CN102386490B - 电连接装置 - Google Patents
电连接装置 Download PDFInfo
- Publication number
- CN102386490B CN102386490B CN201110233364.0A CN201110233364A CN102386490B CN 102386490 B CN102386490 B CN 102386490B CN 201110233364 A CN201110233364 A CN 201110233364A CN 102386490 B CN102386490 B CN 102386490B
- Authority
- CN
- China
- Prior art keywords
- arrangements
- circuit
- base plate
- guide groove
- control appliance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010030063.2 | 2010-06-15 | ||
| DE201010030063 DE102010030063A1 (de) | 2010-06-15 | 2010-06-15 | Elektrische Verbindungsanordnung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102386490A CN102386490A (zh) | 2012-03-21 |
| CN102386490B true CN102386490B (zh) | 2016-01-20 |
Family
ID=44898734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110233364.0A Expired - Fee Related CN102386490B (zh) | 2010-06-15 | 2011-06-14 | 电连接装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6143413B2 (ja) |
| CN (1) | CN102386490B (ja) |
| DE (1) | DE102010030063A1 (ja) |
| IT (1) | ITMI20111040A1 (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105531878B (zh) * | 2013-09-10 | 2018-07-17 | 堺显示器制品株式会社 | 导体连接结构以及显示装置 |
| DE102014221973A1 (de) | 2014-10-28 | 2016-04-28 | Robert Bosch Gmbh | Elektrisches Gerät für den Einsatz in einem kontaminierenden Medium und Verfahren zur Herstellung eines solchen |
| DE102015208413A1 (de) * | 2015-05-06 | 2016-11-10 | Robert Bosch Gmbh | Elektrische Verbindungsanordnung |
| DE102016209421A1 (de) * | 2016-05-31 | 2017-11-30 | Robert Bosch Gmbh | Steuergeräteeinheit, insbesondere für ein Kraftfahrzeug und Verfahren zum elektrischen Verbinden eines Stanzgitters aus im Wesentlichen Kupfer oder Aluminium mit elektrischen Bauelementen auf einer Montagefläche eines Leiterplattenelements |
| DE102016216660A1 (de) | 2016-09-02 | 2018-03-08 | Volkswagen Aktiengesellschaft | Batterieeinheit und Verdrahtungseinheit für eine Batterieeinheit |
| DE102016219374B4 (de) | 2016-10-06 | 2018-06-14 | Siemens Aktiengesellschaft | Langzeitstabile und stoffschlüssige Strompfadverbindung für Nieder-, Mittelspannungs- und/oder Hochspannungsanlagen bzw. –Schaltgeräte mittels Nanomaterialien |
| CN108281804A (zh) * | 2018-04-26 | 2018-07-13 | 贵州电网有限责任公司 | 一种用于电力设备的新型螺母垫片 |
| CN109301513B (zh) * | 2018-10-24 | 2020-10-30 | 云南电网有限责任公司电力科学研究院 | 一种接触反应式电缆连接装置及连接方法 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5624769A (en) * | 1979-08-01 | 1981-03-09 | Suwa Seikosha Kk | Electric connection terminal |
| JPS6177279A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
| JPH07282622A (ja) * | 1994-04-08 | 1995-10-27 | Rohm Co Ltd | 電極材料及びこれを用いたチップ状電子部品 |
| CN1129339A (zh) * | 1994-10-20 | 1996-08-21 | 国际商业机器公司 | 导电胶体材料及其应用 |
| CN1179636A (zh) * | 1996-10-10 | 1998-04-22 | 连接器系统工艺公司 | 大密度电连接器及其制造方法 |
| CN1379506A (zh) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | 使用树脂焊料的电气接触件、电气连接器及连接方法 |
| CN1379503A (zh) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | 使用树脂焊料的电接触件、电连接器及配线板的连接方法 |
