CN102350593A - Full-automatic charging-discharging mechanism used for LED (Light Emitting Diode) laser cutting - Google Patents
Full-automatic charging-discharging mechanism used for LED (Light Emitting Diode) laser cutting Download PDFInfo
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- CN102350593A CN102350593A CN2011103465793A CN201110346579A CN102350593A CN 102350593 A CN102350593 A CN 102350593A CN 2011103465793 A CN2011103465793 A CN 2011103465793A CN 201110346579 A CN201110346579 A CN 201110346579A CN 102350593 A CN102350593 A CN 102350593A
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Abstract
The invention relates to a full-automatic charging-discharging mechanism used for LED (Light Emitting Diode) laser cutting, and the mechanism comprises an X-shaft conveying unit, a Y-shaft conveying unit and a Z-shaft conveying unit, wherein an X-shaft sliding plate of the X-shaft conveying unit is arranged in an X-shaft linear sliding rail; a screw driving pair is composed of the X-shaft sliding plate and an X-shaft ball screw; the X-shaft ball screw is in driving connection with an X-shaft motor; a rotating shaft is mounted on the X-shaft sliding plate; a first sucker and a second sucker are arranged on the rotating shaft; a Y-shaft sliding plate of the Y-shaft conveying unit is arranged in a Y-shaft linear sliding rail; a screw driving pair is composed of the Y-shaft sliding plate and a Y-shaft ball screw; the Y-shaft ball screw is in driving connection with a Y-shaft motor; a clamping mechanism is mounted on the Y-shaft sliding plate; a Z-shaft sliding plate of the Z-shaft conveying unit is arranged in a Z-shaft linear sliding rail; a screw driving pair is composed of the Z-shaft sliding plate and a Z-shaft ball screw; and the Z-shaft ball screw is in driving connection with a Z-shaft motor. The full-automatic charging-discharging mechanism can be applied to the LED laser cutting to realize the full-automatic charging-discharging and solve the problems of low efficiency of traditional LED wafer cutting and instability of manual operation.
Description
Technical field
The present invention relates to a kind of full-automatic loading and unloading equipment, relate in particular to a kind of full-automatic charging and discharging mechanism of the LED of being applied to cut.
Background technology
The LED laser cutting device is a kind of specialized laser devices that is used for the cutting of Sapphire Substrate GaN blue-ray LED wafer; The blue-ray LED wafer normally becomes long-pending technology growing GaN crystal through employing vapour phase on sapphire substrate, and several have the LED luminescence unit of independent lighting function on wafer, to adopt screen printing technique to add top electrode formation at last.
Present laser cutting technique maturation is applied to the cutting of blue-ray LED wafer; In the process of producing; Employing is fixed on blue film or tunica albuginea on the steel loop; Then the LED wafer is sticked on blue film or the tunica albuginea; For the LED wafer is better carried; Putting the steel loop that glues wafer into clip carries; A general clip capacity is 25 steel loops at present; In processing; The steel loop that will be stained with the LED wafer through manual type takes out from clip; Be placed on then on the processing platform of LED laser process equipment; The machined parameters of artificial adjustment LED wafer; Manually get material after machining again; Put the clip that is used to carry wafer into; Be manually-operated in the whole process; According to statistics; Skilled operating personnel; Accomplish the circulation of material loading material loading of---getting material---; Need 40 seconds to 60 seconds, and high-efficiency LED wafer cutting equipment process time (different types of product is variant process time) about 4 minutes, great amount of time consumption is in the artificial loading and unloading stage; Make the effective rate of utilization of equipment reduce; Adopt full manual mode processing, every equipment all need be equipped with operating personnel, the corresponding raising of cost of labor.Because LED wafer cut quality that flow of personnel causes and output can not get guaranteeing.
In order to overcome the above problem that LED wafer cutting equipment is mentioned, need the full-automatic handling equipment of development one cover to LED wafer cutting equipment.
