CN102281715B - Board reinforcing structure, board assembly, and electronic device - Google Patents
Board reinforcing structure, board assembly, and electronic device Download PDFInfo
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- CN102281715B CN102281715B CN201110078526.8A CN201110078526A CN102281715B CN 102281715 B CN102281715 B CN 102281715B CN 201110078526 A CN201110078526 A CN 201110078526A CN 102281715 B CN102281715 B CN 102281715B
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- strengthening part
- circuit board
- breach
- strengthening
- rectangular area
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention relates to a board reinforcing structure, a board assembly, and an electronic device. Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.
Description
Technical field
Execution mode disclosed herein relates to for strengthening being provided with on it plate of the plate of electronic unit strengthens structure.
Background technology
In general, electronic installation is incorporated to the circuit board of the electronic unit of installation such as semiconductor device on it.Along with the recent progress aspect minimizing at electronic installation, the circuit board being incorporated in electronic installation minimizes by high-density installation, and the electronic unit such as semiconductor device being arranged on this circuit board also minimizes.Therefore, the mounting structure for mounting electronic parts on circuit board also minimizes.
As the attachment for mounting semiconductor on circuit board, conventionally use solder bump.Utilize the solder bonds of solder bump electrical connection to be provided and semiconductor device is mechanically fixed to circuit board.In the situation that minimizing as mentioned above mounting structure and solder bump is diminished, also make solder bonds part diminish.Therefore, solder bump fastener is easily because thermal stress and external force are out of shape with impaired, and it causes tending to occur poor connection.
Here, with reference to Figure 1A and 1B, during to solder bump fastener external force being applied to as mounting structure, the distortion of solder bump is described.Figure 1A is exemplified with wherein by solder bump 2, the electrode pad of semiconductor device 1 being engaged to the mounting structure of the connection pad 4 of circuit board 3.When solder reflow, make solder bump 2 melt and solidify, make to form and electrode pad 1 and the solder bonds part 2a that is connected pad 4 close contacts.Figure 1A is exemplified with wherein not applying external force and the undeformed state of this solder bump 2 to solder bump 2.
When applying external force to the part of circuit board 3 as shown in Figure 1A, this circuit board 3 is out of shape in such a way, that is, the corresponding part in place being applied to this external force raises, also distortion as shown in Figure 1B of solder bump 2 simultaneously.Because this part that external force is applied to is away from the center of solder bump 2, so stress is excessively applied to the end of part one side that the close external force of solder bonds part 2a applies.When stopping applying external force, this stress also no longer applies.As a result, solder bump 2 becomes and removes its deformation state, and recovers its initial condition as shown in Figure 1A.
If this external force is applied to circuit board 3 repeatedly, be excessively applied to solder bonds part 2a and be connected between pad 4 to this stress repetition, this so again possible separating solder fastener 2a described end be connected pad 4.And if the separation of the described end of solder bonds part 2a is transferred to solder bonds part 2a and is connected in pad 4, solder bonds part 2a loses with the electrical connection being connected between pad 4, it causes occurring poor connection.
In view of the above problems, adopted a kind of pass (underfill) material of filling between mounted semiconductor device and circuit board to strengthen the method for solder bonds part.In other words, pass (underfill) material being formed by epoxy resin etc. is filled in around solder bonds part, with the periphery at them, strengthen, and by pass material, the front surface of the basal surface of semiconductor device and circuit board is bonded together, so that mechanically fixing.Thus, improve crushing resistance and the long-term reliability of solder bonds part.
Simultaneously, along with recently particularly the electronic installation such as mobile computer (comprising notebook) and mobile phone minimize and Functional Capability aspect development, the pressure that is applied to the shell of electronic installation easily drives to their internal circuit board and mounting structure.Therefore, in order further to improve crushing resistance and the long-term reliability of solder bonds part, to use, there is the bond strength of increase and the pass material of high Young's modulus more.Yet if the bond strength of pass material increases, it becomes and is difficult to remove from circuit board the semiconductor device of being fixed by pass material.
For example, if broken down in this semiconductor device, can not from circuit board, only remove and replace the semiconductor device breaking down after semiconductor device is arranged on to circuit board.Therefore, must wholely replace expensive circuit board, it causes the damage cost of circuit board to increase.In addition, can not only check the function of supposing the out of order semiconductor device of tool and the reason of analyzing this fault.Therefore, can not determine the reason of fault, itself so that increased fraction defective.
