JP (1) JP5595196B2 (https=)
CN (1) CN102403982A (https=)
TW (1) TWI469513B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104617910A (zh) * 2013-11-05 2015-05-13 京瓷晶体元件有限公司 水晶振子

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325151B2 (ja) * 2010-03-31 2013-10-23 日本電波工業株式会社 水晶デバイス、及びその製造方法
JP2012034086A (ja) * 2010-07-29 2012-02-16 Nippon Dempa Kogyo Co Ltd 圧電デバイスの製造方法及び圧電デバイス
JP2012060628A (ja) * 2010-08-07 2012-03-22 Nippon Dempa Kogyo Co Ltd 圧電デバイス及びその製造方法
JP5646367B2 (ja) * 2011-02-25 2014-12-24 日本電波工業株式会社 水晶デバイス
JP5999833B2 (ja) * 2011-06-08 2016-09-28 日本電波工業株式会社 水晶デバイス
JP5788728B2 (ja) * 2011-07-21 2015-10-07 日本電波工業株式会社 圧電振動片、圧電デバイス、及び圧電デバイスの製造方法
US20130043770A1 (en) * 2011-08-17 2013-02-21 Nihon Dempa Kogyo Co., Ltd. Piezoelectric vibrating piece and piezoelectric device
JP2013051512A (ja) * 2011-08-30 2013-03-14 Nippon Dempa Kogyo Co Ltd 水晶振動子
DE102012202727B4 (de) * 2012-02-22 2015-07-02 Vectron International Gmbh Verfahren zur Verbindung eines ersten elektronischen Bauelements mit einem zweiten Bauelement
JP2013258519A (ja) * 2012-06-12 2013-12-26 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP2014060245A (ja) * 2012-09-18 2014-04-03 Mitsubishi Electric Corp 半導体装置
KR101575800B1 (ko) * 2014-08-19 2015-12-08 주식회사 이노칩테크놀로지 압전 소자 및 이를 구비하는 전자기기
US10778182B2 (en) * 2015-03-31 2020-09-15 Murata Manufacturing Co., Ltd. Resonator
WO2016158048A1 (ja) 2015-03-31 2016-10-06 株式会社村田製作所 共振子
US10938375B2 (en) 2015-03-31 2021-03-02 Murata Manufacturing Co, Ltd. Resonator
US10888009B2 (en) * 2018-10-26 2021-01-05 Medtronic, Inc. Method of forming a sealed package
WO2021220544A1 (ja) * 2020-04-30 2021-11-04 株式会社村田製作所 圧電振動子及びそれを備える圧電発振器
TWI788669B (zh) 2020-05-28 2023-01-01 台灣晶技股份有限公司 振子晶體的晶圓級封裝結構
TWI776445B (zh) * 2021-03-30 2022-09-01 台灣晶技股份有限公司 晶體振子封裝結構

Citations (2)

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Publication number Priority date Publication date Assignee Title
US3137836A (en) * 1955-08-25 1964-06-16 Clyde P Glover Support for electro-acoustic transducer
CN101356728A (zh) * 2006-08-10 2009-01-28 株式会社大真空 压电振动器件

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JPS5693412A (en) * 1979-12-26 1981-07-29 Seiko Instr & Electronics Ltd Superthin quartz oscillator
US4641054A (en) * 1984-08-09 1987-02-03 Nippon Ceramic Company, Limited Piezoelectric electro-acoustic transducer
JPS61138275A (ja) 1984-12-10 1986-06-25 Nippon Denki Kanji Syst Kk フラツシユ定着装置
JPS61138275U (https=) * 1985-02-15 1986-08-27
JPS61256656A (ja) * 1985-05-08 1986-11-14 Fujitsu Ltd 半導体装置
JPS6457738A (en) * 1987-08-28 1989-03-06 Sumitomo Electric Industries Package for semiconductor device
JP2712602B2 (ja) * 1989-08-10 1998-02-16 株式会社村田製作所 圧電共振子の製造方法
JP2547787Y2 (ja) * 1991-04-27 1997-09-17 株式会社トーキン 圧電振動子
JPH0559951U (ja) * 1992-01-09 1993-08-06 株式会社村田製作所 圧電部品
JP2580471B2 (ja) 1993-07-28 1997-02-12 調和工業株式会社 ア―ム式作業機用杭打装置
JPH08125050A (ja) * 1994-10-21 1996-05-17 Mitsubishi Electric Corp 半導体装置
JP3301262B2 (ja) * 1995-03-28 2002-07-15 松下電器産業株式会社 弾性表面波装置
JP2000150687A (ja) * 1998-11-18 2000-05-30 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
JP2001119795A (ja) * 1999-08-10 2001-04-27 Murata Mfg Co Ltd 圧電型電気音響変換器
JP2002170895A (ja) * 2000-11-30 2002-06-14 Kyocera Corp 電子部品収納用パッケージおよびその封止方法
JP3669431B2 (ja) * 2001-08-20 2005-07-06 株式会社村田製作所 圧電型電気音響変換器
TW567664B (en) * 2001-10-09 2003-12-21 Ebauchesfabrik Eta Ag Piezoelectric resonator and assembly comprising the same enclosed in a case
JP2003163560A (ja) * 2001-11-27 2003-06-06 Kyocera Corp 圧電振動子収納用容器
JP3968782B2 (ja) * 2002-07-15 2007-08-29 株式会社大真空 電子部品用パッケージおよび当該パッケージを用いた圧電振動デバイスおよび圧電振動デバイスの製造方法
JP2004222053A (ja) 2003-01-16 2004-08-05 Seiko Epson Corp 圧電デバイス、携帯電話装置及び電子機器
JP4003686B2 (ja) * 2003-04-10 2007-11-07 株式会社村田製作所 圧電型電気音響変換器
JP2005109886A (ja) * 2003-09-30 2005-04-21 Seiko Epson Corp 圧電デバイスとその製造方法ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
JP2005216932A (ja) * 2004-01-27 2005-08-11 Kyocera Corp 配線基板及びその製造方法並びに電気部品
JP2007073713A (ja) * 2005-09-06 2007-03-22 Epson Toyocom Corp 圧電デバイス用パッケージ
JP2007258918A (ja) 2006-03-22 2007-10-04 Epson Toyocom Corp 圧電デバイス
JP2007274071A (ja) * 2006-03-30 2007-10-18 Daishinku Corp 圧電振動デバイス用のベースおよび圧電振動デバイス
JP2009278612A (ja) * 2008-04-18 2009-11-26 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶デバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3137836A (en) * 1955-08-25 1964-06-16 Clyde P Glover Support for electro-acoustic transducer
CN101356728A (zh) * 2006-08-10 2009-01-28 株式会社大真空 压电振动器件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104617910A (zh) * 2013-11-05 2015-05-13 京瓷晶体元件有限公司 水晶振子

Also Published As

Publication number Publication date
US8896185B2 (en) 2014-11-25
TWI469513B (zh) 2015-01-11
TW201214961A (en) 2012-04-01
JP5595196B2 (ja) 2014-09-24
JP2012065155A (ja) 2012-03-29
US20120068578A1 (en) 2012-03-22

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120404