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, a kind of full-automatic charging and discharging mechanism of the LED of being applied to cut is provided, be intended to effectively solve the low and manually-operated instability problem of present LED wafer cutting efficiency.
The object of the invention is realized through following technical scheme:
Be applied to the full-automatic charging and discharging mechanism of LED cut; Characteristics are: comprise the separate X that is; Y; The X-axis delivery unit that Z is axial arranged; Y-axis delivery unit and Z axle delivery unit; The X-axis delivery unit comprises the X-axis ball screw; The X-axis line slide rail; X-axis motor and X-axis slide plate; The X-axis slide plate places the X-axis line slide rail; It is secondary that X-axis slide plate and X-axis ball screw constitute worm drive; The X-axis ball screw drives with the X-axis motor and is connected; On the X-axis slide plate rotating shaft is installed; Rotating shaft is connected through being with synchronously with the motor driving; Rotating shaft is provided with first sucker and second sucker; Second sucker comprises the second sucker cylinder; Second sucker stand and suction nozzle; The base of the second sucker cylinder is fixed on the rotating shaft; The piston rod of the second sucker cylinder drives with second sucker stand and is connected; Be furnished with suction nozzle on second sucker stand; First sucker comprises the first sucker cylinder; First sucker stand and suction nozzle; The base of the first sucker cylinder is fixed on the rotating shaft; The piston rod of the first sucker cylinder drives with first sucker stand and is connected, and is furnished with suction nozzle on first sucker stand;
The Y-axis delivery unit comprises Y-axis ball screw, Y-axis line slide rail, Y-axis motor and Y-axis slide plate; The Y-axis slide plate places the Y-axis line slide rail; It is secondary that Y-axis slide plate and Y-axis ball screw constitute worm drive; The Y-axis ball screw drives with the Y-axis motor and is connected; On the Y-axis slide plate clamping device is installed; Clamping device comprises cylinder and clamping plate, and the piston rod of cylinder drives with clamping plate and is connected;
Z axle delivery unit comprises Z shaft ball screw, Z axle line slide rail, Z axle motor and Z axle slide plate, and Z axle slide plate places Z axle line slide rail, and it is secondary that Z axle slide plate and Z shaft ball screw constitute worm drive, and the Z shaft ball screw drives with Z axle motor and is connected.
Further, the above-mentioned full-automatic charging and discharging mechanism that is applied to the LED cut is equipped with first sensor on the said Z axle delivery unit.
Further, the above-mentioned full-automatic charging and discharging mechanism that is applied to the LED cut is equipped with second sensor on the said clamping plate.
Again further, the above-mentioned full-automatic charging and discharging mechanism that is applied to the LED cut, said first sucker and second sucker circumferentially are being 90 ° of angles.
Substantive distinguishing features and obvious improvement that technical scheme of the present invention is outstanding are mainly reflected in:
The present invention is applied to realize in the LED cut full-automatic loading and unloading; Solve the low and manually-operated instability problem of present LED wafer cutting efficiency; Improve equipment efficiency of usage; Reduce artificial factor; Save cost; Z axle delivery unit is adjusted every layer the upper-lower position of steel loop in the clip; Y-axis delivery unit and clamping device take out steel loop from clip; Put back to; First sucker; Second sucker and rotating shaft cooperation will machine with undressed LED wafer and pick and place material, and the X-axis delivery unit switches the LED wafer from zone to be processed and processing microscope carrier fast; Handoff procedure processing with LED wafer to be processed only needed for 6 times in second, and all the other actions are all accomplished in wafer section process time (about 4 minutes), and a manual work can be operated multiple devices simultaneously.In use, realize automatically processing, do not need the manual work intervention, personnel's technical ability is required also to reduce a lot, operating personnel only need be placed on clip on the Z axle delivery unit, directly select processing just can accomplish.
Description of drawings
Below in conjunction with accompanying drawing technical scheme of the present invention is described further:
Fig. 1: structural representation of the present invention;
Fig. 2: the structural representation of X-axis delivery unit;
Fig. 3: the structural representation of Y-axis delivery unit;
Fig. 4: the structural representation of Z axle delivery unit.