In portable electronic devices, circuit board is particularly easily because external force is out of shape.Therefore the stress, causing because of the distortion of circuit board probably drives to the mounting structure of semiconductor device.In view of this problem, proposed accentuator plate and prevented that this circuit board is easily out of shape, so that crushing resistance and the long-term reliability of the mounting structure of improvement solder bonds part etc.In other words, the rear side engagement warpage that has proposed to have installed by scolder the circuit board of semiconductor device thereon reduces parts, strengthens the part (for example,, referring to patent documentation 1) corresponding with being arranged on semiconductor device on circuit board.
And, proposed to be incorporated to strengthening part and prevented that this semiconductor device is easily out of shape in semiconductor device, to strengthen having circuit board and the mounting structure itself (for example,, referring to patent documentation 2 to 4) of semiconductor device.And, proposed to form breach in the bight (corner part) in the periphery of semiconductor device and reduced the warpage (for example,, referring to patent documentation 5) because thermal stress difference causes.
Patent documentation 1: Japanese laid-open patent communique 2007-88293
Patent documentation 2: Japanese laid-open patent communique 11-40687
Patent documentation 3: Japanese laid-open patent communique 02-079450
Patent documentation 4: Japanese laid-open patent communique 10-56110
Patent documentation 5: Japanese laid-open patent communique 10-150117
In patent documentation 1, to reduce parts effective aspect the warpage that reduces to cause because of thermal stress for disclosed warpage.Yet if external force is applied to circuit board, stress drives to solder bonds part via circuit board, and is especially excessively applied to the bight that warpage reduces parts, cause occurring between fastener the connection of difference.For this reason, in patent documentation 1, disclosed warpage reduces the portable electron device that parts are unsuitable for being easily transmitted external force especially.
In each patent documentation in patent documentation 2 to 4, disclosed mounting structure is devoted to strengthen semiconductor device so that it is not easy distortion, rather than is devoted to slow down the stress causing when circuit board is out of shape because of outside gravitation.Therefore, can not accentuator plate and semiconductor device and mounting structure between fastener.
In patent documentation 5, disclosed semiconductor device is devoted to form in the bight of semiconductor device the warpage that otch reduces semiconductor device, and reduce aspect the warpage of circuit board invalid.Therefore, can not accentuator plate and semiconductor device and mounting structure between fastener.
In patent documentation 1,2,4 and 5, final filler opening shaped material between semiconductor device and circuit board, to engage semiconductor device be fixed to circuit board.Therefore,, although can strengthen the fastener of semiconductor device, reckon without easily separation mounting semiconductor and circuit board.
Therefore, wish that exploitation can improve the crushing resistance of fastener of semiconductor device and long-term reliability and can easily from circuit board, remove the mounting structure of mounting semiconductor in the situation that not utilizing pass material.
Summary of the invention
According to an aspect of the present invention, provide a kind of plate to strengthen structure, this plate is strengthened structure and is arranged on the circuit board on first surface for adding good general's electronic unit, and described electronic unit has the electrode in the rectangular area being arranged on described first surface.Described plate is strengthened structure and is comprised: strengthening part, this strengthening part is engaged to position on the second surface of described circuit board, corresponding with the bight of four jiaos of described rectangular area, and described second surface is arranged in the contrary side of described first surface with described circuit board.At described plate, strengthen in structure, in the position corresponding with the bight of described four jiaos of described rectangular area, form corresponding breach, and described breach forms at least two summits described strengthening part, toward the outer side, to form described plate, strengthen the profile of structure.
According to a further aspect in the invention, provide a kind of board component, this board component comprises: circuit board, and this circuit board has first surface and is arranged on the second surface in a side contrary to described first surface; Electronic unit, this electronic unit has the electrode being arranged in rectangular area, and utilizes the described electrode of the splicing ear that is engaged to described circuit board to install; And strengthening part, this strengthening part is engaged to the described second surface of described circuit board.In described board component, described strengthening part is engaged to position on the second surface of described circuit board, corresponding with the bight of four jiaos of described rectangular area, described strengthening part forms corresponding breach in the position corresponding with the bight of described four jiaos of described rectangular area, and described breach forms at least two summits described strengthening part, toward the outer side, to form described plate, strengthen the profile of structure.
