CN102368307B - A kind of electronic tag and manufacture method thereof - Google Patents
A kind of electronic tag and manufacture method thereof Download PDFInfo
- Publication number
- CN102368307B CN102368307B CN201110112763.1A CN201110112763A CN102368307B CN 102368307 B CN102368307 B CN 102368307B CN 201110112763 A CN201110112763 A CN 201110112763A CN 102368307 B CN102368307 B CN 102368307B
- Authority
- CN
- China
- Prior art keywords
- electronic tag
- inlay
- radio frequency
- sizing material
- comprehensively
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000004513 sizing Methods 0.000 claims abstract description 14
- 229920001971 elastomer Polymers 0.000 claims abstract description 10
- 239000000806 elastomer Substances 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 7
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims abstract description 4
- 239000004593 Epoxy Substances 0.000 claims abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 238000004073 vulcanization Methods 0.000 claims abstract description 3
- 230000006698 induction Effects 0.000 claims abstract 2
- 238000005253 cladding Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 238000007723 die pressing method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 239000013536 elastomeric material Substances 0.000 claims description 2
- 238000013007 heat curing Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 2
- 239000002585 base Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The present invention relates to a kind of electronic tag and manufacture method thereof.This electronic tag is made up of electronic tag inlay and its outside overall coated elastomer material comprehensively, and electronic tag uses hot-die molded vulcanization molded package process to manufacture；The circuit board of described electronic tag inlay is flexible circuit board, and base material is Kapton, and on base material, radio frequency induction antenna circuit uses etching mode；The raw material of the overall coated elastomer material comprehensively outside described electronic tag is paste sizing material.It is welded and fixed by the most encapsulated radio frequency chip module completed on the etching antenna contact point of described electronic tag inlay, or directly bonding radio frequency chip protect with epoxy points glue and fix.This electronic tag integral outer does not has seam, it is not necessary to adhesive, can be prevented effectively from the drawbacks such as cracking or adhesive inefficacy of coming unglued, extend the service life of electronic tag.
Description
Technical field
The present invention relates to a kind of electronic tag, belong to RFID tag application, the invention still further relates to this electronics mark
The manufacture method signed.
Background technology
The radiofrequency signal that REID can be sent by read-write equipment, electronic tag is obtained by faradic current
Energy send out storage information in the chips.Electronic tag application includes that warehouse logistics, identification, product are prevented
Puppet, manufacturing industry tracing management etc. industry widely.Owing to the environment of applying electronic label is considerably complicated, so electronic tag exists
Some application need stronger environmental resistance to be hardly damaged.Application such as: the washing articles identification of laundry, tracking,
Statistics；Apparel brand false proof；Garment production and logistic track；Clothing washing identification record etc., due to electronic tag need and
Be washed article together through washing, dry, each flow process such as flatiron, so organic solvent, water, soda acid ring must be able to be tolerated
The various condition elements such as border, high temperature, steam, mechanical force deformation.
Such as: the patent of invention of Application No. 200710047437.0 provides the papery that a kind of fire resistant water resistant soaks
RFID laundry slip, uses acrylic acid pure glued membrane adhesive to be bonded together by its label material.Inside antenna carrier is polyester
Thin film.
The most such as: the patent of invention of Application No. 200910253669.0 provides RFID flexible washing identifier electricity consumption altogether
Subtab, at upper and lower two sheets of flexible silica gel inner surface glue coating, arranges core material assembly in the middle of two-layer silicone rubber.Core material assembly
In antenna rubber polymer be adhered on PET dielectric.
Adhering technique protection circuit part inlay within electronic tag is more than used not corroded by external environment, though
So can reach the purpose of temporarily sealing, but, owing to being that stick portion has recessive connecting sewing, run into organic solvent, high temperature
High pressure, mechanical force bending etc. acts on and is very easy to be dissolved, come unglued or ftracture, and electronic tag inlay exposes damage, service life
Relatively short.The base material of electronic tag inlay is that mylar (PET) tolerable temperature can reach 120 DEG C, uses environment to exceed
120 DEG C of electronic tags can damage.
Summary of the invention
It is an object of the invention to provide a kind of non-damageable electronic tag and manufacture thereof more resistant to external world's erosion
Method.
The present invention is solved by following technical scheme:
For realizing object above, electronic tag is by electronic tag inlay and its outside overall coated elastomer material group comprehensively
Becoming, electronic tag uses the packaging process manufacture of hot-die molded vulcanization molding；
The circuit board of described electronic tag inlay is flexible circuit board, and base material is radio frequency sense on Kapton, base material
Antenna circuit is answered to use etching mode；The raw material of the overall coated elastomer material comprehensively outside described electronic tag is paste glue
Material.
The technical problem of the present invention is solved further by following technical scheme:
On the etching antenna contact point of described electronic tag inlay with the most encapsulated radio frequency chip module completed welding admittedly
Fixed, or directly bonding radio frequency chip protect with epoxy points glue and fix.