The specific embodiment
As shown in Figure 1; Be applied to the full-automatic charging and discharging mechanism of LED cut; Comprise the separate X that is; Y; The X-axis delivery unit 4 that Z is axial arranged; Y-axis delivery unit 2 and Z axle delivery unit 1; As shown in Figure 2; X-axis delivery unit 4 comprises X-axis ball screw 9; X-axis line slide rail 10; X-axis motor 16 and X-axis slide plate 13; X-axis slide plate 13 places X-axis line slide rail 10; X-axis slide plate 13 constitutes the worm drive pair with X-axis ball screw 9; X-axis ball screw 9 drives with X-axis motor 16 and is connected; Rotating shaft 3 is installed on the X-axis slide plate 13; Rotating shaft 3 is through be with 12 to drive with motor and to be connected synchronously; Rotating shaft 3 is provided with first sucker 5 and second sucker 7; First sucker 5 and second sucker 7 circumferentially are being 90 ° of angles; Second sucker 7 comprises the second sucker cylinder 15; Second sucker stand 17 and suction nozzle 18; The base of the second sucker cylinder 15 is fixed on the rotating shaft 3; The piston rod of the second sucker cylinder 15 drives with second sucker stand 17 and is connected; Be furnished with suction nozzle 18 on second sucker stand 17; First sucker 5 comprises the first sucker cylinder 30; First sucker stand and suction nozzle; The base of the first sucker cylinder 30 is fixed on the rotating shaft 3; The piston rod of the first sucker cylinder 30 drives with first sucker stand and is connected, and is furnished with suction nozzle on first sucker stand;
As shown in Figure 3; Y-axis delivery unit 2 comprises Y-axis ball screw 23, Y-axis line slide rail, Y-axis motor 24 and Y-axis slide plate 22; Y-axis slide plate 22 places the Y-axis line slide rail; Y-axis slide plate 22 constitutes the worm drive pair with Y-axis ball screw 23; Y-axis ball screw 23 drives with Y-axis motor 24 and is connected; Clamping device 29 is installed on the Y-axis slide plate 22; Clamping device 29 comprises cylinder 19 and clamping plate 20; The piston rod of cylinder 19 drives with clamping plate 20 and is connected, and second sensor 21 that is used to detect steel loop is installed on the clamping plate 20;
As shown in Figure 4; Z axle delivery unit 1 comprises Z shaft ball screw 26, Z axle line slide rail 27, Z axle motor 25 and Z axle slide plate; Z axle slide plate places Z axle line slide rail 27; It is secondary that Z axle slide plate and Z shaft ball screw 26 constitute worm drive; Z shaft ball screw 26 drives with Z axle motor 25 and is connected; On the Z axle slide plate clip 8 is installed, the first sensor 28 that is used to detect steel loop is installed on the Z axle delivery unit 1.
The upper-lower position of every layer steel loop is adjusted in 1 pair of clip 8 of Z axle delivery unit; Y-axis delivery unit 2 takes out steel loop, puts back to clamping device 29 from clip 8; First sucker 5, second sucker 7 and rotating shaft 3 cooperate will machine with undressed LED wafer and pick and place material, and the X-axis delivery unit switches the LED wafer from zone to be processed and processing microscope carrier fast.
X-axis delivery unit 4, Y-axis delivery unit 2 and Z axle delivery unit 1 all have independently drive source, and the mobile employing line slide rail of slide plate leads separately, and ball screw and motor are as drive source.Rotating shaft 3 adopts bearing 14 as supporting, and motor and synchronous band are as driving.Clamping device 29 adopts cylinders to drive clamping plate as drive source and firmly grasp or action of releasing, and first sucker 5, second sucker, 7 employing cylinders are as drive source, and suction nozzle holds steel loop through vacuum, and the first cylinder sucker 5, second sucker 7 move up and down.Clamping device 29 is installed on the Y-axis slide plate 22; Through moving forward and backward of Y-axis; The function that realization is taken out steel loop and put back to from clip; First sucker 5, second sucker 7 are fixed on the rotating shaft; Rotating shaft 3 is fixed on the X-axis slide plate 13; First sucker 5, second sucker 7 are picked up steel loop and put down at work, and rotating shaft can switch the position of first sucker 5, second sucker 7 fast, makes to process with unprocessed wafer and switches fast in processing place.Follow moving of X-axis slide plate 13, the switching that feasible processing and unprocessed wafer take, put.