According to one embodiment of the present invention, described strengthening part can be dispersed in the inner stress transmitting of circuit board, simultaneously accentuator plate.Thereby, because improved crushing resistance and the long-term reliability of the fastener of mounting electronic parts, thus needn't fix electronic unit by pass material, and can easily from circuit board, remove mounting electronic parts.
Objects and advantages of the present invention are realized and are obtained by parts and the combination of specifically noting in claims.
It should be understood that aforementioned general description and detailed description are below all exemplary and indicative, rather than to claimed restriction of the present invention.
Accompanying drawing explanation
The view of Figure 1A and the 1B distortion of this solder bump when solder bump fastener external force being applied to as mounting structure that is illustration;
Fig. 2 is wherein from the end view of the board component of rear side accentuator plate;
Fig. 3 is the plane graph of the rear surface of board component shown in illustration Fig. 2;
Fig. 4 is the plane graph that illustration is provided with the rear surface of the board component of locating tool strengthening part jaggy in the bight of four jiaos;
Fig. 5 engages according to the end view of the board component of the strengthening part of an execution mode;
The plane graph that Fig. 6 is board component shown in Fig. 5, see from rear surface side;
Fig. 7 is the plane graph of the modified example of strengthening part shown in illustration Fig. 6;
Fig. 8 is the plane graph of another modified example of strengthening part shown in illustration Fig. 6;
Fig. 9 is that illustration forms rectangle frame shape and at the plane graph of four jiaos of tool strengthening parts jaggy;
Figure 10 is that illustration forms cross shape and at the plane graph of four jiaos of tool strengthening parts jaggy;
Figure 11 is the shape of breach and the view of the position of the relative solder bump of this breach of illustration strengthening part;
Figure 12 is the table of the result of illustration structure simulation;
Figure 13 is that illustration is for the plane graph of strengthening part relatively; And
Figure 14 is the stereogram that is incorporated to the notebook of board component.
Embodiment
Next, with reference to accompanying drawing, embodiments of the present invention are described.
First, to being described for strengthening the basic structure of the plate of mounting semiconductor on it.Fig. 2 is wherein from the end view of the board component of rear side accentuator plate.Fig. 3 is the plane graph of the rear surface of illustration board component.
In the rear surface of circuit board 10 (second surface), 10b is upper, engages and has strengthening part 16.This strengthening part 16 is the plate-shaped members that for example formed by the larger metal of the intensity of the material of strength ratio circuit board 10 or ceramic material.By resin adhesive, strengthening part 16 is engaged to circuit board 10.Alternatively, can utilize the copper pattern on the rear surface 10b that is formed on circuit board 10, by the grafting material such as scolder, strengthening part 16 is engaged to circuit board 10.
As shown in Figure 2, strengthening part 16 builds by the size that covers whole mounting semiconductor 12, thus the whole installation region of strengthening being provided with semiconductor device 12.Even external force is applied to circuit board 10, circuit board 10 is also because the strengthening part 16 having engaged is unlikely out of shape.Thereby, slowed down the stress producing in the fastener (mounting structure forming by solder bump 12a) at semiconductor device 12.
Here, if apply external force in the outside, installation region of circuit board 10, this external force reaches this installation region, becomes the stress of circuit board 10 inside.First the stress that reaches installation region reach the periphery of the part that strengthening part 16 is installed.At strengthening part 16, be as shown in Figure 2 rectangle in the situation that, stress is concentrated and is applied to four jiaos of this rectangle periphery.Thereby stress is concentrated the fastener (solder bump 12a) in the bight that is applied to four jiaos, the most close this rectangle.
Therefore, as shown in Figure 4, be arranged on strengthening part 16, stress concentrates breach 16a that the part (bights of four jiaos) that applies is located can disperse to concentrate the stress of the specified point at the place, tip that is applied to bight, thereby accentuator plate 10 more effectively.In other words, by strengthening the part near the bight of four jiaos in the installation region of semiconductor device 12, can only strengthen stress and concentrate the part applying.
