CN102368307A - Electronic tag and production method thereof - Google Patents
Electronic tag and production method thereof Download PDFInfo
- Publication number
- CN102368307A CN102368307A CN2011101127631A CN201110112763A CN102368307A CN 102368307 A CN102368307 A CN 102368307A CN 2011101127631 A CN2011101127631 A CN 2011101127631A CN 201110112763 A CN201110112763 A CN 201110112763A CN 102368307 A CN102368307 A CN 102368307A
- Authority
- CN
- China
- Prior art keywords
- electronic tag
- inlay
- sizing material
- die
- radio frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 26
- 229920001971 elastomer Polymers 0.000 claims abstract description 7
- 239000000806 elastomer Substances 0.000 claims abstract description 5
- 238000000748 compression moulding Methods 0.000 claims abstract description 3
- 238000004513 sizing Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 230000006698 induction Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 238000007723 die pressing method Methods 0.000 claims description 2
- 238000013007 heat curing Methods 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000012536 packaging technology Methods 0.000 abstract 1
- 239000002585 base Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 208000035126 Facies Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000019994 cava Nutrition 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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Abstract
The invention relates to an electronic tag and a production method thereof. The electronic tag is composed of an electronic tag inlay and an elastomer material integrally wrapping outside the electronic tag inlay, wherein the electronic tag is produced by adopting a hot compression molding packaging technology. The whole external of the electronic tag has no joints, therefore, an adhesive is not needed, the defects of debonding and cracking or adhesive invalidation and the like can be effectively avoided, and the service life of the electronic tag is prolonged.
Description
Technical field
The present invention relates to a kind of electronic tag, belong to the RFID tag application, the invention still further relates to the manufacturing approach of this electronic tag.
Background technology
The radiofrequency signal that REID can send through read-write equipment, electronic tag rely on the energy that induction current obtained to send out the information that is stored in the chip.The electronic tag application comprises warehouse logistics, identification, product false proof, manufacturing industry tracing management or the like industry widely.Because the environmental facies of applying electronic label are not fragile so electronic tag needs stronger environmental resistance in some applications when complicated.Application examples like the washing articles identification of: laundry, follow the tracks of, statistics; Apparel brand false proof; Garment production and logistic track; Clothing washing identification record etc.; Because electronic tag needs and is washed article to pass through each flow processs such as washing, oven dry, flatiron together, so must be able to tolerate various condition elements such as organic solvent, water, acid or alkali environment, high temperature, steam, mechanical force distortion.
For example: application number is the papery RFID laundry slip that 200710047437.0 patent of invention provides a kind of fire resistant water resistant to soak, and adopts the pure glued membrane tackifier of acrylic acid that its label material is bonded together.The inside antenna carrier is a mylar.
Again for example: application number is that 200910253669.0 patent of invention provides RFID electronic tag for flexible washing identifier altogether, at two sheets of flexible silica gel inside surface coating glue up and down, the core material assembly is set in the middle of two-layer silicon rubber.Antenna in the core material assembly is adhered on the PET insulating medium with rubber polymer.
More than adopt the inner circuit part inlay of adhering technique protection electronic tag not receive the erosion of external environment; Though can reach the purpose of temporarily sealing, owing to be that stick portion has recessive connection seam; Run into organic solvent, HTHP; That effects such as mechanical force bending are very easy to is dissolved, come unglued or ftracture, and the electronic tag inlay exposes damage, and serviceable life is shorter relatively.The base material of electronic tag inlay is that mylar (PET) tolerable temperature can reach 120 ℃, and environment for use surpasses 120 ℃ of electronic tags and can damage.
Summary of the invention
The object of the present invention is to provide a kind of extraneous erosion of tolerance more and non-damageable electronic tag and manufacturing approach thereof.
The present invention solves through following technical scheme:
For realizing above purpose, electronic tag is made up of electronic tag inlay and the comprehensive coated elastomer material of its external overall, and electronic tag adopts the packaging process manufacturing of hot-die compression molding.
Technical matters of the present invention further solves through following technical scheme:
The circuit board of electronic tag inlay is a FPC, and base material is that the radio frequency induction antenna circuit adopts etching mode on polyimide (Polyimide) film, the base material.
Can use the radio frequency chip module welding that has encapsulated completion fixing on the etching antenna contact point of electronic tag inlay, also directly nation decides radio frequency chip also with epoxy points glue protection and fixing.
The raw material of the comprehensive coated elastomer material of electronic tag external overall is the paste sizing material.
The manufacturing approach of this electronic tag is:
A, according to the shape fabricating mould of electronic tag, divide upper die and lower die, the hole between upper die and lower die forms the electronic tag profile;
B, down putting into two-layer paste sizing material in the die cavity, discharge subtab inlay between the two-layer paste sizing material, paste sizing material edge is greater than electronic tag inlay edge;
C, upper die and lower die pressing, under the temperature and pressure effect, the heat curing of paste sizing material becomes an elastic body integral body, and the electronic tag inlay is coated on its inside comprehensively.
The present invention has following conspicuous outstanding substantive distinguishing features and remarkable advantage compared with prior art:
This electronic tag integral outer is that the elastomeric material coating does not have seam; Do not need adhesive; Can effectively avoid coming unglued cracking or drawback such as adhesive inefficacy, and dimensional accuracy can control through mould and technological parameter, prolonged the serviceable life of electronic tag.