When said apparatus was applied to the full-automatic loading and unloading of LED cut, its concrete steps were:
Step is 1.: Z axle delivery unit 1 rises; Whether the inductor 28 detection clips 8 that are arranged on the Z axle delivery unit have steel loop; When having detected steel loop; The Y-axis slide plate 22 of Y-axis delivery unit 2 is being with clamping device 29 motions; Clamping device 29 is put in steel loop forward; Cylinder 19 drives clamping plate 20 closures; Steel loop is clamped; Y-axis slide plate 22 is being with clamping device 29 to move backward; After steel loop moved to assigned address; Cylinder 19 drives clamping plate 20 and opens, Y-axis slide plate 22 be with clamping device 29 to continue backward the motion certain distance stops.It is downward that thereby the first sucker cylinder 30 of first sucker 5 drives first sucker stand drive suction nozzle, and suction nozzle holds steel loop through vacuum, moves upward thereby the first sucker cylinder 30 drives first sucker stand drive suction nozzle, and steel loop is adsorbed;
Step is 2.: the X-axis slide plate 13 driven rotary axles 3 of X-axis delivery unit 4 move to processing microscope carrier 6; Thereby the first sucker cylinder 30 of first sucker 5 drives first sucker stand drive suction nozzle and moves downward; Close vacuum simultaneously; Steel loop is placed on the processing microscope carrier 6; After putting down steel loop; Thereby the first sucker cylinder 30 of first sucker 5 drives first sucker stand drive suction nozzle and moves upward, and first sucker 5 rises, and this moment, the LED wafer began processing;
Step is 3.: in processing; The X-axis slide plate 13 driven rotary axles 3 of X-axis delivery unit 4 are put the position motion of steel loop to Y-axis delivery unit 2; Behind the in-position; Y-axis slide plate 22 is being with clamping device 29 to move to Z axle delivery unit 3 positions; The move upward position of one deck steel loop of Z axle delivery unit; Clamping device 29 is judged this layer position steel loop through the inductor 21 of head; Judged whether steel loop; Cylinder 19 drives clamping plate 20 closures; Y-axis slide plate 22 drives clamping device 29 and moves backward; After arriving assigned address, clamping plate 20 unclamp, and Y-axis slide plate 22 continues backward that the motion certain distance stops; It is downward that thereby the first sucker cylinder 30 of first sucker 5 drives first sucker stand drive suction nozzle; Through vacuum steel loop is held, the first sucker cylinder 30 moves upward, and steel loop is adsorbed;
Step is 4.: rotating shaft 3 drives first sucker 5 and second sucker, 7 half-twists;
Step is 5.: X-axis slide plate 13 driven rotary axles 3 move to processing microscope carrier 6 places; Wait machines; After machining; 17 drive suction nozzles 18 move downward thereby the second sucker cylinder 15 of second sucker 7 drives second sucker stand; Suction nozzle 18 vacuum suction are lived steel loop; 17 drive suction nozzles 18 move upward thereby the second sucker cylinder 15 of second sucker 7 drives second sucker stand, have adsorbed to machine the wafer steel loop;
Step is 6.: rotating shaft 3 turns clockwise 90 °; With unprocessed band wafer steel loop; Thereby the first sucker cylinder 30 of first sucker 5 drives first sucker stand drive suction nozzle and moves downward; Close vacuum simultaneously; With steel loop be placed on processing microscope carrier 6 on, put down steel loop after, the first sucker cylinder 30 moves upward; First sucker 5 rises, and begins new a slice wafer processing;