As shown in Figure 5, in this embodiment, replace strengthening part 16, four strengthening parts 20 are engaged to four jiaos of installation region of semiconductor device 12, with special accentuator plate 10.Strengthening part 20 is engaged to the bight of four jiaos of rectangle installation region on the rear surface 10b of circuit board 10, semiconductor device 12.In this embodiment, strengthening part 20 is the circles all with breach 20a.Strengthening part 20 is arranged to breach 20a is towards cornerwise outside of installation region, and locates accordingly with the fastener (solder bump 12a) at angle place of installation region on diagonal in the formed conjunction of solder bump 12a.
As mentioned above, by strengthening part 20 be arranged on by the middle of the formed part of solder bump 12a, wherein stress most probable is concentrated the part place apply, and the breach 20a of strengthening part 20 probably concentrates along stress wherein direction (stress is applied to the direction of the installation region of semiconductor device 12 along the diagonal) orientation applying.Therefore, along the stress that angular direction is driven to the installation region of semiconductor device 12, in two mountain portions (mountain part) punishment with the strengthening part 20 of breach 20a, fall apart, and then the fastener (solder bump 20a) having dwindled to breach 2a place is concentrated the stress applying.This has prevented from being applied to the fastener (solder bump 20a) at breach 20a place because being applied to the stress concentrations that the external force of circuit board 10 causes, and can effectively reduce the appearance that connects fault.
In this embodiment, only strengthening part 20 is engaged to the bight of four jiaos of the installation region of semiconductor device 12.This is because the concentrated stress applying other position beyond four jiaos of installation region is not too large, and thus, even if strengthening part 20 is not set, at these fasteners (solder bump 20a), locates also may be difficult to occur connecting fault.
The shape of strengthening part 20 is not limited to the circle with breach 20a shown in Fig. 6.This strengthening part 20 can adopt any shape, all has as shown in Figure 7 a plurality of strengthening parts 22 of breach 22a, and shown in Fig. 8, all has a plurality of strengthening parts 24 of breach 24a, as long as they have the breach as breach 20a.
And, as shown in Figure 9, can form four jiaos of installation region that rectangle shaped as frame strengthening part 26 covers semiconductor device 12, and there is breach 26a at Qi Sijiao.This strengthening part 26 can reduce to concentrate to four jiaos of the installation region of semiconductor device 12 stress applying, simultaneously the whole periphery of the installation region of the semiconductor device 12 on accentuator plate 10.And as shown in figure 10, strengthening part 28 can form by cross shaped head, with the diagonal extension of the installation region along semiconductor device 12, and there is breach 28a in the position corresponding with four jiaos of installation region.This strengthening part 28 can reduce to concentrate to four jiaos of the installation region of semiconductor device 12 stress applying, simultaneously the installation region of the semiconductor device 12 on whole accentuator plate 10.
Here, the shape of the breach of strengthening part and position are described.Figure 11 is the shape of breach 20a and the view of the position of the relative solder bump 12a of this breach 20a of illustration strengthening part 20.As shown in figure 11, the breach 20a of strengthening part 20 has as the bight 20b on the summit of two mountain portions and 20c with as the bight 20d of the lowest point between bight 20b and 20c.The stress transmitting from cornerwise bearing of trend of the installation region of semiconductor device 12 is dispersed and concentrates angle 20b and the 20c reaching as the summit of two mountain portions.Therefore,, for solder bump 12a being positioned to the situation of breach 20a inside, stress is dispersed and reaches angle 20b and the 20c on the both sides of breach 20a, and can not concentrate and be applied to solder bump 12a thus.Therefore,, in the situation that bight 20b and 20c are positioned to the upstream side of solder bump 12a along the direction that wherein stress transmits, this stress can be dispersed and concentrate and be applied to bight 20b and 20c before reaching solder bump 12a.In other words, only need solder bump 12a to be positioned at line (as shown in Figure 11 dotted line) inner side of be connected to each other bight 20b and 20c.
The inventor is by carrying out the effect of structure simulation confirmation to the crushing resistance of above-mentioned strengthening part.Figure 12 is the table of the result of illustration structure simulation.
In structure simulation, the shape of semiconductor device 12 is the square of length of side 27mm.Circuit board 10 is formed by the FR4 as plate material, and has the thickness of 1mm.Strengthening part is formed by stainless steel (SUS material) or the resin material that has 10GPa Young's modulus and have 1mm thickness.Based on above-mentioned condition, the external force of 4Kg is applied to circuit board 10, so that its stress reaches the fastener (solder bump 12a) of four jiaos.Here, find that can not cause the stress that fastener breaks is 300N/mm
2.
