KR101247020B1 - 발광 장치 - Google Patents

발광 장치 Download PDF

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Publication number
KR101247020B1
KR101247020B1 KR1020110016516A KR20110016516A KR101247020B1 KR 101247020 B1 KR101247020 B1 KR 101247020B1 KR 1020110016516 A KR1020110016516 A KR 1020110016516A KR 20110016516 A KR20110016516 A KR 20110016516A KR 101247020 B1 KR101247020 B1 KR 101247020B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
phosphor
red
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020110016516A
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English (en)
Korean (ko)
Other versions
KR20120025956A (ko
Inventor
이와오 미쯔이시
신야 누노우에
다까히로 사또
유미 후꾸다
아오이 오까다
나오또시 마쯔다
도시끼 히꼬사까
Original Assignee
가부시끼가이샤 도시바
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Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20120025956A publication Critical patent/KR20120025956A/ko
Application granted granted Critical
Publication of KR101247020B1 publication Critical patent/KR101247020B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883Arsenides; Nitrides; Phosphides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • H10H20/8513Wavelength conversion materials having two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8514Wavelength conversion means characterised by their shape, e.g. plate or foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
KR1020110016516A 2010-09-08 2011-02-24 발광 장치 Expired - Fee Related KR101247020B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-201336 2010-09-08
JP2010201336 2010-09-08

Publications (2)

Publication Number Publication Date
KR20120025956A KR20120025956A (ko) 2012-03-16
KR101247020B1 true KR101247020B1 (ko) 2013-03-25

Family

ID=43859832

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110016516A Expired - Fee Related KR101247020B1 (ko) 2010-09-08 2011-02-24 발광 장치

Country Status (6)

Country Link
US (1) US8310145B2 (enExample)
EP (1) EP2428543B1 (enExample)
JP (1) JP5752650B2 (enExample)
KR (1) KR101247020B1 (enExample)
CN (1) CN102403429B (enExample)
TW (1) TWI411141B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5592602B2 (ja) * 2008-07-31 2014-09-17 株式会社東芝 蛍光体およびそれを用いた発光装置
US8436527B2 (en) * 2010-09-07 2013-05-07 Kabushiki Kaisha Toshiba Light emitting device
US8414795B2 (en) * 2010-09-09 2013-04-09 Kabushiki Kaisha Toshiba Red light-emitting fluorescent substance and light-emitting device employing the same
JP5185421B2 (ja) * 2010-09-09 2013-04-17 株式会社東芝 赤色発光蛍光体およびそれを用いた発光装置
US11251164B2 (en) * 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
US9055647B2 (en) 2011-12-16 2015-06-09 Marvell World Trade Ltd. Current balancing circuits for light-emitting-diode-based illumination systems
EP2792215A1 (en) * 2011-12-16 2014-10-22 Marvell World Trade Ltd. Current balancing circuits for light-emitting-diode-based illumination systems
TW201403886A (zh) * 2012-07-13 2014-01-16 Ritedia Corp 白光發光二極體
CN104781942B (zh) * 2012-11-01 2017-08-08 皇家飞利浦有限公司 具有宽色域的基于led的设备
JP2014203932A (ja) * 2013-04-03 2014-10-27 株式会社東芝 発光装置
DE102013113188A1 (de) * 2013-11-28 2015-05-28 Osram Gmbh Lumineszenzkonversionselement und optoelektronisches Halbleiterbauteil mit einem solchen Lumineszenzkonversionselement
EP3213355B1 (en) * 2014-10-31 2020-01-29 Lumileds Holding B.V. Phosphor converted led with temperature stable flux and saturated red color point
CN107407464B (zh) * 2015-03-18 2019-03-15 夏普株式会社 照明装置、显示装置和电视接收装置
US10711192B2 (en) 2016-08-12 2020-07-14 Osram Oled Gmbh Lighting device
US10644206B2 (en) 2016-08-12 2020-05-05 Osram Oled Gmbh Lighting device
WO2018087304A1 (de) 2016-11-11 2018-05-17 Osram Gmbh Leuchtstoff, beleuchtungsvorrichtung und verwendung einer beleuchtungsvorrichtung
WO2018029304A1 (de) 2016-08-12 2018-02-15 Osram Gmbh Beleuchtungsvorrichtung
DE102016121692A1 (de) 2016-08-12 2018-02-15 Osram Gmbh Leuchtstoff und Verfahren zur Herstellung eines Leuchtstoffs
JP7050774B2 (ja) 2016-11-11 2022-04-08 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 蛍光体、照明装置および照明装置の使用
CN107452857A (zh) * 2017-06-26 2017-12-08 南通华隆微电子股份有限公司 一种led光电二极管封装结构
CN107492592A (zh) * 2017-06-26 2017-12-19 南通华隆微电子股份有限公司 一种发光二极管封装结构
DE112018004067A5 (de) 2017-08-10 2020-04-23 Osram Oled Gmbh Dimmbare Lichtquelle
DE102018205464A1 (de) 2017-11-10 2019-05-16 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung und verwendung einer beleuchtungsvorrichtung
CN108807648B (zh) * 2018-06-21 2019-09-24 旭宇光电(深圳)股份有限公司 一种发光二极管封装结构及封装方法
CN115799433B (zh) * 2023-01-09 2024-09-10 四川世纪和光科技发展有限公司 一种红光封装结构、红光led光源及封装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134656A (ja) 2005-11-14 2007-05-31 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
JP2007243055A (ja) 2006-03-10 2007-09-20 Matsushita Electric Works Ltd 発光装置
JP2009065137A (ja) 2007-08-09 2009-03-26 Toshiba Lighting & Technology Corp 発光装置
JP2010225960A (ja) 2009-03-25 2010-10-07 Kyocera Corp 発光装置および照明装置