Step is 7.: X-axis slide plate 13 driven rotary axles 3 are put the position motion of steel loop to Y-axis delivery unit 2; Behind the in-position; Rotating shaft 3 is rotated counterclockwise 90 °; The second sucker cylinder 15 of second sucker 7 moves downward; Close vacuum; The wafer of accomplishing processing is put down; Cylinder 19 is opened clamping plate 20; Y-axis slide plate 22 drives clamping device 29 and moves to Z axle delivery unit position; After inductor 21 inductions of clamping device head have steel loop; The Y-axis slide plate 22 motion assigned address that goes ahead; The steel loop that machines is put back to steel loop in the original position of clip; Y-axis slide plate 22 drives clamping device 29 and moves distance to a declared goal backward; The move upward position of one deck steel loop of Z axle delivery unit; Y-axis slide plate 22 drives clamping devices 29 distance to a declared goal that moves forward; Clamping device 29 is judged this layer position steel loop by the inductor 21 of head; Judged whether steel loop; Cylinder 19 drives clamping plate 20 closures; Y-axis slide plate 22 drives clamping device 29 and moves backward; After arriving assigned address; Clamping plate 20 unclamp, and Y-axis slide plate 22 continues backward that the motion certain distance stops;
Step is 8.: rotating shaft 3 turns clockwise 90 °, and to drive suction nozzle downward thereby the first sucker cylinder 30 of first sucker 5 drives first sucker stand, through vacuum steel loop held, and the first sucker cylinder 30 moves upward, and steel loop is adsorbed;
Repeating step 4. ~ 8. step all machine until all wafers.In the whole machining process process, step 5., 6. step for having processed the loading and unloading time of wafer and undressed wafer, owing to adopt rotating suction disc, shorten the time than single station loading and unloading greatly.
In sum; The present invention is applied to full-automatic loading and unloading in the LED cut; Solve the low and manually-operated instability problem of present LED wafer cutting efficiency; Improve equipment efficiency of usage; Reduce artificial factor; Save cost; Handoff procedure processing with LED wafer to be processed only needed for 6 times in second; All the other actions are all accomplished in wafer section process time (about 4 minutes); From the time benefit; 2 clip (50 platelet disk) total loading and unloading times are 5 minutes, if adopt artificial loading and unloading, the total time of its loading and unloading exists; 33 minutes to 50 minutes; For automatically, the total time that machines 2 clips is about 3.5 hours (4+0.1) X50=205 minute), a manual work can be operated multiple devices simultaneously.In use, realize automatically processing, do not need the manual work intervention, personnel's technical ability is required also to reduce a lot, operating personnel only need be placed on clip on the Z axle delivery unit, directly select processing just can accomplish.
What need understand is: the above only is a preferred implementation of the present invention; For those skilled in the art; Under the prerequisite that does not break away from the principle of the invention, can also make some improvement and retouching, these improvement and retouching also should be considered as protection scope of the present invention.
