CN102403229B - 台阶状硅锗源/漏结构的制造方法 - Google Patents
台阶状硅锗源/漏结构的制造方法 Download PDFInfo
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- CN102403229B CN102403229B CN2010102858216A CN201010285821A CN102403229B CN 102403229 B CN102403229 B CN 102403229B CN 2010102858216 A CN2010102858216 A CN 2010102858216A CN 201010285821 A CN201010285821 A CN 201010285821A CN 102403229 B CN102403229 B CN 102403229B
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CN102403229A CN102403229A (zh) | 2012-04-04 |
CN102403229B true CN102403229B (zh) | 2013-11-13 |
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CN103578994B (zh) * | 2012-07-26 | 2016-04-06 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件的制造方法 |
Citations (2)
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US7045433B1 (en) * | 2004-04-06 | 2006-05-16 | Advanced Micro Devices, Inc. | Tip architecture with SPE for buffer and deep source/drain regions |
CN101075562A (zh) * | 2006-05-17 | 2007-11-21 | 国际商业机器公司 | 制造晶体管结构的方法 |
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US7736957B2 (en) * | 2007-05-31 | 2010-06-15 | Freescale Semiconductor, Inc. | Method of making a semiconductor device with embedded stressor |
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US7045433B1 (en) * | 2004-04-06 | 2006-05-16 | Advanced Micro Devices, Inc. | Tip architecture with SPE for buffer and deep source/drain regions |
CN101075562A (zh) * | 2006-05-17 | 2007-11-21 | 国际商业机器公司 | 制造晶体管结构的方法 |
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