| CN1379501A (zh) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | 使用树脂焊料的电气连接具,电气连接器及电线连接方法 |
| CN1379504A (zh) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | 使用树脂焊料的扭绞对电缆的电气连接器及电线连接方法 |
| CN1639922A (zh) * | 2002-02-22 | 2005-07-13 | 莫莱克斯公司 | 用于印刷电路板的电连接器 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03133069A (ja) * | 1989-10-17 | 1991-06-06 | Toshiba Chem Corp | 電気回路成形品 |
| JPH0511380U (ja) * | 1991-07-26 | 1993-02-12 | 市光工業株式会社 | ユニツトを具備する電気機器 |
| EP0972318B1 (de) | 1997-04-02 | 2002-10-23 | Siemens Aktiengesellschaft | Elektrische verbindung eines schaltungsträgers mit einem leiterbahnträger |
| DE19832062C2 (de) | 1998-07-16 | 2001-03-01 | Siemens Ag | Steuergerät für ein Kraftfahrzeug |
| JP2008021873A (ja) * | 2006-07-13 | 2008-01-31 | Toshiba Corp | インターフェイスモジュール付きｌｓｉパッケージ |
| JP2007251197A (ja) * | 2007-05-15 | 2007-09-27 | Hitachi Chem Co Ltd | 半導体装置の製造方法 |
| JP5266774B2 (ja) * | 2008-01-31 | 2013-08-21 | 住友ベークライト株式会社 | 樹脂組成物およびそれを用いて作製した半導体装置または回路基板 |
| JP5112908B2 (ja) * | 2008-02-22 | 2013-01-09 | 株式会社オートネットワーク技術研究所 | 車両用自動変速機の接続ユニット |
| JP5189120B2 (ja) * | 2010-03-08 | 2013-04-24 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
-
2010
- 2010-06-15 DE DE201010030063 patent/DE102010030063A1/de not_active Withdrawn
-
2011
- 2011-06-09 IT ITMI20111040 patent/ITMI20111040A1/it unknown
- 2011-06-14 CN CN201110233364.0A patent/CN102386490B/zh not_active Expired - Fee Related
- 2011-06-15 JP JP2011133131A patent/JP6143413B2/ja not_active Expired - Fee Related
-
2016
- 2016-03-24 JP JP2016060639A patent/JP6121019B2/ja active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5624769A (en) * | 1979-08-01 | 1981-03-09 | Suwa Seikosha Kk | Electric connection terminal |
| JPS6177279A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
| JPH07282622A (ja) * | 1994-04-08 | 1995-10-27 | Rohm Co Ltd | 電極材料及びこれを用いたチップ状電子部品 |
| CN1129339A (zh) * | 1994-10-20 | 1996-08-21 | 国际商业机器公司 | 导电胶体材料及其应用 |
| CN1179636A (zh) * | 1996-10-10 | 1998-04-22 | 连接器系统工艺公司 | 大密度电连接器及其制造方法 |
| CN1379506A (zh) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | 使用树脂焊料的电气接触件、电气连接器及连接方法 |
| CN1379503A (zh) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | 使用树脂焊料的电接触件、电连接器及配线板的连接方法 |
| CN1379501A (zh) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | 使用树脂焊料的电气连接具,电气连接器及电线连接方法 |
| CN1379504A (zh) * | 2001-03-30 | 2002-11-13 | 日本压着端子制造株式会社 | 使用树脂焊料的扭绞对电缆的电气连接器及电线连接方法 |
| CN1639922A (zh) * | 2002-02-22 | 2005-07-13 | 莫莱克斯公司 | 用于印刷电路板的电连接器 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102386490A (zh) | 2012-03-21 |
| JP2016171079A (ja) | 2016-09-23 |
| ITMI20111040A1 (it) | 2011-12-16 |
| DE102010030063A1 (de) | 2011-12-15 |
| JP6121019B2 (ja) | 2017-04-26 |
| JP2012004120A (ja) | 2012-01-05 |
| JP6143413B2 (ja) | 2017-06-07 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 Termination date: 20180614 |
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| CF01 | Termination of patent right due to non-payment of annual fee |