Description of drawings
Fig. 1 is an electronic tag manufacturing approach synoptic diagram 1 of the present invention
Fig. 2 is an electronic tag manufacturing approach synoptic diagram 2 of the present invention
Fig. 3 is an Electronic Tag Structure synoptic diagram of the present invention
Embodiment
In the embodiment as optimal way, paste sizing material 111 is a silicon rubber gross rubber, and is two-layer about the paste sizing material 111 that cuts is divided into, and sandwiches electronic tag inlay 112 in the centre.Paste sizing material 111 and electronic tag inlay 112 are put into counterdie 102 caves, and paste sizing material 111 edges are greater than electronic tag inlay 112 edges, and patrix 101 is 170 ℃ to 190 ℃ with counterdie 102 temperature, is forced into 50kgf/cm behind the matched moulds
2, the final vacuum that puts in place of pressurizeing gets into cure time after exhaust is accomplished, and silicon rubber 113 had vulcanized completion to cure time to the back die sinking in 10 minutes, the formation one whole internal electron label inlay 112 that comprehensively coats.These electronic tag 120 internal electron label inlays 112 are FPC, comprise that base material is that Kapton 114, etching antenna 116 and 115 welding of radio frequency chip module are fixing.The electronic tag 120 of method manufacturing can tolerate various condition elements such as organic solvent, water, acid or alkali environment, HTHP, steam, mechanical force distortion and be not fragile thus.
Above embodiment is the description of this invention and non-limiting, based on other embodiment of inventive concept, all among protection scope of the present invention.
Claims (5)
1. electronic tag and manufacturing approach thereof, it is characterized in that: this electronic tag is made up of electronic tag inlay and the comprehensive coated elastomer material of its external overall, the packaging process manufacturing of electronic tag employing hot-die compression molding.
2. electronic tag according to claim 1 is characterized in that:
The circuit board of said electronic tag inlay is a FPC, and base material is that the radio frequency induction antenna circuit adopts etching mode on polyimide (Polyimide) film, the base material.
3. electronic tag according to claim 1 is characterized in that:
Can use the radio frequency chip module welding that has encapsulated completion fixing on the etching antenna contact point of said electronic tag inlay, also directly nation decides radio frequency chip also with epoxy points glue protection and fixing.
4. electronic tag according to claim 1 is characterized in that:
The raw material of the comprehensive coated elastomer material of said electronic tag external overall is the paste sizing material.
5. electronic tag manufacturing approach according to claim 1 is characterized in that:
A, according to the shape fabricating mould of electronic tag, divide upper die and lower die, the hole between upper die and lower die forms the electronic tag profile;
B, down putting into two-layer paste sizing material in the die cavity, discharge subtab inlay between the two-layer paste sizing material, paste sizing material edge is greater than electronic tag inlay edge;
C, upper die and lower die pressing, under the temperature and pressure effect, the heat curing of paste sizing material becomes an elastic body integral body, and the electronic tag inlay is coated on its inside comprehensively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110112763.1A CN102368307B (en) | 2011-05-03 | A kind of electronic tag and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110112763.1A CN102368307B (en) | 2011-05-03 | A kind of electronic tag and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102368307A true CN102368307A (en) | 2012-03-07 |
| CN102368307B CN102368307B (en) | 2016-12-14 |
Family
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842513A (en) * | 2012-09-03 | 2012-12-26 | 昆山力普电子橡胶有限公司 | Production process adopting rubber packaging chip |
| CN103473594A (en) * | 2013-09-13 | 2013-12-25 | 中国科学院理化技术研究所 | Flexible extensible electronic tag and manufacturing method thereof |
| CN106570555A (en) * | 2016-10-31 | 2017-04-19 | 集速智能标签（上海）有限公司 | Electronic tag and manufacturing process |
| CN106779010A (en) * | 2016-11-23 | 2017-05-31 | 北海高创电子信息孵化器有限公司 | A kind of anti-theft device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122969A (en) * | 2007-09-03 | 2008-02-13 | 天津市易雷电子标签科技有限公司 | Electronic label chip carrier tape (STRAP) module package process |
| US20100059595A1 (en) * | 2008-09-09 | 2010-03-11 | Chuang Longfu | Radio frequency identification label |
| CN101826163A (en) * | 2009-12-01 | 2010-09-08 | 中山达华智能科技股份有限公司 | RFID electronic tag for flexible washing identifier |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122969A (en) * | 2007-09-03 | 2008-02-13 | 天津市易雷电子标签科技有限公司 | Electronic label chip carrier tape (STRAP) module package process |
| US20100059595A1 (en) * | 2008-09-09 | 2010-03-11 | Chuang Longfu | Radio frequency identification label |
| CN101826163A (en) * | 2009-12-01 | 2010-09-08 | 中山达华智能科技股份有限公司 | RFID electronic tag for flexible washing identifier |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842513A (en) * | 2012-09-03 | 2012-12-26 | 昆山力普电子橡胶有限公司 | Production process adopting rubber packaging chip |
| CN103473594A (en) * | 2013-09-13 | 2013-12-25 | 中国科学院理化技术研究所 | Flexible extensible electronic tag and manufacturing method thereof |
| CN103473594B (en) * | 2013-09-13 | 2017-01-04 | 中国科学院理化技术研究所 | A kind of flexible extensible electronic tag and preparation method thereof |
| CN106570555A (en) * | 2016-10-31 | 2017-04-19 | 集速智能标签（上海）有限公司 | Electronic tag and manufacturing process |
| CN106779010A (en) * | 2016-11-23 | 2017-05-31 | 北海高创电子信息孵化器有限公司 | A kind of anti-theft device |
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| PB01 | Publication | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 |