CN102403429B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN102403429B
CN102403429B CN201110051219.0A CN201110051219A CN102403429B CN 102403429 B CN102403429 B CN 102403429B CN 201110051219 A CN201110051219 A CN 201110051219A CN 102403429 B CN102403429 B CN 102403429B
Authority
CN
China
Prior art keywords
light
transparent resin
emitting
layer
phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110051219.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN102403429A (zh
Inventor
三石严
布上真也
佐藤高洋
福田由美
冈田葵
松田直寿
彦坂年辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of CN102403429A publication Critical patent/CN102403429A/zh
Application granted granted Critical
Publication of CN102403429B publication Critical patent/CN102403429B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
CN201110051219.0A 2010-09-08 2011-03-03 发光装置 Expired - Fee Related CN102403429B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP201336/2010 2010-09-08
JP2010201336 2010-09-08

Publications (2)

Publication Number Publication Date
CN102403429A CN102403429A (zh) 2012-04-04
CN102403429B true CN102403429B (zh) 2014-07-16

Family

ID=43859832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110051219.0A Expired - Fee Related CN102403429B (zh) 2010-09-08 2011-03-03 发光装置

Country Status (6)

Country Link
US (1) US8310145B2 (enExample)
EP (1) EP2428543B1 (enExample)
JP (1) JP5752650B2 (enExample)
KR (1) KR101247020B1 (enExample)
CN (1) CN102403429B (enExample)
TW (1) TWI411141B (enExample)

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JP5592602B2 (ja) * 2008-07-31 2014-09-17 株式会社東芝 蛍光体およびそれを用いた発光装置
US8436527B2 (en) * 2010-09-07 2013-05-07 Kabushiki Kaisha Toshiba Light emitting device
US8414795B2 (en) * 2010-09-09 2013-04-09 Kabushiki Kaisha Toshiba Red light-emitting fluorescent substance and light-emitting device employing the same
JP5185421B2 (ja) * 2010-09-09 2013-04-17 株式会社東芝 赤色発光蛍光体およびそれを用いた発光装置
US11251164B2 (en) * 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
US9055647B2 (en) 2011-12-16 2015-06-09 Marvell World Trade Ltd. Current balancing circuits for light-emitting-diode-based illumination systems
EP2792215A1 (en) * 2011-12-16 2014-10-22 Marvell World Trade Ltd. Current balancing circuits for light-emitting-diode-based illumination systems
TW201403886A (zh) * 2012-07-13 2014-01-16 Ritedia Corp 白光發光二極體
CN104781942B (zh) * 2012-11-01 2017-08-08 皇家飞利浦有限公司 具有宽色域的基于led的设备
JP2014203932A (ja) * 2013-04-03 2014-10-27 株式会社東芝 発光装置
DE102013113188A1 (de) * 2013-11-28 2015-05-28 Osram Gmbh Lumineszenzkonversionselement und optoelektronisches Halbleiterbauteil mit einem solchen Lumineszenzkonversionselement
EP3213355B1 (en) * 2014-10-31 2020-01-29 Lumileds Holding B.V. Phosphor converted led with temperature stable flux and saturated red color point
CN107407464B (zh) * 2015-03-18 2019-03-15 夏普株式会社 照明装置、显示装置和电视接收装置
US10711192B2 (en) 2016-08-12 2020-07-14 Osram Oled Gmbh Lighting device
US10644206B2 (en) 2016-08-12 2020-05-05 Osram Oled Gmbh Lighting device
WO2018087304A1 (de) 2016-11-11 2018-05-17 Osram Gmbh Leuchtstoff, beleuchtungsvorrichtung und verwendung einer beleuchtungsvorrichtung
WO2018029304A1 (de) 2016-08-12 2018-02-15 Osram Gmbh Beleuchtungsvorrichtung
DE102016121692A1 (de) 2016-08-12 2018-02-15 Osram Gmbh Leuchtstoff und Verfahren zur Herstellung eines Leuchtstoffs
JP7050774B2 (ja) 2016-11-11 2022-04-08 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 蛍光体、照明装置および照明装置の使用
CN107452857A (zh) * 2017-06-26 2017-12-08 南通华隆微电子股份有限公司 一种led光电二极管封装结构
CN107492592A (zh) * 2017-06-26 2017-12-19 南通华隆微电子股份有限公司 一种发光二极管封装结构
DE112018004067A5 (de) 2017-08-10 2020-04-23 Osram Oled Gmbh Dimmbare Lichtquelle
DE102018205464A1 (de) 2017-11-10 2019-05-16 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung und verwendung einer beleuchtungsvorrichtung
CN108807648B (zh) * 2018-06-21 2019-09-24 旭宇光电（深圳）股份有限公司 一种发光二极管封装结构及封装方法
CN115799433B (zh) * 2023-01-09 2024-09-10 四川世纪和光科技发展有限公司 一种红光封装结构、红光led光源及封装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1924427A (zh) * 2005-09-01 2007-03-07 夏普株式会社 发光装置
JP2007180483A (ja) * 2005-11-30 2007-07-12 Sharp Corp 発光装置
JP2008081631A (ja) * 2006-09-28 2008-04-10 Sharp Corp 発光装置