The manufacture method of this electronic tag is:
A, shape fabricating mould according to electronic tag, point upper die and lower die, the hole between upper die and lower die forms electronics
Label profile；
B, in lower die cavity, put into two-layer paste sizing material, the paste sizing material cut is divided into upper and lower two-layer, two-layer paste glue
Discharge between material subtab inlay, and paste sizing material edge is more than electronic tag inlay edge；
C, upper die and lower die pressing, under temperature and pressure effect, paste sizing material heat cure becomes an elastomer entirety,
Electronic tag inlay is coated with therein comprehensively.
The present invention compared with prior art, has and the most obviously highlights substantive distinguishing features and remarkable advantage:
This electronic tag integral outer is that elastomeric material cladding does not has seam, it is not necessary to adhesive, can be prevented effectively from out
The drawbacks such as glue cracking or adhesive inefficacy, and dimensional accuracy can be controlled by mould and technological parameter, extends electricity
The service life of subtab.
Accompanying drawing explanation
Fig. 1 is electronic tag manufacture method schematic diagram 1 of the present invention.
Fig. 2 is electronic tag manufacture method schematic diagram 2 of the present invention.
Fig. 3 is Electronic Tag Structure schematic diagram of the present invention.
Detailed description of the invention
It is preferred that detailed description of the invention in, paste sizing material 111 is silicon rubber gross rubber, the paste glue that will cut
Material 111 is divided into upper and lower two-layer, sandwiches electronic tag inlay 112 in centre.Paste sizing material 111 and electronic tag inlay 112 are put
Entering in lower mold 102 cave, paste sizing material 111 edge is more than electronic tag inlay 112 edge, and upper mold 101 and lower mold 102 temperature are
170 DEG C to 190 DEG C, after matched moulds, it is forced into 50kgf/cm2, the final vacuum that puts in place of pressurizeing, aerofluxus enters cure time, sulfuration after completing
10 minutes time arrived rear die sinking, and silicone rubber 113 is cured to be completed, the integral comprehensive cladding internal electron label inlay 112 of shape.
This electronic tag 120 internal electron label inlay 112 is flexible circuit board, is Kapton 114, etching sky including base material
Line 116 and radio frequency chip module 115 are welded and fixed.Thus the electronic tag 120 of method manufacture can tolerate organic solvent, water,
The various condition elements such as acid or alkali environment, High Temperature High Pressure, steam, mechanical force deformation and be hardly damaged.
Above embodiment is the description of this invention and non-limiting, other embodiment based on inventive concept, all
Among protection scope of the present invention.
Claims (3)
1. an electronic tag, it is characterised in that: this electronic tag is coated with bullet by electronic tag inlay and its outside entirety comprehensively
Elastomer material forms, and electronic tag uses the packaging process manufacture of hot-die molded vulcanization molding；
The circuit board of described electronic tag inlay is flexible circuit board, and base material is Kapton, radio frequency induction sky on base material
Line circuit uses etching mode；The raw material of the overall coated elastomer material comprehensively outside described electronic tag is paste sizing material；
This electronic tag integral outer is that elastomeric material cladding does not has seam.
Electronic tag the most according to claim 1, it is characterised in that:
It is welded and fixed by the most encapsulated radio frequency chip module completed on the etching antenna contact point of described electronic tag inlay, or
Person's direct bonding radio frequency chip is also protected with epoxy points glue and fixing.
The manufacture method of electronic tag the most according to claim 1 and 2, it is characterised in that:
A, shape fabricating mould according to electronic tag, point upper die and lower die, the hole between upper die and lower die forms electronic tag
Profile；
B, in lower die cavity, put into two-layer paste sizing material, the paste sizing material cut be divided into upper and lower two-layer, two-layer paste sizing material it
Between discharge subtab inlay, paste sizing material edge be more than electronic tag inlay edge；
C, upper die and lower die pressing, under temperature and pressure effect, paste sizing material heat cure becomes an elastomer entirety, by electricity
Subtab inlay is coated with therein comprehensively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110112763.1A CN102368307B (en) | 2011-05-03 | A kind of electronic tag and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110112763.1A CN102368307B (en) | 2011-05-03 | A kind of electronic tag and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102368307A CN102368307A (en) | 2012-03-07 |
| CN102368307B true CN102368307B (en) | 2016-12-14 |
Family
ID=
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122969A (en) * | 2007-09-03 | 2008-02-13 | 天津市易雷电子标签科技有限公司 | Electronic label chip carrier tape (STRAP) module package process |
| CN101826163A (en) * | 2009-12-01 | 2010-09-08 | 中山达华智能科技股份有限公司 | RFID electronic tag for flexible washing identifier |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122969A (en) * | 2007-09-03 | 2008-02-13 | 天津市易雷电子标签科技有限公司 | Electronic label chip carrier tape (STRAP) module package process |
| CN101826163A (en) * | 2009-12-01 | 2010-09-08 | 中山达华智能科技股份有限公司 | RFID electronic tag for flexible washing identifier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 |