In Figure 12, emulation numbering 1 is exemplified with being wherein only arranged on semiconductor device 12 simulation result of the structure on circuit board, and this circuit board is not provided with strengthening part.Under this condition, the stress that confirmation drives to fastener (solder bump 12a) is 500N/mm
2.This stress value greatly exceeds tolerance limit 300N/mm
2thereby, cause fastener to break.
Emulation numbering 2 simulation results exemplified with the structure that wherein semiconductor device 12 and circuit board 10 are fixed to one another by the pass material being filled in therebetween, this circuit board is not provided with strengthening part.Under this condition, the stress that confirmation drives to fastener (solder bump 12a) is 38.5N/mm
2.
Emulation numbering 4 is engaged to the simulation result of structure of the rear surface 10b of circuit board 10 exemplified with the resin material wherein similar shape of strengthening part by with emulation numbering 3 being formed.Under this condition, the stress that confirmation drives to fastener (solder bump 12a) is 160N/mm
2.Even if find to replace strengthening part, use resin material (Young's modulus with 10GPa), the stress that is passed to fastener (solder bump 12a) also can be decreased to a certain degree.
Emulation numbering 5 is exemplified with the simulation result of structure that wherein X-shape metal strengthening part is engaged to the rear surface 10b of circuit board 10.Under this condition, the stress that reaches fastener (solder bump 12a) is 50N/mm
2.Confirmation is compared with filler opening shaped material, and this strengthening part can further reduce to be passed to the stress of fastener (solder bump 12a).
Emulation numbering 6 is engaged to the simulation result of structure of the rear surface 10b of circuit board 10 exemplified with the resin material wherein similar shape of strengthening part by with emulation numbering 5 being formed.Under this condition, the stress that confirmation reaches fastener (solder bump 12a) is 200N/mm
2.Even if find to replace strengthening part, use resin material (Young's modulus with 10GPa), the stress that reaches fastener (solder bump 12a) also can be decreased to a certain degree.
Emulation numbering 7 is exemplified with the simulation result of structures at four jiaos of places that wherein rectangular metal strengthening part 30 is engaged to as shown in figure 13 to the 10bShang installation region, rear surface of circuit board 10.Under this condition, the stress that drives to fastener (solder bump 12a) is 100N/mm
2.Carry out this emulation, as the comparison with following emulation.
Emulation numbering 8 is exemplified with the simulation result that wherein the rectangle strengthening part 16 at Si Jiaochu with breach 16a is engaged to as illustrated in fig. 4 to the structure in the installation region of rear surface 10b of circuit board 10.The external shape of this strengthening part 16 is similar to the external shape of mounting semiconductor 12 dimensionally.Under this condition, the stress that confirmation is passed to fastener (solder bump 12a) is 18.5N/mm
2.
Emulation numbering 9 is exemplified with the simulation result that wherein as shown in Figure 9 the rectangle frame strengthening part 26 at Si Jiaochu with breach 26a is engaged to the structure in the installation region of rear surface 10b of circuit board 10.In the external shape size of this strengthening part 26, be similar to the external shape of mounting semiconductor 12.Under this condition, the stress that confirmation is passed to fastener (solder bump 12a) is 28N/mm
2.
The simulation result of the structure of four jiaos of the installation region that emulation numbering 10 is located exemplified with the rear surface that wherein as shown in Figure 8 a plurality of strengthening parts 24 all with breach 24a is engaged to circuit board.The length of breach 24a is 3mm, and the width of strengthening part 24 is 3mm.Under this condition, the stress that confirmation is passed to fastener (solder bump 12a) is 60N/mm
2.
According to the result of above-mentioned emulation, can be clear, even if only strengthening part is engaged to four jiaos of installation region, also the stress that drives to fastener (solder bump 12a) can be decreased to 100N/mm
2, be significantly less than the tolerance limit 300N/mm of stress
2.In addition, find, by all thering are a plurality of rectangle strengthening parts 24 of breach 24a, stress is further reduced to 60N/mm
2.It seems that the stress dispersion because of breach 24a provides 40N/mm
2decrease.