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JP4565141B2 (ja) * 2004-06-30 2010-10-20 独立行政法人物質・材料研究機構 蛍光体と発光器具
JP4543250B2 (ja) * 2004-08-27 2010-09-15 Ｄｏｗａエレクトロニクス株式会社 蛍光体混合物および発光装置
JPWO2006077740A1 (ja) * 2004-12-28 2008-06-19 日亜化学工業株式会社 発光装置及びその製造方法
CN102827603A (zh) 2005-03-04 2012-12-19 三菱化学株式会社 荧光体及其制备方法、和使用该荧光体的发光装置
US20070052342A1 (en) * 2005-09-01 2007-03-08 Sharp Kabushiki Kaisha Light-emitting device
JP2007134656A (ja) 2005-11-14 2007-05-31 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
US20090033201A1 (en) * 2006-02-02 2009-02-05 Mitsubishi Chemical Corporation Complex oxynitride phosphor, light-emitting device using same, image display, illuminating device, phosphor-containing composition and complex oxynitride
EP2308946B1 (en) 2006-03-10 2013-07-24 Kabushiki Kaisha Toshiba Luminescent material and light-emitting device
JP4353196B2 (ja) 2006-03-10 2009-10-28 パナソニック電工株式会社 発光装置
WO2008032812A1 (fr) * 2006-09-15 2008-03-20 Mitsubishi Chemical Corporation Substance luminescente, son procédé de fabrication, composition contenant la substance luminescente, dispositif émettant de la lumière, dispositif d'affichage d'images et dispositif d'éclairage
JPWO2009011205A1 (ja) * 2007-07-19 2010-09-16 シャープ株式会社 発光装置
JP2009065137A (ja) 2007-08-09 2009-03-26 Toshiba Lighting & Technology Corp 発光装置
JP5044329B2 (ja) 2007-08-31 2012-10-10 株式会社東芝 発光装置
JP2009206459A (ja) * 2008-02-29 2009-09-10 Sharp Corp 色変換部材およびそれを用いた発光装置
JP5592602B2 (ja) 2008-07-31 2014-09-17 株式会社東芝 蛍光体およびそれを用いた発光装置
JP4881358B2 (ja) 2008-08-28 2012-02-22 株式会社東芝 発光装置
JP4869317B2 (ja) * 2008-10-29 2012-02-08 株式会社東芝 赤色蛍光体およびそれを用いた発光装置
JP2010201336A (ja) 2009-03-03 2010-09-16 Fuji Xerox Co Ltd 流路構造体
JP2010225960A (ja) 2009-03-25 2010-10-07 Kyocera Corp 発光装置および照明装置

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1924427A (zh) * 2005-09-01 2007-03-07 夏普株式会社 发光装置
JP2007180483A (ja) * 2005-11-30 2007-07-12 Sharp Corp 発光装置
JP2008081631A (ja) * 2006-09-28 2008-04-10 Sharp Corp 発光装置

Also Published As

Publication number Publication date
TW201212292A (en) 2012-03-16
US20120056526A1 (en) 2012-03-08
CN102403429A (zh) 2012-04-04
JP2012235145A (ja) 2012-11-29
EP2428543A1 (en) 2012-03-14
KR20120025956A (ko) 2012-03-16
EP2428543B1 (en) 2013-05-08
TWI411141B (zh) 2013-10-01
US8310145B2 (en) 2012-11-13
JP5752650B2 (ja) 2015-07-22
KR101247020B1 (ko) 2013-03-25

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20171221

Address after: Tokyo, Japan

Patentee after: Kabushiki Kaisha TOSHIBA

Address before: Tokyo, Japan

Patentee before: Toshiba Corp.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140716

CF01 Termination of patent right due to non-payment of annual fee