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JP4565141B2 (ja) * 2004-06-30 2010-10-20 独立行政法人物質・材料研究機構 蛍光体と発光器具
JP4543250B2 (ja) * 2004-08-27 2010-09-15 Dowaエレクトロニクス株式会社 蛍光体混合物および発光装置
JPWO2006077740A1 (ja) * 2004-12-28 2008-06-19 日亜化学工業株式会社 発光装置及びその製造方法
CN102827603A (zh) 2005-03-04 2012-12-19 三菱化学株式会社 荧光体及其制备方法、和使用该荧光体的发光装置
CN100543361C (zh) * 2005-09-01 2009-09-23 夏普株式会社 发光装置
US20070052342A1 (en) * 2005-09-01 2007-03-08 Sharp Kabushiki Kaisha Light-emitting device
JP4769132B2 (ja) * 2005-11-30 2011-09-07 シャープ株式会社 発光装置
US20090033201A1 (en) * 2006-02-02 2009-02-05 Mitsubishi Chemical Corporation Complex oxynitride phosphor, light-emitting device using same, image display, illuminating device, phosphor-containing composition and complex oxynitride
EP2308946B1 (en) 2006-03-10 2013-07-24 Kabushiki Kaisha Toshiba Luminescent material and light-emitting device
WO2008032812A1 (fr) * 2006-09-15 2008-03-20 Mitsubishi Chemical Corporation Substance luminescente, son procédé de fabrication, composition contenant la substance luminescente, dispositif émettant de la lumière, dispositif d'affichage d'images et dispositif d'éclairage
JP2008081631A (ja) * 2006-09-28 2008-04-10 Sharp Corp 発光装置
JPWO2009011205A1 (ja) * 2007-07-19 2010-09-16 シャープ株式会社 発光装置
JP5044329B2 (ja) 2007-08-31 2012-10-10 株式会社東芝 発光装置
JP2009206459A (ja) * 2008-02-29 2009-09-10 Sharp Corp 色変換部材およびそれを用いた発光装置
JP5592602B2 (ja) 2008-07-31 2014-09-17 株式会社東芝 蛍光体およびそれを用いた発光装置
JP4881358B2 (ja) 2008-08-28 2012-02-22 株式会社東芝 発光装置
JP4869317B2 (ja) * 2008-10-29 2012-02-08 株式会社東芝 赤色蛍光体およびそれを用いた発光装置
JP2010201336A (ja) 2009-03-03 2010-09-16 Fuji Xerox Co Ltd 流路構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134656A (ja) 2005-11-14 2007-05-31 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
JP2007243055A (ja) 2006-03-10 2007-09-20 Matsushita Electric Works Ltd 発光装置
JP2009065137A (ja) 2007-08-09 2009-03-26 Toshiba Lighting & Technology Corp 発光装置
JP2010225960A (ja) 2009-03-25 2010-10-07 Kyocera Corp 発光装置および照明装置

Also Published As

Publication number Publication date
TW201212292A (en) 2012-03-16
US20120056526A1 (en) 2012-03-08
CN102403429A (zh) 2012-04-04
CN102403429B (zh) 2014-07-16
JP2012235145A (ja) 2012-11-29
EP2428543A1 (en) 2012-03-14
KR20120025956A (ko) 2012-03-16
EP2428543B1 (en) 2013-05-08
TWI411141B (zh) 2013-10-01
US8310145B2 (en) 2012-11-13
JP5752650B2 (ja) 2015-07-22

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