According to the strengthening part of present embodiment, when the electronic unit such as semiconductor device being arranged on the circuit board being incorporated in electronic installation, use.Figure 14 is the stereogram being incorporated to according to the notebook of the board component with strengthening part of present embodiment.
The main frame 42 with the keyboard of notebook 40 has been incorporated to and wherein semiconductor device 44 has been arranged on to the board component 48 on circuit board 46.When semiconductor device 44 is arranged on circuit board 46, use according to the strengthening part of present embodiment.Because notebook 40 is thinner, so the power applying to main frame 42 from outside easily drives to circuit board 46, easily cause circuit board 46 to reach deformation state.Therefore, according to the strengthening part of present embodiment, can disperse to reach the stress of the fastener of mounting structure, thereby improve crushing resistance and the long-term reliability of the fastener between semiconductor device 44 and circuit board 46.And, according to the strengthening part of present embodiment, eliminated and by pass material, semiconductor device 44 has been fixed to the necessity of circuit board 46.Thereby semiconductor device 44 can be easily separated with circuit board 46.
It should be noted that, present embodiment is described as the grafting material for semiconductor device is arranged on circuit board with scolder, yet this grafting material is not limited to scolder, but can use other hot-melt material.And preferably, this strengthening part is formed by the metal, pottery with high strength and hardness etc.For engage the situation of strengthening part by scolder, preferably, the front surface of this strengthening part utilizes the plating such as Sn, Au, Cu, Ag.
Claims (15)
1. plate is strengthened a structure, and this plate is strengthened structure for strengthening the circuit board of mounting electronic parts on first surface, and described electronic unit has the electrode in the rectangular area being arranged on described first surface, and described plate is strengthened structure and comprised:
Strengthening part, this strengthening part is engaged to position on the second surface of described circuit board, corresponding with the bight of four jiaos of described rectangular area, and described second surface is arranged on a side contrary with described first surface of described circuit board; Wherein,
In described strengthening part, the position corresponding with each bight in four bights of described four jiaos of described rectangular area form breach,
Described breach forms two summits toward the outer side of described strengthening part, forms the profile of described strengthening part, and
For engaging the fastener in each bight in described four bights of being positioned at of described electronic unit, be arranged on the inner side of described two the interconnective lines in summit that formed by corresponding described breach.
2. plate according to claim 1 is strengthened structure, wherein,
Described strengthening part has rectangle frame shape, and this rectangle frame shape interconnects the position corresponding with the described bight of described four jiaos of described rectangular area, and
Described rectangle frame shape place, angle Thursday outside it has described breach.
3. plate according to claim 1 is strengthened structure, wherein,
Described strengthening part comprises cross shaped head, and this cross shaped head is along the diagonal setting of described rectangular area, and described cross shaped head has described breach in its four ends.
4. plate according to claim 1 is strengthened structure, wherein,
Described strengthening part comprises rectangular shape, identical with described rectangular area in this rectangular shape size, and described rectangular shape place, angle Thursday outside it has described breach.
5. plate according to claim 1 is strengthened structure, wherein,
Described strengthening part comprises four strengthening parts, and described four strengthening parts are separately positioned on the position corresponding with the bight of described four jiaos of described rectangular area, and described four strengthening parts have described breach.
6. according to the plate described in any one in claim 1 to 5, strengthen structure, wherein,
Described strengthening part is the described second surface to described circuit board by solder bonds.
7. according to the plate described in any one in claim 1 to 5, strengthen structure, wherein,
Described strengthening part is engaged to the described second surface of described circuit board by resin adhesive.
8. a board component, this board component comprises:
Circuit board, this circuit board has first surface and is arranged on the second surface of a side contrary to described first surface;
Electronic unit, this electronic unit has the electrode being arranged in rectangular area, and by described electrode engagement to the splicing ear of described circuit board is installed; And
Strengthening part, this strengthening part is engaged to the described second surface of described circuit board; Wherein,
Described strengthening part is engaged to position on the described second surface of described circuit board, corresponding with the bight of four jiaos of described rectangular area,
Corresponding position, described strengthening part each bight in four bights of described four jiaos with described rectangular area has breach,
Described breach forms two summits toward the outer side of described strengthening part, forms the profile of described strengthening part, and
For engaging the fastener in each bight in described four bights of being positioned at of described electronic unit, be arranged on the inner side of described two the interconnective lines in summit that formed by corresponding described breach.