Claims (4)
1. be applied to the full-automatic charging and discharging mechanism of LED cut; It is characterized in that: comprise the separate X that is; Y; The X-axis delivery unit (4) that Z is axial arranged; Y-axis delivery unit (2) and Z axle delivery unit (1); X-axis delivery unit (4) comprises X-axis ball screw (9); X-axis line slide rail (10); X-axis motor (16) and X-axis slide plate (13); X-axis slide plate (13) places X-axis line slide rail (10); X-axis slide plate (13) constitutes the worm drive pair with X-axis ball screw (9); X-axis ball screw (9) drives with X-axis motor (16) and is connected; Rotating shaft (3) is installed on the X-axis slide plate (13); Rotating shaft (3) is connected through being with (12) to drive with motor synchronously; Rotating shaft (3) is provided with first sucker (5) and second sucker (7); Second sucker (7) comprises the second sucker cylinder (15); Second sucker stand (17) and suction nozzle (18); The base of the second sucker cylinder (15) is fixed on the rotating shaft (3); The piston rod of the second sucker cylinder (15) drives with second sucker stand (17) and is connected; Be furnished with suction nozzle (18) on second sucker stand (17); First sucker (5) comprises the first sucker cylinder (30); First sucker stand and suction nozzle; The base of the first sucker cylinder (30) is fixed on the rotating shaft (3); The piston rod of the first sucker cylinder (30) drives with first sucker stand and is connected, and is furnished with suction nozzle on first sucker stand;
Y-axis delivery unit (2) comprises Y-axis ball screw (23), Y-axis line slide rail, Y-axis motor (24) and Y-axis slide plate (22); Y-axis slide plate (22) places the Y-axis line slide rail; Y-axis slide plate (22) constitutes the worm drive pair with Y-axis ball screw (23); Y-axis ball screw (23) drives with Y-axis motor (24) and is connected; Clamping device (29) is installed on the Y-axis slide plate (22); Clamping device (29) comprises cylinder (19) and clamping plate (20), and the piston rod of cylinder (19) drives with clamping plate (20) and is connected;
Z axle delivery unit (1) comprises Z shaft ball screw (26), Z axle line slide rail (27), Z axle motor (25) and Z axle slide plate; Z axle slide plate places Z axle line slide rail (27); It is secondary that Z axle slide plate and Z shaft ball screw (26) constitute worm drive, and Z shaft ball screw (26) drives with Z axle motor (25) and is connected.
2. the full-automatic charging and discharging mechanism that is applied to the LED cut according to claim 1 is characterized in that: on the said Z axle delivery unit (1) first sensor is installed.
3. the full-automatic charging and discharging mechanism that is applied to the LED cut according to claim 1 is characterized in that: said clamping plate are equipped with second sensor on (20).
4. the full-automatic charging and discharging mechanism that is applied to the LED cut according to claim 1 is characterized in that: said first sucker (5) circumferentially is being 90 ° of angles with second sucker (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103465793A CN102350593A (en) | 2011-11-07 | 2011-11-07 | Full-automatic charging-discharging mechanism used for LED (Light Emitting Diode) laser cutting |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103465793A CN102350593A (en) | 2011-11-07 | 2011-11-07 | Full-automatic charging-discharging mechanism used for LED (Light Emitting Diode) laser cutting |
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| CN102350593A true CN102350593A (en) | 2012-02-15 |
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| CN2011103465793A Pending CN102350593A (en) | 2011-11-07 | 2011-11-07 | Full-automatic charging-discharging mechanism used for LED (Light Emitting Diode) laser cutting |
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| CN102717185A (en) * | 2012-04-23 | 2012-10-10 | 吴周令 | Full-automatic semiconductor wafer laser processing device and processing method thereof |
| CN102794556A (en) * | 2012-08-29 | 2012-11-28 | 长城汽车股份有限公司 | Numerical control welding system |
| CN104325225A (en) * | 2014-10-27 | 2015-02-04 | 无锡华联精工机械有限公司 | Laser cutter |
| CN104690433A (en) * | 2015-04-01 | 2015-06-10 | 东莞市盛雄激光设备有限公司 | Full-automatic wafer scriber |
| CN105689899A (en) * | 2016-03-25 | 2016-06-22 | 东莞市盛雄激光设备有限公司 | Fully-automatic laser cutting production workstation |
| CN106206398A (en) * | 2016-08-24 | 2016-12-07 | 屠明州 | A kind of silicon chip translation placement mechanism |
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| CN102717185B (en) * | 2012-04-23 | 2014-08-13 | 吴周令 | Full-automatic semiconductor wafer laser processing device and processing method thereof |
| CN102717185A (en) * | 2012-04-23 | 2012-10-10 | 吴周令 | Full-automatic semiconductor wafer laser processing device and processing method thereof |
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Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant before: Suzhou Delphi Laser Co., Ltd. |
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Application publication date: 20120215 |