9. board component according to claim 8, wherein,
Described strengthening part comprises rectangle frame shape, and this rectangle frame shape interconnects the position corresponding with the described bight of described four jiaos of described rectangular area, and
Described rectangle frame shape place, angle Thursday outside it has described breach.
10. board component according to claim 8, wherein,
Described strengthening part comprises cross shaped head, and this cross shaped head is along the diagonal setting of described rectangular area, and described cross shaped head has described breach in its four ends.
11. board components according to claim 8, wherein,
Described strengthening part comprises rectangular shape, identical with described rectangular area in this rectangular shape size, and described rectangular shape place, angle Thursday outside it has described breach.
12. board components according to claim 8, wherein,
Described strengthening part comprises four strengthening parts, and described four strengthening parts are separately positioned on the position corresponding with the bight of described four jiaos of described rectangular area, and described four strengthening parts have described breach.
13. according to Claim 8 to the board component described in any one in 12, wherein,
Described strengthening part is the described second surface to described circuit board by solder bonds.
14. according to Claim 8 to the board component described in any one in 12, wherein,
Described strengthening part is engaged to the described second surface of described circuit board by resin adhesive.
15. 1 kinds of electronic installations, this electronic installation comprises according to Claim 8 to the board component described in any one in 14.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010133372A JP5445340B2 (en) | 2010-06-10 | 2010-06-10 | Substrate reinforcement structure, substrate assembly, and electronic device |
| JP2010-133372 | 2010-06-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102281715A CN102281715A (en) | 2011-12-14 |
| CN102281715B true CN102281715B (en) | 2014-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110078526.8A Expired - Fee Related CN102281715B (en) | 2010-06-10 | 2011-03-30 | Board reinforcing structure, board assembly, and electronic device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8604347B2 (en) |
| EP (1) | EP2395820B1 (en) |
| JP (1) | JP5445340B2 (en) |
| CN (1) | CN102281715B (en) |
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| JP5884435B2 (en) | 2011-11-22 | 2016-03-15 | 富士通株式会社 | Circuit board reinforcing position determining method and board assembly |
| JP5300994B2 (en) * | 2012-01-31 | 2013-09-25 | 株式会社東芝 | Electronics |
| JP2014027020A (en) | 2012-07-24 | 2014-02-06 | Toshiba Corp | Circuit board, electronic apparatus, and manufacturing method of circuit board |
| JP5983228B2 (en) * | 2012-09-20 | 2016-08-31 | 富士通株式会社 | Circuit board device and electronic device |
| TWI495074B (en) * | 2012-11-30 | 2015-08-01 | Ind Tech Res Inst | Stress relief structure |
| CN106326616B (en) * | 2015-06-25 | 2019-01-15 | 华邦电子股份有限公司 | The stress evaluation method of electronic component |
| KR101787553B1 (en) | 2016-03-24 | 2017-10-19 | 주식회사 하이딥 | Touch pressure detectable touch input device |
| JP6855226B2 (en) * | 2016-11-30 | 2021-04-07 | Ｄｙｎａｂｏｏｋ株式会社 | Circuit boards and electronic devices |
| JP2018170371A (en) | 2017-03-29 | 2018-11-01 | 株式会社東芝 | Electronic apparatus |
| WO2019035370A1 (en) * | 2017-08-14 | 2019-02-21 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board |
| EP3853897A1 (en) * | 2018-09-19 | 2021-07-28 | Tesla, Inc. | Electronic assembly |
| JP7404775B2 (en) | 2019-10-29 | 2023-12-26 | 株式会社リコー | Printed wiring boards and image forming devices |
| DE102022207863A1 (en) | 2022-07-29 | 2024-02-01 | Robert Bosch Gesellschaft mit beschränkter Haftung | Carrier plate arrangement with electronic components and method for producing a carrier plate arrangement with electronic components |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5445340B2 (en) | 2014-03-19 |
| EP2395820B1 (en) | 2013-03-20 |
| JP2011258836A (en) | 2011-12-22 |
| US8604347B2 (en) | 2013-12-10 |
| CN102281715A (en) | 2011-12-14 |
| EP2395820A1 (en) | 2011-12-14 |
| US20110303441A1 (en) | 2011-12-15 |
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